CN107636827A - 功率电子设备模块 - Google Patents
功率电子设备模块 Download PDFInfo
- Publication number
- CN107636827A CN107636827A CN201680021900.1A CN201680021900A CN107636827A CN 107636827 A CN107636827 A CN 107636827A CN 201680021900 A CN201680021900 A CN 201680021900A CN 107636827 A CN107636827 A CN 107636827A
- Authority
- CN
- China
- Prior art keywords
- liquid
- cooler
- power electronics
- electronics devices
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims abstract description 107
- 239000004065 semiconductor Substances 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 238000001816 cooling Methods 0.000 claims abstract description 34
- 239000011810 insulating material Substances 0.000 claims abstract description 34
- 239000000110 cooling liquid Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 16
- 239000003990 capacitor Substances 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 230000000116 mitigating effect Effects 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910000962 AlSiC Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 35
- 230000005611 electricity Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 241000446313 Lamella Species 0.000 description 2
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- 238000007906 compression Methods 0.000 description 2
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- 238000005538 encapsulation Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 208000021760 high fever Diseases 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Inverter Devices (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15163368 | 2015-04-13 | ||
EP15163368.2 | 2015-04-13 | ||
PCT/EP2016/052161 WO2016165843A1 (en) | 2015-04-13 | 2016-02-02 | Power electronics module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107636827A true CN107636827A (zh) | 2018-01-26 |
CN107636827B CN107636827B (zh) | 2020-05-12 |
Family
ID=52875013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680021900.1A Active CN107636827B (zh) | 2015-04-13 | 2016-02-02 | 功率电子设备模块 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10283436B2 (zh) |
JP (1) | JP6925279B2 (zh) |
CN (1) | CN107636827B (zh) |
DE (1) | DE112016001711T5 (zh) |
GB (1) | GB2555241B (zh) |
WO (1) | WO2016165843A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110071079A (zh) * | 2019-04-24 | 2019-07-30 | 深圳第三代半导体研究院 | 一种功率器件封装结构及其方法 |
CN111684587A (zh) * | 2018-02-07 | 2020-09-18 | 株式会社东芝 | 半导体装置 |
CN111937146A (zh) * | 2018-03-30 | 2020-11-13 | 维迪科研究所 | 模块化功率开关元件和多个模块化元件的可拆卸组件 |
CN111933595A (zh) * | 2020-07-16 | 2020-11-13 | 杰群电子科技(东莞)有限公司 | 一种半导体封装结构及半导体封装结构的制造方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112015003244T5 (de) * | 2014-09-25 | 2017-04-13 | Hitachi Automotive Systems, Ltd. | Leistungsumsetzer |
EP3206468B1 (de) * | 2016-02-15 | 2018-12-26 | Siemens Aktiengesellschaft | Umrichter mit gleichspannungszwischenkreis |
FR3060243B1 (fr) | 2016-12-12 | 2019-08-23 | Institut Vedecom | Module de commutation de puissance, convertisseur integrant celui-ci et procede de fabrication |
FR3060254B1 (fr) * | 2016-12-12 | 2019-07-26 | Institut Vedecom | Procede d'integration de puces de puissance et modules electroniques de puissance |
EP3566246B1 (en) * | 2017-02-01 | 2020-11-18 | ABB Power Grids Switzerland AG | Power semiconductor module with short circuit failure mode |
KR102325110B1 (ko) * | 2017-05-31 | 2021-11-11 | 한온시스템 주식회사 | 전기소자 냉각용 열교환기 |
AT521041B1 (de) | 2018-05-25 | 2019-10-15 | Miba Energy Holding Gmbh | Leistungsbaugruppe mit Schottwand |
JP7159620B2 (ja) | 2018-05-30 | 2022-10-25 | 富士電機株式会社 | 半導体装置、冷却モジュール、電力変換装置及び電動車両 |
CN109390299B (zh) * | 2018-10-26 | 2022-12-20 | 蔚来(安徽)控股有限公司 | 功率半导体装置、电机控制器和车辆 |
WO2020210587A1 (en) * | 2019-04-10 | 2020-10-15 | Jetcool Technologies, Inc. | Thermal management of electronics using co-located microjet nozzles and electronic elements |
EP3977832A4 (en) | 2019-04-14 | 2023-07-26 | Jetcool Technologies, Inc. | LIQUID-BASED DIRECT CONTACT COOLING MODULE |
CN110190049B (zh) * | 2019-05-22 | 2020-07-28 | 西安交通大学 | 一种高压功率模块封装结构 |
DE102020123346A1 (de) | 2020-09-08 | 2022-03-10 | Bayerische Motoren Werke Aktiengesellschaft | Leistungselektronische Einrichtung mit einem Spannungsteiler und Kraftfahrzeug |
WO2022060898A1 (en) | 2020-09-15 | 2022-03-24 | Jetcool Technologies Inc. | High temperature electronic device thermal management system |
JPWO2022239154A1 (zh) * | 2021-05-12 | 2022-11-17 | ||
CN115989581A (zh) * | 2021-07-19 | 2023-04-18 | 丹尼克斯半导体有限公司 | 半导体装置 |
EP4135029A1 (en) * | 2021-08-11 | 2023-02-15 | Hamilton Sundstrand Corporation | Power semiconductor cooling assembly |
US12048118B2 (en) | 2021-08-13 | 2024-07-23 | Jetcool Technologies Inc. | Flow-through, hot-spot-targeting immersion cooling assembly |
TW202407925A (zh) | 2022-03-04 | 2024-02-16 | 美商捷控技術有限公司 | 用於電腦處理器及處理器組件之主動冷卻散熱蓋 |
JP7511772B1 (ja) | 2023-02-22 | 2024-07-05 | 株式会社Tmeic | 電力変換ユニット |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090213547A1 (en) * | 2005-10-07 | 2009-08-27 | Jurgen Schulz-Harder | Electrical Module |
US8264087B2 (en) * | 2008-10-09 | 2012-09-11 | Hynix Semiconductor Inc. | Semiconductor package for discharging heat and method for fabricating the same |
CN103367279A (zh) * | 2012-03-30 | 2013-10-23 | 武汉飞恩微电子有限公司 | 双面微通道液冷功率半导体整晶圆平板压接封装结构 |
CN103975431A (zh) * | 2011-11-04 | 2014-08-06 | 富士通株式会社 | 微通道冷却器件、微通道冷却***以及电子装置 |
CN103999214A (zh) * | 2011-12-13 | 2014-08-20 | 伊斯帕诺-絮扎公司 | 具有通过液体金属扩散器冷却的电子装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4103486A1 (de) | 1991-02-06 | 1992-08-20 | Abb Patent Gmbh | Anordnung zur kuehlung waermeerzeugender bauelemente |
JP3000809B2 (ja) * | 1993-01-08 | 2000-01-17 | 富士電機株式会社 | 半導体装置 |
FR2754669B1 (fr) | 1996-10-16 | 2002-04-12 | Alsthom Cge Alkatel | Module electronique de puissance, et systeme electronique de puissance comprenant une pluralite dudit module |
JP3596388B2 (ja) * | 1999-11-24 | 2004-12-02 | 株式会社デンソー | 半導体装置 |
US6703707B1 (en) * | 1999-11-24 | 2004-03-09 | Denso Corporation | Semiconductor device having radiation structure |
EP2234154B1 (en) | 2000-04-19 | 2016-03-30 | Denso Corporation | Coolant cooled type semiconductor device |
JP3879688B2 (ja) * | 2003-03-26 | 2007-02-14 | 株式会社デンソー | 半導体装置 |
JP4292913B2 (ja) * | 2003-08-06 | 2009-07-08 | 株式会社デンソー | 半導体冷却ユニット |
US8482921B2 (en) * | 2006-10-23 | 2013-07-09 | Teledyne Scientific & Imaging, Llc. | Heat spreader with high heat flux and high thermal conductivity |
CN101855723B (zh) * | 2007-11-13 | 2012-04-25 | 西门子公司 | 功率半导体模块 |
EP2270855A1 (en) | 2009-06-29 | 2011-01-05 | ABB Research Ltd. | An electrical module |
US20140319673A1 (en) * | 2011-11-07 | 2014-10-30 | Daikin Industries, Ltd. | Semiconductor device |
JP2014116478A (ja) * | 2012-12-11 | 2014-06-26 | Meidensha Corp | 半導体モジュール及び半導体モジュールの製造方法並びに電力変換装置 |
WO2014158481A1 (en) * | 2013-03-14 | 2014-10-02 | Tactus Technology, Inc. | System for cooling an integrated circuit within a computing device |
US20140291832A1 (en) * | 2013-03-28 | 2014-10-02 | Infineon Technologies Ag | Integrated cooling modules of power semiconductor device |
JP6112077B2 (ja) * | 2014-07-03 | 2017-04-12 | トヨタ自動車株式会社 | 半導体装置 |
-
2016
- 2016-02-02 CN CN201680021900.1A patent/CN107636827B/zh active Active
- 2016-02-02 DE DE112016001711.1T patent/DE112016001711T5/de active Pending
- 2016-02-02 GB GB1716770.1A patent/GB2555241B/en active Active
- 2016-02-02 WO PCT/EP2016/052161 patent/WO2016165843A1/en active Application Filing
- 2016-02-02 JP JP2017553391A patent/JP6925279B2/ja active Active
-
2017
- 2017-10-13 US US15/783,193 patent/US10283436B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090213547A1 (en) * | 2005-10-07 | 2009-08-27 | Jurgen Schulz-Harder | Electrical Module |
US8264087B2 (en) * | 2008-10-09 | 2012-09-11 | Hynix Semiconductor Inc. | Semiconductor package for discharging heat and method for fabricating the same |
CN103975431A (zh) * | 2011-11-04 | 2014-08-06 | 富士通株式会社 | 微通道冷却器件、微通道冷却***以及电子装置 |
CN103999214A (zh) * | 2011-12-13 | 2014-08-20 | 伊斯帕诺-絮扎公司 | 具有通过液体金属扩散器冷却的电子装置 |
CN103367279A (zh) * | 2012-03-30 | 2013-10-23 | 武汉飞恩微电子有限公司 | 双面微通道液冷功率半导体整晶圆平板压接封装结构 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111684587A (zh) * | 2018-02-07 | 2020-09-18 | 株式会社东芝 | 半导体装置 |
CN111684587B (zh) * | 2018-02-07 | 2023-06-09 | 株式会社东芝 | 半导体装置 |
CN111937146A (zh) * | 2018-03-30 | 2020-11-13 | 维迪科研究所 | 模块化功率开关元件和多个模块化元件的可拆卸组件 |
CN111937146B (zh) * | 2018-03-30 | 2024-03-22 | 维迪科研究所 | 模块化功率开关元件和多个模块化元件的可拆卸组件 |
CN110071079A (zh) * | 2019-04-24 | 2019-07-30 | 深圳第三代半导体研究院 | 一种功率器件封装结构及其方法 |
CN111933595A (zh) * | 2020-07-16 | 2020-11-13 | 杰群电子科技(东莞)有限公司 | 一种半导体封装结构及半导体封装结构的制造方法 |
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GB201716770D0 (en) | 2017-11-29 |
WO2016165843A1 (en) | 2016-10-20 |
JP2018512742A (ja) | 2018-05-17 |
US10283436B2 (en) | 2019-05-07 |
DE112016001711T5 (de) | 2018-01-04 |
JP6925279B2 (ja) | 2021-08-25 |
US20180040538A1 (en) | 2018-02-08 |
CN107636827B (zh) | 2020-05-12 |
GB2555241B (en) | 2020-05-13 |
GB2555241A (en) | 2018-04-25 |
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