CN107786276A - A kind of damage compensation method and device of pluggable ACO modules - Google Patents

A kind of damage compensation method and device of pluggable ACO modules Download PDF

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Publication number
CN107786276A
CN107786276A CN201610753845.7A CN201610753845A CN107786276A CN 107786276 A CN107786276 A CN 107786276A CN 201610753845 A CN201610753845 A CN 201610753845A CN 107786276 A CN107786276 A CN 107786276A
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China
Prior art keywords
aco
modules
line card
damage
connector
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CN201610753845.7A
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CN107786276B (en
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曹攀
杨宏
马永东
熊伟
吴双元
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HAISIGUANG ELECTRONICS Co Ltd
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HAISIGUANG ELECTRONICS Co Ltd
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60—Receivers
    • H04B10/61—Coherent receivers
    • H04B10/615—Arrangements affecting the optical part of the receiver

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Dc Digital Transmission (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

The invention discloses a kind of damage compensation method and device of pluggable ACO modules.In present invention method,First slot of the first ACO modules and the first line card is established before plug connection,The first damage measurement parameter is preserved in the register of first ACO modules,The second damage measurement parameter is preserved in the register of first line card,I.e. the first ACO modules and First Line are stuck in before this plug is established with regard to having carried out the demarcation of impairment parameter in advance,Caused damage can be merged processing and be estimated by the first damage measurement parameter and the second damage measurement parameter during transmitting telecommunication between first ACO modules and the first line card,So as to be damaged the estimation of demarcation can completion damage in advance by the first ACO modules and First Line card,The application scenarios for needing often to plug suitable for ACO modules,Damage caused by multi-pin connector is compensated,Improve the transmission performance of electric signal.

Description

A kind of damage compensation method and device of pluggable ACO modules
Technical field
The present invention relates to technical field of photo communication, more particularly to a kind of pluggable simulation coherent light (English full name：Analog Coherent optics, English abbreviation：ACO) the damage compensation method and device of module.
Background technology
With the development of optical communication industry, the data capacity of optical network system carrying increases year by year, it is therefore desirable to more Optical transceiver module, for operator, the increase of number of modules can take more frames and the more power consumptions of increase, because This realizes that the miniaturization of optical transceiver module and low-power consumption are very necessary.The relevant optical module in existing line side is generally larger Optical module, single line card can only place 1 to 2 optical modules, and power consumption is higher.
Fig. 1 describes digital coherent light (English full name in the prior art：Digital Coherent Optics, English letter Claim：DCO) the transmission characteristic of optical module, micro control unit (English full name：Microcontroller Unit, English abbreviation：MCU) It is the control unit of optical module, the data transmission procedure of DCO optical modules is：Optical module will be from framing (English name：Framer) The multi-channel service data that chip is sent pass through parallel series and staticizer (English full name：SERializer- DESerializer, English abbreviation：SERDES) via 168 pin (English names：PIN) interface of connector is transferred to ODSP Chip, SERDES receiving terminal can pass through clock and data recovery (English full name：Clock Data Recovery, English letter Claim：CDR) operation recovery goes out business datum, and ODSP chips pass through digital-to-analogue conversion (English full name again：Digital to Analog Conversion, English abbreviation：DAC) business datum recovered is sent, electric signal amplified by radio frequency amplifier after through toning Device processed is modulated onto area of light, then transmitting terminal (the English full name for passing through optical fiber：Transmitter, English abbreviation：Tx) interface exports Optical signal, so as to realize the transmission of business datum.
The DRP data reception process of DOC optical modules is：Optical signal passes through receiving terminal (English full name：Receiver, English letter Claim：Rx) interface enters optical module, by integrating coherent receiver (English full name：Integrated Coherent Receiver, English abbreviation：ICR) and local oscillator light source is converted into electric signal, electric signal after the processing of ODSP chips, Then electric signal is sent from SERDES, enters Framer chips via 168PIN connectors, the CDR modules in Framer chips can To realize the recovery of clock and data service, so as to realize the reception of signal.
The data of above-mentioned DOC optical modules are sent and received under both scenes, and signal impairment caused by connector can be with Effective compensation is carried out by CDR modules, therefore obvious performance cost will not be introduced.Line side coherent light actually use simultaneously in Module will not be changed after being fixed on line card, thus by measure in advance compensate later these damages inside the optical module caused by Performance cost.
As optical module is concerned with to small size and the active demand of low-power consumption in line side, this is required by lifting process water Power consumption that is flat, reducing the size of photoelectric device and reduction device using new material and new design, to realize single line More optical modules can be placed and supported to card.In order that single line card can place more optical modules, the pluggable (English of C-shaped Literary full name：C Form-factor Pluggable, English abbreviation：CFP), volume only accounts for the CFP2 of CFP half, volume only accounts for The forms such as the CFP4 of CFP a quarters turn into the fresh target of the relevant optical module in line side, and these optical modules require smaller size Lower power consumption, while be required for meeting optical interconnection forum (English full name：Optical Internetworking Forum, English abbreviation：) or multi-source agreement (English full name OIF：Multi Source Agreement, English abbreviation：MSA) standard provides Form-factor and power consumption.Light Digital Signal Processing (the English full name in optical module simultaneously because line side is concerned with：Optical Digital Signal Processing, English abbreviation：ODSP power consumption) is larger, thus be born by the high ODSP of power consumption from The solution being transferred in optical module on single line card, so as to propose CFPx-ACO component form, that is, simulate phase Dry optical module.The main flow module that current stage is researching and developing includes：CFP2-ACO modules, the goal in research of next stage include： CFP4-ACO modules and CFP8-ACO modules.
Next the transmission characteristic that ACO is introduced in optical module is illustrated.As shown in Fig. 2 for using CFPx- The application scenarios of ACO modules.Fig. 2 describes the scene of CFPx-ACO modules in actual use, it can be seen that using CFPx- The maximum difference of ACO modules and DCO optical modules is that ODSP is located on line card not inside optical module.Meet MSA and OIF Defined ACO modules can be placed on the different slots position of different line cards.Under the scene shown in Fig. 2, CFPx-ACO modules Signal transmission process is：
ODSP is by the analog signal of multichannel (such as can be the single-ended signal on 4 tunnels, or the differential signal for 8 tunnels) high speed (it is usually 30 gigabit baud (English names：Gbaud more than)) by CFPx connectors be sent to it corresponding to ACO modules, After the multi-channel electric signal received is amplified by ACO modules, then area of light is transferred to by electrooptic modulator, believed light by Tx interfaces Number launch.
The process of CFPx-ACO module reception signals is：Optical signal enters receiver by Rx interface, after being handled by ICR Multi-channel electric signal (be usually the single-ended signal on 4 tunnels, or be the differential signal on 8 tunnels) is obtained, electric signal passes through the CFPx in Fig. 2 Connector enters ODSP chips, and then ODSP chips recover corresponding data by Digital Signal Processing, so as to realize The receive process of signal.
From described above, DCO optical modules mainly pass through the hair to realizing signal after sending the measurement in advance of end signal The damage compensation of sending end and receiving terminal, this process occur inside optical module.Optical module and outside by multi-pin connector (such as Interface 168PIN) carries out the communication of data signal, and this signal baud rate is relatively low (being usually 10Gbaud or so), and Receiving terminal has CDR modules to can be used for recovering data, therefore the damage that connector introduces does not influence substantially on whole system.
But when using CFPx-ACO modules, system can have problems with：1) mould of high speed (such as 30Gbaud) Intend signal and pass through CFPx connectors, damage can be introduced, and there is no CDR modules to can be used for compensating these damages；2) due to actually making It is pluggable with middle CFPx-ACO modules, therefore can introduce when different optical modules and different line slots are arranged in pairs or groups Damage also have a greater change, therefore can not in ODSP compensation system damage.
The content of the invention
The embodiments of the invention provide a kind of damage compensation method and device of pluggable ACO modules, for multi-pipe pin Damage compensates caused by connector, improves the transmission performance of electric signal.
In order to solve the above technical problems, the embodiment of the present invention provides following technical scheme：
In a first aspect, in the damage compensation method of pluggable ACO modules provided in an embodiment of the present invention, the first ACO modules Before establishing plug connection with the first slot of the first line card, the first damage has been preserved in the register of the first ACO modules Measurement parameter, the second damage measurement parameter, i.e. the first ACO modules and the first line card have been preserved in the register of the first line card With regard to having carried out the demarcation of impairment parameter in advance before this plug is established, therefore passed between the first ACO modules and the first line card Damage caused by power transmission signal can be merged by the first damage measurement parameter and the second damage measurement parameter handle into Row estimation, the total impairment value of connector that needs compensate when the damage assessment result of generation can be used for calculating electric signal transmission should The total impairment value of connector is the effective foundation for carrying out signal impairment compensation, so as to be carried out by the first ACO modules and First Line card The can of damage demarcation in advance completes the estimation of damage, therefore CDR modules need not be used as DCO modules, suitable for ACO Module needs the application scenarios often plugged, and damage caused by multi-pin connector is compensated, improves the transmission of electric signal Performance.
With reference in a first aspect, in the first possible implementation of first aspect, the second multi-pin connector connects There are the 2nd ODSP chips corresponding to the second line card, it is right when the first ACO modules are inserted into corresponding to the second line card on the second slot First ACO modules are inserted in when on the second slot enters horizontal electrical signal by being connected with the second multi-pin connector of the 2nd ODSP chips Caused connector impairment value is measured so as to obtain the first damage measurement parameter during transmission, by the first damage measurement parameter Store into the register of the first ACO modules.In an embodiment of the present invention, the second line card is inserted into by the first ACO modules On-the-spot test was carried out when upper and then the first damage measurement parameter can be obtained, so as to which the first damage measurement parameter is saved in In the register of first ACO modules, after being pulled out so as to the first ACO modules from the second line card, the deposit of the first ACO modules Still the first damage measurement parameter obtained by test calibration is preserved in device.
With reference to the first possible implementation of first aspect, in second of possible implementation of first aspect In, when the first ACO modules are inserted into corresponding to the second line card on the second slot, to the 2nd ODSP chips by being connected with first Caused connector impairment value is measured so as to obtain when second multi-pin connector of ACO modules carries out electric signal transmission 3rd damage measurement parameter, by the storage of the 3rd damage measurement parameter into the register of the second line card.In embodiments of the present invention, On-the-spot test is carried out when being inserted into by the first ACO modules on the second line card and then the 3rd damage measurement parameter can also be obtained, So as to which the 3rd damage measurement parameter is saved in the register of the second line card, so as to which the first ACO modules are from the second line card On pull out after, the 3rd damage measurement parameter obtained by test calibration is still preserved in the register of second line card, So as to which the 3rd damage can also be got when being inserted into other ACO modules on second line card by the register of the second line card Measurement parameter, therefore go for the estimation when plugging ACO modules on the second line card to connector damage.
With reference in a first aspect, in the third possible implementation of first aspect, the first ACO modules are inserted into Corresponding to one line card on the first slot before, the 2nd ACO modules are inserted into corresponding to the first line card on the first slot；To first ODSP chips by be connected with the 2nd ACO modules the first multi-pin connector carry out electric signal transmission when caused connector Impairment value is measured so as to obtain the second damage measurement parameter, by the deposit of the second damage measurement parameter storage to the first line card In device.In embodiments of the present invention, on-the-spot test is carried out when being inserted into by the 2nd ACO modules on the first line card and then can be with The second damage measurement parameter is obtained, so as to which the second damage measurement parameter is saved in the register of the first line card, so as to After 2nd ACO modules are pulled out from the first line card, still preserve in the register of first line card and obtained by test calibration The the second damage measurement parameter arrived, so that when being inserted into other ACO modules (such as the first ACO modules) on first line card The second damage measurement parameter can be got by the register of the first line card, therefore goes for plugging on the first line card To the estimation of connector damage during ACO modules.
With reference to the third possible implementation of first aspect, in the 4th kind of possible implementation of first aspect In, when the 2nd ACO modules are inserted into corresponding to the first line card on the first slot, the 2nd ACO modules are inserted on the first slot When carrying out electric signal transmission by being connected with the first multi-pin connector of the first ODSP chips caused connector damage Value is measured so as to obtain the 4th damage measurement parameter, by the deposit of the 4th damage measurement parameter storage to the 2nd ACO modules In device.In embodiments of the present invention, on-the-spot test is carried out when being inserted into by the 2nd ACO modules on the first line card and then can be obtained To the 4th damage measurement parameter, so as to which the 4th damage measurement parameter is saved in the register of the 2nd ACO modules, so as to After 2nd ACO modules are pulled out from the first line card, still preserved in the register of the 2nd ACO modules and pass through test calibration The 4th obtained damage measurement parameter, can also be by the 2nd ACO moulds when being inserted into other line cards so as to the 2nd ACO modules The register of block gets the 4th damage measurement parameter, therefore goes for when the 2nd ACO modules are inserted into other line cards pair The estimation of connector damage.
With reference to the first of first aspect or first aspect possibility or second of possibility or the third is possible or the 4th kind can The implementation of energy, in the 5th kind of possible implementation of first aspect, connector impairment value is included in following information It is at least one：The propagation time delay of electric signal, positive transmission coefficient S21 filtering characteristics, the amplitude fading of electric signal.It is wherein electric The propagation time delay of signal is properly termed as " Skew " caused by connector, when passing through multitube between ACO modules and ODSP chips Pin connector can produce the damage of Skew, S21 filtering characteristic because of multi-pin connector when carrying out electric signal transmission, can also produce The amplitude fading of electric signal, therefore the compensation calculation of damage measurement can be carried out according to method provided in an embodiment of the present invention, from And the connector compensated is needed when determining to carry out electric signal transmission by multi-pin connector between ACO modules and ODSP chips Total impairment value, the particular type in the embodiment of the present invention for connector impairment value are different, it is necessary to be attached device damage compensation Also differ.
With reference to the 5th kind of possible implementation of first aspect, in the 6th kind of possible implementation of first aspect In, obtained according to damage assessment result and carried out between the first ODSP chips and the first ACO modules by the first multi-pin connector After the total impairment value of connector that needs compensate during electric signal transmission, when the first ODSP chips and the first ACO modules pass through first The total impairment value of connector compensated is needed to include the propagation time delay and forward direction of electric signal during pin connector transmitting telecommunication During transmission coefficient S21 filtering characteristics, the first ODSP chips and the first ACO modules are passed through into the first pin connector transmitting telecommunication number When need the total impairment value of connector that compensates to be sent to the first ODSP chips, by the first ODSP chip compensation electric signals transmission when Between delay and S21 filtering characteristics；When the first ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication When the total impairment value of connector for needing to compensate includes the amplitude fading of electric signal, according to the first ODSP chips and the first ACO modules The radio frequency that the first ACO modules are adjusted by the total impairment value of connector for needing to compensate during the first pin connector transmitting telecommunication is put Big device gain and trans-impedance amplifier TIA gains.
In embodiments of the present invention, it is different, it is necessary to the compensation way taken for the particular type of connector impairment value Differ.Specifically, getting the total impairment value of connector for needing to compensate includes propagation time delay and the S21 filters of electric signal During wave property, Skew and S21 filtering characteristics can be compensated by the first ODSP chips, it is total to get the connector that needs compensate When impairment value includes the amplitude fading of electric signal, it can be mended by the gain of radio frequency amplifier and TIA in the first ACO modules Repay the amplitude fading of electric signal, specific compensation rate can be determined with connected applications scene.
Second aspect, the embodiment of the present invention also provide a kind of damage compensation device of pluggable ACO modules, including：Plug Controller, parameter reader and damage compensation estimator, wherein, swap controller, for the first ACO modules to be inserted into first Corresponding to line card on the first slot, the first ACO modules are that the is inserted into after pulled out corresponding to the second line card on the second slot On one slot, when the first ACO modules are inserted on the first slot, the first multi-pipe pin corresponding to the first ACO modules and the first line card Connector is connected, and the first multi-pin connector is connected with the first smooth Digital Signal Processing ODSP chips corresponding to the first line card, When the first ACO modules are inserted on the second slot, the first ACO modules are connected with the second multi-pin connector corresponding to the second line card Connect；Parameter reader, for getting the first damage measurement parameter from the register of the first ACO modules, wherein, the first damage Measurement parameter is when the first ACO modules are inserted on the second slot, by carrying out electric signal transmission to the second multi-pin connector When caused connector impairment value measure after obtained damage measurement parameter；Parameter reader, it is additionally operable to from First Line The second damage measurement parameter corresponding to the first slot is got in the register of card, wherein, the second damage measurement parameter be Caused connector impairment value measures when first ODSP chips carry out electric signal transmission by the first multi-pin connector The damage measurement parameter obtained afterwards；Compensation estimator is damaged, for the first damage measurement parameter and the second damage measurement parameter Processing is merged so as to obtain damage assessment result, the first ODSP chips and the first ACO moulds are obtained according to damage assessment result The connector total impairment value compensated is needed when carrying out electric signal transmission by the first multi-pin connector between block.
In embodiments of the present invention, the first slot of the first ACO modules and the first line card is established before plug connection, and first The first damage measurement parameter has been preserved in the register of ACO modules, second has been preserved in the register of the first line card Damage measurement parameter, i.e. the first ACO modules and First Line are stuck in before this plug is established with regard to having carried out impairment parameter in advance Demarcation, therefore damage can pass through the first damage measurement caused by transmitting telecommunication number between the first ACO modules and the first line card Parameter and the second damage measurement parameter merge processing and estimated, the damage assessment result of generation can be used for calculating telecommunications Need connector total impairment value for compensating during number transmission, the total impairment value of the connector be carry out signal impairment compensation it is effective according to According to completing the estimation of damage so as to be damaged demarcation can in advance by the first ACO modules and First Line card, therefore be not required to CDR modules, the application scenarios for needing often to plug suitable for ACO modules, to multi-pin connector are used as DCO modules Caused damage compensates, and improves the transmission performance of electric signal.
In the second aspect of the present invention, the comprising modules of the damage compensation device of pluggable ACO modules can also carry out The step of described in aforementioned first aspect and various possible implementations, refer to it is foregoing to first aspect and it is various can Explanation in the implementation of energy.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for For those skilled in the art, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of a scenario that DCO optical modules and line card are used cooperatively in the prior art；
Fig. 2 is the application scenarios schematic diagram in optical module in the prior art using CFPx-ACO modules；
Fig. 3-a are that the first ACO modules provided in an embodiment of the present invention are inserted into the application that the second line card carries out test calibration Schematic diagram of a scenario；
Fig. 3-b are that the first ACO modules provided in an embodiment of the present invention are inserted into the progress actual signal transmission of First Line card Application scenarios schematic diagram；
Fig. 4 is that a kind of process blocks of damage compensation method of pluggable ACO modules provided in an embodiment of the present invention are illustrated Figure；
Fig. 5 is the S21 curve synoptic diagrams of the transmitting terminal provided in an embodiment of the present invention for having connectorless；
Fig. 6 is transmitting terminal Skew provided in an embodiment of the present invention and the error rate of system schematic diagram of S21 differences；
Fig. 7 is the cable clip structure schematic diagram provided in an embodiment of the present invention inserted with ACO modules；
Fig. 8 is line card CPU provided in an embodiment of the present invention by CFP2-ACO modules and the originator and receipts of line card CFP2 slots The Skew at end is overlapped to obtain the Skew schematic diagrames of ODSP compensation；
Fig. 9-a are the amplitude-frequency for the S21 that line card CPU provided in an embodiment of the present invention arrives CFP2-ACO modules and CFP2 slots The compensating parameter that response is overlapped generation respectively is issued to the performance cost signal for being used for compensating originator S21 introducings in ODSP Figure；
Fig. 9-b are the phase frequency for the S21 that line card CPU provided in an embodiment of the present invention arrives CFP2-ACO modules and CFP2 slots The compensating parameter that response is overlapped generation respectively is issued to the performance cost signal for being used for compensating originator S21 introducings in ODSP Figure；
Figure 10 is the performance comparison schematic diagram of accurate compensation provided in an embodiment of the present invention and blind compensation；
Figure 11-a are that a kind of composition structure of the damage compensation device of pluggable ACO modules provided in an embodiment of the present invention is shown It is intended to；
Figure 11-b are the composition structure of the damage compensation device of the pluggable ACO modules of another kind provided in an embodiment of the present invention Schematic diagram；
Figure 11-c are the composition structure of the damage compensation device of the pluggable ACO modules of another kind provided in an embodiment of the present invention Schematic diagram；
Figure 11-d are the composition structure of the damage compensation device of the pluggable ACO modules of another kind provided in an embodiment of the present invention Schematic diagram.
Embodiment
The embodiments of the invention provide a kind of damage compensation method and device of pluggable ACO modules, for multi-pipe pin Damage compensates caused by connector, improves the transmission performance of electric signal.
To enable goal of the invention, feature, the advantage of the present invention more obvious and understandable, below in conjunction with the present invention Accompanying drawing in embodiment, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that disclosed below Embodiment be only part of the embodiment of the present invention, and not all embodiments.Based on the embodiment in the present invention, this area The every other embodiment that technical staff is obtained, belongs to the scope of protection of the invention.
Term " first ", " second " in description and claims of this specification and above-mentioned accompanying drawing etc. are to be used to distinguish Similar object, without for describing specific order or precedence.It should be appreciated that the term so used is in appropriate feelings It can be exchanged under condition, this is only to describe object used differentiation in description in embodiments of the invention to same alike result Mode.In addition, term " comprising " and " having " and their any deformation, it is intended that cover it is non-exclusive include, so as to Process, method, system, product or equipment comprising a series of units are not necessarily limited to those units, but may include unclear Other units that ground is listed or for these processes, method, product or equipment inherently.
It is described in detail individually below.One embodiment of the damage compensation method of the pluggable ACO modules of the present invention, can Applied to the application scenarios for using CFPx-ACO modules to realize in the optical module shown in Fig. 2, with CFPx- in the embodiment of the present invention Exemplified by ACO modules are specially the first ACO modules, the first ACO modules are inserted into the first line card under pluggable application scenarios Connector damage measures estimation caused by upper.Refer to shown in Fig. 3-a and Fig. 3-b, Fig. 3-a provide for the embodiment of the present invention The first ACO modules be inserted into the application scenarios schematic diagram that the second line card carries out test calibration, Fig. 3-b carry for the embodiment of the present invention The first ACO modules supplied are inserted into the application scenarios schematic diagram that First Line card carries out actual signal transmission.Refer to shown in Fig. 4, The damage compensation method for the pluggable ACO modules that one embodiment of the invention provides, can include：
401st, the first ACO modules are inserted into corresponding to the first line card on the first slot.
Wherein, the first ACO modules are to be inserted into after being pulled out corresponding to the second line card on the second slot on the first slot, When the first ACO modules are inserted on the first slot, the first multi-pin connector corresponding to the first the first line card of ACO modules is connected Connect, the first multi-pin connector is connected with the first ODSP chips corresponding to the first line card, when the first ACO modules are inserted in the second slot When upper, the second multi-pin connector corresponding to the first the second line card of ACO modules is connected.
In embodiments of the present invention, first as shown in Fig. 3-a, the second multi-pin connector is provided with the second line card, the Two ODSP chips are connected by the second multi-pin connector and the first ACO modules, and MCU is additionally provided with the first ACO modules.This One ACO modules may be inserted into the first line card after being pulled out from the second line card, and as shown in Fig. 3-b, the is provided with the first line card One multi-pin connector, the first ODSP chips are connected by the first multi-pin connector and the first ACO modules, the first ACO modules On be additionally provided with MCU.It should be noted that the second line card passes through the second multi-pin connector and first in the embodiment of the present invention ACO modules are connected, and second line card can be line card standard component, and second line card is adopted when can also be test connector damage Public line card, multiple ACO modules can be inserted into the enterprising trip link actuator damage measure of the second line card.
402nd, the first damage measurement parameter is got from the register of the first ACO modules.
Wherein, the first damage measurement parameter is when the first ACO modules are inserted on the second slot, is connected by the second multi-pipe pin When connecing device and carrying out electric signal transmission, damage measurement parameter that caused connector impairment value obtains after measuring.
In embodiments of the present invention, the first ACO modules first insert the second slot of the second line card, are then pulled out from the second line card After falling, the first ACO modules are just inserted into the first slot of the first line card, are stored with the register of the first ACO modules First damage measurement parameter, the first damage measurement parameter are when the first ACO modules are inserted on the second slot, more than second When pin connector carries out electric signal transmission, damage measurement parameter that caused connector impairment value obtains after measuring should First damage measurement parameter is stored in the register of the first ACO modules, when the first ACO modules are inserted into corresponding to the first line card After on first slot, central processing unit (the English full name of the first line card：Central Processing Unit, English letter Claim：CPU) the first damage measurement parameter can be read by the register of the first ACO modules.Wherein, the first damage measurement is joined Number can be saved in the register of the first ACO modules by way of being pre-configured with, and can also be inserted into by the first ACO modules On-the-spot test is carried out when on the second line card and then is saved in the register of the first ACO modules, is not limited herein.
In some embodiments of the invention, the second multi-pin connector is connected with the 2nd ODSP cores corresponding to the second line card Piece, method provided in an embodiment of the present invention is except that before performing abovementioned steps, can also comprise the following steps：
A1, when the first ACO modules are inserted into corresponding to the second line card on the second slot, is inserted in the first ACO modules It is caused when carrying out electric signal transmission by being connected with the second multi-pin connector of the 2nd ODSP chips when on two slots to connect Connect device impairment value to measure so as to obtain the first damage measurement parameter, by the first damage measurement parameter storage to the first ACO moulds In the register of block.
Wherein, in some embodiments of the invention, scene is carried out when being inserted into by the first ACO modules on the second line card Then test can obtain the first damage measurement parameter, so as to which the first damage measurement parameter is saved in into the first ACO modules Register in, after being pulled out from the second line card so as to the first ACO modules, still protected in the register of the first ACO modules There is the first damage measurement parameter obtained by test calibration.
In some embodiments of the invention, the first ACO modules are inserted into corresponding to the first line card first and inserted by step 401 Before on groove, method provided in an embodiment of the present invention is except that before performing abovementioned steps, can also comprise the following steps：
B1, the 2nd ACO modules are inserted into corresponding to the first line card on the first slot；
B2, horizontal electrical signal biography is entered by being connected with the first multi-pin connector of the 2nd ACO modules to the first ODSP chips Caused connector impairment value is measured so as to obtain the second damage measurement parameter when defeated, and the second damage measurement parameter is deposited Store up into the register of the first line card.
Wherein, in some embodiments of the invention, scene is carried out when being inserted into by the 2nd ACO modules on the first line card Then test can also obtain the second damage measurement parameter, so as to which the second damage measurement parameter is saved in into the first line card In register, after being pulled out so as to the 2nd ACO modules from the first line card, still preserved in the register of first line card logical The second damage measurement parameter that test calibration obtains is crossed, so as to be inserted into other ACO modules (such as first on first line card ACO modules) when the second damage measurement parameter can also be got by the register of the first line card, therefore go for Estimation when ACO modules are plugged on one line card to connector damage.
In some embodiments of the invention, foregoing execution step B1 to B2 realize scene under, the embodiment of the present invention The method of offer is except that before performing abovementioned steps, can also comprise the following steps：
B3, when the 2nd ACO modules are inserted into corresponding to the first line card on the first slot, is inserted in the 2nd ACO modules It is caused when carrying out electric signal transmission by being connected with the first multi-pin connector of the first ODSP chips when on one slot to connect Connect device impairment value to measure so as to obtain the 4th damage measurement parameter, by the 4th damage measurement parameter storage to the 2nd ACO moulds In the register of block.
Wherein, in some embodiments of the invention, scene is carried out when being inserted into by the 2nd ACO modules on the first line card Then test can obtain the 4th damage measurement parameter, so as to which the 4th damage measurement parameter is saved in into the 2nd ACO modules Register in, after being pulled out from the first line card so as to the 2nd ACO modules, still protected in the register of the 2nd ACO modules There is the 4th damage measurement parameter obtained by test calibration, when being inserted into other line cards so as to the 2nd ACO modules 4th damage measurement parameter can be got by the register of the 2nd ACO modules, therefore go for the 2nd ACO modules and insert Enter to estimation during other line cards to connector damage.
In some embodiments of the invention, the second multi-pin connector is connected with the 2nd ODSP cores corresponding to the second line card Piece, foregoing execution step A1 realize scene under, method provided in an embodiment of the present invention is except before performing abovementioned steps, also It may include steps of：
A2, when the first ACO modules are inserted into corresponding to the second line card on the second slot, company is passed through to the 2nd ODSP chips Caused connector impairment value measures when being connected to the second multi-pin connector progress electric signal transmission of the first ACO modules So as to obtain the 3rd damage measurement parameter, by the storage of the 3rd damage measurement parameter into the register of the second line card.
Wherein, in some embodiments of the invention, scene is carried out when being inserted into by the first ACO modules on the second line card Then test can also obtain the 3rd damage measurement parameter, so as to which the 3rd damage measurement parameter is saved in into the second line card In register, after being pulled out so as to the first ACO modules from the second line card, still preserved in the register of second line card logical The 3rd damage measurement parameter that test calibration obtains is crossed, so that can also when other ACO modules are inserted on second line card 3rd damage measurement parameter is got by the register of the second line card, therefore goes for plugging ACO on the second line card To the estimation of connector damage during module.
403rd, the second damage measurement parameter corresponding to the first slot is got from the register of the first line card.
Wherein, the second damage measurement parameter is to enter horizontal electrical signal by the first multi-pin connector in the first ODSP chips to pass When defeated, damage measurement parameter that caused connector impairment value obtains after measuring.
In embodiments of the present invention, can also be inserted with others on the first line card before the first ACO modules are inserted ACO modules, for ease of description, the 2nd ACO modules are defined as, then the 2nd ACO modules are first inserted the first of the first line card and inserted Groove, then after the 2nd ACO modules are pulled out from the first line card, the first ACO modules are just inserted into the first slot of the first line card, So the second damage is stored with when on the first slot of the first line card inserted with the 2nd ACO modules in the register of first line card Hinder measurement parameter, the second damage measurement parameter is to enter horizontal electrical signal by the first multi-pin connector in the first ODSP chips to pass When defeated, damage measurement parameter that caused connector impairment value obtains after measuring, the second damage measurement parameter is stored in In the register of first line card, after the first ACO modules are inserted into corresponding to the first line card on the first slot, the first line card CPU can read the second damage measurement parameter by the register of the first line card.Wherein, the second damage measurement parameter can lead to The register that the mode being pre-configured with is saved in the first line card is crossed, can also be inserted into by the 2nd ACO modules on the first line card Then Shi Jinhang on-the-spot test is saved in the register of the first line card, do not limited herein.
It should be noted that can first carry out step 402 after step 401 execution performs step 403 again, can also be first Perform step 403 and perform step 402 again, or perform step 402 and step 403 simultaneously, do not limit herein, shown in Fig. 4 It is described in detail in embodiment exemplified by first carrying out step 402 and performing step 403 again.
In the embodiment of the present invention, the first line card and the first ACO modules each have the register for storing, then the One line card and the first ACO modules are established before plug connection, and the first line card and the first ACO modules have been stored with respective respectively Damage measurement parameter, therefore can be posted respectively by respective after the first line card and the first ACO modules establish plug connection Storage gets the first damage measurement parameter and the second damage measurement parameter.
404th, processing is merged to the first damage measurement parameter and the second damage measurement parameter so as to obtain damage assessment As a result, obtain by the first multi-pin connector to enter between the first ODSP chips and the first ACO modules according to damage assessment result The connector total impairment value compensated is needed when horizontal electrical signal transmits.
In embodiments of the present invention, the number by being stored in the register of the first ACO modules and the register of the first line card According to that can extract the first damage measurement parameter and the second damage measurement parameter respectively, the two damage measurement parameters can pass through CPU in first ACO modules reads register to get, and is merged respectively further according to the particular type of damage measurement parameter Processing, so as to obtain damage assessment result, the first ODSP is obtained further according to the damage assessment result by way of calculating The connector compensated is needed always to damage when carrying out electric signal transmission by the first multi-pin connector between chip and the first ACO modules Wound value, the total impairment value of the connector be according to damage assessment result calculate when the first ODSP chips and the first ACO modules it Between need the impairment value that compensates when carrying out electric signal transmission by the first multi-pin connector.
In some embodiments of the invention, connector impairment value can specifically include at least one of following information： The propagation time delay of electric signal, positive transmission coefficient S21 filtering characteristics, the amplitude fading of electric signal.The wherein biography of electric signal Defeated time delay is properly termed as " Skew " caused by connector, when passing through multi-pin connector between ACO modules and ODSP chips The damage of Skew, S21 filtering characteristic can be produced when carrying out electric signal transmission because of multi-pin connector, can also produce electric signal Amplitude fading, therefore the compensation calculation of damage measurement can be carried out according to method provided in an embodiment of the present invention, so that it is determined that The connector compensated is needed always to damage when carrying out electric signal transmission by multi-pin connector between ACO modules and ODSP chips It is worth, the particular type in the embodiment of the present invention for connector impairment value is different, it is necessary to which being attached device damage compensates also not phase Together, the illustration in subsequent embodiment is referred to.Under practical application scene, connector impairment value can also be according to concrete scene To determine to need the type of impairment measured.
Further, in some embodiments of the invention, step 404 obtains the first ODSP cores according to damage assessment result The connector compensated is needed always to damage when carrying out electric signal transmission by the first multi-pin connector between piece and the first ACO modules After value, method provided in an embodiment of the present invention is except that before performing abovementioned steps, can also comprise the following steps：
C1, need to compensate when the first ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication The total impairment value of connector including electric signal propagation time delay and during positive transmission coefficient S21 filtering characteristics, by first The connector total impairment value hair compensated is needed when ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication The first ODSP chips are given, by the propagation time delay and S21 filtering characteristics of the first ODSP chip compensation electric signals；
C2, need to compensate when the first ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication The total impairment value of connector including electric signal amplitude fading when, pass through first according to the first ODSP chips and the first ACO modules The total impairment value of connector for needing to compensate during pin connector transmitting telecommunication adjusts the radio-frequency amplifier gain of the first ACO modules With trans-impedance amplifier (English full name：Transient impendence amplifier, English abbreviation：TIA) gain.
Wherein, in some embodiments of the invention, step C1 and step C2 describes how to be attached device impairment value Compensation, it is different for the particular type of connector impairment value, the compensation way taken also not phase is needed in the embodiment of the present invention With.Specifically, getting the total impairment value of connector for needing to compensate by step 404 includes the propagation time delay of electric signal During with S21 filtering characteristics, Skew and S21 filtering characteristics can be compensated by the first ODSP chips, be got by step 404 When the total impairment value of connector for needing to compensate includes the amplitude fading of electric signal, it can be put by the radio frequency in the first ACO modules The gain of big device and TIA compensates the amplitude fading of electric signal, and specific compensation rate can be determined with connected applications scene.
By illustration of the previous embodiment to the present invention, the first slot of the first ACO modules and the first line card Establish before plug connection, the first damage measurement parameter has been preserved in the register of the first ACO modules, the first line card is posted The second damage measurement parameter is preserved in storage, i.e. the first ACO modules and First Line is stuck in before this plug is established just Carry out the demarcation of impairment parameter in advance, therefore caused damage during transmitting telecommunication between the first ACO modules and the first line card Wound can be merged processing and be estimated by the first damage measurement parameter and the second damage measurement parameter, and the damage of generation is estimated The total impairment value of connector that needs compensate when meter result can be used for calculating electric signal transmission, the total impairment value of the connector are to carry out Effective foundation of signal impairment compensation, it is complete so as to be damaged demarcation can in advance by the first ACO modules and First Line card Into the estimation of damage, therefore CDR modules need not be used as DCO modules, be answered suitable for what ACO modules needed often to plug With scene, damage caused by multi-pin connector is compensated, improves the transmission performance of electric signal.
For ease of being better understood from and implementing the such scheme of the embodiment of the present invention, corresponding application scenarios of illustrating below come It is specifically described.In the embodiment of the present invention by ACO modules 1, ACO modules 2 and line card 1, line card 2 test calibration exemplified by enter Row explanation, ACO modules 1 are demarcated to obtain this ACO module to multi-pipe pin company by the standard component demarcated for ACO module parameters The compensating parameter one of device is connect, is stored in the register of ACO modules 1, ACO modules 2 pass through the standard demarcated for ACO module parameters Part is demarcated to obtain this ACO module to the compensating parameter two of multi-pin connector, is stored in the register of ACO modules 2, line card 1 xth slot by the standard component demarcated for line card ODSP chip parameters demarcated to obtain this multi-pin connector to pair The compensating parameter three of ODSP chip modules is answered, is stored in the register of line card 1, the y slots of line card 2 pass through for line card ODSP The standard component of chip parameter demarcation is demarcated to obtain this multi-pin connector to the compensating parameter four of correspondence ODSP chip modules, It is stored in the register of line card 2.
When the xth slot that ACO modules 1 are inserted to line card 1, line card 1 reads compensating parameter one and the storage of ACO modules 1 Compensating parameter three, by Combined Treatment and compensating parameter one and three is calculated, obtain needing first for system after compensation combination Total compensating parameter, go to compensate skew according to ODSP chip parameters corresponding to the xth slot of this parameter de-regulation line card 1 and frequency is rung Should, while the electric radio frequency amplifier (driver) of control ACO modules 1 is gone and across a group amplifier (TIA) according to this total compensating parameter Gain go compensate electric signal decay.
When the y slots that ACO modules 1 are inserted to line card 2, line card 2 reads compensating parameter one and the storage of ACO modules 1 Compensating parameter four, by Combined Treatment and compensating parameter one and four is calculated, obtain needing second for system after compensation combination Total compensating parameter, go to compensate skew according to ODSP chip parameters corresponding to the y slots of this parameter de-regulation line card 2 and frequency is rung Should, while the electric radio frequency amplifier (driver) of control ACO modules 1 is gone and across a group amplifier (TIA) according to this total compensating parameter Gain go compensate electric signal decay.
When the xth slot that ACO modules 2 are inserted to line card 1, line card 1 reads compensating parameter two and the storage of ACO modules 2 Compensating parameter three, by Combined Treatment and compensating parameter two and three is calculated, obtain needing the 3rd for system after compensation combination Total compensating parameter, go to compensate skew according to ODSP chip parameters corresponding to this xth slot of parameter de-regulation line card 1 and frequency is rung Should, while the electric radio frequency amplifier (driver) of control ACO modules 2 is gone and across a group amplifier (TIA) according to this total compensating parameter Gain go compensate electric signal decay.
When the y slots that ACO modules 2 are inserted to line card 2, line card reads the compensating parameter two of ACO modules 2 and the benefit of storage Parameter four is repaid, by Combined Treatment and calculating compensating parameter two and four, obtain system after needing to combine for compensation the 4th is total Compensating parameter, go to compensate skew according to ODSP chip parameters corresponding to the y slots of this parameter de-regulation line card 2 and frequency is rung Should, while the electric radio frequency amplifier (driver) of control ACO modules 2 is gone and across a group amplifier (TIA) according to this total compensating parameter Gain go compensate electric signal decay.
By this compensation scheme provided in an embodiment of the present invention, the performance cost of system plug can be minimum.ACO modules and The slot of line card is calibrated with standard component, when plug mutually, the corresponding slot of line card read module parameter coordination itself demarcation Characteristic obtain total damage compensating parameter, go to compensate by this parameter.
As shown in figure 5, Fig. 5 is the S21 curve synoptic diagrams of the transmitting terminal provided in an embodiment of the present invention for having connectorless, figure 5 give the S21 curves started using the optical module of different photoelectric devices and connector scheme of actual test, it can be seen that Whether S21 curves can have larger difference using multi-pin connector with the transmitting terminal of optical module.As shown in fig. 6, it is this hair The error rate of system schematic diagram for transmitting terminal Skew and the S21 difference that bright embodiment provides.Fig. 6 is given when the light containing connector When the originator of module uses 200G-16QAM patterns, accurate Skew and S21 compensation are carried out, according to the connector that has in Fig. 6 The parameter of S21 curves goes to compensate, the performance that obtained performance compensates entirely for originator, while tests and add Skew and use in originator The S21 of connectorless removes the bit error performance that compensation is started.When Skew increases to 3ps from 1 psec (picosecond, ps) It can be seen that bit error performance is gradually deteriorated, while it can be seen that S21 compensation inaccuracy can also introduce larger performance cost, Fig. 6 In originator do not mend caused S21 curves when connector S21 refers to transmitting terminal without using connector.
The embodiment of the present invention proposes a kind of damage compensation scheme of pluggable ACO modules, and idiographic flow is to include Following steps：
1st, (it is respectively 8 during differential signal by the originator of ACO modules to connector (CFPx connector public affairs mouth) and each 4 tunnel of receiving end Road) Skew, S21 filter curve and amplitude fading tested and demarcated, and by damage measurement parameter be stored in CFPx-ACO moulds In the readable calibration register of block, OIF standards have reserved corresponding register, and line card and module each have posts for what is stored Storage.
2nd, the originator and each 4 tunnel of receiving end (being respectively 8 tunnels during differential signal) of line card end (mother's CFPx mouth) to ODSP chips Skew, S21 filter curve and amplitude fading carry out test calibration, and damage measurement parameter is stored in the register of line card, from And CPU can access the register of the line card.
3rd, after on the corresponding groove position of ACO modules insertion line card, line card CPU is first by each in read module register Individual calibrating parameters；
4th, line card CPU joins Skew, S21 filter curve and the measurement of amplitude fading equivalent damage of respective modules and corresponding slot Number merges processing, and the parameter for needing to compensate then is handed down into ODSP chips to compensate Skew and filtering characteristic.Pass through tune Section radio frequency amplifier (Driver) gain come compensate originator electric signal decay, compensate receiving end by adjusting TIA gain Decay.
By this scheme, Skew, S21 and amplitude fading of system can be compensated preferably, therefore can be with maximum limit Degree reduces performance cost caused by the various damages of CFPx connectors.
As shown in fig. 7, be the cable clip structure schematic diagram provided in an embodiment of the present invention inserted with ACO modules, line card A bags Include：CPU, ODSP chip, CFP2 connectors, MCU, Framer chip, ACO modules, Framer chips and ODSP chips pass through more Pin connector (such as 168PIN) is connected, and ACO modules are inserted into the CFP2 slots on line card A, and CPU does leading, and MCU can connect The order for receiving CPU goes to control the device in ACO modules.Fig. 7 is the verification platform of embodiment test, and the present invention carries out ACO moulds The embodiment of block damage compensation is as follows：
The transmission flow of signal is：ODSP chips by receiving the business datums of the 200G bits per seconds of Framer chips, The differential signal on 8 tunnels of simulation is transferred to by 104PIN CFP2 connectors by DAC after being carried out DSP processing CFP2-ACO modules, this electric signal are used for the radio frequency amplifier for driving electricity, and the electric signal after amplification obtains light through electrooptic modulator The dual-polarization 16QAM signals on road are sent from Tx optical ports.Mainly include in ACO modules：MCU control unit, laser, radio frequency amplification Device (Driver), electrooptic modulator and integrated coherent receiver (containing TIA).
The reception flow of signal is：Optical signal enters CFP2-ACO modules by Rx ports, by opto-electronic conversion and amplification 8 obtained road electric signals enter ODSP chips by CFP2 connectors.Electric signal is then passed through the signal transacting of receiving end, so as to extensive Complex signal simultaneously is completed to receive, and the signal after reception passes Framer chips back by SERDES again.
As shown in figure 8, being line card CPU provided in an embodiment of the present invention by CFP2-ACO modules and the hair of line card CFP2 slots The Skew of end and receiving end, which is overlapped to obtain ODSP chips, to be needed to compensate Skew schematic diagram.Because modulated using dual-polarization (Dual Polarization) form, two orthogonal polarization states of X and Y be present, each orthogonal polarization is filled out needs and added In-phase (I roads signal is in the same direction) and quadrature (Q roads orthogonal signalling), thus need altogether four road electric signal XI, XQ, YI、YQ.In Fig. 8, the Skew of the originator and receiving end of CFP2-ACO modules and line card CFP2 slots is overlapped by line card CPU, CPU The parameter that superposition obtains afterwards, which is handed down to ODSP chips, realizes compensation effect.
Fig. 9-a are the amplitude-frequency for the S21 that line card CPU provided in an embodiment of the present invention arrives CFP2-ACO modules and CFP2 slots The performance cost that the compensating parameter that response is overlapped generation respectively is issued in ODSP chips for compensation originator S21 introducings is shown It is intended to, Fig. 9-b are the phase frequency response for the S21 that line card CPU provided in an embodiment of the present invention arrives CFP2-ACO modules and CFP2 slots The compensating parameter that generation should be overlapped respectively is issued to the performance cost signal for being used for compensating originator S21 introducings in ODS chips P Figure.According to description above, the performance damage of CFPx-ACO module by signal mainly introduces at CFP2 connectors, and in reality Connector is equal to ODSP chips and connector to Skew, filtering damage and amplitude fading between CFP2-ACO modules in test process Respective demarcation can be carried out, Fig. 8 gives the CFP2-ACO modules Skew and line card Skew processes of superposition, will be total after superposition Skew makees reference and obtains needing the compensation rate issued, and compensation rate, which is issued to, can compensate originator in ODSP chips and the Skew of receiving end draws The performance cost risen, Fig. 9-a and Fig. 9-b give S21 curves and the line card CFP2 connector S21 phase frequency responses of CFP2-ACO modules Should, amplitude-frequency response and the schematic diagram for being superimposed post-compensation parameter, total S21 will be calculated be issued in ODSP chips and carry out S21 The compensation of damage.
When the S21 of demarcation uses absolute value, it is not 0 at 0 frequency, is negative value, the range value that frequency is 0 is changed into 0. For example frequency is 0Hz, 10GHz, the 20GHz corresponding -3/-5/-8dB of frequency.It is changed into 0/-2/-5dB after normalization, moreover it is possible to according to S21 obtains both ends CFP2 interfaces and causes amplitude fading, and the 0Hz in previous example is -3dB, has also reacted declining for signal in fact Subtract, the energy of -3dB representation signals reduces half.Because dB=10*log (P1/P2), when p1=0.5*p2, as a result It is changed into -3dB.CPU obtains the total amount that amplitude fading can be calculated after these information.CPU is adjusted according to attenuation by MCU Driver and TIA gain goes to compensate the amplitude fading that junction introduces.
Figure 10 is the performance comparison schematic diagram of accurate compensation provided in an embodiment of the present invention and blind compensation, is accurately compensated and blind In the performance comparison of compensation, blind compensation is that the optimized parameter combined with line card 1 and module 1 goes to compensate the property of line card 2 and line card 1 Can, therefore have performance [email protected] in Figure 10, represent the frequency of optical wavelength corresponding to 194.1THz, corresponding ripple A length of 1544.525nm.
Demonstrate in the aforementioned embodiment and compensate the property regulation of system to optimal, corresponding error performance is figure The curve accurately compensated in 10.In the case where being changed without module and compensating parameter, in the embodiment of the present invention by same module more (and line card above is same batch) is changed on another line card, it is different by the design and use device of each producer, often Individual module and line card are required for demarcating, so as to could accurately compensate.Corresponding characteristic curve of error code is as shown in blind compensation in Figure 10. If larger performance cost is had it can be seen that not proposing a plan to compensate according to the embodiment of the present invention, particularly to Gao Bo The high-order pattern of special rate, when S21 and Skew difference is larger, actual performance boost may be bigger.
In the embodiment of the present invention, the parameter of line card to CFPx interfaces and CFPx-ACO demarcation is carried out at joint superposition Reason, using obtained parameter as the damage with reference to compensation system performance.Line card can place ACO modules, pass through CFPx standard Interface and ACO modules are interconnected, while ODSP chips and control unit (CPU) has been placed above, and ODSP chips are main here For the signal transacting, communications device between of the CPU to control each device etc. started with receiving end.ACO modules are not wrap The optical module being concerned with containing ODSP, it is made up of originator, receiving end and control unit.Originator mainly includes：Originator laser, electric amplifier And electrooptic modulator.Receiving end mainly includes：Local oscillator laser, optical mixer unit, photodetector and TIA etc..Control unit is main For communication and the power supply of each device etc..CFPx interfaces are the interfaces for meeting MSA relevant regulations, and one end is ACO modules, in addition Side is line card interface, and each pin meets MSA relevant regulations, therefore as defined in satisfaction between the line card of different manufacturers and module Can flexibly it be arranged in pairs or groups.
Technical scheme provided by the invention can reduce Skew when different CFPx-ACO modules and different line slots are arranged in pairs or groups, S21 and decay equivalent damage difference caused by penalty in system performance, can be lifted on the premise of system framework is not changed line card and CFPx-ACO modules form the transmission performance of system, and do not need extra hardware resource.Line card is arrived in the embodiment of the present invention CFPx interfaces and the parameter of Skew, S21 of CFPx-ACO modules filtering and each self-calibration that decays are as input, the CPU meters of line card Calculation module Skew, S21 filtering and decay total with the line card ports of its collocation, the result of calculating is damaged as reference Compensation, performance cost caused by the difference that disparate modules and different line cards are arranged in pairs or groups can effectively be reduced by this technology.This hair The compensation scheme that bright embodiment provides can dynamically be adjusted according to the various combination of module and line card, so as to realize damage Dynamic compensation.
It should be noted that for foregoing each method embodiment, in order to be briefly described, therefore it is all expressed as a series of Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement because According to the present invention, some steps can use other orders or carry out simultaneously.Secondly, those skilled in the art should also know Know, embodiment described in this description belongs to preferred embodiment, and involved action and module are not necessarily of the invention It is necessary.
For ease of preferably implementing the such scheme of the embodiment of the present invention, the phase for implementing such scheme is also provided below Close device.
Refer to shown in Figure 11-a, a kind of damage compensation device of pluggable ACO modules provided in an embodiment of the present invention 1100, it can include：Swap controller 1101, parameter reader 1102 and damage compensation estimator 1103, wherein,
Swap controller 1101, for the first ACO modules to be inserted into the first slot corresponding to the first line card, described One ACO modules are to be inserted into after being pulled out corresponding to the second line card on the second slot on first slot, when described first When ACO modules are inserted on first slot, the first multi-pin connector corresponding to the first line card described in the first ACO modules is connected Connecing, first multi-pin connector is connected with the first smooth Digital Signal Processing ODSP chips corresponding to first line card, when When the first ACO modules are inserted on second slot, the second multi-pipe pin corresponding to the second line card described in the first ACO modules connects Device is connect to be connected；
Parameter reader 1102, for getting the first damage measurement parameter from the register of the first ACO modules, Wherein, the first damage measurement parameter is when the first ACO modules are inserted on second slot, passes through described second When multi-pin connector carries out electric signal transmission, damage measurement parameter that caused connector impairment value obtains after measuring；
The parameter reader 1102, it is additionally operable to get corresponding to described first from the register of first line card Second damage measurement parameter of slot, wherein, the second damage measurement parameter be pass through in the first ODSP chips it is described When first multi-pin connector carries out electric signal transmission, the damage measurement that caused connector impairment value obtains after measuring is joined Number；
Compensation estimator 1103 is damaged, for entering to the first damage measurement parameter and the second damage measurement parameter Row merging treatment obtains the first ODSP chips and described so as to obtain damage assessment result, according to the damage assessment result The connector compensated is needed always to damage when carrying out electric signal transmission by first multi-pin connector between the first ACO modules Value.
In some embodiments of the invention, refer to shown in Figure 11-b, the second multi-pin connector connection is The 2nd ODSP chips corresponding to the second line card are stated, described device 1100 also includes：First damage measurement device 1104, wherein,
The first damage measurement device 1104, for being inserted into the second slot corresponding to the second line card when the first ACO modules When upper, the first ACO modules were inserted in when on second slot by being connected with described the of the 2nd ODSP chips Caused connector impairment value measures when two multi-pin connectors carry out electric signal transmission surveys so as to obtain the first damage Parameter is measured, by the first damage measurement parameter storage into the register of the first ACO modules.
In some embodiments of the invention, the first damage measurement device 1104, it is additionally operable to when the first ACO modules are inserted During to corresponding to the second line card on the second slot, to the 2nd ODSP chips by being connected with the institutes of the first ACO modules Caused connector impairment value when the second multi-pin connector carries out electric signal transmission is stated to measure so as to obtain the 3rd damage Hinder measurement parameter, by the 3rd damage measurement parameter storage into the register of second line card.
In some embodiments of the invention, refer to shown in Figure 11-c, described device 1100 also includes：Second damage is surveyed Measuring device 1105, wherein,
The swap controller 1101, it is additionally operable to the first ACO modules being inserted into corresponding to the first line card on the first slot Before, the 2nd ACO modules are inserted into corresponding to the first line card on the first slot；
The second damage measurement device 1105, for the first ODSP chips by being connected with the 2nd ACO moulds Caused connector impairment value is measured so as to obtain second when first multi-pin connector of block carries out electric signal transmission Damage measurement parameter, by the second damage measurement parameter storage into the register of first line card.
In some embodiments of the invention, the second damage measurement device 1105, it is additionally operable to when the 2nd ACO modules are inserted During to corresponding to the first line card on the first slot, by being connected with when being inserted in the 2nd ACO modules on first slot Caused connector impairment value enters when first multi-pin connector of the first ODSP chips carries out electric signal transmission Row measurement is so as to obtain the 4th damage measurement parameter, by the 4th damage measurement parameter storage to the 2nd ACO modules In register.
In some embodiments of the invention, the connector impairment value includes at least one of following information：Telecommunications Number propagation time delay, positive transmission coefficient S21 filtering characteristics, the amplitude fading of electric signal.
In some embodiments of the invention, refer to shown in Figure 11-d, described device 1100 also includes：Damage compensator 1106, the first ODSP chips and described first are obtained according to the damage assessment result for the damage compensation estimator Needed when carrying out electric signal transmission by first multi-pin connector between ACO modules the total impairment value of connector that compensates it Afterwards, needed when the first ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication When the total impairment value of connector of compensation includes the propagation time delay of electric signal and positive transmission coefficient S21 filtering characteristics, by institute State the first ODSP chips and the company compensated is needed when the first ACO modules pass through the first pin connector transmitting telecommunication Connect the total impairment value of device and be sent to the first ODSP chips, by the propagation time delay of the first ODSP chip compensation electric signals With S21 filtering characteristics；When the first ODSP chips and the first ACO modules are by first pin connector transmission electricity When the total impairment value of connector for needing to compensate during signal includes the amplitude fading of electric signal, according to the first ODSP chips and institute State the total impairment value regulation institute of connector that needs compensate when the first ACO modules pass through the first pin connector transmitting telecommunication State the radio-frequency amplifier gain and trans-impedance amplifier TIA gains of the first ACO modules.
By illustration of the previous embodiment to the present invention, the first slot of the first ACO modules and the first line card Establish before plug connection, the first damage measurement parameter has been preserved in the register of the first ACO modules, the first line card is posted The second damage measurement parameter is preserved in storage, i.e. the first ACO modules and First Line is stuck in before this plug is established just Carry out the demarcation of impairment parameter in advance, therefore caused damage during transmitting telecommunication between the first ACO modules and the first line card Wound can be merged processing and be estimated by the first damage measurement parameter and the second damage measurement parameter, and the damage of generation is estimated The total impairment value of connector that needs compensate when meter result can be used for calculating electric signal transmission, the total impairment value of the connector are to carry out Effective foundation of signal impairment compensation, it is complete so as to be damaged demarcation can in advance by the first ACO modules and First Line card Into the estimation of damage, therefore CDR modules need not be used as DCO modules, be answered suitable for what ACO modules needed often to plug With scene, damage caused by multi-pin connector is compensated, improves the transmission performance of electric signal.
It should be noted that the content such as information exchange, implementation procedure between each module/unit of said apparatus, due to The inventive method embodiment is based on same design, and its technique effect brought is identical with the inventive method embodiment, particular content Reference can be made to the narration in the foregoing shown embodiment of the method for the present invention, here is omitted.
It should be noted that, device embodiment described above is only schematical in addition, wherein described as separation The unit of part description can be or may not be it is physically separate, can be as the part that unit is shown or It can not be physical location, you can with positioned at a place, or can also be distributed on multiple NEs.Can be according to reality Border needs to select some or all of module therein to realize the purpose of this embodiment scheme.It is in addition, provided by the invention In device embodiment accompanying drawing, the annexation between module represents there is communication connection between them, specifically can be implemented as one Bar or a plurality of communication bus or signal wire.Those of ordinary skill in the art are without creative efforts, you can with Understand and implement.
In summary, the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to upper Embodiment is stated the present invention is described in detail, it will be understood by those within the art that：It still can be to upper State the technical scheme described in each embodiment to modify, or equivalent substitution is carried out to which part technical characteristic；And these Modification is replaced, and the essence of appropriate technical solution is departed from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (14)

  1. A kind of 1. damage compensation method of pluggable simulation coherent light ACO modules, it is characterised in that including：
    First ACO modules are inserted into corresponding to the first line card on the first slot, the first ACO modules are from the second line card pair It is inserted into after being pulled out on the second slot answered on first slot, when the first ACO modules are inserted in first slot When upper, the first ACO modules are connected with the first multi-pin connector corresponding to first line card, first multi-pipe pin Connector is connected with the first smooth Digital Signal Processing ODSP chips corresponding to first line card, when the first ACO modules are inserted When on second slot, the first ACO modules are connected with the second multi-pin connector corresponding to second line card；
    The first damage measurement parameter is got from the register of the first ACO modules, wherein, the first damage measurement ginseng Number is when the first ACO modules are inserted on second slot, by carrying out telecommunications to second multi-pin connector Obtained damage measurement parameter after caused connector impairment value measures during number transmission；
    The second damage measurement parameter corresponding to first slot is got from the register of first line card, wherein, The second damage measurement parameter is to enter horizontal electrical signal by first multi-pin connector in the first ODSP chips to pass The damage measurement parameter that caused connector impairment value obtains after measuring when defeated；
    Processing is merged to the first damage measurement parameter and the second damage measurement parameter so as to obtain damage assessment As a result, obtained according to the damage assessment result between the first ODSP chips and the first ACO modules by described the The connector total impairment value compensated is needed when one multi-pin connector carries out electric signal transmission.
  2. 2. according to the method for claim 1, it is characterised in that second multi-pin connector is connected with second line 2nd ODSP chips corresponding to card, methods described also include：
    When the first ACO modules are inserted into corresponding to the second line card on the second slot, described is inserted in the first ACO modules When on two slots electric signal transmission when institute is carried out by being connected with second multi-pin connector of the 2nd ODSP chips Caused connector impairment value is measured so as to obtain the first damage measurement parameter, and the first damage measurement parameter is stored Into the register of the first ACO modules.
  3. 3. according to the method for claim 2, it is characterised in that methods described also includes：
    When the first ACO modules are inserted into corresponding to the second line card on the second slot, connection is passed through to the 2nd ODSP chips Caused connector impairment value enters when second multi-pin connector for having the first ACO modules carries out electric signal transmission Row measurement is so as to obtain the 3rd damage measurement parameter, by the deposit of the 3rd damage measurement parameter storage to second line card In device.
  4. 4. according to the method for claim 1, it is characterised in that described that first ACO modules are inserted into the first line card correspondingly The first slot on before, methods described also includes：
    2nd ACO modules are inserted into corresponding to the first line card on the first slot；
    Horizontal electrical signal biography is entered by being connected with the first multi-pin connector of the 2nd ACO modules to the first ODSP chips Caused connector impairment value is measured so as to obtain the second damage measurement parameter when defeated, and second damage measurement is joined Number storage is into the register of first line card.
  5. 5. according to the method for claim 4, it is characterised in that methods described also includes：
    When the 2nd ACO modules are inserted into corresponding to the first line card on the first slot, described is inserted in the 2nd ACO modules When on one slot electric signal transmission when institute is carried out by being connected with first multi-pin connector of the first ODSP chips Caused connector impairment value is measured so as to obtain the 4th damage measurement parameter, and the 4th damage measurement parameter is stored Into the register of the 2nd ACO modules.
  6. 6. method according to any one of claim 1 to 5, it is characterised in that the connector impairment value includes as follows At least one of information：The propagation time delay of electric signal, positive transmission coefficient S21 filtering characteristics, the amplitude of electric signal decline Subtract.
  7. 7. according to the method for claim 6, it is characterised in that described to obtain described first according to the damage assessment result Need to compensate when carrying out electric signal transmission by first multi-pin connector between ODSP chips and the first ACO modules The total impairment value of connector after, methods described also includes：
    Needed when the first ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication When the total impairment value of connector of compensation includes the propagation time delay of electric signal and positive transmission coefficient S21 filtering characteristics, by institute State the first ODSP chips and the company compensated is needed when the first ACO modules pass through the first pin connector transmitting telecommunication Connect the total impairment value of device and be sent to the first ODSP chips, by the propagation time delay of the first ODSP chip compensation electric signals With S21 filtering characteristics；
    Needed when the first ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication When the total impairment value of connector of compensation includes the amplitude fading of electric signal, according to the first ODSP chips and the first ACO The total impairment value of connector for needing to compensate when module passes through the first pin connector transmitting telecommunication adjusts the first ACO The radio-frequency amplifier gain and trans-impedance amplifier TIA gains of module.
  8. A kind of 8. damage compensation device of pluggable simulation coherent light ACO modules, it is characterised in that including：
    Swap controller, for the first ACO modules to be inserted into the first slot corresponding to the first line card, the first ACO moulds Block is to be inserted into after being pulled out corresponding to the second line card on the second slot on first slot, when the first ACO modules When being inserted on first slot, the first ACO modules are connected with the first multi-pin connector corresponding to first line card Connecing, first multi-pin connector is connected with the first smooth Digital Signal Processing ODSP chips corresponding to first line card, when When the first ACO modules are inserted on second slot, more than second corresponding to the first ACO modules and second line card Pin connector is connected；
    Parameter reader, for getting the first damage measurement parameter from the register of the first ACO modules, wherein, institute It is when the first ACO modules are inserted on second slot, by second multitube to state the first damage measurement parameter The damage measurement parameter that caused connector impairment value obtains after measuring when pin connector carries out electric signal transmission；
    The parameter reader, it is additionally operable to get corresponding to first slot from the register of first line card Two damage measurement parameters, wherein, the second damage measurement parameter is to pass through first multitube in the first ODSP chips The damage measurement parameter that caused connector impairment value obtains after measuring when pin connector carries out electric signal transmission；
    Compensation estimator is damaged, for merging place to the first damage measurement parameter and the second damage measurement parameter Reason obtains the first ODSP chips and the first ACO so as to obtain damage assessment result, according to the damage assessment result The connector total impairment value compensated is needed when carrying out electric signal transmission by first multi-pin connector between module.
  9. 9. device according to claim 8, it is characterised in that second multi-pin connector is connected with second line 2nd ODSP chips corresponding to card, described device also include：First damage measurement device, wherein,
    The first damage measurement device, for when the first ACO modules are inserted into corresponding to the second line card on the second slot, to institute State the first ACO modules and be inserted in when on second slot and connected by being connected with second multi-pipe pin of the 2nd ODSP chips Connect caused connector impairment value when device carries out electric signal transmission to measure so as to obtain the first damage measurement parameter, by institute The storage of the first damage measurement parameter is stated into the register of the first ACO modules.
  10. 10. device according to claim 9, it is characterised in that
    The first damage measurement device, it is additionally operable to when the first ACO modules are inserted into corresponding to the second line card on the second slot, it is right The 2nd ODSP chips carry out electric signal transmission by being connected with second multi-pin connector of the first ACO modules When caused connector impairment value measure so as to obtain the 3rd damage measurement parameter, by the 3rd damage measurement parameter In the register for storing second line card.
  11. 11. device according to claim 8, it is characterised in that described device also includes：Second damage measurement device, wherein,
    The swap controller, before being additionally operable to the first ACO modules being inserted into corresponding to the first line card on the first slot, by Two ACO modules are inserted into corresponding to the first line card on the first slot；
    The second damage measurement device, for the first ODSP chips by being connected with the first of the 2nd ACO modules Caused connector impairment value is measured so as to obtain the second damage measurement when multi-pin connector carries out electric signal transmission Parameter, by the second damage measurement parameter storage into the register of first line card.
  12. 12. device according to claim 11, it is characterised in that the second damage measurement device, be additionally operable to as the 2nd ACO When module is inserted into corresponding to the first line card on the first slot, lead to when being inserted in the 2nd ACO modules on first slot Caused connector when crossing first multi-pin connector progress electric signal transmission for being connected with the first ODSP chips Impairment value is measured so as to obtain the 4th damage measurement parameter, and the 4th damage measurement parameter storage is arrived into described second In the register of ACO modules.
  13. 13. the device according to any one of claim 8 to 12, it is characterised in that the connector impairment value is included such as At least one of lower information：The propagation time delay of electric signal, positive transmission coefficient S21 filtering characteristics, the amplitude of electric signal Decay.
  14. 14. device according to claim 13, it is characterised in that described device also includes：Compensator is damaged, for described Damage compensation estimator is obtained according to the damage assessment result and passed through between the first ODSP chips and the first ACO modules Cross after the total impairment value of connector for needing to compensate when first multi-pin connector carries out electric signal transmission, when described first The connector that needs compensate when ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication is total When impairment value includes the propagation time delay of electric signal and positive transmission coefficient S21 filtering characteristics, by the first ODSP chips The connector total impairment value hair compensated is needed when passing through the first pin connector transmitting telecommunication with the first ACO modules The first ODSP chips are given, by the propagation time delay and S21 filtering characteristics of the first ODSP chip compensation electric signals； Need to compensate when the first ODSP chips and the first ACO modules pass through the first pin connector transmitting telecommunication The total impairment value of connector including electric signal amplitude fading when, according to the first ODSP chips and the first ACO modules The first ACO modules are adjusted by the total impairment value of connector for needing to compensate during the first pin connector transmitting telecommunication Radio-frequency amplifier gain and trans-impedance amplifier TIA gains.
CN201610753845.7A 2016-08-29 2016-08-29 A kind of damage compensation method and device of pluggable ACO module Active CN107786276B (en)

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WO2023082128A1 (en) * 2021-11-11 2023-05-19 华为技术有限公司 Method and device for sending fault alert information

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US20060222373A1 (en) * 2005-04-04 2006-10-05 Giovanni Barbarossa Methods for upgrading and deploying an optical network
CN101908942A (en) * 2009-06-05 2010-12-08 华为技术有限公司 Method for transmitting damage information, node and network system
CN102307142A (en) * 2011-08-19 2012-01-04 中兴通讯股份有限公司 Back plate system
WO2012095043A2 (en) * 2012-02-21 2012-07-19 华为技术有限公司 Method and device for compensating for time path

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US20060222373A1 (en) * 2005-04-04 2006-10-05 Giovanni Barbarossa Methods for upgrading and deploying an optical network
CN101908942A (en) * 2009-06-05 2010-12-08 华为技术有限公司 Method for transmitting damage information, node and network system
CN102307142A (en) * 2011-08-19 2012-01-04 中兴通讯股份有限公司 Back plate system
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WO2023082128A1 (en) * 2021-11-11 2023-05-19 华为技术有限公司 Method and device for sending fault alert information

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