CN109425908A

CN109425908A - Electronic component transmission device and electronic component check device

Info

Publication number: CN109425908A
Application number: CN201810999515.5A
Authority: CN
Inventors: 中村敏
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2017-08-31
Filing date: 2018-08-29
Publication date: 2019-03-05
Also published as: JP2019045231A; TW201913863A

Abstract

The application provides electronic component transmission device and electronic component check device, with a simple configuration can whether there is or not the postures of the electronic component in electronic component or mounting portion in accurate judgement mounting portion.Electronic component transmission device has electronic component transport unit, has the mounting portion of mounting electronic component, the electronic component can be transmitted between first position and the second position；Fluid suction unit can attract fluid from the mounting portion；Irradiation portion, can be to mounting portion side irradiation light；And acceptance part, the light of the irradiation portion irradiation can be received, when the electronic component transport unit is located at the first position, the attraction of the fluid is carried out by the fluid suction unit, and the irradiation of the light is carried out by the irradiation portion, and the light income of the light in flow and the acceptance part based on the fluid judges that whether there is or not the postures of the electronic component in the electronic component or the mounting portion in the mounting portion.

Description

Electronic component transmission device and electronic component check device

Technical field

The present invention relates to electronic component transmission device and electronic component check devices.

Background technique

Conventionally, there is known the electronic component inspection checked such as the electrical characteristic to electronic component IC device Device is assembled with the electronics member device of the maintaining part for IC device to be sent to inspection portion in the electronic component check device Part transmission device.In the inspection of IC device, IC device is configured in maintaining part, and make to be set to multiple probes of maintaining part with Each termination contact of IC device.

The electronic component transmission device, which has, to be heated or is cooled down to IC device in advance and adjusted IC device The confession being sent to for the temperature-uniforming plate of the temperature suitable for inspection, by the IC device for having carried out temperature adjustment through temperature-uniforming plate near inspection portion To shuttle, carry out the transmission of IC device between pallet and temperature-uniforming plate configured with IC device and temperature-uniforming plate and supply are shuttled First device transfer head of the transmission of the IC device between part, is supplied the recycling shuttle for transmitting the IC device after checking The of the transmission of IC device between the transmission of IC device between shuttle and inspection portion and inspection portion and recycling shuttle Two device transfer heads and the transmission for carrying out the IC device between recycling shuttle and the pallet configured for the IC device to be recycled Third device transfer head etc..Supply shuttle and recycling shuttle are respectively provided with multiple pouch-shaped portions for the configuration of IC device.

In addition, Patent Document 1 discloses the electronic component examinations that can determine whether IC device remains on socket Experiment device.

There is the electronic component and device testing unit shooting unit shot to socket, storage to be taken by shooting unit shooting Whether the storage unit and judgement IC device of the reference image data of the socket being not installed in the state of IC device obtained are residual It stays in the residual judging unit on socket.Also, in the electronic component and device testing unit, socket is shot by shooting unit, is obtained The check image data of the socket are taken, and by residual judging unit to the check image data and the reference image data It is compared, therefore, it is determined that whether IC device remains on socket.

Patent document 1: International Publication No. 2007/17953

In previous electronic component transmission device, the IC device before inspection is supplied to shuttle, and to be transported into inspection portion attached Closely.In addition, the IC device after checking is recovered shuttle and transports.

Then, regardless of in which shuttle, when the IC device on shuttle take a seat state difference when, sometimes due to wearing Moving for shuttle and cause IC device to fly out.In that case, it is possible to destroy qualified IC device.Additionally, there are make electronics The problem of driving of component transmission device stops, the time efficiency of inspection reduces.

In addition, will determine the device whether IC device remains on socket is worn applied to whether judgement IC device remains on In the case where the device of shuttle, make device large-scale in hardware aspect and software aspects, i.e., there are device enlargement and The composition of device and control become complicated problem.

Summary of the invention

The present invention is at least part to solve the above-mentioned problems and completes, and can be used as mode below and realizes.

Electronic component transmission device of the invention is characterized in that having: electronic component transport unit, has mounting electricity The mounting portion of sub- component, and the electronic component can be transmitted between the first location and the second location；Fluid suction unit, The fluid can be attracted from the mounting portion via the passable flow path of fluid；Irradiation portion can shine to the mounting portion side Penetrate light；Acceptance part can receive the light of the irradiation portion irradiation；And control unit, control the electronic component transmission The movement in portion, the fluid suction unit, the irradiation portion and the acceptance part, the control unit are passed in the electronic component When portion being sent to be located at the first position, the attraction of the fluid is carried out by the fluid suction unit, and passes through the irradiation portion The irradiation of the light is carried out, and based on the light in the flow and the acceptance part by the fluid of the flow path Light income, judge that whether there is or not the electronic components in the electronic component or the mounting portion in the mounting portion Posture.

Can accurately it be sentenced by the attraction and the irradiation of light this simple composition that carry out fluid in first position as a result, Whether there is or not the postures of the electronic component in electronic component, mounting portion in the mounting portion of disconnected electronic component transport unit.Also, Testing result obtained by the flow of detection fluid and the light income of light is used in the judgement.It, can by using both information Improve the accuracy of judgement.

In electronic component transmission device of the invention, it is preferred that in the stream of the fluid by the flow path When amount is the flow threshold being previously set or less, the control unit, which is judged as in the mounting portion, the electronic component, And the posture of the electronic component in the mounting portion is appropriate.

Thereby, it is possible to the various conditions according to as size of the attraction of such as pump etc. suitably to set flow threshold, Therefore, the judgement of the posture quality of the electronic component of the flow based on fluid can accurately be carried out.

In electronic component transmission device of the invention, it is preferred that in the stream of the fluid by the flow path Amount is more than the flow threshold being previously set, and the light income of the light in the acceptance part is more than the light income being previously set When threshold value, the control unit is judged as in the mounting portion without the electronic component.

Thereby, it is possible to this two information of the light income of flow and light based on fluid, accurately carry out that whether there is or not electronic components Judgement.

In electronic component transmission device of the invention, it is preferred that in the stream of the fluid by the flow path Amount is more than the flow threshold being previously set, and the light income of the light in the acceptance part is the light income threshold being previously set When value is following, the control unit, which is judged as in the mounting portion, the electronic component, but described in the mounting portion The posture of electronic component is inappropriate.

Thereby, it is possible to this two information of the light income of flow and light based on fluid, accurately carry out electronics member device together The judgement of the presence or absence of part and posture.

In electronic component transmission device of the invention, it is preferred that the light of the light in the acceptance part Amount is more than the light income threshold value being previously set, and is the flow threshold being previously set by the flow of the fluid of the flow path When value is following, the control unit, which is judged as in the mounting portion, the electronic component, and the institute in the mounting portion The posture for stating electronic component is appropriate.

Thereby, it is possible to this two information of the flow of light income and fluid based on light, accurately carry out the appearance of electronic component The judgement of gesture quality.

In electronic component transmission device of the invention, it is preferred that the light of the light in the acceptance part Amount is more than the light income threshold value being previously set, and is more than the flow being previously set by the flow of the fluid of the flow path When threshold value, the control unit is judged as in the mounting portion without the electronic component.

Thereby, it is possible to this two information of the flow of light income and fluid based on light, accurately carry out that whether there is or not electronic components Judgement.

In electronic component transmission device of the invention, it is preferred that institute of the control unit in the acceptance part When the light income for stating light is the light income threshold value being previously set or less, the attraction of the fluid of stipulated time is carried out, described The light income of the light in acceptance part is still to be judged as in the mounting portion in the light income threshold value situation below There is the electronic component, but the posture of the electronic component in the mounting portion is inappropriate, in the acceptance part When the light income of the light is more than the light income threshold value, being judged as in the mounting portion has the electronic component, and The posture of the electronic component in the mounting portion is appropriate.

As a result, for example and the presence or absence of non-immediate judgement electronic component and posture, when but can spend as much as possible Between accurately carry out the judgement.

In electronic component transmission device of the invention, it is preferred that the electronic component has prominent formation Terminal, the mounting portion have the micro-valleys entered when loading the electronic component for the terminal.

As a result, when attracting mounting portion using fluid suction unit, the flow of detection generates enough variations.Further, it is possible to The result is used in electronic component transport unit to whether there is or not the judgements of the posture of electronic component, electronic component.

In electronic component transmission device of the invention, it is preferred that the mounting portion by with the fluid communication Recess portion is constituted, and is arranged or is connected in the midway of the flow path and detects to the flow of the fluid by the flow path Flow testing division.

Thereby, it is possible to accurately detect the flow of the fluid by flow path.

Electronic component check device of the invention is it is characterized in that, have: electronic component transport unit, has mounting electricity The mounting portion of sub- component, and the electronic component can be transmitted between the first location and the second location；Fluid suction unit, The fluid can be attracted from the mounting portion via the passable flow path of fluid；Irradiation portion can shine to the mounting portion side Penetrate light；Acceptance part can receive the light of the irradiation portion irradiation；Inspection portion checks the electronic component；And control Portion controls the movement of the electronic component transport unit, the fluid suction unit, the irradiation portion and the acceptance part, institute Control unit is stated when the electronic component transport unit is located at the first position, the stream is carried out by the fluid suction unit The attraction of body, and the irradiation of the light is carried out by the irradiation portion, and the stream based on the fluid by the flow path The light income of amount and the light in the acceptance part, judges that whether there is or not the electronic component or institutes in the mounting portion State the posture of the electronic component in mounting portion.

In addition, electronic component can be sent to inspection portion, therefore, can be carried out in inspection portion for electronics member The inspection of device.

Detailed description of the invention

Fig. 1 is the diagrammatic perspective of the first embodiment of electronic component check device of the invention from face side Figure.

Fig. 2 is the general view for showing the action state of electronic component check device shown in FIG. 1.

Fig. 3 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And the partial vertical sectional view of the movement (one) of device supply unit.

Fig. 4 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And the partial vertical sectional view of the movement (one) of device supply unit.

Fig. 5 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And the partial vertical sectional view of the movement (one) of device supply unit.

Fig. 6 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And the partial vertical sectional view of the movement (one) of device supply unit.

Fig. 7 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And the partial vertical sectional view of the movement (one) of device supply unit.

Fig. 8 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And device supply unit movement (secondly) partial vertical sectional view.

Fig. 9 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And device supply unit movement (secondly) partial vertical sectional view.

Figure 10 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And device supply unit movement (secondly) partial vertical sectional view.

Figure 11 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And device supply unit movement (secondly) partial vertical sectional view.

Figure 12 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And device supply unit movement (thirdly) partial vertical sectional view.

Figure 13 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And device supply unit movement (thirdly) partial vertical sectional view.

Figure 14 is successively to show device transfer head of the electronic component check device shown in FIG. 1 in device supply area And device supply unit movement (thirdly) partial vertical sectional view.

Figure 15 is the pump for showing device transfer head of the electronic component check device shown in FIG. 1 in device supply area Action moment and fluid suction unit pump action moment timing diagram.

Figure 16 is the process for showing the control program for the control unit being built in electronic component check device shown in FIG. 1 Figure.

Figure 17 is to show the control unit being built in electronic component check device (second embodiment) of the invention Control the flow chart of program.

Figure 18 is the plane for showing the device supply unit of electronic component check device of the invention (third embodiment) Figure.

Description of symbols

1 ... electronic component check device, 10 ... electronic component transmission devices, 11A ... tray delivery mechanism, 11B ... Tray delivery mechanism, 12 ... temperature adjustment sections, 13 ... device transfer heads, 131 ... adsorption sections, 132 ... pumps, the supply of 14 ... devices Portion, 14A ... device supply unit, 14B ... device supply unit, 141 ... recess portions, 141-1 ... recess portion, 141-2 ... recess portion, 141-3 ... Recess portion, 141-4 ... recess portion, 141a ... micro-valleys, the bottom surface 141b ..., 142 ... pedestals, 143 ... driving portions, 144 ... linearly lead Rail, 145 ... guide rails, 146 ... sliding blocks, 147 ... flow paths, 148 ... ports, 15 ... tray delivery mechanisms, 16 ... inspection portions, 17 ... devices Part transfer head, 17A ... device transfer head, 17B ... device transfer head, 18 ... device recoverers, 18A ... device recoverer, 18B ... Device recoverer, 19 ... recycling pallets, 20 ... device transfer heads, 21 ... tray delivery mechanisms, 22A ... tray delivery mechanism, 22B ... tray delivery mechanism, 231 ... first spaced walls, 232 ... second spaced walls, 233 ... third spaced walls, between 234 ... the 4th Next door, 235 ... the 5th spaced walls, 241 ... front covers, 242 ... side covers, 243 ... side covers, 244 ... rear covers, 245 ... top covers, 25 ... pass Send portion, 26 ... flow testing divisions, 27 ... irradiation portions, 28 ... acceptance parts, 3 ... fluid suction units, 31 ... fluid suction unit main bodys, 311 ... flow paths, 32 ... pumps, 90 ... IC devices, 902 ... terminals (electronic component side terminal), 200 ... pallets, 300 ... monitoring Device, 301 ... display pictures, 400 ... signal lamps, 500 ... loudspeakers, 600 ... Mouse tables, 700 ... operation panels, 800 ... controls Portion, A1 ... pallet supply area, A2 ... device supply area, the inspection area A3 ..., A4 ... device recovery zone, A5 ... pallet are gone Except region, FL ... fluid, LB ... laser, S101~S110 ... step, S201~S213 ... step, α_11A... arrow, α_11B... arrow Head, α_13X... arrow, α_13Y... arrow, α₁₄... arrow, α₁₅... arrow, α_17Y... arrow, α₁₈... arrow, α_20X... arrow, α_20Y… Arrow, α₂₁... arrow, α_22A... arrow, α_22B... arrow, α₉₀... arrow

Specific embodiment

Hereinafter, preferred embodiment based on the figure, explains electronic component transmission device of the invention in detail And electronic component check device.

< first embodiment >

In the following, referring to Fig.1~Figure 16, to electronic component transmission device and electronic component check device of the invention First embodiment be illustrated.It should be noted that in the following, for ease of description, as shown in Figure 1, by mutually orthogonal Three axis are set as X-axis, Y-axis and Z axis.In addition, the X/Y plane including X-axis and Y-axis is level, Z axis is vertical.In addition, will be with X-axis Parallel direction is also referred to as " X-direction (first direction) ", and the direction parallel with Y-axis is also referred to as " Y-direction (second direction) ", will The direction parallel with Z axis is also referred to as " Z-direction (third direction) ".In addition, by the arrow of all directions towards direction be known as " just ", By its opposite direction referred to as " negative ".In addition, "horizontal" described in present specification is not limited to complete level, as long as It is the transmission for not hindering electronic component, also includes relative to horizontal how much (being, for example, less than 5 ° or so) inclined states.In addition, Sometimes upside, the i.e. Z-direction positive side in Fig. 1 and Fig. 3~Figure 14 is known as "upper" or " top ", by downside, i.e. Z axis side It is known as "lower" or " lower section " to negative side.

Electronic component transmission device 10 of the invention has appearance shown in FIG. 1.The electronic component of the invention passes It send device 10 to include electronic component transport unit, there is mounting portion of the mounting as the IC device 90 of electronic component, and energy It is enough to transmit IC device 90 (electronic component) between the first location and the second location；Fluid suction unit 3, can be via fluid FL Passable flow path 147 attracts fluid FL from mounting portion；Irradiation portion 27 can irradiate laser LB (light) towards mounting portion side；Light Portion 28 can receive the laser LB (light) of the irradiation of irradiation portion 27；And control unit 800, electronic component transport unit, fluid are inhaled The movement for drawing portion 3, irradiation portion 27 and acceptance part 28 is controlled.Also, electronic component transmission device 10 is in electronic component When transport unit is located at first position, the attraction of fluid FL is carried out by fluid suction unit 3, and laser LB is carried out by irradiation portion 27 The irradiation of (light), the laser LB (light) received based on the flow by the fluid FL of flow path 147 and by acceptance part 28 by Light quantity judges that whether there is or not the IC devices 90 (electronic component) in IC device 90 (electronic component) or mounting portion in mounting portion Posture.It should be noted that in the present embodiment, " electronic component transport unit " is device supply unit 14.In the situation Under, " mounting portion " is recess portion 141 possessed by device supply unit 14.In addition, " first position " is device supply unit 14 by IC device Transmission initial position when part 90 is sent near inspection portion 16, " second position " be as transfer destination inspection portion 16 it is attached Closely.

According to the present invention constituted in this way, as described later, by the attraction and the laser LB that carry out fluid FL in first position Irradiation this it is simple constitute, can accurately judge that whether there is or not IC devices 90, recess portion in the recess portion 141 of device supply unit 14 The posture of IC device 90 in 141.Also, in this judgment using the laser LB in the flow and acceptance part 28 of detection fluid FL Testing result obtained from by light state (light income).By using the two information, the accuracy of judgement can be improved.

In addition, as shown in Fig. 2, electronic component check device 1 of the invention have electronic component transmission device 10, and And also there is the inspection portion 16 checked electronic component.That is, electronic component check device 1 of the invention has: electricity Sub- component transport unit, has mounting portion of the mounting as the IC device 90 of electronic component, and can in first position and IC device 90 (electronic component) is transmitted between the second position；Fluid suction unit 3, can be via the passable flow path of fluid FL 147 attract fluid FL from mounting portion；Irradiation portion 27 can irradiate laser LB (light) towards mounting portion side；Acceptance part 28 can receive The laser LB (light) that irradiation portion 27 is irradiated；Inspection portion 16 checks IC device 90 (electronic component)；And control unit 800, to electricity The movement of sub- component transport unit, fluid suction unit 3, irradiation portion 27 and acceptance part 28 is controlled.Also, electronic component is examined Device 1 is looked into when electronic component transport unit is located at first position, the attraction of fluid FL is carried out by fluid suction unit 3, and is led to The irradiation that irradiation portion 27 carries out laser LB (light) is crossed, is connect based on the flow by the fluid FL of flow path 147 and by acceptance part 28 The light income of the laser LB (light) received judges that whether there is or not in IC device 90 (electronic component) or mounting portion in mounting portion The posture of IC device 90 (electronic component).

It can get the electronic component check device 1 with electronic component transmission device 10 above-mentioned as a result,. In addition, electronic component (IC device 90) inspection portion 16 can be sent to, thereby, it is possible to be carried out by inspection portion 16 to the electronics The inspection of component.

Hereinafter, the composition in each portion is described in detail.

As shown in Figure 1 and Figure 2, the electronic component check device 1 with electronic component transmission device 10 is to transmit for example The electronic components such as the IC device as BGA (Ball Grid Array: ball grid array) encapsulation are simultaneously examined in its transmit process Look into, test the device of the electrical characteristic of (in the following, referred to as " checking " merely) electronic component.It should be noted that in the following, in order to Convenient for explanation, typically it is illustrated to the case where IC device is used as electronic component above-mentioned, as " IC device 90".IC device 90 is in tabular in the present embodiment.In addition, there is IC device 90 (electronic component) protrusion to be formed in it Lower surface is simultaneously configured to rectangular multiple terminals (electronic component side terminal) 902 (referring for example to Fig. 3) in plan view. Each terminal 902 is for example hemispherical.

In addition, in addition to the foregoing, such as can also enumerate " LSI (Large Scale as IC device Integration: large scale integrated circuit) ", " CMOS (Complementary MOS: complementary metal oxide semiconductor) ", " CCD (Charge Coupled Device: charge-coupled device) ", the encapsulation of multiple IC devices is turned into obtained by module " module IC ", " crystal device ", " pressure sensor ", " inertial sensor (acceleration transducer) ", " gyro sensor ", " fingerprint passes Sensor " etc..

Electronic component check device 1 (electronic component transmission device 10) has pallet supply area A1, device supply Region A2, inspection area A3, device recovery zone A4 and pallet remove region A5, and as described later, these regions pass through each wall Portion is divided.Also, IC device 90 removes region A5 from pallet supply area A1 to pallet along arrow α₉₀Direction successively passes through Each region above-mentioned is crossed, and the inspection area A3 in midway is checked.In this way, electronic component check device 1, which has, to be had The electronic component transmission device 10 of the transport unit 25 of IC device 90 is transmitted in a manner of via each region, in the A3 of inspection area The control unit 800 of the control in the inspection portion 16 and each portion of progress that are checked.In addition to this, electronic component check device 1 It is also equipped with monitor 300, signal lamp 400 and operation panel 700.

It should be noted that will be removed configured with pallet supply area A1, pallet for electronic component check device 1 The upside in the side for being configured with inspection area A3, i.e. Fig. 2 is made as face side in a side of region A5, the downside i.e. in Fig. 2 For back side come carry out using.

In addition, electronic component check device 1 be pre-loaded with corresponding to IC device 90 it is various types of it is being replaced, claimed For the external member of " test loaded tool (Change Kit) " come carry out using.IC device 90 (electronic component) is placed in test load Tool.In the electronic component check device 1 of present embodiment, test loaded tool is set to multiple positions, such as has aftermentioned temperature Spend adjustment section 12, device supply unit 14, device recoverer 18.In addition, mounting IC device 90 (electronic component) component in addition to Test loaded tool as described above, there are also the pallet 200 prepared by user, recycling pallet 19, in addition to this there are also inspection portions 16.

Pallet supply area A1 is supplied with the supply unit for being arranged with the pallet 200 of multiple IC devices 90 of non-inspection state. Pallet supply area A1, which can also be referred to as, can be laminated the loading area for loading multiple pallets 200.It should be noted that in this implementation In mode, multiple recess portions (pouch-shaped portion) is configured with rectangular in each pallet 200.It can store, load one by one in each recess portion IC device 90.

Device supply area A2 is will to distinguish from multiple IC devices 90 on the pallet 200 that A1 transmission in pallet supply area comes Transmission is supplied to the region of inspection area A3.It should be noted that with across pallet supply area A1's and device supply area A2 Mode is provided with tray delivery mechanism 11A, the 11B for transmitting pallet 200 in the horizontal direction one by one.Tray delivery mechanism 11A is A part of transport unit 25, can make together with the IC device 90 for being placed in the pallet 200 positive side from pallet 200 to Y-direction, That is the arrow α in Fig. 2_11ADirection is mobile.Thus, it is possible to which IC device 90 is steadily sent into device supply area A2.In addition, support Disk transport mechanism 11B is the arrow α that can make empty pallet 200 into the negative side of Y-direction, i.e. Fig. 2_11BThe mobile movement in direction Portion.Thus, it is possible to which empty pallet 200 is made to be moved to pallet supply area A1 from device supply area A2.

Temperature adjustment section (ソー Network プレート (English statement: soak plate, the Chinese is provided in the A2 of device supply area Language states (an example): temperature-uniforming plate)) 12, device transfer head 13 and tray delivery mechanism 15.In addition, also being provided with to be supplied across device Give the mode of region A2 and inspection area A3 mobile device supply unit 14.

Temperature adjustment section 12 is the component for loading multiple IC devices 90, referred to as can IC device 90 to the mounting together " temperature-uniforming plate " being heated or cooled.IC device by the temperature-uniforming plate, before can checking in advance inspection portion 16 90 are heated or cooled, and are adjusted to the temperature suitable for the inspection (high temperature inspection, low temperature inspection).

Temperature adjustment section 12 as such mounting portion is fixed.Thereby, it is possible to steadily to the temperature adjustment section 12 On IC device 90 carry out temperature adjustment.

In addition, temperature adjustment section 12 is grounded (ground).

In composition shown in Fig. 2, temperature adjustment section 12 is configured, in the Y direction there are two fixations.In addition, passing through pallet Transport mechanism 11A is transferred into any one temperature adjustment section from the IC device 90 on the pallet 200 that pallet supply area A1 is sent into 12。

Device transfer head 13 is the handle part for holding IC device 90, and being supported in the A2 of device supply area can be along X Direction and Y-direction are mobile, and then are also supported to also move in z-direction.The device transfer head 13 is also transport unit 25 a part can be responsible for from the IC device 90 between the pallet supply area A1 pallet 200 being sent into and temperature adjustment section 12 Transmission and temperature adjustment section 12 and aftermentioned device supply unit 14 between IC device 90 transmission.It should be noted that In Fig. 2, pass through arrow α_13XDevice transfer head 13 is shown in the movement of X-direction, passes through arrow α_13YDevice transfer head 13 is shown Movement in the Y direction.

As shown in Fig. 3~Figure 14, device transfer head 13 has the adsorption section 131 that IC device 90 is held using absorption.In addition, The pump 132 for generating the attraction of absorption IC device 90 is connected to adsorption section 131.

Device supply unit 14 is the component for the IC device 90 that mounting has carried out temperature adjustment by temperature adjustment section 12, quilt It " supply shuttle plate " that the IC device 90 can be referred to as sent near inspection portion 16 or is referred to simply as " supplying shuttle ".It should Device supply unit 14 can also be used as a part of transport unit 25.The device supply unit 14 has storage, loads IC device 90 Recess portion (pouch-shaped portion) 141 (referring for example to Fig. 3).

In addition, device supply unit 14 be supported to can between device supply area A2 and inspection area A3 in X direction, That is arrow α₁₄Direction moves back and forth.Device supply unit 14 can steadily pass IC device 90 from device supply area A2 as a result, It send to the inspection portion 16 of inspection area A3, in addition, IC device 90 by device transfer head 17 takes it away in the A3 of inspection area Afterwards, device supply unit 14 can again return to device supply area A2.

In composition shown in Fig. 2, along Y-direction configuration, there are two device supply units 14, sometimes by the device of Y-direction negative side Supply unit 14 is referred to as " device supply unit 14A ", and the device supply unit 14 of Y-direction positive side is referred to as " device supply unit 14B ".And And device supply unit 14A is transferred into the A2 of device supply area for the IC device 90 in temperature adjustment section 12 or device supplies Give portion 14B.In addition, be similarly configured to can be to being placed in the device supply unit 14 for device supply unit 14 and temperature adjustment section 12 IC device 90 be heated or cooled.It, can accordingly, for the IC device 90 for having carried out temperature adjustment by temperature adjustment section 12 To be sent near the inspection portion 16 of inspection area A3 with maintaining its temperature adjustment state.It should be noted that device supply unit 14 are also grounded in the same manner as temperature adjustment section 12.

Tray delivery mechanism 15 is that the empty pallet 200 in the state of eliminating all IC devices 90 is supplied in device To the positive side of X-direction, i.e. arrow α in the A2 of region₁₅The mechanism of direction transmission.Also, after the transmission, pass through pallet conveyer Structure 11B makes empty pallet 200 return to pallet supply area A1 from device supply area A2.

Inspection area A3 is the region for checking IC device 90.It is equipped in the A3 of the inspection area and IC device 90 is checked Inspection portion 16 and device transfer head 17.

Device transfer head 17 is a part of transport unit 25, and being similarly configured to temperature adjustment section 12 can be to holding IC device 90 is heated or cooled.The device transfer head 17 can hold IC device 90 by absorption.Thereby, it is possible to hold dimension The IC device 90 for holding the temperature adjustment state, with being able to maintain that the temperature adjustment state by IC device 90 in inspection area A3 Interior transmission.

Such device transfer head 17 is supported to move back and forth in the A3 of inspection area along Y-direction and Z-direction, It is known as a part of the mechanism of " index arm (index arm) ".Device transfer head 17 can be from from device drainage area as a result, The device supply unit 14 that domain A2 is transported into picks up IC device 90 and transmits, is placed in inspection portion 16.

It should be noted that passing through arrow α in Fig. 2_17YThe reciprocating movement of device transfer head 17 in the Y direction is shown. Although but not limited to this in addition, device transfer head 17 is supported to move back and forth along Y-direction, it can also support and be It can also move back and forth in X direction.In addition, in composition shown in Fig. 2, there are two device transfer head 17 configures in the Y direction, Sometimes the device transfer head 17 of Y-direction negative side is referred to as " device transfer head 17A ", the device transfer head 17 of Y-direction positive side is claimed Make " device transfer head 17B ".Device transfer head 17A can be responsible for IC device 90 from device supply unit 14A in the A3 of inspection area Transmission to inspection portion 16, device transfer head 17B can be responsible in the A3 of inspection area IC device 90 from device supply unit 14B to The transmission in inspection portion 16.

Inspection portion 16 (socket) loads the IC device 90 as electronic component to check the electrical characteristic of the IC device 90. The inspection portion 16 has the recess portion of storage, mounting IC device 90, and the bottom of the recess portion is provided with multiple probes (mounting portion side Son).Then, the terminal 902 of IC device 90 and the probe can connect in a manner of conduction, contact, so as to Carry out the inspection of IC device 90.The inspection of IC device 90 is the inspection control being had based on the tester connecting with inspection portion 16 The program stored in portion carries out.

Such inspection portion 16 is heated or cooled IC device 90 in the same manner as temperature adjustment section 12, can be by the IC Device 90 is adjusted to the temperature suitable for checking.

Device recovery zone A4 is to recycle multiple IC devices 90 that its inspection is examined and finished in the A3 of inspection area Region.Recycling pallet 19, device transfer head 20 and tray delivery mechanism 21 are provided in the A4 of the device recovery zone. In addition, being additionally provided with the mobile device recoverer 18 of across inspection area A3 and device recovery zone A4.In addition, in device recovery zone Free pallet 200 is also prepared in A4.

Device recoverer 18 is can to load to finish the IC device 90 checked by inspection portion 16 and by the IC device 90 It is sent to the mounting portion of device recovery zone A4, be referred to as " recycling shuttle plate " or is referred to simply as " recycling shuttle ". The device recoverer 18 also can be used as a part of transport unit 25.

In addition, device recoverer 18 be supported to can between inspection area A3 and device recovery zone A4 in X direction, That is arrow α₁₈Direction moves back and forth.In addition, device recoverer 18 is in the same manner as device supply unit 14 in composition shown in Fig. 2 In the Y direction there are two configuration, the device recoverer 18 of Y-direction negative side is referred to as " device recoverer 18A " sometimes, by Y-direction The device recoverer 18 of positive side is referred to as " device recoverer 18B ".Then, the IC device 90 in inspection portion 16 is transmitted, is placed in Device recoverer 18A or device recoverer 18B.It should be noted that IC device 90 is from inspection portion 16 to device recoverer 18A Transmission be responsible for by device transfer head 17A, be responsible for from inspection portion 16 to the transmission of device recoverer 18B by device transfer head 17B. In addition, device recoverer 18 is also grounded in the same manner as temperature adjustment section 12, device supply unit 14.

Recycling is the component for the IC device 90 that the portion 16 on inspection that loads is checked with pallet 19, is fixed as not in device It is moved in the A4 of part recovery zone.Even the device for being configured with the various movable parts such as device transfer head 20 more as a result, returns Region A4 is received, the IC device 90 for checking and finishing can also be steadily loaded on recycling pallet 19.It should be noted that scheming In composition shown in 2, there are three recycling is configured in X direction with pallet 19.

In addition, empty pallet 200 is also there are three configurations in X direction.The pallet 200 of the sky is also mounting portion 16 on inspection The component of the IC device 90 checked.Then, the mobile IC device come on the device recoverer 18 of device recovery zone A4 Part 90 transmitted, be placed in recycling pallet 19 and the pallet 200 of sky in either on.Each inspection result pair is pressed as a result, IC device 90 is classified, is recycled.

Device transfer head 20 is supported to can be in the A4 of device recovery zone in X direction and Y-direction is mobile, and also With can also be along the part that Z-direction moves.The device transfer head 20 is a part of transport unit 25, can by IC device 90 from Device recoverer 18 is sent to recycling pallet 19, empty pallet 200.It should be noted that passing through arrow α in Fig. 2_20XShow Device transfer head 20 passes through arrow α in the movement of X-direction out_20YThe movement of device transfer head 20 in the Y direction is shown.

Tray delivery mechanism 21 is the pallet 200 for the sky that will be transported into from pallet removal region A5 in the A4 of device recovery zone To X-direction, i.e. arrow α₂₁The mechanism of direction transmission.Then, after the transmission, empty pallet 200 is configured in recycling IC device That is, the position of part 90, can become any pallet in three above-mentioned empty pallets 200.

Pallet removal region A5 is recycling, removes the pallet 200 for being arranged with the multiple IC devices 90 for checking the state that finishes Removal portion.Multiple pallets 200 can be stacked in pallet removal region A5.

In addition, being provided with pallet 200 in a manner of across device recovery zone A4 and pallet removal region A5 one by one along the side Y Tray delivery mechanism 22A, tray delivery mechanism 22B to transmission.Tray delivery mechanism 22A is a part of transport unit 25, is Pallet 200 can be made along Y-direction, i.e. arrow α_22AThe moving portion that direction moves back and forth.Thus, it is possible to the IC device that inspection is finished Part 90 is sent to pallet removal region A5 from device recovery zone A4.In addition, tray delivery mechanism 22B can be used in recycling IC The empty pallet 200 of device 90 is to the positive side of Y-direction, i.e. arrow α_22BDirection is mobile.Thus, it is possible to make empty pallet 200 from support Disk removal region A5 is moved to device recovery zone A4.

Control unit 800 has at least one processor, which carries out various judgements, various orders etc..Control unit 800 Such as tray delivery mechanism 11A, tray delivery mechanism 11B, temperature adjustment section 12, device transfer head 13, device can be controlled and supplied It is passed to portion 14, tray delivery mechanism 15, inspection portion 16, device transfer head 17, device recoverer 18, device transfer head 20, pallet Send the movement of mechanism 21, tray delivery mechanism 22A and tray delivery mechanism 22B etc..In addition to this, control unit 800 can be controlled The movement of irradiation portion 27, acceptance part 28, fluid suction unit 3 processed.

It should be noted that in the present embodiment, control unit 800 is built in electronic component check device 1, but unlimited In this.For example, control unit 800 also can be set in external equipments such as external computers.In addition, the external equipment for example in the presence of The case where being communicated via cable etc. with electronic component check device 1, the case where of carrying out wireless communication, via network (example Such as internet) the case where being connect with electronic component check device 1.

Operator can set by monitor 300 or confirm the operation condition etc. of electronic component check device 1.The prison Device 300 is controlled for example with the display picture 301 being made of liquid crystal panel, is configured at the front of electronic component check device 1 Upper lateral part.As shown in Figure 1, right side is provided with the Mouse table 600 of mounting mouse in the figure of pallet removal region A5.The mouse exists Use when being operated to picture shown by monitor 300.

In addition, being configured with operation panel 700 in the lower right of Fig. 1 for monitor 300.Operation panel 700 with Order electronic component check device 1 carries out desired movement to monitor 300 respectively.

In addition, signal lamp 400 can report the movement of electronic component check device 1 by the combination of luminous color State etc..Signal lamp 400 is configured at the top of electronic component check device 1.It should be noted that loudspeaker 500 is built in In electronic component check device 1, the movement shape of electronic component check device 1 can also be reported by the loudspeaker 500 State etc..

In electronic component check device 1, supplied by 231 segmented tray supply area A1 of the first spaced walls and device Between the A2 of region, is separated between device supply area A2 and inspection area A3 by the second spaced walls 232, pass through third spaced walls 233 separate between inspection area A3 and device recovery zone A4, separate device recovery zone A4 and support by the 4th spaced walls 234 Disk removes between the A5 of region.In addition, between device supply area A2 and device recovery zone A4 also by the 5th spaced walls 235 every It opens.

The most external (most exterior) of electronic component check device 1 is covered by cover, the cover for example have front cover 241, Side cover 242, side cover 243, rear cover 244 and top cover 245.

As previously mentioned, device supply unit 14 will be sent to as the IC device 90 of electronic component from device supply area A2 Inspection area A3.In addition, there is the device supply unit 14 as the electronic component transport unit device supply unit 14A and device to supply Give portion 14B (referring to Fig. 2).Device supply unit 14A is identical structure other than configuration position is different from device supply unit 14B At, therefore be illustrated below using device supply unit 14A as representative.

As shown in Fig. 3~Figure 14, device supply unit 14A has flat pedestal 142 and in X direction reciprocal driving The driving portion 143 of pedestal 142.

Pedestal 142 (electronic component transport unit) has the recess portion 141 of storage, mounting IC device 90 (electronic component) (mounting portion) (referring for example to Fig. 5).The recess portion 141 is recessed from the upper surface of pedestal 142 and is formed.It should be noted that recess portion 141 formation number is one in the present embodiment, and but it is not limited to this, is also possible to multiple.In addition, multiple being formed with In the case where recess portion 141, preferably with rectangular configuration in X-direction and Y-direction.In this case, for the configuration number of X-direction Amount, the configuration quantity of Y-direction are not defined especially.In addition, the mounting portion of mounting IC device 90 is in the present embodiment by recessed It falls into the recess portion 141 formed to constitute, but it is not limited to this, for example, it is also possible to by one of the upper surface as device supply unit 14A The flat part (flat surface) divided is constituted.

As described above, IC device 90 (electronic component) has the prominent multiple terminals 902 formed.(the mounting of recess portion 141 Portion) there are the multiple micro-valleys 141a entered when loading IC device 90 (electronic component) for terminal 902.Each micro-valleys 141a is formed in the bottom surface 141b of recess portion 141.In addition, the degree that there is each micro-valleys 141a terminal 902 can just enter Size.Using such micro-valleys 141a, IC device 90 is steadily placed in recess portion 141, can prevent with bottom surface Gap is formed between 141b (referring to Fig. 5~Fig. 7).As a result, using aftermentioned fluid suction unit 3 to being inhaled in recess portion 141 When drawing, enough variations are generated by the flow that flow testing division 26 detects.Thus, it is possible to be used to judge that device to supply for the result Whether there is or not the postures of IC device 90, IC device 90 on portion 14A.It should be noted that the forming quantity of micro-valleys 141a preferably with The forming quantity of terminal 902 is corresponding, is formed as more than one.

In addition, pedestal 142 (electronic component transport unit) has the flow path 147 being connected to recess portion 141.Flow path 147 is recessed The side of the X-direction negative side of the bottom surface 141b and pedestal 142 in portion 141 is open.Also, in the side, the connection of port 148, It is fixed on flow path 147.Port 148 is corrugated, has retractile elasticity in its longitudinal direction.

Driving portion 143 in X direction back and forth driving pedestal 142, can in the A2 of device supply area first position and inspection The IC device 90 (electronic component) being placed on pedestal 142 is transmitted between the second position looked into the A3 of region.First position is IC device 90 is placed in the position of the recess portion 141 of pedestal 142 by device transfer head 13.The second position is transmitted by device Head 17A takes out the position of IC device 90 from recess portion 141.

The driving portion 143 is constituted such as by linear guides 144.

Linear guides 144 are supported to that pedestal 142 can be moved back and forth in X direction.Linear guides 144 with X-direction by putting down The guide rail 145 of row configuration and two sliding blocks 146 slided on guide rail 145 are constituted.Two sliding blocks 146 are as separated as possible each other Ground configuration, from downside supporting base 142.It should be noted that the configuration quantity of sliding block 146 is two in the present embodiment, But it is not limited to this, such as is also possible to one or three or more.

In addition, driving portion 143, which preferably also has, (does not scheme as the motor of driving source for example other than linear guides 144 Show) and the ball screw (not shown) being connected to motor etc..

Can from recess portion 141 (mounting portion) attract fluid FL fluid suction unit 3 detachably with device supply unit 14A Pedestal 142 connect.As shown in Fig. 3~Figure 14, fluid suction unit 3 has fluid suction unit main body 31 and pump 32.

Fluid suction unit main body 31 is fixed in the A3 of inspection area.The fluid suction unit main body 31 is in bulk.In addition, fluid Suction unit main body 31, which has, penetrates through its flow path 311 that is internal and being formed.One end of flow path 311 is towards the positive side opening of X-direction.By This, when pedestal 142 is located at first position, the port 148 of tubulose is airtightly connect (referring to Fig. 3~Fig. 6, Fig. 8 with flow path 311 ~Figure 14).Hereinafter, the state is referred to as " connection status ".In addition, when pedestal 142 has carried out mobile towards the second position, end Mouth 148 is separated with flow path 311, releases connection status (referring to Fig. 7).In this way, port 148 can take connection status and releasing The connection of the connection status releases state.Thereby, it is possible to mobile pedestal 142 and fixed fluid suction unit main body 31 it Between omit always by the arrangement of the piping of the two connection, therefore, device can be made, which to constitute, to be become simple and constitutes.

Pump 32 is connected in the another side of flow path 311.Pump 32 is under above-mentioned connection status to the recess portion 141 of pedestal 142 Inside attracted.As a result, for example as shown in figure 5, fluid FL from recess portion 141 successively via flow path 147, port 148, flow path 311 And it is inhaled into pump 32.Also, it is detected by the flow of the fluid FL of the flow path 147 by flow testing division 26.

It should be noted that as fluid FL, for example, air (gas), but it is not limited to this, can also with become mist The liquid of shape mixes.

In addition, pump 32 is also configured to that attraction can be adjusted such as each condition according to the size of recess portion 141.

As described above, the mounting portion of mounting IC device 90 (electronic component) is made of recess portion 141.In addition, device supplies The pedestal 142 of portion 14A (electronic component transport unit) has the flow path 147 being connected to recess portion 141.It is set in the midway of flow path 147 Set or be connected with the flow testing division 26 detected to the flow of the fluid FL by flow path 147.Thereby, it is possible to accurately The flow that detection passes through the fluid FL of flow path 147.Then, the testing result, the flow detected are used for device supply unit 14A On whether there is or not the judgements of the posture of IC device 90, IC device 90.

It should be noted that the configuration position of flow testing division 26 is not limited to the position of diagram (such as Fig. 3), for example, both It can be than position upstream shown in Fig. 3 side, it can also side farther downstream.

In addition, not being defined especially as flow testing division 26, such as it is able to use orifice flowmeter, venturi flow Differential pressure flowmeter (restriction flowmeter) as meter etc., can also use volume flowmeter, mass flowmenter in addition to this Deng.Also, flow testing division 26 is electrically connected with control unit 800, is taken into the information from flow testing division 26 by control unit 800 (flow).

In addition, for judging on device supply unit 14A whether there is or not the flow of the posture of IC device 90, IC device 90 either Flow itself, be also possible to for example by flow rate conversion be voltage value obtained by value.

As shown in figure 3, being provided with irradiation portion (illumination region) 27 and acceptance part in the top for the pedestal 142 for being located at first position 28.Irradiation portion 27 and acceptance part 28 are oppositely disposed, but be not limited in the X direction in constituting shown in diagram (such as Fig. 3) This, such as can also be oppositely disposed in the Y direction.

Irradiation portion 27 can irradiate laser LB (light) to (mounting portion) side of recess portion 141 for the pedestal 142 for being located at first position (referring for example to Fig. 5).It as irradiation portion 27, is not defined especially, such as is able to use the device with laser diode.

Acceptance part 28 can receive the laser LB (light) of the irradiation of irradiation portion 27.As acceptance part 28, it is not defined especially, Such as it is able to use the device with photodiode.

In this way, irradiation portion 27 and acceptance part 28 constitute the optical sensor of light-transmission type in couples.Thereby, it is possible to detect to come to shine Whether the laser LB for penetrating portion 27 is received by acceptance part 28.Then, the testing result is for whether there is or not IC devices on device supply unit 14A The judgement of the posture of part 90, IC device 90.It should be noted that irradiation portion 27 and acceptance part 28 are constituted thoroughly in the present embodiment The optical sensor of light type, but it is not limited to this, such as also may be constructed the optical sensor of reflection-type.

It is being intended to IC device 90 is transmitted to the top of device supply unit 14A using device transfer head 13 and by the IC device 90 When being placed in device supply unit 14A, such as next three states (mode) can be caused.The first state is Fig. 3~Fig. 7 institute The state shown.Second of state is state shown in Fig. 8~Figure 11.The third state is state shown in Figure 12~Figure 14.With Under, each state is illustrated.

Firstly, being illustrated referring to Fig. 3~Fig. 7 and Figure 15 to the first state.

As shown in figure 3, device transfer head 13 is in the state for having held IC device 90.In addition, device supply unit 14A is in Pedestal 142 is located at the state of first position.Also, device transfer head 13 be in IC device 90 pedestal 142 recess portion 141 just State of the top towards the recess portion 141.

It should be noted that in the condition shown in figure 3, the attraction movement of fluid suction unit 3 not yet carries out, and pump 32 is in The state of stopping.In addition, the irradiation of laser LB is not also carried out from irradiation portion 27.

Then, as shown in figure 4, device transfer head 13 is made to keep the state for holding IC device 90 and decline.As the decline Position, such as preferably IC device 90 are separated with the bottom surface 141b of recess portion 141 slightly (such as 0.5mm or more and 2mm or less) Position.Such position can for example become the height and the height phase of the upper surface of pedestal 142 of each terminal 902 of IC device 90 With the position of degree.

Then, as shown in the timing diagram of Figure 15, stop the movement of the pump 132 in device transfer head 13, and attract fluid The pump 32 in portion 3 acts.As the movement of pump 132 stops, the attraction of IC device 90 being released from, IC device 90 is to vertical lower section It falls.In addition, by the movement of pump 32, IC device 90 is drawn to flow path 147 together with fluid FL.Then, in this way The complementary effect for falling and attracting, IC device 90 are stablized and are promptly placed in recess portion 141, and shape shown in fig. 5 is become State.90 posture of IC device at this time is appropriate.Here, " posture is appropriate " refers to, as an example, entire IC device 90 is accommodated in In recess portion 141 and terminal 902 enters the state in micro-valleys 141a.In addition, irradiating laser LB from irradiation portion 27.The laser LB passes through on IC device 90, and is received by acceptance part 28.

Then, as shown in fig. 6, device transfer head 13 is made to rise to height identical with the device transfer head 13 in Fig. 3.It needs It is noted that preferably, the irradiation of the laser LB of the attraction and irradiation portion 27 that are carried out by the movement of pump 32 remains former Sample.

Then, as shown in fig. 7, stopping the photograph of the laser LB of the attraction and irradiation portion 27 that carry out by the movement of pump 32 It penetrates, and acts driving portion 143, move together pedestal 142 to inspection area A3 (second position) together with IC device 90.

Next, being illustrated referring to Fig. 8~Figure 11 to second of state.Here, it surrounds with the first above-mentioned state not Same point is illustrated, and then the description thereof will be omitted for same item.

As shown in figure 8, device transfer head 13 is in the state for having held IC device 90.The IC device 90 with it is shown in Fig. 3 State is compared to X-direction positive side and is held with deviateing.In addition, device supply unit 14A is in the shape that pedestal 142 is located at first position State.Also, device transfer head 13 is in the state of recess portion 141 of the IC device 90 towards pedestal 142.

Then, as shown in figure 9, device transfer head 13 is made to maintain the state for holding IC device 90 and decline.The down position For position identical with the height of device transfer head 13 in Fig. 4.

Then, as shown in Figure 10, IC device 90 is discharged from device transfer head 13.Later, IC device 90 is fallen to vertical lower section Under, but it is hooked in the outer edge of recess portion 141, become the posture tilted in recess portion 141.IC device 90 at this time becomes posture not Suitably.Here, " posture is inappropriate " refers to, as an example, the state tilted in recess portion 141 of IC device 90.Though in addition, Laser LB so is irradiated from irradiation portion 27, but due to not received by acceptance part 28 by 90 shading of IC device.

Then, as shown in figure 11, device transfer head 13 is made to rise to height identical with the device transfer head 13 in Fig. 8.

In addition, in the unsuitable situation of posture of IC device 90, it is standby that pedestal 142 is maintained at first position, is limited It is mobile to inspection area A3.

Next, 2~Figure 14 referring to Fig.1, is illustrated the third state.Here, it surrounds and the first above-mentioned state Different points are illustrated, and then the description thereof will be omitted for same item.

As shown in figure 12, device transfer head 13 is in the state for having held IC device 90.In addition, at device supply unit 14A It is located at the state of first position in pedestal 142.Also, device transfer head 13 is in IC device 90 in the recess portion 141 of pedestal 142 State of the surface towards the recess portion 141.

Then, as shown in figure 13, device transfer head 13 is made to maintain the state for holding IC device 90 and decline.The down position For position identical with the height of device transfer head 13 in Fig. 4.Then, it is intended to discharge IC device 90 from device transfer head 13, but IC device 90 is still attached to adsorption section 131.About its reason, such as it is contemplated that machinery is attached in the upper surface of IC device 90 The case where higher liquid of viscosity as oil etc. etc..Alternatively, high temperature check when, device transfer head 13 material be with In the case where the silicon rubber of heat resistance, occurs viscosity due to high temperature, so that IC device 90 is still attached to adsorption section 131.

Then, as shown in figure 14, device transfer head 13 is made to rise to height identical with the device transfer head 13 in Figure 12. At this point, IC device 90 rises together with device transfer head 13.Therefore, become that IC device 90 should be placed in recess portion 141, But the state of (no IC device) is not loaded.In addition, the laser LB irradiated from irradiation portion 27 passes through the state of no IC device 90 On recess portion 141, and received by acceptance part 28.In the case where becoming such state, pedestal 142 is maintained at first position and waits for Machine is limited mobile to inspection area A3.

It then, can be for device supply unit in electronic component check device 1 (electronic component transmission device 10) 14A judges any state that IC device 90 is in above-mentioned three kinds of states.Hereinafter, for the judgement, referring to Fig.1 shown in 6 Flow chart is illustrated.It should be noted that the judgement is carried out by control unit 800.

When the pedestal 142 (electronic component transport unit) of device supply unit 14 is located at first position, make fluid suction unit 3 (pump 32) movement, and start the flow (step S101) that fluid FL is detected by flow testing division 26.In addition, being irradiated from irradiation portion 27 Laser LB (light).

Next, acting the timer (not shown) for being built in control unit 800, judge whether then (step S102).It is judged as in step s 102 in the case of, judges that the flow of the fluid FL detected by flow testing division 26 is It is no for (step S103) below the flow threshold that is previously set.It should be noted that flow threshold is for example asked by experiment in advance Out.

It in step s 103, is the flow threshold feelings below being previously set in the flow of the fluid FL by flow path 147 Under condition, being judged as in recess portion 141 (mounting portion) has IC device 90 (electronic component), and in recess portion 141 (mounting portion) The posture of IC device 90 (electronic component) is appropriate (step S104).By suitably setting flow threshold, Neng Gouzhun like this Really carry out the judgement of the posture quality of the IC device 90 of the flow based on fluid FL.

Next, the pedestal 142 of device supply unit 14A is made to shift to inspection area A3 (step S105).

In addition, being judged as that the flow of fluid FL be more than the flow threshold that is previously set (is not flow in step s 103 Below threshold value) when, judge whether the light income of laser LB (light) is more than the light income threshold value being previously set, judges that laser LB is It is no that (step S106) is received by acceptance part 28.

It is judged as that laser LB is received that (light income of laser LB (light) is more than to set in advance by acceptance part 28 in step s 106 Fixed light income threshold value) when, it is judged as in recess portion 141 (mounting portion) without IC device 90 (electronic component) (step S107).

In such manner, it is possible to which the flow in the fluid FL by flow path 147 is more than the flow threshold being previously set and acceptance part 28 In laser LB (light) light income be more than the light income threshold value that is previously set in the case where, be judged as in (the mounting of recess portion 141 Portion) in without IC device 90 (electronic component).Thereby, it is possible to the light income (laser of flow and laser LB based on fluid FL LB in acceptance part 28 by light state) this two information, accurately carry out that whether there is or not the judgements of IC device 90.

After executing step S107, the purport (step S108) of " without IC device 90 in recess portion 141 " is reported.This report It is carried out preferably for example by monitor 300, signal lamp 400, loudspeaker 500 or their combination.Then, the report is understood The operator of the electronic component check device 1 (electronic component transmission device 10) of announcement locates as defined in capable of implementing to the device Reason.

(light income of laser LB (light) is to set in advance to the case where laser LB is not received by acceptance part 28 in step s 106 Situation below fixed light income threshold value) under, being judged as in recess portion 141 (mounting portion) has IC device 90 (electronic component), But the posture of the IC device 90 (electronic component) in recess portion 141 (mounting portion) is inappropriate (step S109).

In such manner, it is possible to which the flow in the fluid FL by flow path 147 is more than the flow threshold being previously set and acceptance part 28 In the light income of laser LB (light) be to be judged as in (the mounting of recess portion 141 in the light income threshold value situation below being previously set Portion) in have IC device 90 (electronic component), but the posture of the IC device 90 (electronic component) in the recess portion 141 (mounting portion) It is inappropriate.Thereby, it is possible to the light income of flow and laser LB based on fluid FL (light shape of the laser LB in acceptance part 28 State) this two information, the judgement of the presence or absence of IC device 90 and posture is accurately carried out together.

Next, report " has the posture of IC device 90 and the IC device 90 in the recess portion 141 uncomfortable in recess portion 141 When " purport (step S110).This report also in the same manner as the report in step S108, preferably for example by monitor 300, is believed Signal lamp 400, loudspeaker 500 or their combination carry out.Then, the operator for understanding this report can be to electronics member device Part check device 1 implements defined processing.

As described above, the attraction of fluid FL and the irradiation of laser LB can be carried out in first position, and detect fluid FL's Flow and the laser LB in acceptance part 28 by light state.Thus, it is possible to be based on its testing result, device is accurately judged Whether there is or not the postures of the IC device 90 in IC device 90, recess portion 141 in the recess portion 141 of supply unit 14A.

Even if light is detection laser LB in addition, for example inappropriate with a thickness of thin 90 posture of IC device of 0.3mm or so If by light state, it is also possible to it is inappropriate not to be judged as posture.However, passing through the detection by light state in addition to laser LB Except, the flow of fluid FL is detected, further also so as to prevent such erroneous judgement.

In addition, the attraction due to fluid FL is carried out in the detection of the flow of fluid FL, can shorten as much as possible Pull up time.In the case that for example IC device 90 was carried out heating when carrying out high temperature inspection as a result, it is able to suppress IC device 90 temperature reduces.

< second embodiment >

Hereinafter, the second of 7 pairs of electronic component transmission devices and electronic component check device of the invention referring to Fig.1 Embodiment is illustrated, wherein being illustrated around the point different from embodiment above-mentioned, is then saved for same item Slightly its explanation.

Present embodiment is other than judging process of the IC device relative to the state of device supply unit, with above-mentioned first Embodiment is identical.

When the pedestal 142 (electronic component transport unit) of device supply unit 14 is located at first position, shone from irradiation portion 27 Laser LB (light) is penetrated, and judges whether laser LB by acceptance part 28 receives (step S201).

It is judged as that laser LB is received that (light income of laser LB (light) is more than to set in advance by acceptance part 28 in step s 201 Fixed light income threshold value) in the case where, act fluid suction unit 3 (pump 32), and start to be detected by flow testing division 26 The flow (step S202) of fluid FL.

Next, acting the timer (not shown) for being built in control unit 800, judge whether then (step S203).Be judged as in step S203 in the case of, judge that the flow of the fluid FL detected by flow testing division 26 is It is no for (step S204) below the flow threshold that is previously set.It should be noted that flow threshold is for example asked by experiment in advance Out.

The flow of fluid FL is to be judged as in the flow threshold situation below being previously set in recess portion in step S204 There is the posture of the IC device 90 in IC device 90 and recess portion 141 appropriate (step S205) in 141.

In such manner, it is possible to the light income of the laser LB (light) in acceptance part 28 is more than the light income threshold value being previously set, and It and by the flow of the fluid FL of flow path 147 is to be judged as in the flow threshold situation below being previously set in recess portion 141 There is the IC device 90 (electronic component) in IC device 90 (electronic component) and recess portion 141 (mounting portion) in (mounting portion) Posture is appropriate.Thereby, it is possible to light incomes (laser LB in acceptance part 28 by light state) and fluid FL based on laser LB Flow this two information, accurately carry out the judgement of the posture quality of IC device 90.

After performing step S205, the pedestal 142 of device supply unit 14A is made to shift to inspection area A3 (step S206)。

In addition, being judged as in the case that the flow of fluid FL is more than the flow threshold being previously set in step S204 Without IC device 90 (step S207) in recess portion 141.

In such manner, it is possible to the light income of the laser LB (light) in acceptance part 28 is more than the light income threshold value being previously set, and And in the case that the flow for passing through the fluid FL of flow path 147 is more than the flow threshold being previously set, it is judged as and (is carried in recess portion 141 Set portion) in without IC device 90 (electronic component).Thereby, it is possible to the light income based on laser LB, (laser LB is in acceptance part 28 By light state) and the flow of fluid FL this two information, accurately carry out IC device 90 whether there is or not judgement.

After performing step S207, the purport (step S208) of " without IC device 90 in recess portion 141 " is reported.

In addition, being judged as that laser LB is not received that (light income of laser LB (light) is not by acceptance part 28 in step s 201 More than the light income threshold value being previously set) in the case where, fluid suction unit 3 (pump 32) is acted, starts to supply device To the attraction (step S209) of the recess portion 141 of the pedestal 142 of portion 14A.

Next, acting the timer (not shown) for being built in control unit 800, judge whether then (step S210).Be judged as in step S210 in the case of, judge whether laser LB by acceptance part 28 receives (step again S211)。

In the case where being judged as that laser LB is received by acceptance part 28 in step S211, successively execute step S205 and it Step afterwards.

In addition, being judged as in the case where being judged as that laser LB is not received by acceptance part 28 in step S211 in recess portion There is IC device 90 in 141, but the posture of the IC device 90 in recess portion 141 is inappropriate (step S212).

Next, report " having IC device 90 in recess portion 141, but the posture of the IC device 90 in the recess portion 141 is inappropriate " Purport (step S213).

As described above, can the light income of the laser LB (light) in acceptance part 28 be the light income threshold value that is previously set with In the case where lower, the attraction of the fluid FL of stipulated time is carried out, the light income of the laser LB (light) in acceptance part 28 is still In light income threshold value situation below, being judged as in recess portion 141 (mounting portion) has IC device 90 (electronic component), but recess portion The posture of IC device 90 (electronic component) in 141 (mounting portions) is inappropriate, the laser LB (light) in acceptance part 28 by Light quantity be more than light income threshold value in the case where, be judged as have in recess portion 141 (mounting portion) IC device 90 (electronic component) and The posture of IC device 90 (electronic component) in recess portion 141 (mounting portion) is appropriate.For example not being as a result, is to judge IC device immediately The presence or absence of part 90 and posture, but spend the time to accurately carry out the judgement as much as possible.

It should be noted that be judged as in step S211 laser LB received by acceptance part 28 be because, sometimes through Attraction in step S209, IC device 90 can be dragged into recess portion 141 and the posture of IC device 90 made to become posture appropriate.

< third embodiment >

Hereinafter, referring to Fig.1 8, to the of electronic component transmission device and electronic component check device of the invention Three embodiments are illustrated, but are illustrated around the point different from aforementioned embodiments, are then omitted for same item Its explanation.

Present embodiment is identical as foregoing first embodiment other than the composition of device supply unit is different.

As shown in figure 18, in the present embodiment, there are four recess portions 141 for the tool of device supply unit 14.Also, these recess portions 141 in the X direction and in the Y direction there are two each configurations.Hereinafter, will be located at the leftmost side in Figure 18 and be located at lower side Recess portion 141 is referred to as " recess portion 141-1 ".In addition, in Figure 18 " recess portion will be referred to as positioned at the recess portion 141 on the right side of recess portion 141-1 141-2".In addition, in Figure 18 " recess portion 141-3 " will be referred to as positioned at the recess portion 141 of the upside of recess portion 141-1.In addition, scheming In 18, " recess portion 141-4 " will be referred to as positioned at the recess portion 141 on the right side of recess portion 141-3.

In addition, irradiation portion 27 and 28 composition group of acceptance part, are configured with four groups in the present embodiment.

About first group, irradiation portion 27 is configured with acceptance part 28 across recess portion 141-1 and recess portion 141-2.In this set, Irradiation portion 27 is configured at the side recess portion 141-1, and acceptance part 28 is configured at the side recess portion 141-2.

About second group, irradiation portion 27 is configured with acceptance part 28 across recess portion 141-3 and recess portion 141-4.In this set, Irradiation portion 27 is configured at the side recess portion 141-3, and acceptance part 28 is configured at the side recess portion 141-4.

About third group, irradiation portion 27 is configured with acceptance part 28 across recess portion 141-1 and recess portion 141-3.In this set, Irradiation portion 27 is configured at the side recess portion 141-1, and acceptance part 28 is configured at the side recess portion 141-3.

About the 4th group, irradiation portion 27 is configured with acceptance part 28 across recess portion 141-2 and recess portion 141-4.In this set, Irradiation portion 27 is configured at the side recess portion 141-2, and acceptance part 28 is configured at the side recess portion 141-4.

Also, the posture of the IC device 90 of the flow based on fluid FL judges preferred pin to the recess portion of 28 side of acceptance part IC device 90 in 141 carries out.Thereby, it is possible to carry out accurate and high-precision judgement.

It should be noted that the configuration about four recess portions 141, in the present embodiment in X-direction and Y-direction There are two upper each configurations, and but it is not limited to this, for example, both four can be configured in the X direction and configure one in the Y direction, One can also be configured in the X direction and configure four in the Y direction.

In addition, the forming quantity of recess portion 141 is four in the present embodiment, but it is not limited to this, such as is also possible to Two, three or five or more.In this case, for the configuration quantity of the configuration quantity of X-direction and Y-direction, not especially It is defined.

More than, although illustrating electronic component transmission device and electronics member of the invention for embodiment illustrated Device inspection apparatus, but the present invention is not limited to this, constitutes electronic component transmission device and electronic component inspection dress Each portion set can replace with the arbitrary composition that can play said function.Furthermore it is also possible to add arbitrary construct.

In addition, electronic component transmission device and electronic component check device of the invention can also combine it is above-mentioned each More than any two in embodiment composition (feature) and obtain.

In addition, " electronic component transport unit " is suitable for device supply unit in the present embodiment, but it is not limited to this, example Pallet as can be also suitable for device recoverer, device recovery zone.

In addition, whether there is or not used in the judgement of the posture of IC device, IC device through device supply unit in device supply unit Flow path fluid flow.Here, it can also try to consider the feelings instead of flow and using the pressure (vacuum degree) in flow path Condition.However, the fluid device of detection pressure has becoming for resolution ratio reduction compared with the fluid device (flowmeter) of detection flows Gesture, therefore not preferably.

In addition, being set with a flow threshold for whether there is or not the judgements of the posture of IC device, IC device in device supply unit Value, but the setting of flow threshold is not limited to one.For example, it is also possible to be sized different multiple flow thresholds.As flow Threshold value, such as in the case where setting first flow threshold value and less than the second flow threshold value of first flow threshold value, Neng Goutong Crossing first flow threshold decision, whether there is or not IC devices, pass through the posture of second flow threshold decision IC device.

In addition, whether there is or not used whether acceptance part receives in the judgement of the posture of IC device, IC device in device supply unit To the information of laser, but not limited to this, for example, also can be used by the light income in acceptance part is interim or continuity it is several Information after value.

In addition, the undulatory port of device supply unit can be separated with fluid suction unit, but it is not limited to this, such as can also Independently always to be connect with fluid suction unit with the movement of pedestal.

In addition, being to be tried without hot test, low temperature in electronic component transmission device (electronic component check device) In the case where the device tested, such as it also can be omitted the second spaced walls, third spaced walls, the 5th spaced walls.

Claims

1. a kind of electronic component transmission device, which is characterized in that have:

Electronic component transport unit has the mounting portion of mounting electronic component, and passes between the first location and the second location Send the electronic component；

Fluid suction unit attracts the fluid from the mounting portion via the flow path passed through for fluid；

Irradiation portion, Xiang Suoshu mounting portion irradiation light；

Acceptance part receives the light of the irradiation portion irradiation；And

Control unit controls the electronic component transport unit, the fluid suction unit, the irradiation portion and the acceptance part Movement,

The control unit is carried out when the electronic component transport unit is located at the first position by the fluid suction unit The attraction of the fluid, and the irradiation of the light is carried out by the irradiation portion, and based on the stream for passing through the flow path The light income of the light in the flow of body and the acceptance part, judge in the mounting portion whether there is or not the electronic component, Or the posture of the electronic component in the mounting portion.

2. electronic component transmission device according to claim 1, which is characterized in that

When the flow of the fluid by the flow path is the flow threshold being previously set or less, the control unit is judged as There is the posture of the electronic component in the electronic component and the mounting portion appropriate in the mounting portion.

3. electronic component transmission device according to claim 1, which is characterized in that

The flow by the fluid of the flow path be more than in the flow threshold being previously set and the acceptance part described in When the light income of light is more than the light income threshold value being previously set, the control unit is judged as in the mounting portion without the electronics Component.

4. electronic component transmission device according to claim 1, which is characterized in that

The flow by the fluid of the flow path be more than in the flow threshold being previously set and the acceptance part described in When the light income of light is the light income threshold value being previously set or less, the control unit, which is judged as in the mounting portion, the electricity The posture of the electronic component in sub- component and the mounting portion is inappropriate.

5. electronic component transmission device according to claim 1, which is characterized in that

The light income of the light in the acceptance part is more than the light income threshold value being previously set and the institute for passing through the flow path When the flow for stating fluid is the flow threshold being previously set or less, the control unit, which is judged as in the mounting portion, the electricity The posture of the electronic component in sub- component and the mounting portion is appropriate.

6. electronic component transmission device according to claim 1, which is characterized in that

The light income of the light in the acceptance part is more than the light income threshold value being previously set and the institute for passing through the flow path When stating the flow of fluid more than the flow threshold being previously set, the control unit is judged as in the mounting portion without the electronics Component.

7. electronic component transmission device according to claim 1, which is characterized in that

When the light income of the light of the control unit in the acceptance part is the light income threshold value being previously set or less, into Gone the stipulated time the fluid attraction after detect light income,

When the light income for having carried out the light after the attraction of stipulated time is the light income threshold value or less, it is judged as There is the posture of the electronic component in the electronic component and the mounting portion inappropriate in the mounting portion, When the light income of the light after having carried out the attraction of stipulated time is more than the light income threshold value, it is judged as in the load Setting has the posture of the electronic component in the electronic component and the mounting portion appropriate in portion.

8. electronic component transmission device according to claim 1, which is characterized in that

The electronic component has the prominent terminal formed,

The mounting portion has the micro-valleys entered when loading the electronic component for the terminal.

9. electronic component transmission device according to claim 1, which is characterized in that

The mounting portion by being constituted with the recess portion of the fluid communication,

It is arranged or is connected with the stream detected to the flow of the fluid by the flow path in the midway of the flow path Measure test section.

10. a kind of electronic component check device, which is characterized in that have:

Electronic component transport unit, has a mounting portion of mounting electronic component, and can first position and the second position it Between transmit the electronic component；

Irradiation portion, Xiang Suoshu mounting portion irradiation light；

Acceptance part receives the light of the irradiation portion irradiation；

Inspection portion checks the electronic component；And