CN106920647A - A kind of new magnetic element heat dissipating method - Google Patents
A kind of new magnetic element heat dissipating method Download PDFInfo
- Publication number
- CN106920647A CN106920647A CN201710270913.9A CN201710270913A CN106920647A CN 106920647 A CN106920647 A CN 106920647A CN 201710270913 A CN201710270913 A CN 201710270913A CN 106920647 A CN106920647 A CN 106920647A
- Authority
- CN
- China
- Prior art keywords
- magnetic element
- heat dissipating
- dissipating method
- fin
- element heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to hot-fluid technical field, and in particular to a kind of new magnetic element heat dissipating method.The purpose is to provide heat dissipating method that is a kind of easy and easily implementing, copper radiating rib is added by the top of magnetic element, air channel can be effectively utilized, solve the problems, such as such as transformer temperature rise of conventional magnetic element.
Description
Technical field
The present invention relates to hot-fluid technical field, and in particular to a kind of new magnetic element heat dissipating method.The purpose is to carry
For heat dissipating method that is a kind of easy and easily implementing, copper radiating rib is added by the top of magnetic element, can effective land productivity
With air channel, such as transformer temperature rise of conventional magnetic element is solved the problems, such as.
Background technology
Transformer is the larger part of caloric value in Switching Power Supply, if radiating is bad, it is impossible to effectively reduce transformer
Temperature, just occurs the phenomenon that transformer overheat causes power supply to damage.The radiating of power module magnetic element is always power supply neck
Stubborn problem is compared in domain, and due to leaving unused for air channel, the air quantity for blowing to magnetic element is minimum, the transformer temperature mistake of actual test
Height, has harmful effect to the life-span and stability of power module.It is to increase to improve the most common method of transformer heat dispersal situations
Air flow beside transformer, that is, set up fan and dried against transformer, and the perforate on casing allows stream of hot air
It is logical.But perforate is easily fallen pocket-handkerchief and entered on casing, and easily enters dust and steam when using, can exempt to damage transformation for a long time
Element inside device, and have certain distance between fan and transformer, whole device floor space is excessive.
Regarding to the issue above, the application proposes a kind of new magnetic element heat dissipation design side from the angle of device architecture
Method, copper radiating rib is added at the top of magnetic element, is bonded with heat-conducting glue between copper radiating rib and magnetic core, can so make this portion
Blowed air in point radiating copper sheet, improved transformer temperature rise.
The content of the invention
Present application invents a kind of new magnetic element heat dissipating method, and the heat dissipating method specifically includes following steps：In magnetic
Property element at the top of add fin；Bonded using heat-conducting glue between fin and magnetic element.
Magnetic element heat dissipating method as described above, is further characterized in that, the material of fin is thermal conductive metallic material.
Magnetic element heat dissipating method as described above, is further characterized in that, the material of fin is copper.
Magnetic element heat dissipating method as described above, is further characterized in that, the shape of fin can be rectangle, side
Shape, semicircle.
Brief description of the drawings
Fig. 1, magnetic element heat dissipating method schematic diagram of the present invention；
Fig. 2, the specific material object implemented by the method for the invention；
In Fig. 1, the 1. heat-conducting glue of 2. radiating copper sheet of magnetic element 3.
Specific embodiment
In order to illustrate more clearly of technical scheme of the invention or of the prior art, below will be to make needed for embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing, belong to the scope of protection of the invention.
More detailed elaboration is carried out to present disclosure below：
As shown in figure 1, adding a fin at the top of magnetic element, its material can be copper, it is also possible to lead other
Hot metallic material；The shapes and sizes of fin can be adjusted according to space size, rectangle, square or semicircle
Deng the quantity of fin can be adjusted as needed.
Can be bonded using heat-conducting glue between fin and magnetic element, heat can so be drawn from inside magnetic element
Go out and cause on fin, so as to expand area of dissipation.
Fin is located at air channel, therefore blows air over, and can take away the heat of magnetic element generation.
Magnetic element can be the magnetic element that heat is easily produced when transformer etc. has coil working.
Fig. 2 show the specific material object implemented according to herein described invention.
By using the heat dissipating method of magnetic element of the present invention, can reach makes magnetic element good heat dissipation, effect
High, fault rate is low, long service life purpose, and the temperature rise of magnetic element is improved, and is conducive to the raising of product stability, is carried
Operating efficiency high.
Claims (4)
1. a kind of new magnetic element heat dissipating method, the heat dissipating method specifically includes following steps：
A fin is added at the top of magnetic element；
Bonded using heat-conducting glue between fin and magnetic element.
2. magnetic element heat dissipating method as claimed in claim 1, is further characterized in that, the material of fin is heat-conducting metal material
Material.
3. magnetic element heat dissipating method as claimed in claim 2, is further characterized in that, the material of fin is copper.
4. magnetic element heat dissipating method as claimed in claim 3, is further characterized in that, the shape of fin can be rectangular
Shape, square, semicircle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270913.9A CN106920647A (en) | 2017-04-21 | 2017-04-21 | A kind of new magnetic element heat dissipating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710270913.9A CN106920647A (en) | 2017-04-21 | 2017-04-21 | A kind of new magnetic element heat dissipating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106920647A true CN106920647A (en) | 2017-07-04 |
Family
ID=59568887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710270913.9A Pending CN106920647A (en) | 2017-04-21 | 2017-04-21 | A kind of new magnetic element heat dissipating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106920647A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108648898A (en) * | 2018-07-27 | 2018-10-12 | 南通鑫源电器制造有限公司 | A kind of heat dissipation protruding type transformer |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1309341A (en) * | 2000-02-08 | 2001-08-22 | 山洋电气株式会社 | Cooling device provided with radiator |
| CN1353570A (en) * | 2000-11-13 | 2002-06-12 | 台达电子工业股份有限公司 | Fine-shaped heat radiator of electronic element |
| US7085136B2 (en) * | 2004-04-14 | 2006-08-01 | Thermaltake Technology Ltd. | Heat duct-equipped heat-radiating device for power supply |
| CN2849819Y (en) * | 2005-12-06 | 2006-12-20 | 浪潮电子信息产业股份有限公司 | Zero noise PC power |
| CN202522994U (en) * | 2012-04-26 | 2012-11-07 | 浪潮电子信息产业股份有限公司 | Mute power supply device |
| CN202522995U (en) * | 2012-04-26 | 2012-11-07 | 浪潮电子信息产业股份有限公司 | High-density power module device |
| CN202551603U (en) * | 2012-04-23 | 2012-11-21 | 深圳市晶福源电子技术有限公司 | Device provided with radiator |
| CN203434142U (en) * | 2013-06-17 | 2014-02-12 | 陈成生 | Radiating device |
-
2017
- 2017-04-21 CN CN201710270913.9A patent/CN106920647A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1309341A (en) * | 2000-02-08 | 2001-08-22 | 山洋电气株式会社 | Cooling device provided with radiator |
| CN1353570A (en) * | 2000-11-13 | 2002-06-12 | 台达电子工业股份有限公司 | Fine-shaped heat radiator of electronic element |
| US7085136B2 (en) * | 2004-04-14 | 2006-08-01 | Thermaltake Technology Ltd. | Heat duct-equipped heat-radiating device for power supply |
| CN2849819Y (en) * | 2005-12-06 | 2006-12-20 | 浪潮电子信息产业股份有限公司 | Zero noise PC power |
| CN202551603U (en) * | 2012-04-23 | 2012-11-21 | 深圳市晶福源电子技术有限公司 | Device provided with radiator |
| CN202522994U (en) * | 2012-04-26 | 2012-11-07 | 浪潮电子信息产业股份有限公司 | Mute power supply device |
| CN202522995U (en) * | 2012-04-26 | 2012-11-07 | 浪潮电子信息产业股份有限公司 | High-density power module device |
| CN203434142U (en) * | 2013-06-17 | 2014-02-12 | 陈成生 | Radiating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108648898A (en) * | 2018-07-27 | 2018-10-12 | 南通鑫源电器制造有限公司 | A kind of heat dissipation protruding type transformer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170704 |
|
| RJ01 | Rejection of invention patent application after publication |