CN109863573B - 检查基板的方法和具有指令存储于其上的计算机可读介质 - Google Patents

检查基板的方法和具有指令存储于其上的计算机可读介质 Download PDF

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Publication number
CN109863573B
CN109863573B CN201680090320.8A CN201680090320A CN109863573B CN 109863573 B CN109863573 B CN 109863573B CN 201680090320 A CN201680090320 A CN 201680090320A CN 109863573 B CN109863573 B CN 109863573B
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Prior art keywords
substrate
charged particle
images
particle beam
grain structure
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CN201680090320.8A
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Chinese (zh)
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CN109863573A (zh
Inventor
伯纳德·G·穆勒
张雪娜
彼得·努南
库普雷特·辛格·维迪
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical or photographic arrangements associated with the tube
    • H01J37/222—Image processing arrangements associated with the tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/221—Image processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/226—Image reconstruction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244—Detection characterized by the detecting means
    • H01J2237/2446—Position sensitive detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/2611—Stereoscopic measurements and/or imaging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2809—Scanning microscopes characterised by the imaging problems involved
    • H01J2237/2811—Large objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2814—Measurement of surface topography

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
CN201680090320.8A 2016-12-12 2016-12-12 检查基板的方法和具有指令存储于其上的计算机可读介质 Active CN109863573B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/080662 WO2018108239A1 (en) 2016-12-12 2016-12-12 Ltps layer qualification on display substrates by inline sem using a multi perspective detector and method for inspecting a large area substrate

Publications (2)

Publication Number Publication Date
CN109863573A CN109863573A (zh) 2019-06-07
CN109863573B true CN109863573B (zh) 2021-10-15

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CN201680090320.8A Active CN109863573B (zh) 2016-12-12 2016-12-12 检查基板的方法和具有指令存储于其上的计算机可读介质

Country Status (4)

Country Link
KR (1) KR102260984B1 (ko)
CN (1) CN109863573B (ko)
TW (1) TWI734875B (ko)
WO (1) WO2018108239A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020011580A1 (en) * 2018-07-13 2020-01-16 Asml Netherlands B.V. Sem image enhancement methods and systems
WO2023155078A1 (en) * 2022-02-16 2023-08-24 Applied Materials, Inc. Method of in-line inspection of a substrate, scanning electron microscope, and computer-readable medium

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1073923C (zh) * 1996-04-19 2001-10-31 东丽株式会社 芳香族聚酰胺薄膜及其制备方法以及采用芳香族聚酰胺薄膜的磁记录媒体
CN101622525A (zh) * 2007-02-28 2010-01-06 株式会社尼康 观察方法、检查装置及检查方法
CN102192908A (zh) * 2010-03-15 2011-09-21 株式会社日立高新技术 多晶硅薄膜检查方法及其装置
WO2016101978A1 (en) * 2014-12-22 2016-06-30 Applied Materials, Inc. Apparatus for inspecting a substrate, method for inspecting a substrate, large area substrate inspection apparatus and method of operating thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007067296A2 (en) * 2005-12-02 2007-06-14 Alis Corporation Ion sources, systems and methods
US7981150B2 (en) * 2006-11-09 2011-07-19 Boston Scientific Scimed, Inc. Endoprosthesis with coatings
US20080294236A1 (en) * 2007-05-23 2008-11-27 Boston Scientific Scimed, Inc. Endoprosthesis with Select Ceramic and Polymer Coatings
JP4936985B2 (ja) * 2007-05-14 2012-05-23 株式会社日立ハイテクノロジーズ 走査電子顕微鏡およびそれを用いた三次元形状測定装置
DE102012217761B4 (de) * 2012-09-28 2020-02-06 Carl Zeiss Microscopy Gmbh Verfahren zur Vermeidung von Artefakten beim Serial Block Face Imaging
JP6084888B2 (ja) * 2013-04-17 2017-02-22 株式会社アドバンテスト 欠陥検査装置及び欠陥検査方法
KR20160024542A (ko) * 2014-08-26 2016-03-07 현대제철 주식회사 강재의 탄화물 분석방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1073923C (zh) * 1996-04-19 2001-10-31 东丽株式会社 芳香族聚酰胺薄膜及其制备方法以及采用芳香族聚酰胺薄膜的磁记录媒体
CN101622525A (zh) * 2007-02-28 2010-01-06 株式会社尼康 观察方法、检查装置及检查方法
CN102192908A (zh) * 2010-03-15 2011-09-21 株式会社日立高新技术 多晶硅薄膜检查方法及其装置
WO2016101978A1 (en) * 2014-12-22 2016-06-30 Applied Materials, Inc. Apparatus for inspecting a substrate, method for inspecting a substrate, large area substrate inspection apparatus and method of operating thereof

Also Published As

Publication number Publication date
KR102260984B1 (ko) 2021-06-03
KR20190052121A (ko) 2019-05-15
CN109863573A (zh) 2019-06-07
WO2018108239A1 (en) 2018-06-21
TW201837865A (zh) 2018-10-16
TWI734875B (zh) 2021-08-01

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