CN107657588A - Bearing calibration for the radioscopic image of BGA solder joints - Google Patents
Bearing calibration for the radioscopic image of BGA solder joints Download PDFInfo
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- CN107657588A CN107657588A CN201710871631.4A CN201710871631A CN107657588A CN 107657588 A CN107657588 A CN 107657588A CN 201710871631 A CN201710871631 A CN 201710871631A CN 107657588 A CN107657588 A CN 107657588A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 38
- 239000011159 matrix material Substances 0.000 claims abstract description 21
- 230000009466 transformation Effects 0.000 claims abstract description 19
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 6
- 239000000284 extract Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 6
- 101100001674 Emericella variicolor andI gene Proteins 0.000 claims description 2
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T3/00—Geometric image transformations in the plane of the image
- G06T3/60—Rotation of whole images or parts thereof
- G06T3/608—Rotation of whole images or parts thereof by skew deformation, e.g. two-pass or three-pass rotation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10116—X-ray image
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Abstract
The present invention proposes a kind of automatically-perspective bearing calibration of the radioscopic image for BGA solder joints, including：S1, detect all solder joints in radioscopic image；S2, triangle gridding built according to triangulation to the solder joint that is detected in S1, the intersection point that every line is formed in grid is converged on the center of circle of solder joint；S3, the length of side of the grid of formation and the average value of the length of side are calculated, the unnecessary center of circle is removed according to the threshold value of setting, until the remaining center of circle meets specified conditions, extract 4 special summits；S4, solve perspective transformation matrix and perspective transform is done to original image using its inverse matrix, the front view formed after perspective correction.
Description
Technical field
The present invention relates to BGA image rectifications and field is identified, more particularly to a kind of radioscopic image for BGA solder joints
Bearing calibration.
Background technology
During the analysis of BGA solder joints, traditional perspective image correction and slant correction are, it is necessary to know picture shooting
Angle of inclination, and in some cases, angle of inclination is unknowable, also directly cannot obtain perspective transform by angle of inclination
Matrix.This just needs those skilled in the art badly and solves corresponding technical problem.
The content of the invention
It is contemplated that at least solving technical problem present in prior art, especially innovatively propose one kind and be used for
The bearing calibration of the radioscopic image of BGA solder joints.
In order to realize the above-mentioned purpose of the present invention, the invention provides a kind of user BGA radioscopic images tilt detection figure
The auto-correction method of picture, this method can obtain the higher soldered ball of circularity by system-computed, consequently facilitating follow-up weldering
Ball identifies and the identification of soldered ball internal flaw.
The present invention discloses a kind of bearing calibration of the radioscopic image for BGA solder joints, including：
S1, using all solder joints detected based on the method that Hough detects in BGA radioscopic images；
S2, triangle gridding built according to triangulation to the solder joint that is detected in S1, every line is formed in grid
Intersection point is converged on the center of circle of solder joint；
S3, the length of side of the grid of formation and the average value of the length of side are calculated, the unnecessary center of circle is removed according to the threshold value of setting, until
The remaining center of circle meets specified conditions, extracts 4 special summits；
S4, solve perspective transformation matrix and perspective transform is done to original image using its inverse matrix, after forming perspective correction
Front view.
The bearing calibration of the described radioscopic image for BGA solder joints, it is preferred that the S1 includes：
S1-1, the solder joint in image is extracted using Hough loop truss algorithm, and mark all center of circle v, its
In i-th of center of circle be designated as vi, its coordinate is (xi,yi)。
The bearing calibration of the described radioscopic image for BGA solder joints, it is preferred that the S2 includes：
S2-1, using Delaunay Triangulation algorithm structure triangle gridding, the intersection point that every line is formed in grid converges
In the center of circle of solder joint, the connection figure G=(V, E) between each solder joint is obtained, defines G number of vertex n=n (G) and G side number m
=m (G), d (vi) it is i-th of center of circle viThe number of degrees, ω (ei) it is side eiThe length of side.
The bearing calibration of the described radioscopic image for BGA solder joints, it is preferred that the S3 includes：
S3-1, the length of side on all sides in S2-1 is calculated, for side ei=vjvk, its ω (ei) it is equal to vjAnd vkIn original image
In Euclidean distance, i.e.,：Wherein, j-th of center of circle vjCoordinate be (xj,yj), the
K center of circle vkCoordinate be (xk,yk)；
S3-2, calculate the average value ω of the length of sidem, the departure degree k of all length of sides and average value is calculated, for side ei, its
Irrelevance is defined as k (ei)=‖ (ω (ei)-ωm) ‖,
S3-3, select { k (ei), i=1,2.....m } in maximum, be designated as k (et), andI.e.WithIt is
The maximum side e of irrelevancetTwo end points
S3-4, calculateIrrelevanceWithIrrelevanceDefinitionWherein： ωl
Represent withThe length on the l articles connected side,Equal to it is all withThe average value of the length on connected side.
S3-5, a threshold value T is manually set according to the inclined degree of image, ifAndEqual to one
Natural number, then S3-7 is carried out, otherwise performs S3-6；
S3-6, ifThen remove summitS2-1 is jumped to continue executing with, ifThen remove summitJump
S2-1 is gone to continue executing with；
S3-7, for new center of circle set v, wherein v includes several centers of circle, and now the remaining center of circle is arranged into resemblance matrix
Row, seek its convex closure C；
The angle on two sides on all summits in S3-8, calculating convex closure C, and 4 minimum special summits of angle are found out,
It is v to make it1,v2,v3,v4, and v1In the upper left corner, v2In the upper right corner, v3In the lower left corner, v4In the lower right corner.
The bearing calibration of the described radioscopic image for BGA solder joints, it is preferred that the S4 includes：
S4-1, the v of acquisition1,v2,v3,v4Four points arranged on PCB be square 4 summits, and v1In the upper left corner,
v2In the upper right corner, v3In the lower left corner, v4In the lower right corner；
S4-2, the universal transformation formula of image are：
(x', y', w')=(u, v, w) M, wherein：
It is the transformation matrix of image,Represent the linear transformation of image, (a31
a21) represent image translation transformation, (a13 a23)TRepresent the perspective transform of image.In order that M convenient calculating, defines into square formation
(u v) is the coordinate at original image midpoint,It is the coordinate at image midpoint after converting.
Make v1,v2,v3,v4The original coordinates of four points be respectively (0,0), (1,0), (0,1), (1,1) i.e.：
Namely：
a31=x1
a11+a31-a13x2=x2
a11+a21+a31-a13x2-a23x2=x3
a21+a31-a23x4=x4
a32=y1
a12+a32-a13y2=y2
a12+a22+a32-a13y2-a23y2=y3
a22+a32-a23y4=y4
Above formula can try to achieve transformation matrix M；Inverse transformation is carried out to original image using M inverse matrix, after being corrected
Front view.
In summary, by adopting the above-described technical solution, the beneficial effects of the invention are as follows：
Automatically it is front view picture by inclined BGA image rectifications, facilitates further perspective to handle, be easy to tester to find
Solder joint is abnormal, improves the efficiency of detection early, and improve follow-up accuracy of detection.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 is original X-rays figure of the present invention；
Fig. 2 is that the present invention obtains solder joint extraction figure；
Fig. 3 is that iteration of the present invention completes matrix grid drafting figure；
Fig. 4 is first time iterative mesh drafting figure of the invention；
Fig. 5 is second of iterative mesh drafting figure of the invention；
Fig. 6 is convex closure wire figure of the present invention；
Fig. 7 is the wire figure after present invention correction；
Fig. 8 is the radioscopic image after correction；
Fig. 9 is workflow diagram of the present invention.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " is based on accompanying drawing institutes
The orientation or position relationship shown, it is for only for ease of the description present invention and simplifies description, rather than instruction or the dress for implying meaning
Put or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limit of the invention
System.
In the description of the invention, unless otherwise prescribed with limit, it is necessary to explanation, term " installation ", " connected ",
" connection " should be interpreted broadly, and also can be the connection of two element internals for example, can be mechanical connection or electrical connection, energy
Enough it is joined directly together, can be also indirectly connected by intermediary, for the ordinary skill in the art, being capable of basis
Concrete condition understands the concrete meaning of above-mentioned term.
As shown in figure 1, original image is obtained, so as to carry out the work of Part I,
Part I：Four summits of rectangle are extracted, due to there is successive ignition, therefore the present embodiment is only provided and changed for the first time
The specific data of the process in generation
1. being extracted using Hough loop truss algorithm to the solder joint in image, and all center of circle v are marked, wherein the
The i center of circle is designated as vi, its coordinate is (xi,yi), as shown in Figure 2.Central coordinate of circle difference is as follows：
| Sequence number | 1 | 2 | 3 | 4 | 5 | 6 | 7 |
| Central coordinate of circle | (267,688) | (282,501) | (73,875) | (251,875) | (105,485) | (90,678) | (297,317) |
| Sequence number | 8 | 9 | 10 | 11 | 12 | 13 | 14 |
| Central coordinate of circle | (432,695) | (460,338) | (624,186) | (611,357) | (445,515) | (597,528) | (122,294) |
| Sequence number | 15 | 16 | 17 | 18 | 19 | 20 | 21 |
| Central coordinate of circle | (473,161) | (764,210) | (417,877) | (312,133) | (138,103) | (585,703) | (750,376) |
| Sequence number | 22 | 23 | 24 | 25 | 26 | 27 | |
| Central coordinate of circle | (571,877) | (774,45) | (738,541) | (636,16) | (711,876) | (721,707) |
2. using Delaunay Triangulation algorithm structure triangle gridding, obtain between each solder joint connection figure G=(V,
E), n=n (G)=27, m=m (G)=63 is G number of vertex and side number respectively, d (vi) it is i-th of center of circle viThe number of degrees, ω
(ei) it is side eiWeight.As shown in Figure 3.
3. the length of side between each summit is calculated, for side ei=vjvk, its ω (ei) it is equal to vjAnd vkIn original image
Euclidean distance, i.e.,：ω(ei) the partial results such as following table that calculates, 1 is illustrated in table
Euclidean distance between No. 10 centers of circle, NA represent not connect
4. calculate the average value ω of the length of sidem=195.24, the departure degree k of all length of sides and average value is calculated, for
Side ei, its departure degree is defined as k (ei)=‖ (ω (ei)-ωm)‖
5. select { k (ei), i=1,2 ..., 63 } in maximum, k values in the present embodiment first time iteration are maximum
E is v25v19Connect the side in No. 25 centers of circle and No. 19 centers of circle
6. calculate v25IrrelevanceAnd v19Irrelevance
7. threshold value T is set as 0.2, due toAndIt is not a natural number, therefore performs step
8。
8. due toThen remove vertex v25, jump to step 2
Above is the process of first time iteration,
The effect of iteration as shown in Figures 3 to 5, after iteration twice, completes the first step twice
9. for new V, its convex closure C is asked to be：3-5-19-16-23-24-22-17-3, as shown in Figure 6
10. calculate the angle between each summit Liang Tiao sides：
| Summit | 3 | 5 | 19 | 16 | 23 | 24 | 22 | 17 |
| Angle | 85.49° | 179.95° | 85.17° | 95.19° | 179.87° | 95.20° | 179.15° | 179.98° |
Angle is taken closest to the summit that 90 ° of 4 points are quadrangle, therefore 19,16,3,24 four points are the top of quadrangle
Point.v19In the upper left corner, v16In the upper right corner, v3In the lower left corner, v24In the lower right corner, coordinate is as shown in the table：
| Point | 19 | 16 | 3 | 24 |
| Coordinate | (138,103) | (764,210) | (73,875) | (738,541) |
Part II：Solve perspective transformation matrix and do perspective transform.
11. as shown in fig. 6, according to the result of previous step, v19,v16,v3,v24Arrangement of four points in PCB versions is square
4 summits of shape, and v19In the upper left corner, v16In the upper right corner, v3In the lower left corner, v24In the lower right corner.
12. it is as follows to try to achieve transformation matrix M：
13. inverse transformation is carried out to original image using M inverse matrix, it becomes possible to obtain the front view of original image, such as Fig. 7
Radioscopic image after shown wire figure and correction shown in Fig. 8.
As shown in figure 9, the present invention proposes a kind of automatically-perspective bearing calibration of the radioscopic image for BGA solder joints, wrap
Include：
S1, detect all solder joints in radioscopic image；
S2, triangle gridding built according to triangulation to the solder joint that is detected in S1, every line is formed in grid
Intersection point is converged on the center of circle of solder joint；
S3, the length of side of the grid of formation and the average value of the length of side are calculated, the unnecessary center of circle is removed according to the threshold value of setting, until
The remaining center of circle meets specified conditions, extracts 4 special summits；
S4, solve perspective transformation matrix and perspective transform is done to original image using its inverse matrix, after forming perspective correction
Front view.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Necessarily refer to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be any
One or more embodiments or example in combine in an appropriate manner.
Although an embodiment of the present invention has been shown and described, one of ordinary skill in the art it will be appreciated that：Not
In the case of departing from the principle and objective of the present invention a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The scope of invention is limited by claim and its equivalent.
Claims (5)
- A kind of 1. bearing calibration of radioscopic image for BGA solder joints, it is characterised in that including：S1, using all solder joints detected based on the method that Hough detects in BGA radioscopic images；S2, triangle gridding built according to triangulation to the solder joint that is detected in S1, the intersection point that every line is formed in grid Converge on the center of circle of solder joint；S3, the length of side of the grid of formation and the average value of the length of side are calculated, the unnecessary center of circle is removed according to the threshold value of setting, until residue The center of circle meets specified conditions, extracts 4 special summits；S4, solve perspective transformation matrix and perspective transform is done to original image using its inverse matrix, formed after perspective correction just View.
- 2. the bearing calibration of the radioscopic image according to claim 1 for BGA solder joints, it is characterised in that the S1 bags Include：S1-1, the solder joint in image is extracted using Hough loop truss algorithm, and mark all center of circle v, wherein i-th The individual center of circle is designated as vi, its coordinate is (xi,yi)。
- 3. the bearing calibration of the radioscopic image according to claim 2 for BGA solder joints, it is characterised in that the S2 bags Include：S2-1, using Delaunay Triangulation algorithm structure triangle gridding, the intersection point that every line is formed in grid converges in weldering The center of circle of point, obtains the connection figure G=(V, E) between each solder joint, defines G number of vertex n=n (G) and G side number m=m (G), d (vi) it is i-th of center of circle viThe number of degrees, ω (ei) it is side eiThe length of side.
- 4. the bearing calibration of the radioscopic image according to claim 3 for BGA solder joints, it is characterised in that the S3 bags Include：S3-1, the length of side on all sides in S2-1 is calculated, for side ei=vjvk, its ω (ei) it is equal to vjAnd vkIn original image Euclidean distance, i.e.,：Wherein, j-th of center of circle vjCoordinate be (xj,yj), k-th Center of circle vkCoordinate be (xk,yk)；S3-2, calculate the average value ω of the length of sidem, the departure degree k of all length of sides and average value is calculated, for side ei, it deviates Degree is defined as k (ei)=‖ (ω (ei)-ωm) ‖,S3-3, select { k (ei), i=1,2.....m } in maximum, be designated as k (et), andI.e.WithIt is to deviate Spend maximum side etTwo end pointsS3-4, calculateIrrelevanceWithIrrelevanceDefinitionWherein：ωlRepresent withThe length on the l articles connected side,Equal to it is all withThe average value of the length on connected side；S3-5, a threshold value T is manually set according to the inclined degree of image, ifAndEqual to one nature Number, then carry out S3-7, otherwise perform S3-6；S3-6, ifThen remove summitS2-1 is jumped to continue executing with, ifThen remove summitJump to S2-1 is continued executing with；S3-7, for new center of circle set v, wherein v includes several centers of circle, and now the remaining center of circle arranges into resemblance matrix, Seek its convex closure C；The angle on two sides on all summits in S3-8, calculating convex closure C, and 4 minimum special summits of angle are found out, make it For v1,v2,v3,v4, and v1In the upper left corner, v2In the upper right corner, v3In the lower left corner, v4In the lower right corner.
- 5. the bearing calibration of the radioscopic image according to claim 4 for BGA solder joints, it is characterised in that the S4 bags Include：S4-1, the v of acquisition1,v2,v3,v4Four points arranged on PCB be square 4 summits, and v1In the upper left corner, v2 The upper right corner, v3In the lower left corner, v4In the lower right corner；S4-2, the universal transformation formula of image are：(x', y', w')=(u, v, w) M, wherein：It is the transformation matrix of image, a11-a33Representative image position,Represent image Linear transformation, (a31 a21) represent image translation transformation, (a13 a23)TRepresent the perspective transform of image；In order that M is into square formation, Convenient to calculate, defined parameters w and parameter w conversion w' are：(u v) is the coordinate at original image midpoint,It is the coordinate at image midpoint after converting；Make v1,v2,v3,v4The original coordinates of four points be respectively (0,0), (1,0), (0,1), (1,1) i.e.：v1:(0,0)→(x1,y1)v2:(1,0)→(x2,y2)v3:(0,1)→(x3,y3),v4:(1,1)→(x4,y4)Namely：a31=x1a11+a31-a13x2=x2a11+a21+a31-a13x2-a23x2=x3a21+a31-a23x4=x4a32=y1a12+a32-a13y2=y2a12+a22+a32-a13y2-a23y2=y3a22+a32-a23y4=y4Above formula can try to achieve transformation matrix M；Inverse transformation, facing after being corrected are carried out to original image using M inverse matrix Figure.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108956653A (en) * | 2018-05-31 | 2018-12-07 | 广东正业科技股份有限公司 | A kind of quality of welding spot detection method, system, device and readable storage medium storing program for executing |
| CN108961187A (en) * | 2018-06-29 | 2018-12-07 | 南京环印防伪科技有限公司 | A kind of label cambered surface method for correcting image |
| CN110570398A (en) * | 2019-08-14 | 2019-12-13 | 兰州理工大学 | Cable joint welding spot qualification detection method based on deep learning technology |
| CN113218970A (en) * | 2021-03-17 | 2021-08-06 | 上海师范大学 | BGA packaging quality automatic detection method based on X-ray |
| CN113569854A (en) * | 2021-07-01 | 2021-10-29 | 南京航空航天大学 | Method for measuring span of chip welding gold wire |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010010321A1 (en) * | 1998-12-09 | 2001-08-02 | Garrity John Joseph | Enhanced pad design for substrate |
| CN103278515A (en) * | 2013-05-16 | 2013-09-04 | 华南理工大学 | Rotary X-ray layered photographic detection system and method |
| CN105279757A (en) * | 2015-10-19 | 2016-01-27 | 广州视源电子科技股份有限公司 | Welding spot positioning method and device |
-
2017
- 2017-09-25 CN CN201710871631.4A patent/CN107657588B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010010321A1 (en) * | 1998-12-09 | 2001-08-02 | Garrity John Joseph | Enhanced pad design for substrate |
| CN103278515A (en) * | 2013-05-16 | 2013-09-04 | 华南理工大学 | Rotary X-ray layered photographic detection system and method |
| CN105279757A (en) * | 2015-10-19 | 2016-01-27 | 广州视源电子科技股份有限公司 | Welding spot positioning method and device |
Non-Patent Citations (2)
| Title |
|---|
| 吴健雄: "CTCS_3级车载DMI界面信息自动识别方法及工具的研究", 《中国优秀硕士学位论文全文数据库 工程科技II科技辑》 * |
| 孟伟荣: "PCB_AXI图像中的矩形与圆目标分割与识别", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108956653A (en) * | 2018-05-31 | 2018-12-07 | 广东正业科技股份有限公司 | A kind of quality of welding spot detection method, system, device and readable storage medium storing program for executing |
| CN108961187A (en) * | 2018-06-29 | 2018-12-07 | 南京环印防伪科技有限公司 | A kind of label cambered surface method for correcting image |
| CN108961187B (en) * | 2018-06-29 | 2021-11-12 | 南京环印防伪科技有限公司 | Label cambered surface image correction method |
| CN110570398A (en) * | 2019-08-14 | 2019-12-13 | 兰州理工大学 | Cable joint welding spot qualification detection method based on deep learning technology |
| CN113218970A (en) * | 2021-03-17 | 2021-08-06 | 上海师范大学 | BGA packaging quality automatic detection method based on X-ray |
| CN113569854A (en) * | 2021-07-01 | 2021-10-29 | 南京航空航天大学 | Method for measuring span of chip welding gold wire |
| CN113569854B (en) * | 2021-07-01 | 2022-05-03 | 南京航空航天大学 | Method for measuring span of chip welding gold wire |
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