CN106714441B - Board structure of circuit and preparation method thereof - Google Patents
Board structure of circuit and preparation method thereof Download PDFInfo
- Publication number
- CN106714441B CN106714441B CN201510774334.9A CN201510774334A CN106714441B CN 106714441 B CN106714441 B CN 106714441B CN 201510774334 A CN201510774334 A CN 201510774334A CN 106714441 B CN106714441 B CN 106714441B
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit
- line
- board structure
- busbar wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (9)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510774334.9A CN106714441B (en) | 2015-11-13 | 2015-11-13 | Board structure of circuit and preparation method thereof |
TW104137872A TWI615070B (en) | 2015-11-13 | 2015-11-17 | Circuit structure and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510774334.9A CN106714441B (en) | 2015-11-13 | 2015-11-13 | Board structure of circuit and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106714441A CN106714441A (en) | 2017-05-24 |
CN106714441B true CN106714441B (en) | 2019-06-11 |
Family
ID=58922960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510774334.9A Active CN106714441B (en) | 2015-11-13 | 2015-11-13 | Board structure of circuit and preparation method thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN106714441B (en) |
TW (1) | TWI615070B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI643537B (en) * | 2018-02-07 | 2018-12-01 | 易華電子股份有限公司 | Bendable soft circuit board |
TWI750428B (en) * | 2018-11-22 | 2021-12-21 | 易鼎股份有限公司 | Conductive circuit structure including conductive resin layer |
CN110456567B (en) * | 2019-08-06 | 2020-05-08 | 深圳市利航电子有限公司 | Golden finger anti-breaking structure of backlight source |
TWI717278B (en) * | 2020-05-18 | 2021-01-21 | 景碩科技股份有限公司 | Method for making circuit board using reinforcing frame |
CN114080118B (en) * | 2020-08-12 | 2024-03-12 | 宏恒胜电子科技(淮安)有限公司 | Manufacturing method of stepped golden finger circuit board and circuit board |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5416276A (en) * | 1994-05-23 | 1995-05-16 | Hou; Chin-Jung | Printed circuit board having protecting means |
CN102316664A (en) * | 2010-07-02 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5235000B2 (en) * | 2009-07-14 | 2013-07-10 | 日本電信電話株式会社 | Flexible printed circuit board and connection method thereof |
CN103188869B (en) * | 2011-12-29 | 2016-08-03 | 上海天马微电子有限公司 | Flexible printed circuit board |
US20140069696A1 (en) * | 2012-09-11 | 2014-03-13 | Apple Inc. | Methods and apparatus for attaching multi-layer flex circuits to substrates |
CN204518208U (en) * | 2015-01-19 | 2015-07-29 | 联想(北京)有限公司 | Flexible printed circuit board and electronic equipment |
-
2015
- 2015-11-13 CN CN201510774334.9A patent/CN106714441B/en active Active
- 2015-11-17 TW TW104137872A patent/TWI615070B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5416276A (en) * | 1994-05-23 | 1995-05-16 | Hou; Chin-Jung | Printed circuit board having protecting means |
CN102316664A (en) * | 2010-07-02 | 2012-01-11 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacture method thereof |
CN104427783A (en) * | 2013-08-19 | 2015-03-18 | 宏启胜精密电子(秦皇岛)有限公司 | A flexible printed circuit board having golden fingers and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW201722226A (en) | 2017-06-16 |
TWI615070B (en) | 2018-02-11 |
CN106714441A (en) | 2017-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190425 Address after: 223065 No. 11 Honghai North Road, Huaian Economic and Technological Development Zone, Jiangsu Province Applicant after: Qing Ding precision electronic (Huaian) Co., Ltd. Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Building A1 to A3 of Pengding Park Factory Building, Songluo Road, Yanchuan Community, Yanluo Street, Baoan District, Shenzhen City, Guangdong Province Applicant before: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |