CN110289347A - 模制led显示模块及其制造方法 - Google Patents

模制led显示模块及其制造方法 Download PDF

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CN110289347A
CN110289347A CN201910441449.4A CN201910441449A CN110289347A CN 110289347 A CN110289347 A CN 110289347A CN 201910441449 A CN201910441449 A CN 201910441449A CN 110289347 A CN110289347 A CN 110289347A
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display module
led display
resin part
substrate
black resin
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邵世丰
刘恒
潘昶宏
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GUANGZHOU SILICONCORE ELECTRONIC TECHNOLOGY Ltd
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GUANGZHOU SILICONCORE ELECTRONIC TECHNOLOGY Ltd
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    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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Abstract

一种LED显示模块，包括基板以及按行和列布置在基板上的发光器件阵列。每个发光器件具有电连接至基板上的接触垫的LED芯片、遮盖在接触垫周围的黑色树脂部分、以及模制在LED芯片和黑色树脂部分周围的透明树脂部分。通过在每个金属垫周围形成黑色树脂部分，所述LED显示模块提高了显示表面的对比度。

Description

模制LED显示模块及其制造方法
技术领域
本发明涉及电子封装，更具体地说，涉及一种具有高对比度的LED显示模块及其制造方法。
背景技术
LED封装是容纳LED芯片的组件。当今使用的LED封装种类众多，每种都有特定的应用和优点。LED封装的功能包括保护LED芯片和焊接引线不与环境直接接触，用模制材料(例如环氧树脂或硅树脂)固定和封装芯片，并实现在LED照明应用中的多功能性和标准化。表面贴装器件(SMD)LED、板上芯片(COB)LED，多杯集成式COB封装(MCOB)LED是一些常见的LED封装技术。
SMD LED模块使用表面贴装技术(SMT)将LED芯片安装在印刷电路板(PCB)上。SMDLED模块通常包括驱动PCB，该驱动PCB承载按行和列布置的大量表面安装LED器件。每个SMDLED器件可承载限定像素的垂直定向的红色、绿色和蓝色LED直线阵列。SMD LED器件可布置在耦合至PCB上的导电元件的中间基板(例如引线框)上。
另一方面，COB或MCOB LED模块具有直接粘合到基板(例如PCB)上的LED芯片阵列。由于COB LED不需要诸如引线框之类的附件，因此它在PCB上占用的空间较少，因而COB LED模块可具有比SMD LED模块更大的LED密度。当COB LED封装通电时，它看起来更像是一块照明板而不是多个单独的灯，就像使用紧密安装在一起的多个SMD LED一样。COB LED模块的较高密度实现了较高的亮度。
在SMD和COB型LED模块中，发光器件电连接至基板上的接触垫，该接触垫又连接至电信号处理和驱动电路。这些接触垫通常由金属(例如金)制成，因此它们可通过LED周围的模制层向外反射光。这种反射与LED本身的光发射冲突，并且可能显著降低显示表面的对比度。
对比度是LED显示器的最高亮度(亮度密度)与最低亮度之比。最低亮度可以是显示屏在完全黑暗环境中的亮度。或者，显示屏的最低亮度已被限定为其处于OFF状态时的亮度。具有较高对比度的显示屏具有较高的动态应用范围。因此需要一种具有高对比度的LED显示模块。
发明内容
本节的目的是简要介绍将在下面的“具体实施方式”一节中进一步描述的一些概念。本节不旨在确定所要保护的主题的关键特征或基本特征，也不旨在用作确定所要保护的主题的范围的辅助手段。
在本发明的一些实施例中，本发明的LED显示模块包括基板、以及按行和列布置在基板上的发光器件阵列。每个器件包括电连接至基板上接触垫的LED芯片、遮盖在接触垫周围的黑色树脂部分、以及模制在LED芯片和黑色树脂部分周围的透明树脂部分。LED芯片布置在安装在基板上的基垫上，并且第二黑色树脂部分遮盖在基垫周围。
在另一个实施例中，基板是印刷电路板(PCB)，并且发光器件耦合至PCB上的导电元件。或者，发光器件布置在支撑结构(例如引线框)上，该支撑结构耦合至印刷电路板(PCB)上的导电元件。
在另一个实施例中，黑色树脂部分由黑色颜料与环氧树脂或硅树脂的混合物制成。黑色颜料可以是碳粉。黑色树脂部分还具有岛形形状，具有平坦顶部和遮盖接触垫的平坦侧壁。黑色树脂部分的厚度范围为5微米至500微米。透明树脂部分由环氧树脂或硅树脂制成。
本发明还提供了一种用于制造发光二极管(LED)显示模块的方法。该方法包括：提供具有多个接触垫的基板，安装具有LED芯片的发光器件阵列，将LED芯片电连接至基板上的接触垫，用黑色树脂部分遮盖多个接触垫中的一个或多个，以及用透明树脂层覆盖LED芯片和覆有黑色树脂的接触垫。在该方法中，LED芯片布置在安装在基板上的基垫上，并且第二黑色树脂部分遮盖在基垫周围。黑色树脂部分可有选择性地印刷在接触垫或基垫上。
附图说明
通过参照附图阅读以下详细说明，很容易理解本发明的公开内容。在附图中：
图1是示出一种现有技术LED封装的侧向横截面的示意图；
图2是示出另一种现有技术LED封装的侧向横截面的示意图；
图3是示出图2的器件的表面和没有黑色层的器件的表面的照片；
图4是示出本发明的一个实施例的LED封装的侧向横截面的示意图；
图5是本发明公开的一个实施例的表面与图1的装置的表面对比的照片。
具体实施方式
现在将参照附图对本发明的示例性实施例进行详细说明。应注意，在可行的情况下，在附图中可能使用类似或相似的附图标记，并且这些附图标记可指示类似或相似的元件。
附图仅出于说明的目的描绘了本发明的一些实施例。本领域技术人员从以下说明中很容易认识到，在不脱离本发明的总体原理的情况下，存在替代实施例。
图1和图2示出了两种现有的COB LED封装的侧向横截面。如图1和图2所示，LED显示模块(100或200)包括驱动PCB(120或220)。每个驱动PCB承载限定像素的LED芯片(110或210)阵列。LED芯片(110或210)通过键合线(W)电连接至PCB(120或220)上的接触垫(130或230)，该键合线(W)经由PCB上的线道连接至电信号处理和驱动电路(未示出)。接触垫(130或230)由金属材料制成，该金属材料可通过LED芯片周围的模制层反射光。为了减少这种反射，图1中的现有的LED封装使用包含0.1至3.0％的深色颜料(例如碳粉)的模制层140。所形成的模制层呈现黑色，或者是不透明的。这种不透明或黑色模制层会阻挡来自LED的光，并降低显示屏的亮度。在本申请中，“黑色模制层”、“黑色树脂”等短语中的“黑色”或“暗色”一词通常意味着该物质不透明。它指从较浅到较深的不同程度的不透明度。
如图2所示的另一种现有的LED封装，包括遮盖LED芯片210和接触垫230的透明树脂层240、以及透明树脂层240上的黑色层250。黑色层250具有1％至30％的透明度。容易理解，在图1和2中，来自LED芯片的光以及来自接触垫的反射光被部分地阻挡。
图3示出了图2中所示的结构的效果。左侧面板是图2的LED显示模块的表面的图片。黑色层250具有30％的透明度。右侧面板示出了相同LED显示模块的表面，但是它没有黑色层250。容易理解，左侧的表面比右侧的表面明显更暗。这种效果是由于黑色层250吸收来自键合线W和接触垫230的光所导致的。相反，在没有黑色层250的情况下，键合线W和接触垫230通过透明树脂层向外反射光，未受到多大阻碍，因而其在OFF状态时更亮，并具有较低的对比度。
图4示出了本发明的COB LED封装的侧向横截面。LED模块400包括基板420以及按行和列布置在基板420上的LED芯片410阵列。在该实施例中，一块印刷电路板(PCB)构成基板，并且LED直接耦合至PCB上的导电元件。
PCB连接至或者可包括驱动电路。虽然在本发明中未示出驱动电路的细节，但是在一些实施例中，驱动电路可包括锁相环、多个脉宽调制引擎、配置寄存器、多个增益可调快速充电电流源、以及串行输入/输出接口。在一些实施例中，在要布置元件的位置，PCB可具有不带孔的通常镀有锡-铅、银或金的扁平铜垫，称为焊盘。可首先使用不锈钢或镍模板通过丝网印刷工艺向所有焊盘涂装由焊剂和微小焊料颗粒的粘性混合物构成的焊锡膏。也可通过类似于喷墨打印机的喷墨打印机构涂装焊锡膏。
在该实施例中，每个LED芯片410在芯片的顶部具有一对触点411。该对触点411包括p触点和n触点，它们分别耦合至每个LED芯片410的p层和n层(未示出)。在图4所示的实施例中，LED芯片410的触点411可通过键合线W电连接至基板420上的接触垫430。在另一个实施例中，可通过在芯片的底部布置触点来消除引线，其中这些触点直接连接至布置在芯片下的接触垫，即，倒装芯片。接触垫的材料可以是单种材料，也可以是多层材料。金属材料可以是镍、金、银、铝、钛、钨、镉、钒、铂等的合金。
LED芯片410可布置在基垫460上，该基垫460经由粘合层(未示出)安装在基板420上。基垫460由导热材料(例如金属、合金、焊料)制成，因此它从LED芯片410向基板420传递热量。粘合层(未示出)是导电和导热界面，例如粘合剂、涂层、薄膜、密封剂、焊料、糊剂、油脂和/或其它适当的材料，例如经过烘烤的银环氧树脂。
在该实施例中，第一黑色树脂部分470遮盖每个接触垫430，第二黑色树脂部分480遮盖基垫460。第一黑色树脂部分470和第二黑色树脂部分480由包含黑色颜料的环氧树脂或硅树脂制成。在某些特定实施例中，第一黑色树脂部分470和第二黑色树脂部分480可以是岛的形式，具有平坦顶部和平坦侧壁，与每个接触垫430和基垫460的形状相符。
作为一个非限制性的示例，第一黑色树脂部分和第二黑色树脂部分可具有5微米至500微米的厚度。第一黑色树脂部分470和第二黑色树脂部分480可通过在金属接触垫430和金属基垫460上进行喷墨印刷形成，或者可通过其它适当的方法形成，例如掩模、丝网印刷。在一个优选实施例中，在将LED芯片布置在基垫上之前，将黑色树脂印刷在基垫460上。在另一个实施例中，黑色树脂可涂装在p触点和n触点411以及金属接触垫430和金属基垫460上。
在形成遮盖金属接触垫430和金属基垫460的第一黑色树脂部分470和第二黑色树脂部分480之后，在LED芯片410周围模制透明树脂部分440，覆盖住第一黑色树脂部分470和第二黑色树脂部分480。透明树脂部分440由透明树脂或硅树脂制成。在一些实施例中，透明树脂部分440可通过封装过程形成。在本发明的实施例中，第一黑色树脂部分470和第二黑色树脂部分480可有选择性地模制或印刷在每个触点或基垫周围。黑色树脂具有低透明度，例如透明度小于20％、小于10％、小于5％。因此，来自金属垫(接触垫430和基垫460)的光反射基本上被阻挡。
图5在右侧示出了图4中的实施例的表面，并在左侧示出了图1的LED显示模块的表面，以进行对比，左侧的LED显示模块具有含2％碳粉的模制材料。右侧的本发明的实施例在OFF状态时明显更暗。因此，本发明的LED显示屏实现了比现有技术LED显示模块更高的对比度。
用黑色树脂有选择性地遮盖外露的接触垫的方法也适用于SMD LED显示模块。在这种情况下，外露的接触垫可位于PCB上或SMD LED的引线框上。
上文中详细说明了本发明的一些实施例。在考虑和实践本发明的基础上，对于本领域技术人员来说，其它实施例也是显而易见的。因此，本说明书和附图应仅视为示例性和说明性的，本发明的实际范围由所附权利要求限定。

Claims (15)

1.一种LED显示模块，包括：
基板；和
按行和列布置在基板上的发光器件阵列，每个发光器件包括：
电连接至基板上的一个或多个接触垫的LED芯片，
遮盖一个或多个接触垫的黑色树脂部分，和
遮盖LED芯片和黑色树脂部分的透明树脂部分。
2.如权利要求1所述的LED显示模块，其中，所述LED芯片布置在安装在基板上的基垫上，并且第二黑色树脂部分遮盖基垫。
3.如权利要求1所述的LED显示模块，其中，所述基板是PCB，并且所述发光器件耦合至PCB上的导电元件。
4.如权利要求1所述的LED显示模块，其中，所述发光器件经由耦合至PCB上的导电元件的引线框布置在基板上。
5.如权利要求1所述的LED显示模块，其中，所述黑色树脂部分包括黑色颜料和环氧树脂或硅树脂。
6.如权利要求1所述的LED显示模块，其中，所述黑色树脂部分具有与所述一个或多个接触垫之一的形状相符的形状。
7.如权利要求1所述的LED显示模块，其中，所述黑色树脂部分具有5微米至500微米的厚度。
8.如权利要求1所述的LED显示模块，其中，所述透明树脂部分由树脂、环氧树脂或硅树脂制成。
9.一种制造LED显示模块的方法，包括：
提供具有布置在其上的多个接触垫的基板；
安装发光器件阵列，每个发光器件包括电连接至基板上的多个接触垫中的一个或多个的LED芯片；
用黑色树脂部分遮盖多个接触垫；和
用一层透明模制材料遮盖LED芯片和覆有黑色树脂的接触垫。
10.如权利要求9所述的制造LED显示模块的方法，其中，所述LED芯片布置在安装在基板上的基垫上，并且第二黑色树脂部分遮盖基垫。
11.如权利要求9所述的制造LED显示模块的方法，其中，所述基板是PCB，并且所述发光器件耦合至PCB上的导电元件。
12.如权利要求9所述的制造LED显示模块的方法，其中，所述发光器件是布置在基板上的SMD。
13.如权利要求9所述的制造LED显示模块的方法，其中，所述黑色树脂部分通过喷墨印刷、掩模印刷或丝网印刷涂装在接触垫中的一个或多个上。
14.如权利要求9所述的制造LED显示模块的方法，其中，在将LED芯片布置在基垫上之前将第二黑色树脂部分涂装在基垫上。
15.如权利要求14所述的制造LED显示模块的方法，其中，所述第二黑色树脂部分通过喷墨印刷、掩模印刷或丝网印刷涂装在基垫上。
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Application publication date: 20190927