CN106459736A - 放热部材用组合物、放热部材、电子机器 - Google Patents
放热部材用组合物、放热部材、电子机器 Download PDFInfo
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- CN106459736A CN106459736A CN201580024274.7A CN201580024274A CN106459736A CN 106459736 A CN106459736 A CN 106459736A CN 201580024274 A CN201580024274 A CN 201580024274A CN 106459736 A CN106459736 A CN 106459736A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
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- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- C09K2019/0448—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit characterized by a linking chain between rings or ring systems, a bridging chain between extensive mesogenic moieties or an end chain group the end chain group being a polymerizable end group, e.g. -Sp-P or acrylate
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- C09K2219/00—Aspects relating to the form of the liquid crystal [LC] material, or by the technical area in which LC material are used
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Abstract
Description
Claims (9)
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JP2014098190 | 2014-05-09 | ||
JP2014-098190 | 2014-05-09 | ||
PCT/JP2015/063316 WO2015170744A1 (ja) | 2014-05-09 | 2015-05-08 | 放熱部材用組成物、放熱部材、電子機器 |
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EP (1) | EP3141589A4 (zh) |
JP (1) | JP6653793B2 (zh) |
KR (1) | KR20170008212A (zh) |
CN (1) | CN106459736B (zh) |
TW (1) | TWI658091B (zh) |
WO (1) | WO2015170744A1 (zh) |
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CN108779386A (zh) * | 2016-03-02 | 2018-11-09 | 捷恩智株式会社 | 放热构件用组合物、放热构件、电子机器、放热构件用组合物的制造方法、放热构件的制造方法 |
CN110785376A (zh) * | 2017-07-14 | 2020-02-11 | 富士胶片株式会社 | 表面修饰无机氮化物、组合物、导热材料及带导热层的器件 |
CN110876251A (zh) * | 2018-08-31 | 2020-03-10 | 夏普株式会社 | 热开关、热开关的制造方法、含热传导性填料的复合材料、含该复合材料的装置及显示设备 |
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KR102293461B1 (ko) * | 2017-07-14 | 2021-08-25 | 후지필름 가부시키가이샤 | 표면 수식 무기 질화물, 조성물, 열전도 재료, 열전도층 부착 디바이스 |
EP3653574B1 (en) | 2017-07-14 | 2021-01-06 | FUJIFILM Corporation | Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006265527A (ja) * | 2005-02-25 | 2006-10-05 | Chisso Corp | 放熱部材およびその製造方法 |
JP2008285671A (ja) * | 2007-04-19 | 2008-11-27 | Sumitomo Chemical Co Ltd | エポキシ樹脂組成物 |
JP2013227451A (ja) * | 2012-04-26 | 2013-11-07 | Hitachi Chemical Co Ltd | エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、及びプリント配線板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004175926A (ja) * | 2002-11-27 | 2004-06-24 | Polymatech Co Ltd | 熱伝導性エポキシ樹脂成形体及びその製造方法 |
JP2008507594A (ja) | 2004-06-15 | 2008-03-13 | シーメンス パワー ジェネレーション インコーポレイテッド | 樹脂内に配列した高熱伝導性材料 |
JP5392178B2 (ja) * | 2010-05-13 | 2014-01-22 | 日立化成株式会社 | 高熱伝導性複合粒子及びそれを用いた放熱材料 |
JP5962514B2 (ja) * | 2011-01-19 | 2016-08-03 | 日立化成株式会社 | 液晶性樹脂組成物、放熱材料前駆体、bステージシート、プリプレグ、放熱材料、積層板、金属基板、プリント配線板、液晶性樹脂組成物の製造方法、放熱材料前駆体の製造方法及び放熱材料の製造方法 |
JP6081751B2 (ja) * | 2012-09-13 | 2017-02-15 | 三菱化学株式会社 | 高熱伝導性樹脂組成物 |
-
2015
- 2015-05-08 EP EP15788695.3A patent/EP3141589A4/en not_active Withdrawn
- 2015-05-08 WO PCT/JP2015/063316 patent/WO2015170744A1/ja active Application Filing
- 2015-05-08 KR KR1020167030687A patent/KR20170008212A/ko not_active Application Discontinuation
- 2015-05-08 US US15/309,793 patent/US9938371B2/en not_active Expired - Fee Related
- 2015-05-08 JP JP2016517942A patent/JP6653793B2/ja active Active
- 2015-05-08 TW TW104114717A patent/TWI658091B/zh not_active IP Right Cessation
- 2015-05-08 CN CN201580024274.7A patent/CN106459736B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006265527A (ja) * | 2005-02-25 | 2006-10-05 | Chisso Corp | 放熱部材およびその製造方法 |
JP2008285671A (ja) * | 2007-04-19 | 2008-11-27 | Sumitomo Chemical Co Ltd | エポキシ樹脂組成物 |
JP2013227451A (ja) * | 2012-04-26 | 2013-11-07 | Hitachi Chemical Co Ltd | エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、及びプリント配線板 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108779386A (zh) * | 2016-03-02 | 2018-11-09 | 捷恩智株式会社 | 放热构件用组合物、放热构件、电子机器、放热构件用组合物的制造方法、放热构件的制造方法 |
CN110785376A (zh) * | 2017-07-14 | 2020-02-11 | 富士胶片株式会社 | 表面修饰无机氮化物、组合物、导热材料及带导热层的器件 |
CN110785376B (zh) * | 2017-07-14 | 2023-03-31 | 富士胶片株式会社 | 表面修饰无机氮化物、组合物、导热材料及带导热层的器件 |
CN111373319A (zh) * | 2017-08-10 | 2020-07-03 | 夏普株式会社 | 液晶显示装置及液晶显示装置的制造方法 |
CN111373319B (zh) * | 2017-08-10 | 2023-05-02 | 夏普株式会社 | 液晶显示装置 |
CN110876251A (zh) * | 2018-08-31 | 2020-03-10 | 夏普株式会社 | 热开关、热开关的制造方法、含热传导性填料的复合材料、含该复合材料的装置及显示设备 |
CN110876251B (zh) * | 2018-08-31 | 2021-10-01 | 夏普株式会社 | 热开关、热开关的制造方法、含热传导性填料的复合材料、含该复合材料的装置及显示设备 |
CN117328154A (zh) * | 2023-11-24 | 2024-01-02 | 烟台泰和新材高分子新材料研究院有限公司 | 一种用于连续生产液晶聚酯纤维的方法和设备 |
CN117328154B (zh) * | 2023-11-24 | 2024-03-05 | 烟台泰和新材高分子新材料研究院有限公司 | 一种用于连续生产液晶聚酯纤维的方法和设备 |
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Publication number | Publication date |
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CN106459736B (zh) | 2020-04-07 |
TWI658091B (zh) | 2019-05-01 |
EP3141589A4 (en) | 2018-05-02 |
TW201546166A (zh) | 2015-12-16 |
JPWO2015170744A1 (ja) | 2017-04-20 |
KR20170008212A (ko) | 2017-01-23 |
WO2015170744A1 (ja) | 2015-11-12 |
EP3141589A1 (en) | 2017-03-15 |
JP6653793B2 (ja) | 2020-02-26 |
US9938371B2 (en) | 2018-04-10 |
US20170137561A1 (en) | 2017-05-18 |
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