CN110198596A - Connecting circuit board and display device - Google Patents
Connecting circuit board and display device Download PDFInfo
- Publication number
- CN110198596A CN110198596A CN201910447478.1A CN201910447478A CN110198596A CN 110198596 A CN110198596 A CN 110198596A CN 201910447478 A CN201910447478 A CN 201910447478A CN 110198596 A CN110198596 A CN 110198596A
- Authority
- CN
- China
- Prior art keywords
- area
- circuit board
- pad
- connection circuit
- baffle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 57
- 230000004888 barrier function Effects 0.000 claims description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 20
- 238000012360 testing method Methods 0.000 claims description 19
- 239000011241 protective layer Substances 0.000 claims description 12
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- 239000011147 inorganic material Substances 0.000 claims description 9
- 229910004205 SiNX Inorganic materials 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052593 corundum Inorganic materials 0.000 claims description 7
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000005213 imbibition Methods 0.000 claims description 2
- 239000011229 interlayer Substances 0.000 claims description 2
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 9
- 230000007797 corrosion Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 230000000903 blocking effect Effects 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000009977 dual effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 210000002186 septum of brain Anatomy 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a connecting circuit board and a display device, wherein the connecting circuit board comprises a connecting area and a blocking area; the connecting area is provided with at least one golden finger, and the golden finger is used for electrically connecting a first bonding pad of a binding area on the part to be connected; the blocking area is used for covering at least one second bonding pad of the non-binding area on the part to be connected, and the second bonding pad is electrically insulated from the blocking area. The blocking area is used for covering the second bonding pad of the non-binding area on the part to be connected, and the blocking area is electrically insulated from the second bonding pad, so that moisture is effectively prevented from entering the part to be connected from the second bonding pad on the part to be connected and further causing corrosion of a circuit in the part to be connected, and the effect of prolonging the service life of the part to be connected is achieved.
Description
Technical field
The present embodiments relate to display technology more particularly to a kind of connection circuit board and display devices.
Background technique
Display panel has a wide range of applications in the electronic products such as mobile phone, plate and computer, and the service life also affects
The service life of electronic product.
Display panel will do it a series of test before factory, the weldering such as vision-based detection (VT detection), for detection
Disk, pad (VT pad) meeting as VT is detected is exposed in air, and the moisture in air is easy to penetrate by VT pad aobvious
Show in panel, influences the service life of display panel.
Summary of the invention
The present invention provides a kind of connection circuit board and display device, effectively to obstruct moisture penetration into display panel,
Extend the service life of display device.
In a first aspect, connection circuit board includes bonding pad and barrier the embodiment of the invention provides a kind of connection circuit board
Area；The bonding pad is provided at least one golden finger, and the golden finger is used to be electrically connected the to binding area in connecting component
One pad；The baffle area is used to cover described at least one second pad to unbundling area in connecting component, and described the
Two pads are electrically insulated with the baffle area.
Second aspect, the embodiment of the invention also provides a kind of display device, including connection circuit board and display panel, institutes
Stating connection circuit board includes bonding pad and baffle area；The bonding pad is provided at least one golden finger；The display panel packet
It includes binding area and unbundling area, the binding area is provided at least one first pad, the unbundling area is provided at least one
A second pad, second pad is for testing the display panel；
At least one described first pad and at least one described golden finger are bound；
The baffle area covers second pad.
The present invention is by using the connection circuit board including bonding pad and baffle area, and bonding pad is provided at least one gold
Finger, baffle area is used to cover the second pad to unbundling area in connecting component, and baffle area and the second pad are electrically exhausted
Edge enters to the second pad in connecting component to cause in turn wait connect in connecting component to efficiently avoid moisture
The corrosion on component mid-line road achieved the effect that improve to the connecting component service life.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for connecting circuit board provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of connection circuit board and corresponding display panel provided in an embodiment of the present invention；
Fig. 3 is sectional view of the Fig. 1 along the direction A1A2；
Fig. 4 is sectional view of the Fig. 1 along the direction A3A4；
Fig. 5 is sectional view of the Fig. 1 along the direction A5A6；
Fig. 6 is an a kind of sectional view for connecting circuit board；
Fig. 7 is an a kind of sectional view for connecting circuit board；
Fig. 8 is an a kind of sectional view for connecting circuit board；
Fig. 9 is a kind of structural schematic diagram of display device provided in an embodiment of the present invention；
Figure 10 is sectional view of the Fig. 9 along the direction A7A8；
Figure 11 is an a kind of sectional view of display device.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Fig. 1 is a kind of structural schematic diagram for connecting circuit board provided in an embodiment of the present invention, and Fig. 2 mentions for the embodiment of the present invention
The structural schematic diagram of the connection circuit board and corresponding display panel of confession, with reference to Fig. 1 and Fig. 2, company provided in an embodiment of the present invention
Connecing circuit board 11 can connect with binding to connecting component, can be display panel 12 to connecting component, electricity is connected shown in Fig. 2
Road plate 11 and display panel 12 are not bound also；Connecting circuit board 11 includes bonding pad 111 and baffle area 110, bonding pad 111
It is provided at least one golden finger 114, golden finger 114 is used to be electrically connected the first pad that area 121 is bound on display panel 12
206, baffle area 110 is used to cover at least one second pad in unbundling area 120 on display panel 12, and the second pad and resistance
Septal area 110 is electrically insulated.
Specifically, connection circuit board 11 can be realized being electrically connected for display panel 12 and mainboard, the connection setting of circuit board 11
There is the side of golden finger 114 to be bound on display panel, the other side is connect with mainboard.It include at least one on bonding pad 111
Golden finger 114, golden finger 114 are used to bind with the first pad 206 bound on display panel 12 in area 121, the first pad 206
With in display panel 12 driver and/or control signal wire be electrically connected, after connecting circuit board 11 and display panel 12 and binding,
First pad 206 is electrically connected with the golden finger 114 connecting on circuit board 11, is realized display panel 12 and mainboard and is electrically connected.
The bonding pad 111 of connection circuit board 11, which is used as to the driver and/or control signal wire being arranged in display panel 12, provides letter
Number, such as can be by the driving IC on the data signal transmission to display panel 12 of mainboard output, so that display panel 12 is normal
Work；It include at least one second pad in unbundling area 120 on display panel 12, the second pad is sudden and violent on display panel 12
The some pads exposed, the second pad are generally not used for binding with other component, such as are not used in and driving IC or circuit board
Equal components binding, such as the second pad can be the VT pad for being tested display panel 12.VT pad can be used for display surface
Plate 12 receives the test signal that test device provides before unbound connection circuit board 11 and driving IC, realizes to display surface
The lighting test of plate.After being connected to test device such as VT pad, it can be applied to the test signal of self-test device, to display
What the test of panel can be the operation for checking the Organic Light Emitting Diode in each sub-pixel lights test；
It is illustrated so that the second pad is VTpad as an example below, after connection circuit board 11 and the binding of display panel 12, even
The first pad connect in golden finger and the binding area 121 in area 111 realizes electric connection, and baffle area 110 covers unbundling
VT pad in area 120 opens VT pad and external (such as air) barrier, and the moisture avoided in air is seeped by VT pad
The corrosion of route in display panel 12 is penetrated into display panel 12 and causes, so that improve display panel 12 uses the longevity
Life.Baffle area 110 and VT pad is electrically insulated, and illustratively, the block-water performance of pad is poor, covers VT pad according to pad
Lid, if the block-water performance of connection circuit board 11 is poor, moisture may pass through the pad of covering VT pad on connection circuit board 11
Into in display panel 12, therefore pad is not provided on baffle area 110, the settable stronger material of block-water performance, such as inorganic material
Material etc. so that efficiently barrier moisture enters in display panel 12, and then prevents corrosion of the moisture to route in display panel 12,
Improve the service life of display panel 12.
The technical solution of the present embodiment, by using the connection circuit board including bonding pad and baffle area, and bonding pad is set
Be equipped at least one golden finger, baffle area is used to cover the second pad to unbundling area in connecting component, and baffle area and
Second pad is electrically insulated, and enters to the second pad in connecting component in connecting component to efficiently avoid moisture
Lead to the corrosion to route in connecting component in turn, has achieved the effect that improve to the connecting component service life.
Optionally, continue to refer to figure 1 and Fig. 2, golden finger 114 can be it is multiple, multiple golden fingers 114 are in along first direction Y
At least a line is arranged；Baffle area 110 may include the first baffle area and the second baffle area, in a second direction X, the first baffle area and
Two baffle areas are respectively arranged at the two sides of bonding pad 111, and first direction Y is vertical with second direction X.
Illustratively, the baffle area 110 on 111 left side of bonding pad can be considered the first baffle area in Fig. 1, bonding pad 111 in Fig. 1
The baffle area 110 on the right can be considered the second baffle area, and the number of the golden finger in bonding pad 111 can be with tying up in display panel 12
Determine the number matching of the first pad in area 121；And the position of baffle area 110 and number can also be according to unbundlings on display panel 12
The position of 120 pad of area and determine, if the VT pad on display panel 12 be generally positioned at binding area 121 on two sides, therefore
Baffle area 110 on connection circuit board 11 is also disposed on the two sides in binding area 111.If further including other similar on display panel 12
External pad is exposed in VT pad, connecting may also set up corresponding baffle area 110 on circuit board 11.It can also to connecting component
For the other component other than display panel 12, the bonding pad 111 being set on circuit board 11 to match in connecting component is connected
With baffle area 110, the type that the present embodiment treats connecting component is not specifically limited, and connects the baffle area on circuit board 11
110 with to the unbundling area 120 in connecting component 11 position and number match.
Optionally, Fig. 3 is sectional view of the Fig. 1 along the direction A1A2；Fig. 4 is sectional view of the Fig. 1 along the direction A3A4；Fig. 5 is Fig. 1
Sectional view along the direction A5A6；With reference to Fig. 1-Fig. 5, connects circuit board and include the substrate 112 set gradually, conductive layer 113 and protect
Sheath 115, wherein the material of substrate 112 can be PI (polyimides), and the material of conductive layer 113 can be copper, the material of protective layer 115
Material can also be PI.Conductive layer 113 covers conduction including golden finger 114 and the cabling connecting with golden finger 114, protective layer 115
The cabling of layer simultaneously exposes bonding pad and baffle area.
Specifically, 110 settable barrier layer 116, barrier layer 116 are set gradually with substrate 112 at baffle area, substrate 112
Support can be provided for barrier layer 116, while substrate 112 is that barrier layer 116 and conductive layer 113 share, connection circuit board 11 makes
In the process, it does not need to increase technique；When connecting circuit board 11 with connecting when connecting component, barrier layer 116 is covered to interconnecting piece
Moisture has been isolated into the second pad in the second pad on part, and then obstructs moisture and treated in connecting component by the second pad
The corrosion of route and device；Bonding pad includes the substrate 112 set gradually and golden finger 114, wherein bonding pad may include multiple
Golden finger 114, for being bound with the first pad to bind area in connecting component；Other regions on connection circuit board may include
Substrate 112, conductive layer 113 and the protective layer 115 set gradually；The present embodiment illustrates only the knot that connection circuit board is single sided board
Structure, connection circuit board can also be dual platen, and when connecting circuit board is dual platen, at least one side for connecting circuit board is provided with resistance
The position and number of septal area, baffle area can do specific setting according to the type to connecting component.
Illustratively, connection circuit board shown in Fig. 1 can be dual platen, such as can be two-sided FPC (Flexible
Printed Circuit, flexible circuit board), Fig. 6 is an a kind of sectional view for connecting circuit board；Fig. 7 is a kind of connection circuit
One sectional view of plate；Fig. 8 is an a kind of sectional view for connecting circuit board；Such as connection circuit board can be the connection in Fig. 1
Circuit board, Fig. 6 can be Fig. 1 along a sectional view in the direction A1A2；Fig. 7 can be Fig. 1 along a sectional view in the direction A3A4；Fig. 8 can be
A sectional view of the Fig. 1 along the direction A5A6；With reference to Fig. 6-Fig. 8, baffle area 110 may be provided with barrier layer 116, substrate 112 and the back side
Barrier layer 1161, wherein the material and thickness of back side barrier layer 1161 can be consistent with barrier layer 116, can also be according to even
The difference of relay part and do different settings；Bonding pad 110 may include golden finger 114, substrate 112 and back side golden finger 1141,
Back side golden finger 1141 can be identical with the effect of golden finger 114, and details are not described herein；Other regions of connection circuit board may include
Substrate 112, conductive layer 113, protective layer 115, backside conductive layer 1131 and back-protective layer 1151, wherein backside conductive layer 115
It can be copper, back-protective layer 1151 can be PI, and backside conductive layer 1131 is oppositely arranged with conductive layer 113, back-protective layer
1151 are oppositely arranged with protective layer 115.Connect circuit board be dual platen when, can to connection circuit board two faces in bonding pad and
The setting of baffle area can be according to needing the type to connecting component to be respectively set, it is not limited to the exemplary type of the present embodiment,
Enter to connecting component to obstruct moisture and then and cause the generation of its internal wiring corrosion phenomenon.
The thickness of barrier layer 116 may be configured as between 30 nanometers to 2 microns.The thickness of barrier layer 116 is too thick, the company of will affect
Circuit board and the integral thickness after connecting component is connect are connect, and if the thickness of barrier layer 116 is too thin, the resistance of barrier layer 116
It is aqueous can be weaker, still have partial moisture and enter to connecting component, so that corrosion is to the route in connecting component, and then influence to
The service life of connecting component.The material of barrier layer 116 can be inorganic material, such as SiNxOr Al2O3, SiNxAnd Al2O3Block water
Performance is stronger, can further improve connection circuit board and the block-water performance after connecting component is connect.Certainly, the choosing of inorganic material
It selects and is also possible to except SiNxAnd Al2O3The stronger material of other block-water performances.
Optionally, connection circuit board can be TAB circuit plate or FPC circuit board, using TAB circuit plate or FPC circuit board,
Driving chip to connecting component can be set on connection circuit board, to be conducive to reduce the size of circuit board to be connected, such as
When connecting circuit board is display panel, using TAB circuit plate or FPC circuit board, the IC of display panel can be set to company
It connects on circuit board, to avoid that IC is arranged in the stepped region of display panel, achievees the effect that improve display panel screen accounting, more preferably
Meet the needs of users.
With reference to Fig. 9, Fig. 9 is a kind of structural schematic diagram of display device provided in an embodiment of the present invention, and display device includes
Connect circuit board 11 and display panel 12, wherein connection circuit board 11 and display panel 12 are bound, and connection circuit board 11 includes connecting
Meet area 111 and baffle area 110；Bonding pad 111 is provided at least one golden finger；Display panel 12 includes binding area and unbundling
Area, binding area are provided at least one first pad, and unbundling area is provided at least one second pad, and the second pad is used for
Display panel 12 is tested；At least one first pad and at least one golden finger are bound；Baffle area 110 is for covering the
Two pads.
Specifically, connection circuit board 11 can be realized being electrically connected for display panel 12 and mainboard, the connection setting of circuit board 11
There is the side of golden finger 114 to be bound on display panel, the other side is connect with mainboard.It include at least one on bonding pad 111
Golden finger 114, golden finger 114 are used to bind with the first pad 206 bound on display panel 12 in area 121, the first pad 206
With in display panel 12 driver and/or control signal wire be electrically connected, after connecting circuit board 11 and display panel 12 and binding,
First pad 206 is electrically connected with the golden finger 114 connecting on circuit board 11, is realized display panel 12 and mainboard and is electrically connected.
The bonding pad 111 of connection circuit board 11, which is used as to the driver and/or control signal wire being arranged in display panel 12, provides letter
Number, such as can be by the driving IC on the data signal transmission to display panel 12 of mainboard output, so that display panel 12 is normal
Work；It include at least one second pad in unbundling area 120 on display panel 12, the second pad is sudden and violent on display panel 12
The some pads exposed, the second pad are generally not used for binding with other component, such as are not used in and driving IC or circuit board
Equal components binding, such as the second pad can be the VT pad for being tested display panel 12.VT pad can be used for display surface
Plate 12 receives the test signal that test device provides before unbound connection circuit board 11 and driving IC, realizes to display surface
The lighting test of plate.After being connected to test device such as VT pad, it can be applied to the test signal of self-test device, to display
What the test of panel can be the operation for checking the Organic Light Emitting Diode in each sub-pixel lights test；
By taking the second pad is VT pad as an example, after connection circuit board 11 and the binding of display panel 12, on bonding pad 111
The first pad on golden finger and binding area, which is realized, to be electrically connected, and baffle area 110 covers the VT pad in unbundling area, with
VT pad and external (such as air) barrier are opened, the moisture avoided in air is penetrated into display panel 12 by VT pad
And lead to the corrosion of route in display panel 12, to improve the service life of display panel 12.Baffle area 110 and VT pad
It is electrically insulated, illustratively, the block-water performance of pad is poor, VT pad is covered according to pad, if connection circuit board 11
Block-water performance is poor, and moisture may be entered in display panel 12 by covering the pad of VT pad on connection circuit board 11, because
Pad, the settable stronger material of block-water performance, such as inorganic material are not provided on this baffle area 110, to efficiently obstruct
Moisture enters in display panel 12, improves the service life of display panel.
The technical solution of the present embodiment, by using the display device for including connection circuit board and display panel, wherein even
Connecing circuit board includes bonding pad and baffle area, and baffle area is used to cover second pad in display panel unbundling area, thus by non-
Second pad in binding area is isolated from the outside, and extraneous moisture is avoided to enter display panel through the second pad and corrode display panel
In route and device, influence the service life of display panel, while the second weldering need not be considered further that in display panel manufacturing process
The problem that blocks water of disk, to reduce the cost of manufacture of display panel.
Optionally, Figure 10 is sectional view of the Fig. 9 along the direction A7A8, and with reference to Fig. 9 and Figure 10, connecting circuit board 11 includes substrate
112 and golden finger 114, display panel 12 may include the substrate 201 stacked gradually, buffer layer 202, gate insulating layer 203 and layer
Between insulating layer 204, further include the first pad 206, the first pad 207 and passivation layer 205 on the interlayer insulating film 204；
The bonding pad of connection circuit board 11 is provided with barrier layer 116, between the first pad 302 and golden finger 114 and barrier layer 116
Glue-line 301 is provided between the second pad 207.The specific structure of display panel 12 according to the difference of 12 type of display panel and
With different structures, a kind of merely exemplary structure for showing display panel 12 of the present embodiment, it is to be understood that this implementation
The display panel 12 that example provides can also be other types.
Illustratively, glue-line 301 may include the first glue-line and the second glue-line, set between the first pad 302 and golden finger 114
It is equipped with the first glue-line, the first glue-line includes anisotropic conductive adhesive layer；And is provided between barrier layer 116 and the second pad 207
Two glue-lines.It include conducting sphere 302 in anisotropic conductive adhesive layer, when connection circuit board 11 is connected with display panel 12 by glue-line 301
After connecing, due to the effect of conducting sphere 302 in anisotropic conductive adhesive layer, golden finger 114 and display panel in circuit board 11 are connected
The first pad 206 in 12 realizes electrical connection, to realize the transmission of signal between display panel 12 and external devices；And second
Glue-line can also be anisotropic conductive adhesive layer, if the second glue-line and the first glue-line are anisotropic conductive adhesive layer, use glue-line
301 will connection circuit board 11 and display panel 12 when being fixed together, can produce once glue-line 301 completion, namely only need to apply
One time glue can produce glue-line 301, to reduce production process, save cost of manufacture, while glue-line 301 can also make to connect
It connects circuit board 11 and the connection of display panel is more secured.
Illustratively, Figure 11 is an a kind of sectional view of display device, and display device can be to show dress shown in Fig. 9
It sets, Figure 11 can be Fig. 9 along a sectional view in the direction A7A8, unlike Figure 10, the first glue-line 304 and second of glue-line 301
Gap is provided between glue-line 303, the second glue-line 303 coats barrier layer 116 and covers the second pad 207；Second glue-line 303
It can be the glue-line that blocks water, it such as can be polyacrylate or polypropylene that the material for the glue-line that blocks water, which can be the high molecular material of water imbibition,
Amide etc., wherein other a small amount of auxiliary water-absorbent material (such as inorganic matter silicon nitride, silica or zinc oxide) can also be mixed.Pass through
Setting blocks water glue-line, and covers the second pad 207, and barrier layer 116 can obstruct moisture, infiltrates into the by the front of display device
At two pads 207, the glue that blocks water have water-resisting ability, block-water effect also can be enhanced, and the glue-line that blocks water can also prevent moisture from
The side of display device infiltrates at the second pad 207, namely the glue-line that blocks water is arranged and can further improve blocking water for display device
Performance improves the service life of display device.
Optionally, connection circuit board 12 includes substrate, conductive layer and the protective layer set gradually；Conductive layer includes golden finger
And the cabling being electrically connected with golden finger；Protective layer covering cabling simultaneously exposes bonding pad and baffle area.
Optionally, the material of barrier layer can be inorganic material, such as SiNxOr Al2O3, and the thickness of barrier layer 116 is settable
Between 30 nanometers to 2 microns.The thickness of barrier layer 116 is too thick, will affect connection circuit board with after connecting component is connect
Integral thickness, and if the thickness of barrier layer 116 is too thin, the block-water performance of barrier layer 116 is weaker, still have partial moisture entrance
Display panel 12, to corrode the cabling in display panel 12.And inorganic material, such as SiNxOr Al2O3Block-water performance it is stronger,
It can further improve the block-water performance after connection circuit board 11 is connect with display panel 12.Certainly, the selection of inorganic material can also
To be except SiNxAnd Al2O3The stronger material of other block-water performances.
Optionally, golden finger is multiple, and multiple golden fingers are arranged along first direction Y at least a line；Baffle area 110 includes
First baffle area and the second baffle area, X, the first baffle area and the second baffle area are respectively arranged at bonding pad 111 in a second direction
Two sides, first direction Y is vertical with second direction X；
The unbundling area of display panel 12 includes the first unbundling area and the second unbundling area；
The area of first baffle area is greater than the area in the first unbundling area, and the area of the second baffle area is greater than the second unbundling
The area in area.
Specifically, the area of the first baffle area is greater than the area in the first unbundling area, it will be appreciated that in the first baffle area
The area of barrier layer 116 is greater than the area of upper second pad 207 in the first unbundling area in display panel 12, such as barrier layer 116
The area of the second pad of area ratio 207 is big by 10%, to guarantee that barrier layer 116 can cover all the second pad 207, can obstruct water
Divide and infiltrate at the second pad 207 and then penetrate into display device, improves the service life of display device.
Optionally, connection circuit board 12 is TAB ((Tape Automated Bonding, carry automatic welding)) circuit board or
FPC circuit board.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (17)
1. a kind of connection circuit board, which is characterized in that including bonding pad and baffle area；The bonding pad is provided at least one gold
Finger, the golden finger are used to be electrically connected the first pad to bind area in connecting component；The baffle area is described for covering
To at least one second pad in unbundling area in connecting component, and second pad is electrically insulated with the baffle area.
2. connection circuit board according to claim 1, which is characterized in that the golden finger is multiple, multiple golden hands
Refer to and arranges along first direction at least a line；The baffle area includes the first baffle area and the second baffle area, in a second direction, institute
It states the first baffle area and second baffle area and is respectively arranged at the two sides of the bonding pad, the first direction and described second
Direction is vertical.
3. connection circuit board according to claim 1, which is characterized in that the connection circuit board includes the base set gradually
Bottom, conductive layer and protective layer；The conductive layer includes the golden finger and the cabling that is electrically connected with the golden finger；The guarantor
Sheath covers the cabling and exposes the bonding pad and baffle area.
4. connection circuit board according to claim 1-3, which is characterized in that the baffle area is provided with barrier
Layer.
5. connection circuit board according to claim 4, which is characterized in that the material of the barrier layer is inorganic material.
6. connection circuit board according to claim 5, which is characterized in that the material of the barrier layer uses SiNxOr
Al2O3。
7. connection circuit board according to claim 4, which is characterized in that the barrier layer it is micro- with a thickness of 30 nanometers to 2
Rice.
8. connection circuit board according to claim 1, which is characterized in that the connection circuit board is TAB circuit plate or FPC
Circuit board.
9. a kind of display device, which is characterized in that including connection circuit board and display panel, the connection circuit board includes connection
Area and baffle area；The bonding pad is provided at least one golden finger；The display panel includes binding area and unbundling area, institute
It states binding area and is provided at least one first pad, the unbundling area is provided at least one second pad, second weldering
Disk is for testing the display panel；
At least one described first pad and at least one described golden finger are bound；
The baffle area covers second pad.
10. display device according to claim 9, which is characterized in that the baffle area of the connection circuit board is provided with resistance
Interlayer；
Glue-line is set between first pad and the golden finger and between the barrier layer and second pad.
11. display device according to claim 10, which is characterized in that the glue-line includes the first glue-line and the second glue
Layer；First glue-line is provided between first pad and the golden finger, first glue-line includes anisotropy conduction
Glue-line；
Second glue-line is provided between the barrier layer and second pad.
12. display device according to claim 11, which is characterized in that second glue-line is the glue-line that blocks water.
13. display device according to claim 12, which is characterized in that the material of the glue-line that blocks water includes water imbibition
High molecular material.
14. display device according to claim 10, which is characterized in that the connection circuit board includes the base set gradually
Bottom, conductive layer and protective layer；The conductive layer includes the golden finger and the cabling that is electrically connected with the golden finger；The guarantor
Sheath covers the cabling and exposes the bonding pad and baffle area.
15. display device according to claim 10, which is characterized in that the material of the barrier layer is inorganic material.
16. display device according to claim 9, which is characterized in that the golden finger is multiple, multiple golden fingers
It arranges along first direction at least a line；The baffle area includes the first baffle area and the second baffle area, in a second direction, described
First baffle area and second baffle area are respectively arranged at the two sides of the bonding pad, the first direction and the second party
To vertical；
The unbundling area of the display panel includes the first unbundling area and the second unbundling area；
First baffle area covers first unbundling area, and second baffle area covers second unbundling area；
Wherein, the area of first baffle area is greater than the area in first unbundling area, the area of second baffle area
Greater than the area in second unbundling area.
17. the connection circuit board is TAB circuit plate or FPC electricity according to claim 9-16 described in any item display devices
Road plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910447478.1A CN110198596B (en) | 2019-05-27 | 2019-05-27 | Connecting circuit board and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910447478.1A CN110198596B (en) | 2019-05-27 | 2019-05-27 | Connecting circuit board and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110198596A true CN110198596A (en) | 2019-09-03 |
| CN110198596B CN110198596B (en) | 2021-07-06 |
Family
ID=67753247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910447478.1A Active CN110198596B (en) | 2019-05-27 | 2019-05-27 | Connecting circuit board and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110198596B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111105704A (en) * | 2019-12-23 | 2020-05-05 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN112669707A (en) * | 2020-12-22 | 2021-04-16 | 上海天马有机发光显示技术有限公司 | Display panel, flexible circuit board and display device |
| CN113311606A (en) * | 2021-05-26 | 2021-08-27 | 合肥京东方光电科技有限公司 | Substrate for display device and display device |
| CN114203025A (en) * | 2020-09-17 | 2022-03-18 | 华为技术有限公司 | Display screen and electronic equipment |
| CN114296263A (en) * | 2022-01-25 | 2022-04-08 | 昆山龙腾光电股份有限公司 | Lighting test circuit, display panel and display device |
| CN114360371A (en) * | 2021-11-30 | 2022-04-15 | 昆山国显光电有限公司 | Display screen assembly and display device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6081429A (en) * | 1999-01-20 | 2000-06-27 | Micron Technology, Inc. | Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods |
| US20010033127A1 (en) * | 2000-04-24 | 2001-10-25 | Nec Corporation | Display panel module with improved bonding structure and method of forming the same |
| US20080251946A1 (en) * | 2004-03-30 | 2008-10-16 | Toshiharu Seko | Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus |
| US20100220455A1 (en) * | 2006-12-22 | 2010-09-02 | Chunghwa Picture Tubes, Ltd. | Bonding structure of circuit substrate for instant circuit inspecting |
| KR20150025389A (en) * | 2013-08-29 | 2015-03-10 | 삼성전기주식회사 | Touch Sensor Module |
| CN205283925U (en) * | 2015-11-25 | 2016-06-01 | 武汉天马微电子有限公司 | Flexible circuit board |
| JP2018125370A (en) * | 2017-01-31 | 2018-08-09 | 株式会社デンソー | Electronic device |
| CN208273349U (en) * | 2018-05-31 | 2018-12-21 | 云谷（固安）科技有限公司 | Flexible circuit board and its bonding structure and flexible display apparatus |
-
2019
- 2019-05-27 CN CN201910447478.1A patent/CN110198596B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6081429A (en) * | 1999-01-20 | 2000-06-27 | Micron Technology, Inc. | Test interposer for use with ball grid array packages assemblies and ball grid array packages including same and methods |
| US20010033127A1 (en) * | 2000-04-24 | 2001-10-25 | Nec Corporation | Display panel module with improved bonding structure and method of forming the same |
| US20080251946A1 (en) * | 2004-03-30 | 2008-10-16 | Toshiharu Seko | Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus |
| US20100220455A1 (en) * | 2006-12-22 | 2010-09-02 | Chunghwa Picture Tubes, Ltd. | Bonding structure of circuit substrate for instant circuit inspecting |
| KR20150025389A (en) * | 2013-08-29 | 2015-03-10 | 삼성전기주식회사 | Touch Sensor Module |
| CN205283925U (en) * | 2015-11-25 | 2016-06-01 | 武汉天马微电子有限公司 | Flexible circuit board |
| JP2018125370A (en) * | 2017-01-31 | 2018-08-09 | 株式会社デンソー | Electronic device |
| CN208273349U (en) * | 2018-05-31 | 2018-12-21 | 云谷（固安）科技有限公司 | Flexible circuit board and its bonding structure and flexible display apparatus |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111105704A (en) * | 2019-12-23 | 2020-05-05 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN114203025A (en) * | 2020-09-17 | 2022-03-18 | 华为技术有限公司 | Display screen and electronic equipment |
| CN112669707A (en) * | 2020-12-22 | 2021-04-16 | 上海天马有机发光显示技术有限公司 | Display panel, flexible circuit board and display device |
| CN113311606A (en) * | 2021-05-26 | 2021-08-27 | 合肥京东方光电科技有限公司 | Substrate for display device and display device |
| CN113311606B (en) * | 2021-05-26 | 2023-06-20 | 合肥京东方光电科技有限公司 | Substrate for display device and display device thereof |
| CN114360371A (en) * | 2021-11-30 | 2022-04-15 | 昆山国显光电有限公司 | Display screen assembly and display device |
| CN114360371B (en) * | 2021-11-30 | 2023-11-07 | 昆山国显光电有限公司 | Display screen assembly and display device |
| CN114296263A (en) * | 2022-01-25 | 2022-04-08 | 昆山龙腾光电股份有限公司 | Lighting test circuit, display panel and display device |
| CN114296263B (en) * | 2022-01-25 | 2023-08-25 | 昆山龙腾光电股份有限公司 | Lighting test circuit, display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110198596B (en) | 2021-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110198596A (en) | Connecting circuit board and display device | |
| CN109801949B (en) | Organic light emitting display panel and display device | |
| US7327038B2 (en) | Semiconductor device package | |
| CN109459895A (en) | Display panel and display device | |
| US7541680B2 (en) | Semiconductor device package | |
| CN104699320A (en) | Array substrate, color film substrate and touch display device | |
| CN107066946B (en) | Fingerprint mould group, display screen and mobile terminal | |
| TW200812448A (en) | Flexible electronic assembly | |
| JP2007059916A5 (en) | ||
| CN111430421B (en) | Display device and method for manufacturing the same | |
| KR20190095684A (en) | Semiconductor package and display apparatus comprising the same | |
| CN104238796B (en) | Touch control integrated circuit device | |
| CN105807514A (en) | Display device | |
| CN212136426U (en) | Flip chip and chip packaging structure | |
| JP2006229157A (en) | Shield film of shield flexible printed wiring board and shield flexible printed wiring board using same | |
| CN111508399A (en) | Display panel and display device | |
| CN109102772A (en) | Drive circuit board and display device | |
| TW539904B (en) | Tape carrier, manufacturing method for the tape carrier, and manufacturing method | |
| WO2024119688A1 (en) | Display panel and display device | |
| KR20140125673A (en) | Cof package and display device including the same | |
| TW200406906A (en) | Electronic circuit apparatus and integrated circuit device | |
| CN106611752B (en) | Electric connection structure and its manufacturing method between the positive back side of chip | |
| KR20090050762A (en) | Display device | |
| JP2018092223A (en) | Fingerprint detector, and electronic apparatus | |
| KR20100045076A (en) | Semiconductor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |