CN106102328A - A kind of printed board COB box dam manufacture method - Google Patents
A kind of printed board COB box dam manufacture method Download PDFInfo
- Publication number
- CN106102328A CN106102328A CN201610704046.0A CN201610704046A CN106102328A CN 106102328 A CN106102328 A CN 106102328A CN 201610704046 A CN201610704046 A CN 201610704046A CN 106102328 A CN106102328 A CN 106102328A
- Authority
- CN
- China
- Prior art keywords
- box dam
- substrate
- milling
- dam substrate
- depth
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of printed board COB box dam manufacture method, relates to printed board and manufactures field.This printed board COB box dam manufacture method, comprises the following steps: 1) box dam substrate is placed on operating board, use boring machine to get out hole, location in the corner of box dam substrate；2) the box dam substrate being drilled with hole, location is placed on milling machine, uses the milling cutter on milling machine to mill out inside groove on box dam substrate；3) box dam substrate need laminating the side carry out V CUT or controlled depth milling operation, the box dam housing degree of depth is milled out thickness of slab 2/1 to three/2nds the degree of depth；4) use polisher that the box dam substrate after V CUT or controlled depth milling is polished, get rid of the burr on box dam substrate.This printed board COB box dam manufacture method, the quality of production efficiently solving printed wiring board is poor, it is impossible to the problem enough meeting mass production, improve the manufacturing speed of printed wiring board, technological process is simpler, it is not necessary to separately increase equipment, quality qualification rate is high, it is simple to be widely used.
Description
Technical field
The present invention relates to printed board manufacturing technology field, be specially a kind of printed board COB box dam manufacture method.
Background technology
Printed wiring board, also known as printed circuit board (PCB), is the supplier of electronic devices and components electrical connection.Its development existing 100
History for many years, it be mainly designed to layout design.Before printed circuit board occurs, the interconnection between electronic component is all
It is dependent on electric wire to be directly connected to and form complete circuit, so the major advantage using printed wiring board is to greatly reduce wiring
With the mistake of assembling, improve Automated water gentle productive labor rate.
The surface of printed wiring board needs welding component, and some special components and parts such as lamp bead etc. need to add peripheral protection
Device, Main Function has the effect of location heat radiation focusing protection, and the general material of box dam can be metal, it is also possible to be silica gel, FR4
Deng, box dam generally has circular or square, and thickness is at 0.6-1.5mm, and box dam dam width is at 0.8-1.0mm, but needs when making at present
Being bonded together with the component side of printed board, be fitted with bigger difficulty in manufacturing process molding and bonding, traditional box dam makes
Method is after printed board is completed other Making programme, is shaped box dam, generally uses milling or punching, but due to box dam dam
The most often there is problems with in the less production of width:
1, single box dam does not position hole, and CNC milling manufacture difficulty is very big, and punching qualification rate is low；
2, laminating is that cell board making needs to be fixed by tool, and production efficiency is low；
3, needing to be coated with binding agent or resin before box dam laminating, manufacture difficulty is big.
The generation of the problems referred to above makes the quality of production of printed wiring board poor, it is impossible to enough meet mass production.
Summary of the invention
(1) solve the technical problem that
For the deficiencies in the prior art, the invention provides a kind of printed board COB box dam manufacture method, solve track
The quality of production of road plate is poor, it is impossible to the problem enough meeting mass production.
(2) technical scheme
For realizing object above, the present invention is achieved by the following technical programs: a kind of printed board COB box dam making side
Method, comprises the following steps:
1), box dam substrate is placed on operating board, uses boring machine to get out hole, location in the corner of box dam substrate；
2), the box dam substrate being drilled with hole, location is placed on milling machine, uses the milling cutter on milling machine to mill out on box dam substrate
Inside groove；
3), need the side of laminating to carry out V-CUT or controlled depth milling operation at box dam substrate, the box dam housing degree of depth is milled out
The degree of depth of 2nd/to three/2nds of thickness of slab；
4), use polisher that the box dam substrate after V-CUT or controlled depth milling is polished, get rid of draping over one's shoulders on box dam substrate
Cutting edge of a knife or a sword；
5) after, polishing burr completes, the binding face at box dam substrate uses silk-screen mode to stamp resin or hot-setting adhesive, position
Identical with box dam width shape；
6), the box dam substrate after completing pcb board and the silk-screen that main flow becomes is carried out pressing；
7) above-mentioned 3, are used) same mode carries out V-CUT or controlled depth milling operation the another side of box dam substrate, it is ensured that enclose
Dam milling is worn but is not hurt pcb board.
(3) beneficial effect
The invention provides a kind of printed board COB box dam manufacture method.Possess following beneficial effect:
1, this printed board COB box dam manufacture method, box dam is made into jigsaw by single PCS and makes, and jigsaw first passes through brill when making
Hole machine drill takes hole, location, re-uses milling plate and box dam substrate is operated by V-CUT technique, be effectively increased manufacturing speed, system
Making efficiency high, qualification rate is high.
2, this printed board COB box dam manufacture method, need not when box dam is fitted use tool, uses big plate pressing work
Skill, flow process simple and fast, accelerate production efficiency, save the time.
3, this printed board COB box dam manufacture method, fixing binding agent or resin use half tone silk-screen, it is not necessary to individually coat
Binding agent or resin, reduce the operation easier of operator, decreases the operational ton of operator, time saving and energy saving.
In sum, this printed board COB box dam manufacture method, the quality of production efficiently solving printed wiring board is poor, no
The problem that disclosure satisfy that mass production, improves the manufacturing speed of printed wiring board, and technological process is simpler, it is not necessary to another increasing sets
Standby, quality qualification rate is high, it is simple to be widely used.
Detailed description of the invention
Below the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment
It is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
The every other embodiment that art personnel are obtained under not making creative work premise, broadly falls into the model of present invention protection
Enclose.
The embodiment of the present invention provides a kind of printed board COB box dam manufacture method, comprises the following steps:
1), box dam substrate is placed on operating board, uses boring machine to get out hole, location in the corner of box dam substrate.
2), the box dam substrate being drilled with hole, location is placed on milling machine, uses the milling cutter on milling machine to mill out on box dam substrate
Inside groove.
3), need the side of laminating to carry out V-CUT or controlled depth milling operation at box dam substrate, the box dam housing degree of depth is milled out
The degree of depth of 2nd/to three/2nds of thickness of slab.
V-CUT i.e. operates with V-CUT cutter, and V-CUT cutter, as electron trade cutter, has another name called pcb board V-CUT miniature carving
Cutter, VCUT cutter, miniature carving cutter, also have and be the V hole title such as cutter or V groove cutter it, be mainly used in above PCB V-CUT machine
Polynary wiring board is carried out the carbide tool of V-CUT operation.
Controlled depth milling refer to printed wiring board when shape fabricating on its position specified by controlling the cutter degree of depth under CNC,
Mill out the dovetail groove meeting assembling demand, make printed wiring board install during can by plug-in type card on equipment,
Play fixing effect, it is ensured that saved space while not reducing sheet metal thickness, and printed wiring board and equipment can be made
Connect more stable.
When manufactured box dam is square box dam, uses V-CUT that box dam substrate is carried out one side V-CUT, box dam is needed
That face of fitting carries out V anyhow and cuts, and V cuts the degree of depth at 2nd/1 to three/2nds of thickness of slab.
When manufactured box dam is circular box dam, use controlled depth milling that the one side of box dam baseplate-laminating is operated, ladder
The degree of depth of shape groove is 2nd/1 to three/2nds of thickness of slab.
4), use polisher that the box dam substrate after V-CUT or controlled depth milling is polished, get rid of draping over one's shoulders on box dam substrate
Cutting edge of a knife or a sword.
Burr is the quality term of plastic cement industry, refers to the nonuseable part that product edge position has more, because the part having more
Generally hinder a little hands, so with cutting edge of a knife or a sword.Being also referred to as burr in plastic cement industry, overlap, overflow edge is burr.Generally arise from mould typing
On face, being due to material flowability, mould structure defect, moulding process is inappropriate to be caused.
Box dam is made into jigsaw by single PCS and makes, and jigsaw first passes through boring machine and drills through hole, location when making, re-use milling plate and
Box dam substrate is operated by V-CUT technique, is effectively increased manufacturing speed, and make efficiency is high, and qualification rate is high.
5) after, polishing burr completes, the binding face at box dam substrate uses silk-screen mode to stamp resin or hot-setting adhesive, position
Identical with box dam width shape.
Fixing binding agent or resin use half tone silk-screen, it is not necessary to individually coated with adhesive or resin, reduce operator
The operation easier of member, decreases the operational ton of operator, time saving and energy saving.
6), the box dam substrate after completing pcb board and the silk-screen that main flow becomes is carried out pressing, need not when box dam fit transport
With tool, use big plate process for pressing, flow process simple and fast, accelerate production efficiency, save the time.
7) above-mentioned 3, are used) same mode carries out V-CUT or controlled depth milling operation the another side of box dam substrate, it is ensured that enclose
Dam milling is worn but is not hurt pcb board.
In sum, this printed board COB box dam manufacture method, the quality of production efficiently solving printed wiring board is poor, no
The problem that disclosure satisfy that mass production, improves the manufacturing speed of printed wiring board, and technological process is simpler, it is not necessary to another increasing sets
Standby, quality qualification rate is high, it is simple to be widely used.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, permissible
Understand and these embodiments can be carried out multiple change without departing from the principles and spirit of the present invention, revise, replace
And modification, the scope of the present invention be defined by the appended.
Claims (1)
1. a printed board COB box dam manufacture method, it is characterised in that comprise the following steps:
1), box dam substrate is placed on operating board, uses boring machine to get out hole, location in the corner of box dam substrate；
2), the box dam substrate being drilled with hole, location is placed on milling machine, uses the milling cutter on milling machine to mill out inside groove on box dam substrate；
3), need the side of laminating to carry out V-CUT or controlled depth milling operation at box dam substrate, the box dam housing degree of depth is milled out thickness of slab
2/1 to three/2nds the degree of depth；
4), use polisher that the box dam substrate after V-CUT or controlled depth milling is polished, get rid of the burr on box dam substrate；
5), polishing burr use silk-screen mode to stamp resin or hot-setting adhesive at the binding face of box dam substrate after completing, position with enclose
Dam width shape is identical；
6), the box dam substrate after completing pcb board and the silk-screen that main flow becomes is carried out pressing；
7) above-mentioned 3, are used) same mode carries out V-CUT or controlled depth milling operation the another side of box dam substrate, it is ensured that enclose
Dam milling is worn but is not hurt pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610704046.0A CN106102328B (en) | 2016-08-22 | 2016-08-22 | A kind of printed board COB box dam production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610704046.0A CN106102328B (en) | 2016-08-22 | 2016-08-22 | A kind of printed board COB box dam production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106102328A true CN106102328A (en) | 2016-11-09 |
| CN106102328B CN106102328B (en) | 2019-03-12 |
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ID=57224700
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610704046.0A Active CN106102328B (en) | 2016-08-22 | 2016-08-22 | A kind of printed board COB box dam production method |
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| Country | Link |
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| CN (1) | CN106102328B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366318A (en) * | 2019-07-16 | 2019-10-22 | 深圳市星河电路股份有限公司 | It is a kind of reduce V-CUT line to wire spacing processing technology |
| CN111182728A (en) * | 2020-01-22 | 2020-05-19 | 惠州中京电子科技有限公司 | Manufacturing method of printed circuit board with metal substrate of aluminum dam |
| CN111477733A (en) * | 2020-04-26 | 2020-07-31 | 深圳市环基实业有限公司 | Chip packaging method |
| CN116981182A (en) * | 2018-04-04 | 2023-10-31 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
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| US20070137886A1 (en) * | 2005-12-21 | 2007-06-21 | Chen-Hsiang Yen | Method for partial replacement of a circuit board |
| CN202678408U (en) * | 2012-06-01 | 2013-01-16 | 深圳市华高光电科技有限公司 | LED dam structure of COB |
| CN104681691A (en) * | 2014-11-14 | 2015-06-03 | 易美芯光（北京）科技有限公司 | Low-light attenuation flip chip-packaging LED (light-emitting diode) integrated light source structure and preparation method thereof |
-
2016
- 2016-08-22 CN CN201610704046.0A patent/CN106102328B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070137886A1 (en) * | 2005-12-21 | 2007-06-21 | Chen-Hsiang Yen | Method for partial replacement of a circuit board |
| CN202678408U (en) * | 2012-06-01 | 2013-01-16 | 深圳市华高光电科技有限公司 | LED dam structure of COB |
| CN104681691A (en) * | 2014-11-14 | 2015-06-03 | 易美芯光（北京）科技有限公司 | Low-light attenuation flip chip-packaging LED (light-emitting diode) integrated light source structure and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116981182A (en) * | 2018-04-04 | 2023-10-31 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN116981182B (en) * | 2018-04-04 | 2024-05-21 | 苏州康尼格电子科技股份有限公司 | PCBA (printed circuit board assembly) board packaging equipment and PCBA board packaging method |
| CN110366318A (en) * | 2019-07-16 | 2019-10-22 | 深圳市星河电路股份有限公司 | It is a kind of reduce V-CUT line to wire spacing processing technology |
| CN110366318B (en) * | 2019-07-16 | 2021-05-11 | 深圳市星河电路股份有限公司 | Processing technology for reducing distance from V-CUT line to lead |
| CN111182728A (en) * | 2020-01-22 | 2020-05-19 | 惠州中京电子科技有限公司 | Manufacturing method of printed circuit board with metal substrate of aluminum dam |
| CN111477733A (en) * | 2020-04-26 | 2020-07-31 | 深圳市环基实业有限公司 | Chip packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106102328B (en) | 2019-03-12 |
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