CN109392257A - The manufacturing method and multilayer printed-wiring board of multilayer printed-wiring board - Google Patents
The manufacturing method and multilayer printed-wiring board of multilayer printed-wiring board Download PDFInfo
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- CN109392257A CN109392257A CN201810759433.3A CN201810759433A CN109392257A CN 109392257 A CN109392257 A CN 109392257A CN 201810759433 A CN201810759433 A CN 201810759433A CN 109392257 A CN109392257 A CN 109392257A
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- interarea
- metal foil
- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides the manufacturing method and multilayer printed-wiring board of multilayer printed-wiring board, and project is to prevent the accumulation of the dislocation of the wiring pattern of each layer, improves the position precision of the wiring pattern of each layer.The manufacturing method of multilayer printed-wiring board as the method solved the problem of the present invention includes following processes: the metal foil (12) of laminated plate clad with metal foil (10) being patterned, the process for forming the target label (14) with location hole (14a)；With from thickness direction location hole (14a) be located at the process that laminated plate clad with metal foil (20) is stacked on laminated plate clad with metal foil (10) by the mode in the through hole (24) of laminated plate clad with metal foil (20)；With from thickness direction location hole (14a) be located at the process that laminated plate clad with metal foil (30) is stacked on laminated plate clad with metal foil (10) by the mode in the through hole (34) of laminated plate clad with metal foil (30)；And on the basis of location hole (14a), metal foil (22) and metal foil (32) are patterned and the process that forms wiring pattern (25), (35).
Description
Technical field
The present invention relates to the manufacturing method of multilayer printed-wiring board and multilayer printed-wiring boards.
Background technique
In the past, the requirement by the densification for printed wiring board, developing lamination has multiple printed wiring boards
Multilayer printed-wiring board.As one of multilayer printed-wiring board, blended multi-layer circuit substrate is described in patent document 1.Multilayer
Also include in printed wiring board flexible multilayer flexible printed wiring plate (multi-layer FPC).
The conductive pattern of each layer of multilayer printed-wiring board uses well known photosensitive etching and processing
(photofabrication) method is formed.That is, being formed after photoresist layer on the copper foil of copper-coated laminated board, will retouch
Figuratum exposed mask (photomask) position alignment is drawn to configure after in photoresist layer.Then, pass through exposed mask
After photoresist layer irradiation light, development treatment is carried out, forms etching mask.Then, using etching mask by copper foil into
Row etching is to form conductive pattern.In the formation of conductive pattern, improving the position precision between the conductive pattern of each layer is weight
It wants.By improving the position precision of conductive pattern, for example, can be by patchboard (land) path of interlayer interconnecting piece.
It is described in patent document 2, the target of positioning, and the shape for exposing it using laser processing is set in internal layer
It is positioned under state, to obtain the manufacturing method of the multilayer printed-wiring board for the position alignment data for forming processing for through-hole.
In the method, due to exposing target, thus target can be clearly identified to be positioned, position alignment precision is high.
Existing technical literature
Patent document
Patent document 1: Japanese Patent Publication No. 2631287
Patent document 2: Japanese Unexamined Patent Publication 10-256737 bulletin
Summary of the invention
Problems to be solved by the invention
But the progress of miniaturization, densification with the electronic equipment for using multilayer printed-wiring board, in recent years,
It gradually requires to reduce the distance between end face and wiring pattern of multilayer printed-wiring board.
For example, it is desired to the cable shape that width is very narrow, and horizontal position multiple wiring patterns having the same in each layer
Multilayer flexible printed wiring plate.In this case, need to improve the position precision of the wiring pattern of each layer, so as in sharp processing
When each layer wiring pattern do not expose in the side end face of multilayer flexible printed wiring plate.
Be used to form the exposure process of the wiring pattern of each layer, in the past, as documented by patent document 2, using with
The target label that the wiring pattern of the immediate inside of processed copper foil is formed simultaneously, by exposed mask position alignment later into
Row.That is, the target label for the internal layer side for being located at processed conductive film is formed wiring pattern as benchmark.
However, in the method, having the progress with multiple stratification, such project is accumulated in the dislocation of wiring pattern.That is,
In the previous method, position precision × exposure frequency amount dislocation when needing to estimate exposure.For example, the cloth in each layer is linear
Position alignment precision (the configuration precision of exposed mask) when at pattern is ± 10 μm, and manufactures 6 layers by total 5 exposures
Dislocation in the case where multilayer printed-wiring board, as wiring pattern, it is necessary to estimate ± 50 μm.It is estimating as the feelings less than the value
Under condition, yield rate is likely to decrease.If being set as such as ± 25 μm using the sharp processing precision of laser, it can only make shape
It is extremely 75 μm apart from wiring pattern that it is close, which to process end,.
Therefore, the purpose of the present invention is to provide the accumulations of the dislocation for the wiring pattern that can prevent each layer, improve each layer
Wiring pattern position precision multilayer printed-wiring board manufacturing method and multilayer printed-wiring board.
The method used for solving the problem
The manufacturing method of multilayer printed-wiring board of the present invention is characterized in that having following processes:
Prepare the process of the first laminated plate clad with metal foil, first laminated plate clad with metal foil have with the first interarea and
With the core substrate of the second interarea of above-mentioned first interarea opposite side and it is formed in the first metal foil of above-mentioned first interarea,
By above-mentioned first metallic foil pattern, the process with the target label of location hole is formed,
Prepare the process of the second laminated plate clad with metal foil, second laminated plate clad with metal foil have with third interarea and
Substrate is combined with the first of the 4th interarea of above-mentioned third interarea opposite side and is formed in the second gold medal of above-mentioned third interarea
Belong to foil,
The process for penetrating through the first through hole of above-mentioned second laminated plate clad with metal foil in a thickness direction is formed,
Prepare the process of third laminated plate clad with metal foil, the third laminated plate clad with metal foil have with the 5th interarea and
Substrate is combined with the second of the 6th interarea of above-mentioned 5th interarea opposite side and is formed in the third gold of above-mentioned 5th interarea
Belong to foil,
The process for penetrating through the second through hole of above-mentioned third laminated plate clad with metal foil in a thickness direction is formed,
So that above-mentioned 4th interarea it is opposed with above-mentioned first interarea and from thickness direction above-mentioned location hole be located at it is above-mentioned
Above-mentioned second laminated plate clad with metal foil is stacked on the work of above-mentioned first laminated plate clad with metal foil by the mode in the first through hole
Sequence,
So that above-mentioned 6th interarea it is opposed with above-mentioned second interarea and from thickness direction above-mentioned location hole be located at it is above-mentioned
Above-mentioned third laminated plate clad with metal foil is stacked on the work of above-mentioned first laminated plate clad with metal foil by the mode in the second through hole
Sequence,
On the basis of the above-mentioned location hole of above-mentioned target label, by above-mentioned second metal foil and above-mentioned third metallic foil pattern
Change, the process for being respectively formed the first wiring pattern and the second wiring pattern.
In addition, the manufacturing method of multilayer printed-wiring board of the present invention is characterized in that, have following processes:
Prepare the process of the first laminated plate clad with metal foil, first laminated plate clad with metal foil have with the first interarea and
With the core substrate of the second interarea of above-mentioned first interarea opposite side and it is formed in the first metal foil of above-mentioned first interarea,
By above-mentioned first metallic foil pattern, the process with the target label of location hole is formed,
Prepare the process of the second laminated plate clad with metal foil, second laminated plate clad with metal foil have with third interarea and
Substrate is combined with the first of the 4th interarea of above-mentioned third interarea opposite side and is formed in the second gold medal of above-mentioned third interarea
Belong to foil,
The process for penetrating through the first through hole of above-mentioned second laminated plate clad with metal foil in a thickness direction is formed,
So that above-mentioned 4th interarea it is opposed with above-mentioned first interarea and from thickness direction above-mentioned location hole be located at it is above-mentioned
Above-mentioned second laminated plate clad with metal foil is stacked on the work of above-mentioned first laminated plate clad with metal foil by the mode in the first through hole
Sequence,
On the basis of the above-mentioned location hole of above-mentioned target label, by above-mentioned second metallic foil pattern, wiring pattern is formed
Process,
Prepare the process of third laminated plate clad with metal foil, the third laminated plate clad with metal foil have with the 5th interarea and
Substrate is combined with the second of the 6th interarea of above-mentioned 5th interarea opposite side and is formed in the third gold of above-mentioned 5th interarea
Belong to foil,
The process for penetrating through the second through hole of above-mentioned third laminated plate clad with metal foil in a thickness direction is formed,
So that above-mentioned 6th interarea is opposed with the above-mentioned third interarea of above-mentioned second laminated plate clad with metal foil and from thickness side
It is located at the mode in above-mentioned second through hole to above-mentioned location hole is observed, above-mentioned third laminated plate clad with metal foil is stacked on above-mentioned
The process of second laminated plate clad with metal foil,
On the basis of the above-mentioned location hole of above-mentioned target label, by above-mentioned third metallic foil pattern, wiring pattern is formed
Process.
Multilayer printed-wiring board of the present invention is characterized in that having:
Core wiring plate, the core wiring plate have: second with the first interarea and with above-mentioned first interarea opposite side
The core substrate of interarea, and be formed in above-mentioned first interarea and be equipped with the target label of location hole,
First composite wiring plate, the first composite wiring plate have: have third interarea and with above-mentioned third interarea phase
First combination substrate of the 4th interarea of anti-side, and it is formed in the first wiring pattern of above-mentioned third interarea,
Second composite wiring plate, the second composite wiring plate have: have the 5th interarea and with above-mentioned 5th interarea phase
Second combination substrate of the 6th interarea of anti-side, and it is formed in the second wiring pattern of above-mentioned 5th interarea,
Above-mentioned first composite wiring plate is in the above-mentioned 4th interarea mode opposed with above-mentioned first interarea via adhesive layer
It is stacked on above-mentioned core wiring plate,
Above-mentioned second composite wiring plate is in the above-mentioned 6th interarea mode opposed with above-mentioned second interarea via adhesive layer
It is stacked on above-mentioned core wiring plate,
Above-mentioned core wiring plate be formed with penetrate through above-mentioned core substrate in a thickness direction have bottom outlet,
Above-mentioned first composite wiring plate is formed with the first through hole for penetrating through above-mentioned first combination substrate in a thickness direction,
Above-mentioned second composite wiring plate is formed with penetrates through above-mentioned second combination substrate and connection above-mentioned has in a thickness direction
Second through hole of bottom outlet,
Above-mentioned location hole exposes in the bottom surface of above-mentioned first through hole, can observe from above-mentioned third main surface side, and
Expose in the above-mentioned bottom surface for having bottom outlet, can also be observed from above-mentioned 5th main surface side.
In addition, multilayer printed-wiring board of the present invention is characterized in that having:
Core wiring plate, the core wiring plate have: second with the first interarea and with above-mentioned first interarea opposite side
The core substrate of interarea, and be formed in above-mentioned first interarea and be equipped with the target label of location hole,
First composite wiring plate, the first composite wiring plate have: have third interarea and with above-mentioned third interarea phase
First combination substrate of the 4th interarea of anti-side, and it is formed in the first wiring pattern of above-mentioned third interarea,
Second composite wiring plate, the second composite wiring plate have: have the 5th interarea and with above-mentioned 5th interarea phase
Second combination substrate of the 6th interarea of anti-side, and it is formed in the second wiring pattern of above-mentioned 5th interarea,
Above-mentioned first composite wiring plate is in the above-mentioned 4th interarea mode opposed with above-mentioned first interarea via adhesive layer
It is stacked on above-mentioned core wiring plate,
Above-mentioned second composite wiring plate is in the above-mentioned 6th interarea mode opposed with above-mentioned third interarea via adhesive layer
It is stacked on above-mentioned first composite wiring plate,
Above-mentioned first composite wiring plate is formed with the first through hole for penetrating through above-mentioned first combination substrate in a thickness direction,
Above-mentioned second composite wiring plate is formed with penetrates through above-mentioned second combination substrate and connection above-mentioned the in a thickness direction
Second through hole of one through hole,
Above-mentioned location hole exposes in the bottom surface of above-mentioned first through hole, can observe from above-mentioned 5th main surface side.
The effect of invention
According to the present invention it is possible to provide the accumulation that can prevent the dislocation of wiring pattern of each layer, the wiring of each layer is improved
The manufacturing method and multilayer printed-wiring board of the multilayer printed-wiring board of the position precision of pattern.
Detailed description of the invention
Fig. 1 is the process sectional view for illustrating the manufacturing method of multilayer printed-wiring board that first embodiment is related to.
Fig. 2A is the top view for the target label that first case is related to.
Fig. 2 B is the top view for the target label that second case is related to.
Fig. 2 C is the top view for showing the configuration example of 2 target labels and wiring pattern.
Fig. 3 is the process sectional view for illustrating the manufacturing method of multilayer printed-wiring board that first embodiment is related to.
Fig. 4 is the process sectional view for illustrating the manufacturing method of multilayer printed-wiring board that first embodiment is related to.
Fig. 5 is then Fig. 4, the process of the manufacturing method for illustrating multilayer printed-wiring board that first embodiment is related to
Sectional view.
Fig. 6 is then Fig. 5, the process of the manufacturing method for illustrating multilayer printed-wiring board that first embodiment is related to
Sectional view.
Fig. 7 is then Fig. 6, the process of the manufacturing method for illustrating multilayer printed-wiring board that first embodiment is related to
Sectional view.
Fig. 8 is then Fig. 7, the process of the manufacturing method for illustrating multilayer printed-wiring board that first embodiment is related to
Sectional view.
Fig. 9 is the process sectional view for illustrating the manufacturing method of multilayer printed-wiring board that second embodiment is related to.
Figure 10 is then Fig. 9, the work of the manufacturing method for illustrating multilayer printed-wiring board that second embodiment is related to
Sequence sectional view.
Figure 11 is then Figure 10, the work of the manufacturing method for illustrating multilayer printed-wiring board that second embodiment is related to
Sequence sectional view.
Figure 12 is then Figure 11, the work of the manufacturing method for illustrating multilayer printed-wiring board that second embodiment is related to
Sequence sectional view.
Figure 13 is then Figure 12, the work of the manufacturing method for illustrating multilayer printed-wiring board that second embodiment is related to
Sequence sectional view.
Symbol description
1 core wiring plate
2,3 composite wiring plate
10 laminated plate clad with metal foil
11 core substrates
11a, 11b interarea
12,13 metal foil
14 target labels
14a location hole
15,16 wiring pattern
17 have bottom outlet
20,30 laminated plate clad with metal foil
21,31 combination substrate
21a, 21b, 31a, 31b interarea
22,32 metal foil
23,33 adhesive layer
24,34 through hole
25,26,35,36 wiring pattern
41,42 dry film
41a, 41b, 42a, 42b etching mask
C1, C2 tangent line.
Specific embodiment
Hereinafter, being illustrated while referring to attached drawing for embodiment of the present invention.In addition, having in each figure
There is the constituent element of same function to enclose the same symbol.In addition, attached drawing be it is schematical, emphasis shows what each embodiment was related to
The relationship of characteristic, thickness and planar dimension, ratio of thickness of each layer etc. are different with the situation of reality.
(first embodiment)
About the first embodiment of the present invention is related to multilayer printed-wiring board manufacturing method, referring to Fig.1~Fig. 8 into
Row explanation.
Firstly, preparing laminated plate clad with metal foil 10 (the first laminated plate clad with metal foil) as shown in Fig. 1 (1).Clad with metal foil is folded
Laminate 10 is the so-called two sides laminated plate clad with metal foil with core substrate 11, metal foil 12 and metal foil 13.
Core substrate 11 has interarea 11a (the first interarea) and the interarea 11b (the second interarea) with interarea 11a opposite side.
Metal foil 12 is formed in the interarea 11a of core substrate 11, and metal foil 13 is formed in the interarea 11b of core substrate 11.The thickness of core substrate 11
Degree be such as 50 μm, metal foil 12,13 with a thickness of such as 12 μm.
Core substrate 11 is made of the material of insulating properties.In the present embodiment, core substrate 11 is by liquid crystal polymer (Liquid
Crystal Polymer:LCP), the flexible material such as polyimides constitutes.In addition, core substrate 11 can be by other insulation
Material is constituted, or can be constituted by not having flexible material.Metal foil 12,13 is in the present embodiment copper foil, but unlimited
In this, the metal foil being made of other metals (such as silver, aluminium) can be.
Next, metal foil 12 is patterned as shown in Fig. 1 (2), form the target label 14 with location hole 14a.Mesh
Mark label 14 is used jointly when forming the wiring pattern of each layer in subsequent process.The diameter of target label 14 is for example
The diameter of 3mm, location hole 14a are such as 0.5mm.
The patterning of metal foil 12 is to be etched metal foil 12 to carry out by using well known photosensitive processing method.
By the patterning of metal foil 12, target label 14 and wiring pattern 15 can be formed.
The outer shape of target label 14 is as shown in Figure 2 A circle, but not limited to this.For example, as shown in Figure 2 B, target
The outer shape of label 14 can be quadrangle.In addition, target label 14 can be formed it is multiple.For example, as shown in Figure 2 C, it can be with
It clips wiring pattern 15 and forms 2 target labels 14.
As shown in Fig. 1 (2), metal foil 13 is patterned, forms wiring pattern 16.In the present embodiment, by metal foil
12 and 13 simultaneous processing of metal foil, it is respectively formed wiring pattern 15 and wiring pattern 16.
Here, illustrate the details of the patterning method of metal foil.
Firstly, forming photoresist layer (not shown) in metal foil 12 and metal foil 13.The photoresist layer can
With by by dry film lamination in being formed in metal foil 12,13, or can by the way that resist paste will be etched in metal foil
12, it is formed on 13.Next, by the exposed mask of table side (not shown) in the photoresist layer of coated metal foil 12
Position alignment and configure.Similarly, inboard exposed mask (is not schemed in the photoresist layer of coated metal foil 13
Show) position alignment and configure.
Then, photoresist layer exposed, develop and forms etching mask.
Then, metal foil 12 and metal foil 13 are etched using etching mask.After etching, etching mask is removed.
Operation is in this way to form target label 14, wiring pattern 15 and wiring pattern 16.Wiring pattern 15 and 16 can be with
Relatively high position precision (such as within ± 10 μm) formation.In the present embodiment, it when wiring pattern 16 is to overlook and is routed
The mode that pattern 15 is almost overlapped is formed.Wiring pattern 15,16 upwardly extends in Fig. 1 (2) with paper Vertical Square.In addition,
In the present embodiment, if the center line of wiring pattern 15,16 is almost the same, width can be different.
Operation carries out the patterning of metal foil 12,13 as described above, formed target label 14 and wiring pattern 15,16 it
Afterwards, as shown in Fig. 1 (3), it is formed with bottom outlet 17.The diameter for thering is the diameter of bottom outlet 17 to be greater than location hole 14a, for example, 1mm.
There is bottom outlet 17 to penetrate through core substrate 11 in a thickness direction, location hole 14a exposes in the bottom surface for having bottom outlet 17.Pass through shape
At there is bottom outlet 17, so that target label 14 (location hole 14a) can also be observed from the side interarea 11b of core substrate 11.
In the present embodiment, bottom outlet 17 is to be laser machined core substrate 11 by irradiating laser to interarea 11b
And formed.The laser processing uses CO2 laser etc..The approximate centre of laser aiming target label 14 (near location hole 14a)
It is irradiated.The adjustment of laser irradiating position can be with wiring pattern 16 or the target label being formed simultaneously with wiring pattern 16
It is carried out on the basis of (not shown).Special positioning is not needed as a result, has just been capable of forming bottom outlet 17.
In addition, the inner face that can carry out that the metal foil 12 of target label 14 will be constituted is (with core after being formed with bottom outlet 17
Substrate 11 be bonded face) mirror-polishing processing.For example, carrying out corona treatment or etching process (example for target label 14
Slight etching such as 1 μm or so), thus by the inner face mirror-polishing of metal foil 12.Thereby, it is possible to improve from the side interarea 11b
When target label 14 visibility.
Next, preparing laminated plate clad with metal foil 20 (the second laminated plate clad with metal foil) as shown in Fig. 3 (1).Clad with metal foil
Laminated plate 20 has combination substrate 21 (the first combination substrate), metal foil 22 (the second metal foil) and adhesive layer 23.In addition, viscous
Oxidant layer 23 is connect to be not required.
Combining substrate 21 has interarea 21a (third interarea) and interarea 21b (the 4th master with interarea 21a opposite side
Face).Metal foil 22 is formed in interarea 21a, and adhesive layer 23 is temporarily attached to interarea 21b.Combine substrate 21 with a thickness of for example
50 μm, metal foil 22 with a thickness of such as 12 μm.
Combination substrate 21 is made of the material of insulating properties.In the present embodiment, combination substrate 21 is by liquid crystal polymer, poly-
The flexible material such as acid imide is constituted.In addition, combination substrate 21 can be made of other insulating materials, or can be by not having
There is flexible material to constitute.Metal foil 22 is copper foil in the present embodiment, but not limited to this, it can be by other metal (examples
As silver, aluminium) constitute metal foil.
Next, as shown in Fig. 3 (2), the through hole 24 (for penetrating through laminated plate clad with metal foil 20 in a thickness direction is formed
One through hole).The through hole 24 is formed by being partially removed in combination substrate 21 using for example laser machining.Through hole 24
Diameter be such as 2.5mm.The diameter of through hole 24 needs the diameter greater than location hole 14a.
In addition, the diameter of through hole 24 is preferably slightly less than the diameter of target label 14.Thus, it is possible to make target label 14
The glued pressing of oxidant layer 23 in peripheral part (referring to Fig. 6 (1)).
Next, preparing laminated plate clad with metal foil 30 (third laminated plate clad with metal foil) as shown in Fig. 4 (1).Clad with metal foil
Laminated plate 30 has combination substrate 31 (the second combination substrate), metal foil 32 (third metal foil) and adhesive layer 33.In addition,
Adhesive layer 33 is not required.
Combining substrate 31 has interarea 31a (the 5th interarea) and interarea 31b (the 6th master with interarea 31a opposite side
Face).Metal foil 32 is formed in interarea 31a, and adhesive layer 33 is temporarily attached to interarea 31b.Combine substrate 31 with a thickness of for example
50 μm, metal foil 32 with a thickness of such as 12 μm.
Combination substrate 31 is made of the material of insulating properties.In the present embodiment, combination substrate 31 is by liquid crystal polymer, poly-
The flexible material such as acid imide is constituted.In addition, combination substrate 31 can be made of other insulating materials, or can be by not having
There is flexible material to constitute.Metal foil 32 is copper foil in the present embodiment, but not limited to this, it can be by other metal (examples
As silver, aluminium) constitute metal foil.
Next, as shown in Fig. 4 (2), the through hole 34 (for penetrating through laminated plate clad with metal foil 30 in a thickness direction is formed
Two through holes).The through hole 34 to be formed by being partially removed in combination substrate 31 using such as laser processing.Through hole 34
Diameter be such as 2.5mm.The diameter of through hole 34 needs the diameter greater than location hole 14a.
In addition, the diameter of through hole 34 is preferably greater than the diameter for having bottom outlet 17.Even if will be covered in subsequent process as a result,
Dislocation to a certain extent has occurred in metal foil laminates plate 30 when being stacked on laminated plate clad with metal foil 10, can also be logical from outside
Through hole 34 is crossed to observe location hole 14a.
Next, as shown in Fig. 5 and Fig. 6 (1), so that 11a pairs of interarea of the interarea 21b of combination substrate 21 and core substrate 11
It sets and location hole 14a is located at the mode in through hole 24 from thickness direction, via adhesive layer 23 by clad with metal foil lamination
Plate 20 is stacked on laminated plate clad with metal foil 10.The lamination carries out laminated plate clad with metal foil for example, by guide pin (pin guide)
Between position alignment after carry out.It is also the same for lamination procedure below.
Next, as shown in Fig. 5 and Fig. 6 (1), so that 11b pairs of interarea of the interarea 31b of combination substrate 31 and core substrate 11
It sets and location hole 14a is located at the mode in through hole 34 from thickness direction, via adhesive layer 33 by clad with metal foil lamination
Plate 30 is stacked on laminated plate clad with metal foil 10.At this point, laminated plate clad with metal foil 30 is with through hole 34 and the side that has bottom outlet 17 to be connected to
Formula is stacked on laminated plate clad with metal foil 10.
In addition, half can will not be flowed in the case where laminated plate clad with metal foil 20,30 not set adhesive layer 23,33
Cured sheets (low flow bonding sheet) are laminated to after the two sides of core substrate 11, by laminated plate clad with metal foil 20,30
It is stacked on core substrate 11.
Next, by the laminated plate clad with metal foil 10,20,30 (laminated body) being stacked heating, pressurization and it is integrated.Specifically
For, using vacuum pressurizing device or vacuum lamination (laminator) device, laminated body is heated and pressurizeed.For example,
Laminated body is heated to 150~200 DEG C or so, and is pressurizeed with the pressure of 2~4MPa or so.In addition, the temperature compares liquid
Low 50 DEG C of the softening temperature of crystalline polymer or more.By this process, adhesive layer 23,33 solidifies.
Next, as shown in Fig. 7 (2), by metal foil 22 and metal foil 32 on the basis of the location hole 14a of target label 14
Patterning, is respectively formed wiring pattern 25 (the first wiring pattern) and wiring pattern 35 (the second wiring pattern).In this embodiment party
In formula, almost be overlapped mode is formed with wiring pattern 15,16 when wiring pattern 25,35 is overlooked.
Wiring pattern 25,35 specifically operates as described below to be formed.
Firstly, using laminater, pasting dry film 41 and 42 in the outer surface of laminated body as shown in Fig. 6 (2).It passes through as a result,
The opening of through-hole 24 is covered by dry film 41, and the opening of through hole 34 is covered by dry film 42.As dry film 41,42, it is expected that using tool
There is the dry film photoresist for the thickness (such as 30 μ m-thicks) that through hole 24,34 can be covered to (tenting).
Next, 2 cameras (not shown) of table side and the back side setting by laminated body, identify the positioning of laminated body
Hole 14a.Then, the position based on identified location hole 14a carries out 2 exposed masks (photomask) for table side and back side
Position alignment, be respectively arranged on dry film 41 and 42.Then, by exposing dry film 41,42, development, thus such as Fig. 7 (1)
It is shown, form etching mask 41a, 41b, 42a, 42b.In addition, the exposure of dry film 41,42 can by two sides exposure come simultaneously into
Row, can also while carry out.
Etching mask 41a, 42a is to protect target label 14 not to be etched and shape when etching metal foil 22,32
At.Etching mask 41b, 42b is to be used to form the etching mask of wiring pattern 25,35.In this way, in the present embodiment, by
In configuring exposed mask on the basis of common location hole 14a, thus can be formed with high position accuracy etching mask 41b,
42b。
Then, metal foil 22 and metal foil 32 are etched using etching mask 41a, 41b, 42a, 42b.After etching,
Etching mask 41a, 41b, 42a, 42b are removed.Wiring pattern 25,35 is formed as a result,.Due to being lost with high position accuracy to be formed
Mask 41b, 42b are carved, therefore can be formed and be routed with high position accuracy (such as within ± 10 μm) relative to wiring pattern 15,16
Pattern 25,35.
Wiring pattern 25,35 upwardly extends in Fig. 7 (2) with paper Vertical Square.In addition, in the present embodiment, such as
The center line of fruit wiring pattern 25,35 is almost the same, then width can be different.
Through the above steps, as shown in Fig. 7 (2), four layers of multilayer printed-wiring board is obtained.Four layers of wiring pattern
15, it 16,25,35 is formed with high position accuracy.
Further, in the case where manufacturing the printed wiring board of multilayer, as long as by above-mentioned operation (compound clad with metal foil
The preparation of laminated plate, the formation of through hole, lamination and metal foil pattern formed) repeatedly.Fig. 8 is shown in Fig. 7 (2)
Shown in four layers multilayer printed-wiring board two sides lamination six layers of multilayer printed-wiring board of laminated plate clad with metal foil.Most
The wiring pattern 26,36 of outer layer is in the same manner as wiring pattern 25,35, by using using common location hole 14a as benchmark
And formed etching mask etching and formed.Wiring pattern 26,36 is formed as a result, with high position accuracy.Therefore, wiring pattern
26, it 36 is formed relative to wiring pattern 25,35 with high position accuracy (such as within ± 10 μm).As a result, can be with high position
Precision forms six layers of wiring pattern 15,16,25,26,35,36.
Wiring pattern 26,36 is upwardly extended with paper Vertical Square in fig. 8.In addition, in the present embodiment, if cloth
The center line of line pattern 26,36 is almost the same, then width can be different.
As described above, the manufacturing method for the multilayer printed-wiring board being related to according to the present embodiment, can be with high position
Precision forms the wiring pattern of each layer.As a result, for example, the sharp processing end of wiring pattern and multilayer printed-wiring board can be shortened
The distance between.If for by taking Fig. 8 as an example, since the lateral dislocation of wiring pattern 15,16,25,26,35,36 is small, because
This can shorten the length between tangent line C1 and tangent line C2.Thus, it is possible to the elongated printed wiring of such as cable shape easy to manufacture
Plate.
The sharp processing of multilayer printed-wiring board is for example carried out by the laser processing of framing mode.That is, with shining
The location hole 14a of camera identification target label 14 and carry out the position alignment of laser source and multilayer printed-wiring board, along tangent line
Carry out sharp processing.Tangent line can be set in the position close to wiring pattern in the range of the machining accuracy of laser.
According to the present embodiment, the wiring pattern of each layer, can due to being formed on the basis of common target label
To prevent the accumulation of dislocation.Thus, it is possible to obtain sharp processing end close to wiring pattern until laser processing precision (such as ± 25
μm) multilayer printed-wiring board with the root mean square (such as ± 27 μm) of the forming position precision (such as ± 10 μm) of wiring pattern.
In this way, according to the present embodiment, not applying particularly expensive device, so that it may so that sharp processing end and previous methods
Compared to closer to wiring pattern.
In addition, in the example of fig. 8, it, can although having cut the region for being formed with target label 14 in sharp processing
To retain the region.
The manufacturing method of above-mentioned multilayer printed-wiring board is not limited to an example, and various modifications may be made.For example, for covering gold
It is arbitrary for belonging to the implementation sequence of the respective manufacturing procedure of foil laminate plate 10,20,30.It can be in laminated plate clad with metal foil 20,30
After upper formation through hole 24,34, forms the target label 14 of laminated plate clad with metal foil 10, has bottom outlet 17.
In addition, there is bottom outlet 17 that can be formed after forming target label 14.
In addition, camera can be observed by insulating substrate in the case where core substrate 11 is made of transparent material
When target label 14, bottom outlet 17 can be formed without.
In addition, laminated plate clad with metal foil 10 is two sides laminated plate clad with metal foil, but not limited to this, it is (main to can be only single side
Face 11a) it is formed with the single side laminated plate clad with metal foil of metal foil.
In addition, target label 14 can be to contain the identification of the multilayer printed-wiring board of manufacture by the above-mentioned manufacture method
The mode of information is formed.For example, target label 14 can be formed as the shapes such as bar code, two dimensional code.Thereby, it is possible to from initial
Process (processing of laminated plate clad with metal foil 10) track multilayer printed-wiring board.
< multilayer printed-wiring board >
The multilayer printed-wiring board that the manufacturing method for the multilayer printed-wiring board being related to by first embodiment manufactures
With following composition.
About multilayer printed-wiring board of the present embodiment, as shown in Fig. 7 (2), has core wiring plate 1, is laminated in
The composite wiring plate 2 of one interarea of core wiring plate 1 is stacked on the composite wiring plate 3 of another interarea of core wiring plate 1.
Core wiring plate 1 has core substrate 11, and is formed in the interarea 11a of core substrate 11, the target equipped with location hole 14a
Label 14.Composite wiring plate 2 has combination substrate 21, and is formed in the wiring pattern 25 of the interarea 21a of combination substrate 21.Group
Close the wiring pattern 35 that wiring plate 3 has combination substrate 31 and is formed in the interarea 31a of combination substrate 31.
The mode opposed with the interarea 11a of core substrate 11 with interarea 21b of composite wiring plate 2, via 23 lamination of adhesive layer
In core wiring plate 1.The mode opposed with the interarea 11b of core substrate 11 with interarea 31b of composite wiring plate 3, via adhesive layer 33
It is stacked on core wiring plate 1.
Core wiring plate 1, which is formed with, to be penetrated through core substrate 11 in a thickness direction and has a bottom outlet 17.Composite wiring plate 2 is formed with
The through hole 24 of perforation combination substrate 21 on thickness direction.Composite wiring plate 3 is formed with perforation combination substrate in a thickness direction
31, and it is communicated with the through hole 34 of bottom outlet 17.
The location hole 14a of target label 14 exposes in the bottom surface of through hole 24, can be from the side interarea 21a of combination substrate 21
It observes, and exposes in the bottom surface for having bottom outlet 17, can also be observed from the side interarea 31a of combination substrate 31.
In addition, as shown in Fig. 7 (2), each layer has to be printed in multilayer about multilayer printed-wiring board of the present embodiment
The wiring pattern 15,16,25,35 extended on the length direction of brush wiring plate.Moreover, wiring pattern 15,16,25,35 with length
The position for spending the orthogonal width direction in direction is almost the same from the thickness direction of multilayer printed-wiring board.
(second embodiment)
Next, the manufacturing method for the multilayer printed-wiring board being related to for second embodiment of the present invention, referring to Fig. 9
~Figure 13 is illustrated.One of second embodiment and the difference of first embodiment be, laminated plate clad with metal foil 20,30
Laminating method.In the first embodiment, in an interarea lamination laminated plate clad with metal foil 20 of laminated plate clad with metal foil 10,
Another interarea lamination laminated plate clad with metal foil 30.In contrast, in this second embodiment, laminated plate clad with metal foil 20,30 is all
It is stacked on a surface side of laminated plate clad with metal foil 10.
Hereinafter, the explanation with the repeating part of first embodiment is suitably omitted, it is real for second centered on difference
The mode of applying is illustrated.
Firstly, being formed has positioning as shown in figure 9, patterning metal foil 12 after preparing laminated plate clad with metal foil 10
The target label 14 of hole 14a.It is operated in the same way with first embodiment, also forms wiring pattern 15,16.However, in this implementation
In mode, do not need to be formed with bottom outlet 17.
Next, after preparing laminated plate clad with metal foil 20, as shown in figure 9, forming perforation in a thickness direction covers metal
The through hole 24 of foil laminate plate 20.
Next, as shown in Fig. 9 and Figure 10 (1), so that the interarea 11a of the interarea 21b of combination substrate 21 and core substrate 11
It is opposed and location hole 14a is located at the mode in through hole 24 from thickness direction, clad with metal foil is folded via adhesive layer 23
Laminate 20 is stacked on laminated plate clad with metal foil 10.Then, the laminated plate clad with metal foil 10,20 (laminated body) being stacked is heated,
Pressurization and it is integrated.By this process, adhesive layer 23 solidifies.
Next, as shown in Figure 11 (2), on the basis of the location hole 14a of target label 14, metal foil 22 is patterned and
Form wiring pattern 25.Wiring pattern 25 operates as described below to be formed.
Firstly, pasting dry film 41 in metal foil 22 as shown in Figure 10 (2).The opening of through hole 24 is by dry film 41 as a result,
Covering.Next, identifying location hole 14a by dry film 41 from the outside of laminated body using camera (not shown).Then, it is based on
The position of identified location hole 14a, is exposed the position alignment of mask, configures exposed mask on dry film 41.Then, lead to
It crosses and exposes dry film 41, develop, as shown in Figure 11 (1), form etching mask 41a, 41b.Then, using etching mask 41a,
41b etches metal foil 22.As a result, as shown in Figure 11 (2), wiring pattern 25 is formed.
Next, as shown in figure 12, forming perforation in a thickness direction after preparing laminated plate clad with metal foil 30 and covering metal
The through hole 34 of foil laminate plate 30.
In addition, through hole 24 is identical as the diameter of through hole 34 in Figure 12, but not limited to this, the diameter of through hole 34
The diameter of through hole 24 can be greater than.As a result, in subsequent process, metal is covered even if laminated plate clad with metal foil 30 is stacked on
Dislocation to a certain extent has occurred when on foil laminate plate 20, also can from outside by through hole 34 the location hole 14a come from.
Next, as shown in Figure 12 and Figure 13 (1), so that the interarea 31b of combination substrate 31 and the interarea for combining substrate 21
21a is opposed and location hole 14a is located at the mode in through hole 34 from thickness direction, via adhesive layer 33 by clad with metal foil
Laminated plate 30 is stacked on laminated plate clad with metal foil 20.In addition, being configured in a manner of being connected to through hole 34 with through hole 24.So
Afterwards, by the laminated plate clad with metal foil 10,20,30 being stacked heating, pressurization and it is integrated.By this process, adhesive layer 33 is solid
Change.
Next, as shown in Figure 13 (2), on the basis of the location hole 14a of target label 14, metal foil 32 is patterned and
Form wiring pattern 35.Wiring pattern 35 is formed using method same as wiring pattern 25.
Through the above steps, as shown in Figure 13 (2), four layers of multilayer printed-wiring board is obtained.Due to four layers of wiring
Pattern 15,16,25,35 is formed on the basis of common location hole 14a, therefore is formed with high position accuracy.
In addition, the printed wiring board of more layers can be manufactured by repeating above-mentioned operation.
As described above, the manufacturing method for the multilayer printed-wiring board being related to according to the present embodiment, can be with high position
Precision forms the wiring pattern of each layer.As a result, for example, the sharp processing end of wiring pattern and multilayer printed-wiring board can be shortened
The distance between.
< multilayer printed-wiring board >
The multilayer printed-wiring board of the manufacturing method manufacture for the multilayer printed-wiring board being related to by second embodiment has
There is following composition.
Shown in multilayer printed-wiring board of the present embodiment such as Figure 13 (2), has core wiring plate 1, is stacked on core cloth
The composite wiring plate 2 of line plate 1 and the composite wiring plate 3 for being stacked on composite wiring plate 2.
Core wiring plate 1 has core substrate 11, and is formed in the interarea 11a of core substrate 11 and is equipped with the mesh of location hole 14a
Mark label 14.Composite wiring plate 2 has combination substrate 21, and is formed in the wiring pattern 25 of the interarea 21a of combination substrate 21.
Composite wiring plate 3 has combination substrate 31, and is formed in the wiring pattern 35 of the interarea 31a of combination substrate 31.
Mode of the composite wiring plate 2 to keep the interarea 21b for combining substrate 21 opposed with the interarea 11a of core substrate 11, via
Adhesive layer 23 is stacked on core wiring plate 1.Composite wiring plate 3 so that combination substrate 31 interarea 31b and the master that combines substrate 21
Face 21a opposed mode is stacked on composite wiring plate 2 via adhesive layer 33.
Composite wiring plate 2 is formed with the through hole 24 of perforation combination substrate 21 in a thickness direction.The formation of composite wiring plate 3
There is perforation combination substrate 31 in a thickness direction, and is connected to the through hole 34 of through hole 24.
The location hole 14a of target label 14 exposes in the bottom surface of through hole 24, can be from the side interarea 31a of combination substrate 31
(that is, from outside of laminated body) is observed.
In addition, as shown in Figure 13 (2), each layer has in multilayer about multilayer printed-wiring board of the present embodiment
The wiring pattern 15,16,25,35 extended on the length direction of printed wiring board.Moreover, wiring pattern 15,16,25,35 with
The position of the orthogonal width direction of length direction is almost the same from the thickness direction of multilayer printed-wiring board.
Based on above-mentioned record, those skilled in the art may it is conceivable that additional effect of the invention, various modifications, but
Mode of the invention is not limited to the above embodiment.It is led in the content and its equipollent for not departing from claim defined
In the range of the conceptual thought of the present invention and purport out, it is able to carry out various additions, change and part and deletes.
Claims (11)
1. a kind of manufacturing method of multilayer printed-wiring board, which is characterized in that have following process:
Prepare the process of the first laminated plate clad with metal foil, first laminated plate clad with metal foil have with the first interarea and with institute
It states the core substrate of the second interarea of the first interarea opposite side and is formed in the first metal foil of first interarea,
By first metallic foil pattern, the process with the target label of location hole is formed,
Prepare the process of the second laminated plate clad with metal foil, second laminated plate clad with metal foil have with third interarea and with institute
It states the first combination substrate of the 4th interarea of third interarea opposite side and is formed in the second metal foil of the third interarea,
The process for penetrating through the first through hole of second laminated plate clad with metal foil in a thickness direction is formed,
Prepare third laminated plate clad with metal foil process, the third laminated plate clad with metal foil have with the 5th interarea and with institute
It states the second combination substrate of the 6th interarea of the 5th interarea opposite side and is formed in the third metal foil of the 5th interarea,
The process for penetrating through the second through hole of the third laminated plate clad with metal foil in a thickness direction is formed,
So that the 4th interarea is opposed with first interarea and the location hole is located at described first from thickness direction
Mode in through hole, the process that second laminated plate clad with metal foil is stacked on first laminated plate clad with metal foil,
So that the 6th interarea is opposed with second interarea and the location hole is located at described second from thickness direction
Mode in through hole, the process that the third laminated plate clad with metal foil is stacked on first laminated plate clad with metal foil,
On the basis of the location hole of the target label, by second metal foil and the third metallic foil pattern,
The process for being respectively formed the first wiring pattern and the second wiring pattern.
2. the manufacturing method of multilayer printed-wiring board according to claim 1, which is characterized in that be further equipped with following works
Sequence: the process for having bottom outlet that formation penetrates through the core substrate in a thickness direction and the location hole exposes in bottom surface,
The third laminated plate clad with metal foil by second through hole with it is described there is bottom outlet to be connected in a manner of be stacked on described
One laminated plate clad with metal foil.
3. the manufacturing method of multilayer printed-wiring board according to claim 2, which is characterized in that the core substrate is by liquid crystal
Polymer or polyimides are constituted.
4. the manufacturing method of multilayer printed-wiring board according to claim 2, which is characterized in that second through hole
Diameter is greater than the diameter for having bottom outlet.
5. the manufacturing method of multilayer printed-wiring board according to claim 2, which is characterized in that have described in formation bottom outlet it
Afterwards, carry out to constitute the processing of the inner face mirror-polishing of the metal foil of the target label.
6. the manufacturing method of multilayer printed-wiring board described according to claim 1~any one of 5, which is characterized in that institute
Stating core substrate, the first combination substrate and the second combination substrate has flexibility.
7. a kind of manufacturing method of multilayer printed-wiring board, which is characterized in that have following processes:
Prepare the process of the first laminated plate clad with metal foil, first laminated plate clad with metal foil have with the first interarea and with institute
It states the core substrate of the second interarea of the first interarea opposite side and is formed in the first metal foil of first interarea,
By first metallic foil pattern, the process with the target label of location hole is formed,
Prepare the process of the second laminated plate clad with metal foil, second laminated plate clad with metal foil have with third interarea and with institute
It states the first combination substrate of the 4th interarea of third interarea opposite side and is formed in the second metal foil of the third interarea,
The process for penetrating through the first through hole of second laminated plate clad with metal foil in a thickness direction is formed,
So that the 4th interarea is opposed with first interarea and the location hole is located at described first from thickness direction
Mode in through hole, the process that second laminated plate clad with metal foil is stacked on first laminated plate clad with metal foil,
On the basis of the location hole of the target label, by second metallic foil pattern, the work of wiring pattern is formed
Sequence,
Prepare third laminated plate clad with metal foil process, the third laminated plate clad with metal foil have with the 5th interarea and with institute
It states the second combination substrate of the 6th interarea of the 5th interarea opposite side and is formed in the third metal foil of the 5th interarea,
The process for penetrating through the second through hole of the third laminated plate clad with metal foil in a thickness direction is formed,
So that the 6th interarea is opposed with the third interarea of second laminated plate clad with metal foil and sees from thickness direction
The mode that the location hole is located in second through hole is examined, the third laminated plate clad with metal foil is stacked on described second
The process of laminated plate clad with metal foil,
On the basis of the location hole of the target label, by the third metallic foil pattern, the work of wiring pattern is formed
Sequence.
8. the manufacturing method of multilayer printed-wiring board according to claim 7, which is characterized in that second through hole
Diameter is greater than the diameter of first through hole.
9. the manufacturing method of multilayer printed-wiring board according to claim 7 or 8, which is characterized in that the core substrate, institute
Stating the first combination substrate and the second combination substrate has flexibility.
10. a kind of multilayer printed-wiring board, which is characterized in that have:
Core wiring plate, the core wiring plate have: having the first interarea and the second interarea with the first interarea opposite side
Core substrate, and be formed in first interarea and be equipped with location hole target label,
First composite wiring plate, the first composite wiring plate have: have third interarea and with the third interarea opposite one
First combination substrate of the 4th interarea of side, and it is formed in the first wiring pattern of the third interarea,
Second composite wiring plate, the second composite wiring plate have: have the 5th interarea and with the 5th interarea opposite one
Second combination substrate of the 6th interarea of side, and it is formed in the second wiring pattern of the 5th interarea,
The first composite wiring plate is in the 4th interarea mode opposed with first interarea via adhesive layer lamination
In the core wiring plate,
The second composite wiring plate is in the 6th interarea mode opposed with second interarea via adhesive layer lamination
In the core wiring plate,
The core wiring plate be formed with penetrate through the core substrate in a thickness direction have bottom outlet,
The first composite wiring plate is formed with the first through hole for penetrating through the first combination substrate in a thickness direction,
The second composite wiring plate, which is formed with to penetrate through in a thickness direction described in the second combination substrate and connection, bottom outlet
The second through hole,
The location hole exposes in the bottom surface of first through hole, can observe from the third main surface side, and in institute
The bottom surface for stating bottom outlet is exposed, and can also be observed from the 5th main surface side.
11. a kind of multilayer printed-wiring board, which is characterized in that have:
Core wiring plate, the core wiring plate have: having the first interarea and the second interarea with the first interarea opposite side
Core substrate, and be formed in first interarea and be equipped with location hole target label,
First composite wiring plate, the first composite wiring plate have: have third interarea and with the third interarea opposite one
First combination substrate of the 4th interarea of side, and it is formed in the first wiring pattern of the third interarea,
Second composite wiring plate, the second composite wiring plate have: have the 5th interarea and with the 5th interarea opposite one
Second combination substrate of the 6th interarea of side, and it is formed in the second wiring pattern of the 5th interarea,
The first composite wiring plate is in the 4th interarea mode opposed with first interarea via adhesive layer lamination
In the core wiring plate,
The second composite wiring plate is in the 6th interarea mode opposed with the third interarea via adhesive layer lamination
In the first composite wiring plate,
The first composite wiring plate is formed with the first through hole for penetrating through the first combination substrate in a thickness direction,
The second composite wiring plate is formed with to penetrate through the second combination substrate in a thickness direction and be connected to described first and pass through
Second through hole of through-hole,
The location hole exposes in the bottom surface of first through hole, can observe from the 5th main surface side.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-154499 | 2017-08-09 | ||
| JP2017154499A JP6935268B2 (en) | 2017-08-09 | 2017-08-09 | Manufacturing method of multi-layer printed wiring board and multi-layer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109392257A true CN109392257A (en) | 2019-02-26 |
| CN109392257B CN109392257B (en) | 2023-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810759433.3A Active CN109392257B (en) | 2017-08-09 | 2018-07-11 | Method for manufacturing multilayer printed wiring board and multilayer printed wiring board |
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| Country | Link |
|---|---|
| JP (1) | JP6935268B2 (en) |
| CN (1) | CN109392257B (en) |
| TW (1) | TWI763895B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115397117A (en) * | 2022-08-10 | 2022-11-25 | 中山芯承半导体有限公司 | Circuit board manufacturing method for improving interlayer and layer alignment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867256A (en) * | 2021-01-04 | 2021-05-28 | 深圳市兴森快捷电路科技股份有限公司 | Manufacturing method of multi-press printed circuit board and printed circuit board |
| CN117939811B (en) * | 2024-03-22 | 2024-05-31 | 绵阳新能智造科技有限公司 | High-performance AME multilayer circuit board lamination device |
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| JP2006237088A (en) * | 2005-02-22 | 2006-09-07 | Sumitomo Metal Electronics Devices Inc | Method of manufacturing multilayer printed wiring board |
| JP2011171658A (en) * | 2010-02-22 | 2011-09-01 | Sanyo Electric Co Ltd | Multilayer substrate and method of manufacturing the same |
| JP5710152B2 (en) * | 2010-04-15 | 2015-04-30 | 日本メクトロン株式会社 | Manufacturing method of multilayer flexible printed wiring board |
| JP5794502B2 (en) * | 2012-01-23 | 2015-10-14 | 京セラサーキットソリューションズ株式会社 | Method for manufacturing printed wiring board |
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2017
- 2017-08-09 JP JP2017154499A patent/JP6935268B2/en active Active
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- 2018-08-01 TW TW107126713A patent/TWI763895B/en active
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| JP2002185102A (en) * | 2000-12-13 | 2002-06-28 | Nec Saitama Ltd | Flexible printed wiring board capable of recognizing both surfaces |
| JP2004071749A (en) * | 2002-08-05 | 2004-03-04 | Toppan Printing Co Ltd | Method of manufacturing multilayer circuit wiring board |
| US20120312590A1 (en) * | 2011-06-09 | 2012-12-13 | Ngk Spark Plug Co., Ltd. | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
| CN104885581A (en) * | 2012-12-28 | 2015-09-02 | 日立化成株式会社 | Layered body with support substrate, method for fabricating same, and method for fabricating multi-layer wiring substrate |
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| CN115397117A (en) * | 2022-08-10 | 2022-11-25 | 中山芯承半导体有限公司 | Circuit board manufacturing method for improving interlayer and layer alignment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109392257B (en) | 2023-06-20 |
| TWI763895B (en) | 2022-05-11 |
| JP6935268B2 (en) | 2021-09-15 |
| JP2019033223A (en) | 2019-02-28 |
| TW201911992A (en) | 2019-03-16 |
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