CN108227402A - A kind of method of adjustment of mask plate exposure stage and mask plate - Google Patents
A kind of method of adjustment of mask plate exposure stage and mask plate Download PDFInfo
- Publication number
- CN108227402A CN108227402A CN201711474976.2A CN201711474976A CN108227402A CN 108227402 A CN108227402 A CN 108227402A CN 201711474976 A CN201711474976 A CN 201711474976A CN 108227402 A CN108227402 A CN 108227402A
- Authority
- CN
- China
- Prior art keywords
- mask plate
- exposure stage
- height
- plate exposure
- levelness
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention relates to field of lithography, disclose a kind of mask plate exposure stage, and the regulating valve for adjusting the mask plate exposure stage height and levelness is set in the mesa base of the mask plate exposure stage.The levelness and height of mask plate can be adjusted using the technical solution, and then improves exposure accuracy.
Description
Technical field
The present invention relates to field of lithography, the method for adjustment of more particularly to a kind of mask plate exposure stage and mask plate.
Background technology
In FPD lithographic process, exposure machine required precision generally in the micron-scale not, and its depth of focus generally ±
Within 10um or even higher is required, so high to requirement for horizontality of the mask plate in mask plate exposure stage.General mask
Plate 10 is all to be placed directly in mask plate exposure stage 20 to be exposed after vacuum suction, for the levelness and scape of mask plate 10
Deeply without effectively being controlled.Once there is the unhorizontal situation of mask plate 10, then will appear as illustrated in fig. 1 and 2, figure line
Wide deviation is too big, has seriously affected exposure machine precision.Mask plate 10 is not horizontal in mask plate exposure stage 20 to lead to focus institute
In plane, that is, focusing surface 30 and glass substrate 40 not in same plane, if the height of the focusing surface 30 of camera lens 50 and glass substrate 40
Beyond focal depth range, then the pattern precision exposed does not reach requirement difference.
Invention content
The embodiment of the present invention is designed to provide a kind of mask plate exposure stage and the method for adjustment of mask plate, improves
Exposure accuracy.
A kind of mask plate exposure stage provided in an embodiment of the present invention, sets in the mesa base of the mask plate exposure stage
Put the regulating valve for adjusting the mask plate exposure stage height and levelness.
Optionally, the regulating valve uses the height of mask plate exposure stage described in laser measurement.
Optionally, at four angles of mesa base of the mask plate exposure stage, respectively setting one is used to adjust the mask
The regulating valve of plate exposure stage height and levelness.
Optionally, it is hemispherical or bowl-shape at the top of the regulating valve.
Optionally, it is embedded between the mask plate exposure stage, with the mask plate exposure stage at the top of the regulating valve
There are gaps.
Optionally, the mask plate exposure stage is additionally provided with position of platform and angular adjustment valve.
In addition, the present invention also provides a kind of method of adjustment of mask plate, the mask plate is placed in as described above any
In mask plate exposure stage, the mask plate is adjusted by adjusting levelness and the height of the mask plate exposure stage
Levelness and height.
Optionally, four labels are done respectively on four angles of the mask plate, ccd image sensor measures each mark
The figure gray scale of note, take each figure most clearly position to the ccd image sensor height as each label to institute
The height of ccd image sensor is stated, the deviation of four angle height of mask plate is obtained, sends deviation to the mask plate
The regulating valve of exposure stage height and levelness is adjusted by adjusting levelness and the height of the mask plate exposure stage
The levelness and height of the mask plate.
Optionally, when the mask plate exposure stage adjusts height and levelness, the regulating valve of position and angle keeps lock
It is fixed, while in the mask plate exposure stage adjusting position and angle and exposure process, the mask plate exposure stage height and
The regulating valve of levelness keeps locking.
Therefore using the present embodiment technical solution, due to increasing by one group of height in the mask plate exposure stage
With the regulating valve of levelness, reach the level and height of control mask plate by controlling the height of the mask plate exposure stage
The effect of degree, improves exposure accuracy.
Description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also
To obtain other attached drawings according to these attached drawings.
Fig. 1 is that exposure caused by mask plate out-of-flatness is abnormal；
Fig. 2 is mask plate exposure process schematic diagram；
Fig. 3 is a kind of mask plate exposure stage structure diagram provided by the invention；
Fig. 4 is another mask plate exposure stage structure diagram provided by the invention；
Fig. 5 is a kind of Z axis regulating valve structure schematic diagram provided by the invention；
Fig. 6 is a kind of mask structure being schematic diagram provided by the invention.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without creative efforts
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1：
The present embodiment provides a kind of mask plate exposure stage, as shown in Figures 3 and 4, in the mask plate exposure stage 60
Mesa base sets the Z axis regulating valve for adjusting the mask plate exposure stage height and levelness.It can be, but not limited to, institute
Z axis regulating valve is stated using laser ranging, measures the height of the mask plate exposure stage 60.The mask plate exposure stage 60 is also
It is provided with position of platform X-axis, Y-axis and θ angular adjustment valves.Control mask plate flat in mask plate exposure by each regulating valve
Level and height on platform 60.
For example, at four angles of mesa base of the mask plate exposure stage 60, respectively setting one is used to adjust the mask
The Z axis regulating valve of 60 height of plate exposure stage and levelness.As shown in figure 5, it is hemispherical or bowl at the top of the Z axis regulating valve
Shape.Embedded in there are one between the mask plate exposure stage 60, with the mask plate exposure stage 60 at the top of the Z axis regulating valve
Fixed gap, it is ensured that the flexibility when adjusting height, i.e., when adjusting X-axis, Y-axis, θ angles, since adjustment amount is micron
Grade, certain gap can ensure that Z axis regulating valve is unaffected in locking.By adjusting the mask plate exposure stage 60 4
The height at a angle adjusts the height at the four of mask plate angles, so as to which the mask plate be made to reach horizontal.
As it can be seen that increase the regulating valve of one group of height and levelness in the mask plate exposure stage, by described in control
The height of mask plate exposure stage improves exposure accuracy so as to have the function that the levelness and height of control mask plate.
Due to can not only adjust the level of mask plate, while the whole height of mask plate can also be adjusted, gathered in camera lens
Coke can adjust the depth of field i.e. mask plate with a distance from camera lens, have the function that adjust depth of focus indirectly beyond focal depth range.Depth of focus is
In the case where ensureing exposure accuracy, focusing surface (image planes) moveable range.The depth of field be in the case where ensureing exposure accuracy,
Object plane (mask plate) moveable range.
Embodiment 2：
The present invention also provides a kind of method of adjustment of mask plate, the mask plate is placed in any mask plate as described above
In exposure stage, the levelness of the mask plate is adjusted by adjusting levelness and the height of the mask plate exposure stage
And height.
It can be, but not limited to, as shown in fig. 6, doing four labels respectively on four angles of the mask plate, ccd image passes
Sensor measures the figure gray scale of each label, and taking each figure, most clearly the height of position to the ccd image sensor is made
For the height of each label to the ccd image sensor, the deviation of four angle height of mask plate is obtained, by deviation
The regulating valve of the mask plate exposure stage height and levelness is sent to, by the level for adjusting the mask plate exposure stage
Degree and height and then the levelness and height that adjust the mask plate.Specifically respectively add at described four angles of mask plate exposure stage
One Z axis regulating valve is covered by the Z axis regulating valve for increasing adjustment height on four angles of mask plate exposure stage to adjust
The height of diaphragm plate exposure stage, so as to adjust the height of the mask plate.The Z axis regulating valve uses mask described in laser measurement
The height of plate exposure stage.
When the mask plate exposure stage Z axis adjusts valve regulation height and levelness, the tune of position X-axis, Y-axis and θ angles
It saves valve and keeps locking, while in the mask plate exposure stage position X-axis, Y-axis and θ angular adjustments and exposure process, it is described to cover
The Z axis regulating valve of diaphragm plate exposure stage height and levelness keeps locking, in order to ensure that the Z axis regulating valve is unaffected and high
The flexibility of adjustment is spent, by the Z axis regulating valve top design into bowl-shape or semicircle shape, embedded in the mask plate exposure stage
It is interior, while there are certain intervals.
As it can be seen that by adjusting the height of the mask plate exposure stage so as to reach the levelness and height of adjustment mask plate
Effect, improves exposure accuracy.
Embodiments described above does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (9)
1. a kind of mask plate exposure stage, which is characterized in that set to adjust in the mesa base of the mask plate exposure stage
Save the regulating valve of the mask plate exposure stage height and levelness.
2. a kind of mask plate exposure stage as described in claim 1, which is characterized in that the regulating valve uses laser measurement institute
State the height of mask plate exposure stage.
3. a kind of mask plate exposure stage as claimed in claim 2, which is characterized in that in the flat of the mask plate exposure stage
The angle of platform bottom four respectively sets one for adjusting the regulating valve of the mask plate exposure stage height and levelness.
4. a kind of mask plate exposure stage as claimed in claim 3, which is characterized in that at the top of the regulating valve to be hemispherical or
It is bowl-shape.
5. a kind of mask plate exposure stage as claimed in claim 4, which is characterized in that covered at the top of the regulating valve embedded in described
There are gaps between diaphragm plate exposure stage, with the mask plate exposure stage.
6. a kind of mask plate exposure stage as claimed in claim 5, which is characterized in that the mask plate exposure stage is also set up
There are position of platform and angular adjustment valve.
7. a kind of method of adjustment of mask plate, which is characterized in that the mask plate is placed in as described in any in claim 1 to 6
Mask plate exposure stage on, adjust the mask plate by adjusting levelness and the height of the mask plate exposure stage
Levelness and height.
8. a kind of method of adjustment of mask plate as claimed in claim 7, which is characterized in that on four angles of the mask plate
Do four labels respectively, ccd image sensor measures the figure gray scale of each label, takes each figure most clearly position to institute
The height of ccd image sensor is stated as each label to the height of the ccd image sensor, obtains the mask plate four
Deviation is sent to the regulating valve of the mask plate exposure stage height and levelness, passes through adjusting by the deviation of a angle height
The levelness and height of the mask plate exposure stage and then the levelness and height that adjust the mask plate.
A kind of 9. method of adjustment of mask plate as claimed in claim 7 or 8, which is characterized in that the mask plate exposure stage
When adjusting height and levelness, the regulating valve of position and angle keeps locking, while the mask plate exposure stage adjusting position
In angle and exposure process, the regulating valve of the mask plate exposure stage height and levelness keeps locking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711474976.2A CN108227402A (en) | 2017-12-29 | 2017-12-29 | A kind of method of adjustment of mask plate exposure stage and mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711474976.2A CN108227402A (en) | 2017-12-29 | 2017-12-29 | A kind of method of adjustment of mask plate exposure stage and mask plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108227402A true CN108227402A (en) | 2018-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711474976.2A Pending CN108227402A (en) | 2017-12-29 | 2017-12-29 | A kind of method of adjustment of mask plate exposure stage and mask plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN108227402A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020135557A1 (en) * | 2018-12-28 | 2020-07-02 | 上海微电子装备（集团）股份有限公司 | Mask attitude monitoring method and apparatus and mask particle size measurement device |
| CN114252014A (en) * | 2021-12-24 | 2022-03-29 | 长飞光纤光缆股份有限公司 | System and method for testing mark size of photomask substrate |
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| CN101546134A (en) * | 2008-03-25 | 2009-09-30 | 纽富来科技股份有限公司 | Electron beam writing apparatus and method |
| CN101986207A (en) * | 2009-07-28 | 2011-03-16 | 日本精工株式会社 | Exposure apparatus and exposure method |
| CN102043351A (en) * | 2009-10-12 | 2011-05-04 | 上海微电子装备有限公司 | Leveling and focusing mechanism and mask platform with same |
| CN202904220U (en) * | 2012-11-12 | 2013-04-24 | 川宝科技股份有限公司 | Horizontal angle adjusting mechanism for photomask structure of exposure machine |
| CN104253067A (en) * | 2013-06-26 | 2014-12-31 | 三星显示有限公司 | Substrate Processing Device, Depositing Device, Substrate Processing Method And Depositing Method |
| CN107329376A (en) * | 2017-07-18 | 2017-11-07 | 中国科学院光电研究院 | Nested type supporting structure with position adjustment function and application thereof |
-
2017
- 2017-12-29 CN CN201711474976.2A patent/CN108227402A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546134A (en) * | 2008-03-25 | 2009-09-30 | 纽富来科技股份有限公司 | Electron beam writing apparatus and method |
| CN101986207A (en) * | 2009-07-28 | 2011-03-16 | 日本精工株式会社 | Exposure apparatus and exposure method |
| CN102043351A (en) * | 2009-10-12 | 2011-05-04 | 上海微电子装备有限公司 | Leveling and focusing mechanism and mask platform with same |
| CN202904220U (en) * | 2012-11-12 | 2013-04-24 | 川宝科技股份有限公司 | Horizontal angle adjusting mechanism for photomask structure of exposure machine |
| CN104253067A (en) * | 2013-06-26 | 2014-12-31 | 三星显示有限公司 | Substrate Processing Device, Depositing Device, Substrate Processing Method And Depositing Method |
| CN107329376A (en) * | 2017-07-18 | 2017-11-07 | 中国科学院光电研究院 | Nested type supporting structure with position adjustment function and application thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020135557A1 (en) * | 2018-12-28 | 2020-07-02 | 上海微电子装备（集团）股份有限公司 | Mask attitude monitoring method and apparatus and mask particle size measurement device |
| CN114252014A (en) * | 2021-12-24 | 2022-03-29 | 长飞光纤光缆股份有限公司 | System and method for testing mark size of photomask substrate |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |
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| RJ01 | Rejection of invention patent application after publication |