CN1056464C - Vacuum load switch contact material and its mfg. method - Google Patents
Vacuum load switch contact material and its mfg. method Download PDFInfo
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- CN1056464C CN1056464C CN97111717A CN97111717A CN1056464C CN 1056464 C CN1056464 C CN 1056464C CN 97111717 A CN97111717 A CN 97111717A CN 97111717 A CN97111717 A CN 97111717A CN 1056464 C CN1056464 C CN 1056464C
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Abstract
The present invention belongs to the field of vacuum switch contact material which is suitable for vacuum load switches. The contact material is composed of 85 to 93% of tungsten and 7 to 15% of copper or copper alloy. The manufacturing method of the contact material comprises material preparation, isostatic cool pressing, compression moulding forming into a tungsten powder blank, presintering and sintering the blank into a tungsten skeleton, and finally diffusing copper or copper alloy in the tungsten skeleton to obtain the contact material. The material has the advantages of excellent ablation and fusion welding resistance, low chopping current, low contact resistance and long service life.
Description
The invention belongs to the contact material of vacuum switch field.Mainly be applicable to vacuum load switch.
Vacuum switch is widely used in each industrial department because of its series of advantages, has become the main developing direction of mesohigh device for switching.And to the primary condition of Contact Material for Vacuum Switchgear be that requirement refractory weldering characteristic is good, proof voltage intensity height, cut-off current that current breaking capacity is big and low, and low and stable temperature rise, promptly low and stable resistance and contact resistance.
Vacuum load switch comprises vacuum circuit-breaker, vacuum contactor and vacuum load switch, and dissimilar vacuum switches has different requirements to contact material.Vacuum circuit-breaker requires to have high compressive resistance, big short circuit current connecting-disconnecting function, but its number of operations is less.The described material for Cu-Cr-Fe vacuum contact finger of Chinese patent ZL90108738.6 adapts to this requirement very much; In addition, vacuum contactor then needs frequent operation, requires shut off value low, and proof voltage is less demanding, need not to cut-off short circuit current, and Chang Gui W-Cu-Al-Te and Cu-WC contact material just can adapt to its requirement well for this reason; And the vacuum load switch short circuit current is big, operates also frequently, to its contact material, has both required to have the good operation current breaking capacity, requires to have certain short circuit current connecting-disconnecting function again, and dynamic and thermal stability and low shut off value.Conventional Cu-Cr contact materials, WCuAlTe material, Cu-WC material do not satisfy instructions for use all because of arc resistant ablation property difference etc.In traditional WCu material, copper content is higher, general 20～40%, tungsten particle can not form continuous skeleton in this material, and under arcing, the fusing of copper is splashed seriously, the arc resistant ablation property is poor, and this class material is generally without high-temperature process, and gas content height (reaching about 150PPm) is so can not be used for vacuum load switch.(" High-Voltage Electrical Appliances " Vol.29, NO.3,1993.P27-27; " Proc.XVthIn t.Symp.ON DEIV " 1992, P273-278).
The object of the present invention is to provide a kind of contact material that is applicable to that vacuum load switch needs, i.e. vacuum load switch contact material and manufacture method thereof.This contact material is anti-ablative good with resistance fusion welding, the dielectric strength height, and shut off value is low, and gas content is low, has certain short circuit current ability of cut-offfing, and can satisfy the requirement of vacuum load switch well.At above-mentioned purpose, vacuum load switch contact material of the present invention is made by the tungsten copper infiltrated alloy.
The percentage by weight of tungsten copper infiltrated alloy chemical composition is:
W85～93%, copper or copper alloy 7～15%,
Wherein the percentage by weight of copper alloy chemistry composition is:
Cu90～99.9%, any or any two above sum 0.1～10% among Bi, Te, Sb, Pb, Se, the Sn.
Tungsten of the present invention is a kind of refractory metal element, has the good high-temperature performance, tungsten powder tungsten particle behind high temperature sintering is coupled to the W skeleton (seeing accompanying drawing 1) that has than high bond strength, and a spot of copper is uniformly distributed in and (sees accompanying drawing 2) in the W skeleton, thereby guarantee that contact has characteristics such as good anti-ablation, anti-melting welding, high pressure resistant and low shut off value, can adapt to the requirement of vacuum load switch fully.
The manufacture method of vacuum load switch contact material of the present invention, comprise get the raw materials ready, press forming, the presintering of tungsten powder blank, sintering and ooze copper process, existing division is as follows:
One, gets the raw materials ready
Tungsten, copper or copper alloy raw material all adopt Powdered, wherein, and granularity requirements 1～10 μ m of tungsten powder, and according to chemical composition proportioning is got the raw materials ready.
Two, press forming
Press forming has two kinds of methods: the one, and cold isostatic compaction; The one, mechanical die forming,
(1) cold isostatic compaction is packed tungsten powder in the soft mode cover into, and puts into and be pressed into the tungsten powder blank in the cold isostatic press, and its forming pressure is 100～200MPa.
(2) mechanical die forming is pressed into the tungsten powder blank with tungsten powder on the mould of hydraulic press or punching machine, and it is 60～150MPa that institute exerts pressure,
When adopting mechanical die forming, need in tungsten powder, add binder, add binder percentage by weight be 0.1～4.0%, its binder be in alcohol, acetone, glycerine, polyvinyl alcohol, oleic acid, paraffin wax, rubber, the stearate any.
Binder is when getting the raw materials ready, and adds in the tungsten powder.The purpose that adds binder is in order to improve the forming property of tungsten material base material.
(3) the tungsten powder blank presintering of mechanical die forming
The tungsten powder blank of machinery die forming needs through presintering, and presintering divides two stages to carry out:
Phase I presintering: 400～800 ℃ of temperature, 2～6 hours time;
Second stage presintering: 1000～1300 ℃ of temperature, 0.5～3.0 hour time.
Above-mentioned phase I presintering purpose is in order fully to remove binder; The purpose of second stage presintering is in order further to improve the intensity of tungsten powder blank.
Through the tungsten powder blank of cold isostatic compaction, need not to carry out presintering, can directly carry out sintering.
(4) tungsten powder blank sintering
Place sintering furnace hydrogen shield or vacuum to carry out sintering with the tungsten powder blank of cold isostatic compaction with through the tungsten powder blank of the mechanical die forming of presintering, sintering temperature is 1800～2400 ℃, and sintering time is 1～5 hour;
The tungsten powder blank can be removed impurity effectively behind sintering under high-temperature hydrogen protection or the vacuum, improve material purity, has reduced gas content, its gas and be mingled with low 5～10 times of the general contact material of content, and total amount is less than 10PPm.
In addition,, the purity of W skeleton is improved, guarantee carrying out smoothly of infiltration, make this contact material more even, fine and close through high-temperature hydrogen protection sintering.
The tungsten powder blank promptly becomes the W skeleton with higher-strength behind sintering.
(5) W skeleton oozes copper
W skeleton put into ooze the copper stove and ooze copper or copper alloy, oozing the copper temperature is 1150～1300 ℃, oozes 0.5～3.5 hour copper time, oozes the copper process and carries out under hydrogen atmosphere or vacuum.
W skeleton promptly becomes vacuum load switch contact material goods of the present invention after oozing copper or copper alloy.This material homogeneity is good, no hole, relative density reaches more than 99.0%, and the height of anti-intensity, anti-ablate and the resistance fusion welding energy good, shut off value is low, the conductance height, as copper content be 10% o'clock conductance greater than 20m/mm2, be specially adapted to make the vacuum load switch contact.
Compared with prior art, the present invention has following advantage:
(1) anti-ablative good with resistance fusion welding.Because the present invention has reduced the copper content in the existing tungsten copper contact material, make tungsten particle form continuous W skeleton with higher-strength, low melting-point coper or copper alloy fix in the capillary of W skeleton, reduced the splash of the low melting point phase under the electric arc, improve the anti-galvano-cautery performance of contact widely, thereby guaranteed the anti-ablation of contact, the characteristic of anti-melting welding.
(2) shut off value is low.Because W skeleton forms network, has stoped the energy loss under the little arc current, improve the evaporation capacity of copper or copper alloy phase, when cut-offfing little electric current, can provide enough metal vaporss, stablizing of pilot arc reduces shut off value.Add a small amount of low melting point constituent element in the copper alloy that is oozed, help further to reduce shut off value.
(3) compressive resistance height, contact resistance is little.Contact material of the present invention, hardness is moderate, Brinell hardness HB is 220～260, just in time satisfied the requirement of on-load switch, moderate hardness number, both guarantee withstand voltage requirement, and avoided too high spring that causes of hardness and contact resistance to raise again, improved the rated operational current and the dynamic thermal stability of vacuum switch greatly.
(4) purity height, impurity content is low, insulate after helping improving arc, thereby improves connecting-disconnecting function and vacuum load switch tube lifetime.Through high-temperature hydrogen protection sintering, can remove impurity and gas effectively, improve material purity.
(5) good uniformity, no hole, relative density reaches more than 99.0%, helps improving the combination property of material.
Now the invention will be further described in conjunction with the accompanying drawings.
Accompanying drawing 1 is the shape appearance figure of W skeleton in the vacuum load switch contact material of the present invention.
Accompanying drawing 2 is the micro-organization chart of vacuum load switch contact material of the present invention.
Accompanying drawing 3 is the micro-organization chart of conventional tungsten copper contact material.
By finding out among above-mentioned Fig. 1,2, W skeleton of the present invention is the higher continuous skeleton of intensity, and copper or copper alloy are scattered among the W skeleton equably, and this structural state guarantees that contact material has good anti-ablation, resistance fusion welding energy and low shut off value. And the microscopic structure of the conventional tungsten copper contact material of accompanying drawing 3 is discrete state, and under the arcing, the fusing of copper is splashed seriously, and arc resistant is ablative poor.
Embodiment
According to the chemical composition and the manufacture method of vacuum load switch contact material of the present invention, prepared five batches of contact materials, five batch of materials are after getting the raw materials ready, through cold isostatic compaction or die forming.The chemical composition of five batch of materials is as shown in table 1.Its granularity and molding condition are as shown in table 2.The tungsten powder blank of cold isostatic compaction directly carries out sintering and oozes copper; Tungsten powder blank for die forming then needs to carry out sintering again and ooze copper after the presintering in first, second stage.The process conditions that table 3 has been listed presintering, sintering, oozed copper.
After oozing copper, promptly become vacuum load switch contact material product of the present invention.And final contact material product carried out Performance Detection, its result lists table 4 in.Find out by table 4, contact material density of the present invention and conductance height, hardness is moderate, and oxygen and hydrogen content are low.
The chemical composition of table 1 embodiment contact material
Table 2 embodiment tungsten powder particle-size, molding condition and size of formed part
The presintering of table 3 embodiment contact material, sintering and ooze the process for copper parameter
Annotate: presintering, sintering all carry out under hydrogen shield.
| Lot number | Chemical composition (weight %) | |||||||
| W | Cu | Bi | Te | Sb | Pb | Se | Sn | |
| 1 | 85.0 | 14.8 | 0.2 | |||||
| 1 | 89.6 | 10.4 | ||||||
| 1 | 87.2 | 12.5 | 0.5 | 0.3 | ||||
| 1 | 89.5 | 9.5 | 0.9 | |||||
| 1 | 88.0 | 11.1 | 0.3 | 0.2 | 0.4 | |||
| Lot number | Manufacturing process | Tungsten powder particle-size μ m | Blank | Binder kind and content (weight %) | Forming pressure MPa | |
| Shape | Size mm | |||||
| 1 | Isostatic cool pressing | 7.8 | The garden is bar-shaped | φ30×300 | 200 | |
| 2 | Isostatic cool pressing | 4.3 | Sheet | φ30×7.5 | 100 | |
| 3 | Mold pressing | 5.0 | Sheet | φ27×6.0 | Paraffin 0.5% | 70 |
| 4 | Mold pressing | 6.5 | Sheet | φ34×7.5 | Glycerine 1% | 120 |
| 5 | Mold pressing | 2.8 | Sheet | φ36×7.0 | Zinc stearate 2% | 100 |
| Lot number | Presintering | Sintering | Ooze copper | ||||||
| Phase I | Second stage | Temperature ℃ | Time hour | Temperature ℃ | Time hour | Atmosphere | |||
| Temperature ℃ | Time hour | Temperature ℃ | Time hour | ||||||
| 1 | 2250 | 3.5 | 1300 | 1.0 | Hydrogen | ||||
| 2 | 1950 | 4.0 | 1250 | 2.0 | | ||||
| 3 | 600 | 3.0 | 1150 | 1.5 | 2000 | 3.5 | 1200 | 2.5 | Hydrogen |
| 4 | 450 | 2.0 | 1200 | 2.0 | 2100 | 4.0 | 1320 | 2.0 | Hydrogen |
| 5 | 700 | 4.0 | 1100 | 1.0 | 1850 | 3.0 | 1280 | 3.0 | Vacuum |
The The performance test results of table 4 embodiment contact material
| Lot number | Density g/cm 3 | Relative density % | Conductance μ S/m | Hardness HB | Gas content PPm | |
| Oxygen | Nitrogen | |||||
| 1 | 16.30 | 99.5 | 25.0 | 228 | 11 | 1 |
| 2 | 17.13 | 99.4 | 21.0 | 240 | 10 | 1 |
| 3 | 16.68 | 99.1 | 20.0 | 236 | 12 | 2 |
| 4 | 17.30 | 99.3 | 18.0 | 259 | 13 | 3 |
| 5 | 17.08 | 99.6 | 17.0 | 250 | 10 | 2 |
Claims (2)
1, a kind of vacuum load switch contact material is made by the tungsten copper infiltrated alloy, it is characterized in that the percentage by weight of tungsten copper infiltrated alloy chemical composition is:
W85～93%, copper or copper alloy 7～15%,
Wherein the percentage by weight of copper alloy chemistry composition is:
Cu90～99.9%; Any or any two above sum is 0.1～10% among Bi, Te, Sb, Pb, Se, the Sn.
2, the manufacture method of the described vacuum load switch contact material of a kind of claim 1 is characterized in that this method comprises following operation:
A. get the raw materials ready
Tungsten, copper or copper alloy raw material all adopt Powdered, wherein, and granularity requirements 1～10 μ m of tungsten powder, and according to chemical composition proportioning is got the raw materials ready;
B. press forming
Press forming has two kinds of methods: the one, and cold isostatic compaction; The one, mechanical die forming,
Cold isostatic compaction is packed tungsten powder in the soft mode cover, and puts into and be pressed into the tungsten powder blank in the cold isostatic press, and its forming pressure is 100～200MPa;
The machinery die forming is pressed into the tungsten powder blank with tungsten powder on the mould of hydraulic press or punching machine, it is 60～150MPa that institute exerts pressure;
When adopting mechanical die forming, need in tungsten powder, add binder, add binder percentage by weight be 0.1～4.0%, its binder be in alcohol, acetone, glycerine, polyvinyl alcohol, oleic acid, paraffin wax, rubber, the stearate any;
C. the presintering of mechanical die forming tungsten powder blank
Machinery die forming tungsten powder blank needs through presintering, and presintering divides two stages to carry out:
Phase I presintering: 400～800 ℃ of temperature, 2～6 hours time;
Second stage presintering: 1000～1300 ℃ of temperature, 0.5～3.0 hour time;
D. tungsten powder blank sintering
Place the sintering furnace under hydrogen shield or the vacuum to carry out sintering with the tungsten powder blank of cold isostatic compaction with through the mechanical die forming tungsten powder blank of presintering, sintering temperature is 1800～2400 ℃, and sintering time is 1～5 hour;
E. W skeleton oozes copper
W skeleton put into ooze the copper stove and ooze copper or copper alloy, oozing the copper temperature is 1150～1300 ℃, oozes 0.5～3.5 hour copper time, oozes the copper process and carries out under hydrogen atmosphere or vacuum.
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| Application Number | Priority Date | Filing Date | Title |
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| CN97111717A CN1056464C (en) | 1997-05-05 | 1997-05-05 | Vacuum load switch contact material and its mfg. method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97111717A CN1056464C (en) | 1997-05-05 | 1997-05-05 | Vacuum load switch contact material and its mfg. method |
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| CN1167992A CN1167992A (en) | 1997-12-17 |
| CN1056464C true CN1056464C (en) | 2000-09-13 |
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| CN97111717A Expired - Fee Related CN1056464C (en) | 1997-05-05 | 1997-05-05 | Vacuum load switch contact material and its mfg. method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327027C (en) * | 2005-02-03 | 2007-07-18 | 西安建筑科技大学 | Preparation technology of tungsten copper or tungsten silver composite material |
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| CN100338251C (en) * | 2004-05-11 | 2007-09-19 | 高殿斌 | Method for producing products of tungsten, molybdenum and alloy |
| CN101699591B (en) * | 2009-10-30 | 2012-01-11 | 西安福莱电工合金有限公司 | Integrated contact of copper-tungsten contact part /copper or copper alloy conductive rod and preparation method thereof |
| CN102162055B (en) * | 2011-04-08 | 2012-08-22 | 福州博力达机电有限公司 | Method for preparing a tungsten-copper composite material with high arc ablation resistance |
| CN102225434A (en) * | 2011-04-13 | 2011-10-26 | 陕西理工机电科技有限公司 | Method for preparing tungsten copper alloy wire materials by using hot-swage technology |
| CN102779681B (en) * | 2012-08-03 | 2015-04-15 | 库柏(宁波)电气有限公司 | Method for operating vacuum circuit breaker |
| CN105364075B (en) * | 2014-08-29 | 2018-10-02 | 优美科管理（上海）有限公司 | A kind of manufacturing method of strip fine grain copper tungsten contact |
| CN104561625A (en) * | 2014-12-11 | 2015-04-29 | 陕西斯瑞工业有限责任公司 | Method for preparing copper-tungsten composite with high electric erosive resistance by virtue of microwave sintering |
| CN105441764A (en) * | 2015-12-29 | 2016-03-30 | 常熟市良益金属材料有限公司 | Tungsten-based high-density alloy |
| CN108893642A (en) * | 2018-06-25 | 2018-11-27 | 浙江立泰复合材料股份有限公司 | A kind of preparation method of contact material of vacuum switch |
| CN109371356A (en) * | 2018-12-14 | 2019-02-22 | 北京九土科技有限公司 | A kind of infiltration copper product seeping process for copper and its preparation and application |
| CN110408811B (en) * | 2019-07-18 | 2021-04-06 | 西安理工大学 | Method for strengthening CuW alloy by in-situ autogenous tungsten boride |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1062928A (en) * | 1990-12-28 | 1992-07-22 | 中南工业大学 | The metallurgical contact alloy of tungsten-copper-silver-nickel by powder |
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1997
- 1997-05-05 CN CN97111717A patent/CN1056464C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1062928A (en) * | 1990-12-28 | 1992-07-22 | 中南工业大学 | The metallurgical contact alloy of tungsten-copper-silver-nickel by powder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327027C (en) * | 2005-02-03 | 2007-07-18 | 西安建筑科技大学 | Preparation technology of tungsten copper or tungsten silver composite material |
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| CN1167992A (en) | 1997-12-17 |
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