CN106714441B - Board structure of circuit and preparation method thereof - Google Patents
Board structure of circuit and preparation method thereof Download PDFInfo
- Publication number
- CN106714441B CN106714441B CN201510774334.9A CN201510774334A CN106714441B CN 106714441 B CN106714441 B CN 106714441B CN 201510774334 A CN201510774334 A CN 201510774334A CN 106714441 B CN106714441 B CN 106714441B
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- China
- Prior art keywords
- layer
- circuit
- line
- board structure
- busbar wire
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of board structure of circuit comprising the first basal layer, the first line layer for being located at two opposite surfaces of first basal layer and the second line layer, be formed in second line layer outside the second protective layer and the overlay structure that is arranged on second protective layer；Second line layer includes busbar wire, which covers second line layer and manifest the busbar wire, which is connected with the busbar wire.The invention further relates to the production methods of the board structure of circuit.
Description
Technical field
The present invention relates to field of circuit boards, in particular to a kind of board structure of circuit and preparation method thereof.
Background technique
Flexible circuit board is light-weight with its, thickness is thin, line density is high, it is bent, can flexing the advantages that, and answered extensively
For in the important mould group of the products such as smart phone, tablet computer.In order to guarantee other groups in flexible circuit panel products and product
Part component has good splicing results and stable working environment, in the industry to needing and other assemblies on flexible circuit panel products
The copper surface of junction carries out gold-plated processing, guarantees the good conduction and trustworthiness of junction.The prior art is real
It is now gold-plated to flexible circuit board, need procedure for producing design when be pre-designed electroplate lead wire, with guarantee all junctions with
Extraneous electrode forming circuit realizes that gold adheres in junction, and is also needed in follow-up process through cross cutting or machine drill
Mode cuts off circuit lead to restore the original circuit network relationship of flexible circuit board, and process is lengthy and tedious, higher cost.In addition,
After electroplate lead wire is via cross cutting or machine drill cutting, copper can be leaked on product lateral incision face, this leakage copper leads to flexible circuit board and its
His component causes bad short circuit, and cyberrelationship is caused to change, and leads to functional failure.
Summary of the invention
In view of this, it is necessary to provide a kind of functional preferably board structure of circuit and preparation method thereof.
A kind of board structure of circuit comprising the first basal layer, positioned at the first of two opposite surfaces of first basal layer
Line layer and the second line layer, the first protective layer being covered on the first line layer and be covered on second line layer
Two protective layers, and the overlay structure being arranged on second protective layer.The first line layer includes multiple golden fingers, this first
Protective layer has at least one first opening to manifest multiple golden finger, which includes a busbar wire, should
Second protective layer has at least one second opening to manifest the busbar wire, which includes composite layer and conduction
Glue, the composite layer offer the first windowing, which is set in first windowing, which passes through the conducting resinl
It is connected with the busbar wire.
A kind of production method of board structure of circuit, comprising the following steps:
An at least wiring board unit is provided, which includes a basal layer, positioned at opposite two of the basal layer
The first line layer and the second line layer on surface, the first protective layer being covered on the first line layer and it is covered in second line
The second protective layer on the floor of road, the first line layer include multiple golden fingers, which there is at least one first to open
Mouthful to manifest multiple golden finger, which includes a busbar wire, second protective layer have at least one the
Two openings are to manifest the busbar wire；
An overlay structure is provided, which includes a composite layer, the insulation that is sequentially arranged on the composite layer
The overlay structure, is pressed together on the outside of second protective layer, makes the composite layer by layer, metal layer and outermost strengthening course
Conducting resinl inserts the slot of the insulating layer and the second opening of second protective layer, the metal layer pass through the conduction of the composite layer
Glue is electrically connected the busbar wire；
A surface-treated layer is formed on each golden finger surface；
The part overlay structure is removed to obtain board structure of circuit.
Board structure of circuit provided by the invention and preparation method thereof, which includes busbar wire, second guarantor
Sheath covers second line layer and manifests the busbar wire, which is connected with the busbar wire；The busbar wire
Positioned at the product zone of the board structure of circuit without cutting, and it is not necessary that the first line layer is extended to garbage area, therefore it is not present
Electroplated lead does not have electroplated lead residual condition, therefore the board structure of circuit will not form short circuit with other assemblies, functional
Preferably.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the substrate for the board structure of circuit that better embodiment of the present invention provides.
Fig. 2 is the diagrammatic cross-section after the substrate manufacture route in Fig. 1.
Fig. 3 is the diagrammatic cross-section of the substrate aperture in Fig. 2.
Fig. 4 is the diagrammatic cross-section after the hole of the substrate in Fig. 3 is electroplated.
Fig. 5 is the cross-sectional view for the wiring board unit that covering protection film is formed on substrate in Fig. 4.
Fig. 6 is that the diagrammatic cross-section after overlay structure is pressed on wiring board unit in Fig. 5.
Fig. 7 is the decomposition diagram of the overlay structure in Fig. 6.
Fig. 8 be the wiring board unit in Fig. 6 carry out it is gold-plated after diagrammatic cross-section.
Fig. 9 is the diagrammatic cross-section that board structure of circuit is formed by after the wiring board unit in Fig. 8 is handled.
Main element symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
The production method of the board structure of circuit of better embodiment of the present invention the following steps are included:
The first step, referring to Fig. 1, providing a substrate 1.The substrate 1 includes that first basal layer 11, one first is led
Electric layer 12 and second conductive layer 13.First basal layer 11 includes first surface 111 and opposite with the first surface 111
Second surface 112, first conductive layer 12 are arranged on the first surface 111, which is arranged in second table
On face 112.First basal layer 11 is flexible resin layer, such as polyimides (Polyimide, PI), poly terephthalic acid second two
Alcohol ester (Polyethylene Terephthalate, PET) or polyethylene naphthalate (Polythylene
Naphthalate,PEN).In present embodiment, first conductive layer 12 and second conductive layer 13 are copper foil.
Second step, referring to Fig. 2, first conductive layer 12 and second conductive layer 13 are fabricated to first line layer respectively
14 and second line layer 15.In present embodiment, the first line layer 14 and second line layer 15 first are led by this respectively
Electric layer 12 and second conductive layer 13 make to be formed by selective etch.
The first line layer 14 includes multiple golden fingers 141 and conducting wire 142, multiple golden finger 141 and the conduction
Route 142 is electrically connected.Second line layer 15 includes busbar wire 151.
The substrate 1 includes product zone a, connection area b and garbage area c, and connection area b is located at product zone a and faces
The position of nearly garbage area c.Product zone a connects garbage area c.
Multiple golden finger 141 and the busbar wire 151 are located in a of the product zone.One end of the busbar wire 151 is located at
In connection area b.
Third step, referring to Fig. 3, opening up at least one through hole 16.At least one through hole 16 is located at product zone a
It is interior.The through hole 16 sequentially passes through the corresponding conducting wire 142, first basal layer 11 and second line layer 15.
4th step, referring to Fig. 4, the inner hole wall at least one through hole 16 forms layer of conductive material, so that should
Through hole 16 becomes conductive through hole 18.The conductive through hole 18 is electrically connected the busbar wire 151 and the conducting wire 142.This reality
It applies in mode, which is copper, which is formed by plating.
5th step, referring to Fig. 5, being respectively formed in the outside of the first line layer 14 and the outside of second line layer 15
First protective layer 20 and the second protective layer 21, to obtain wiring board unit 30.First protective layer 20 covers the first line
Layer 14.First protective layer 20 has at least one first opening 201 to manifest multiple golden finger 141.Second protection
Layer 21 covers second line layer 15.Second protective layer 21 has at least one second opening 211 to manifest the busbar connector
Line 151.In present embodiment, first protective layer 20 and second protective layer 21 are made of insulating material；This first
Protective layer 20 and second protective layer 21 are formed by coating method.
6th step please refers to Fig. 6 and Fig. 7, provides an overlay structure 40.The overlay structure 40 includes a composite layer
41,43, metal layers 44 of an insulating layer and a strengthening course 45.The composite layer 41 is opened up there are two the first windowing 411,
Two first windowing, 411 interval settings.The composite layer 41 further includes being separately positioned on leading in two first windowings 411
Electric glue 42.The side of the composite layer 41 is arranged in the insulating layer 43, and the position for corresponding to two first windowings 411 is opened respectively
Equipped with a slot 431.The side of the insulating layer 43 far from the composite layer 41 is arranged in the metal layer 44, should by two
Slot 431 is electrically connected with the conducting resinl 42.
The side of the metal layer 44 far from the insulating layer 43 is arranged in the strengthening course 45, covers the metal layer 44.It should
Overlay structure 40 is pressed together with the wiring board unit 30, and the conducting resinl 42 of the overlay structure 40 is made to insert the insulating layer 43
Second opening 211 of slot 431 and second protective layer 21, the metal layer 44 are electrical by the conducting resinl 42 of the composite layer 41
The busbar wire 151 is connected, to make multiple golden finger 141, at least one conductive through hole 18, the busbar wire 151, be somebody's turn to do
Conducting resinl 42 and the metal layer 44 are electrically connected, which is directly electrically connected with external electrode.Present embodiment
In, which is different side's conducting resinl；The metal layer 44 is copper foil.
7th step, referring to Fig. 8, forming a surface-treated layer 22 on each golden finger 141.The surface-treated layer 22
For gold.It is appreciated that in other embodiments, which can also be other metals, as palladium, nickel, nickel palladium close
Gold, nickel billon.The surface-treated layer 22 is formed on the golden finger 141 by plating.
8th step, referring to Fig. 9, removing the part overlay structure 40.Specifically, it is useless positioned at this to cut off the overlay structure 40
The part for expecting area c, obtains board structure of circuit 100.
The board structure of circuit 100 includes the first basal layer 11, is located at two opposite surfaces of first basal layer 11
First line layer 14 and the second line layer 15, be covered in the first line layer 14 and the first protective layer of second line layer 15
20 and second protective layer 21, the composite layer 41 that is arranged on second protective layer 21, conduction is provided in the composite layer 41
Glue 42.The composite layer 41 offers the first windowing 411, which is set in first windowing 411.Second route
Layer 15 includes busbar wire 151.Second protective layer 21 covers second line layer 15, which has at least one
A second opening 211 is to manifest the busbar wire 151.The conducting resinl 42 is connected with the busbar wire 151.The first line
Layer 14 includes multiple golden fingers 141 and the conducting wire 142 with the electric connection of multiple golden finger 141.The board structure of circuit 100
It is provided at least one conductive through hole 18, which is electrically connected the conducting wire 142 and the busbar wire 151.Often
A surface-treated layer 22 is formed on a golden finger 141.The board structure of circuit 100 further includes insulating layer 43 and strengthening course 45,
The side of the composite layer 41 is arranged in the insulating layer 43, and the position for corresponding to first windowing 411 offers a slot 431.
The side of the metal layer 44 far from the insulating layer 43 is arranged in the strengthening course 45, covers the metal layer 44.
Board structure of circuit provided by the invention and preparation method thereof, which includes busbar wire, second guarantor
Sheath covers second line layer and manifests the busbar wire, which is connected with the busbar wire；The busbar wire
Positioned at the product zone of the board structure of circuit without cutting, and it is not necessary that the first line layer is extended to garbage area, therefore it is not present
Electroplated lead does not have electroplated lead residual condition, therefore the board structure of circuit will not form short circuit with other assemblies, functional
Preferably.
It is understood that for those of ordinary skill in the art, can do in accordance with the technical idea of the present invention
Various other changes and modifications out, and all these changes and deformation all should belong to the protection model of the claims in the present invention
It encloses.
Claims (9)
1. a kind of board structure of circuit comprising the first basal layer, the First Line positioned at two opposite surfaces of first basal layer
Road floor and the second line layer, the first protective layer being covered on the first line floor and be covered on second line layer second
Protective layer, and the overlay structure being arranged on second protective layer；The first line layer includes multiple golden fingers, first guarantor
Sheath has at least one first opening to manifest multiple golden finger, which includes a busbar wire, this
Two protective layers have at least one second opening to manifest the busbar wire, which includes composite layer and conduction
Glue, the composite layer offer the first windowing, which is set in first windowing, which passes through the conducting resinl
It is connected with the busbar wire.
2. board structure of circuit as described in claim 1, it is characterised in that: it is logical that the board structure of circuit is provided at least one conduction
Hole, the conductive through hole are electrically connected the busbar wire and the golden finger.
3. board structure of circuit as described in claim 1, it is characterised in that: be formed with a surface treatment on each golden finger
Layer.
4. board structure of circuit as described in claim 1, it is characterised in that: the conducting resinl is different side's conducting resinl.
5. board structure of circuit as described in claim 1, it is characterised in that: the overlay structure further includes that be sequentially arranged this compound
Insulating layer, metal layer and strengthening course on glue-line, the insulating layer open up grooved hole, which can be led by the slot with this
Electric glue is electrically connected.
6. a kind of production method of board structure of circuit, comprising the following steps:
An at least wiring board unit is provided, which includes a basal layer, positioned at two opposite surfaces of the basal layer
First line layer and the second line layer, the first protective layer for being covered on the first line layer and be covered in second line layer
On the second protective layer, which includes multiple golden fingers, first protective layer have at least one first opening with
Multiple golden finger is manifested, which includes a busbar wire, which there is at least one second to open
Mouth is to manifest the busbar wire；
An overlay structure is provided, which includes a composite layer, the insulating layer being sequentially arranged on the composite layer, gold
Belong to layer and strengthening course, which is pressed together on to the outside of second protective layer, inserting the conducting resinl of the composite layer should
Second opening of the slot of insulating layer and second protective layer, which is electrically connected by the conducting resinl of the composite layer should
Busbar wire；
A surface-treated layer is formed on each golden finger surface；
The part overlay structure is removed to obtain board structure of circuit.
7. the production method of board structure of circuit as claimed in claim 6, it is characterised in that: the production of the wiring board unit includes
Following steps:
One substrate is provided, which includes the first basal layer, be formed on two opposite surfaces of first basal layer the
One conductive layer and the second conductive layer, the substrate include product zone, positioned at the product zone connection area, connect the product zone
Garbage area and bonding pad positioned at the garbage area；
First conductive layer and second conductive layer are fabricated to first line layer and the second line layer respectively, the busbar wire
One end is located in the connection area；
Make at least one conductive through hole for running through the first line layer, first basal layer and second line layer, the conduction
Through-hole passes through the first line layer and second line layer and the golden finger respectively and the busbar wire is electrically connected；
The second protective layer and the first protective layer are respectively formed on the outside of the outside of second line layer and first line layer, this
One protective layer manifests the connection area and the bonding pad.
8. the production method of board structure of circuit as claimed in claim 7, it is characterised in that: the conducting resinl is different side's conducting resinl,
Its one end being electrically connected with the busbar wire is located at the connection area.
9. the production method of board structure of circuit as claimed in claim 6, it is characterised in that: the surface-treated layer is following metal
One or more of: gold, palladium, nickel, Ni-Pd alloy, nickel billon.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510774334.9A CN106714441B (en) | 2015-11-13 | 2015-11-13 | Board structure of circuit and preparation method thereof |
| TW104137872A TWI615070B (en) | 2015-11-13 | 2015-11-17 | Circuit structure and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510774334.9A CN106714441B (en) | 2015-11-13 | 2015-11-13 | Board structure of circuit and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106714441A CN106714441A (en) | 2017-05-24 |
| CN106714441B true CN106714441B (en) | 2019-06-11 |
Family
ID=58922960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510774334.9A Active CN106714441B (en) | 2015-11-13 | 2015-11-13 | Board structure of circuit and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106714441B (en) |
| TW (1) | TWI615070B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI643537B (en) * | 2018-02-07 | 2018-12-01 | 易華電子股份有限公司 | Bendable soft circuit board |
| TWI750428B (en) * | 2018-11-22 | 2021-12-21 | 易鼎股份有限公司 | Conductive circuit structure including conductive resin layer |
| CN110456567B (en) * | 2019-08-06 | 2020-05-08 | 深圳市利航电子有限公司 | Golden finger anti-breaking structure of backlight source |
| TWI717278B (en) * | 2020-05-18 | 2021-01-21 | 景碩科技股份有限公司 | Method for making circuit board using reinforcing frame |
| CN114080118B (en) * | 2020-08-12 | 2024-03-12 | 宏恒胜电子科技（淮安）有限公司 | Manufacturing method of stepped golden finger circuit board and circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5416276A (en) * | 1994-05-23 | 1995-05-16 | Hou; Chin-Jung | Printed circuit board having protecting means |
| CN102316664A (en) * | 2010-07-02 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5235000B2 (en) * | 2009-07-14 | 2013-07-10 | 日本電信電話株式会社 | Flexible printed circuit board and connection method thereof |
| CN103188869B (en) * | 2011-12-29 | 2016-08-03 | 上海天马微电子有限公司 | Flexible printed circuit board |
| US20140069696A1 (en) * | 2012-09-11 | 2014-03-13 | Apple Inc. | Methods and apparatus for attaching multi-layer flex circuits to substrates |
| CN204518208U (en) * | 2015-01-19 | 2015-07-29 | 联想(北京)有限公司 | Flexible printed circuit board and electronic equipment |
-
2015
- 2015-11-13 CN CN201510774334.9A patent/CN106714441B/en active Active
- 2015-11-17 TW TW104137872A patent/TWI615070B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5416276A (en) * | 1994-05-23 | 1995-05-16 | Hou; Chin-Jung | Printed circuit board having protecting means |
| CN102316664A (en) * | 2010-07-02 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
| CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201722226A (en) | 2017-06-16 |
| TWI615070B (en) | 2018-02-11 |
| CN106714441A (en) | 2017-05-24 |
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Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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Effective date of registration: 20190425 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Building A1 to A3 of Pengding Park Factory Building, Songluo Road, Yanchuan Community, Yanluo Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
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