CN105301473B - Electronic component conveying device and electronic component inspection device - Google Patents
Electronic component conveying device and electronic component inspection device Download PDFInfo
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- CN105301473B CN105301473B CN201510142209.6A CN201510142209A CN105301473B CN 105301473 B CN105301473 B CN 105301473B CN 201510142209 A CN201510142209 A CN 201510142209A CN 105301473 B CN105301473 B CN 105301473B
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- pattern
- cooling
- heating element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Control Of Temperature (AREA)
Abstract
The present invention provides electronic component conveying device and electronic component inspection device.Electronic component conveying device possesses：Heating element is cooled down, it can configure electronic unit, and at least one in being cooled down or being heated；And operation portion, it can make choice between stopping the cooling of the first pattern of cooling of the cooling heating element and the stopping cooling heating element and heating second pattern for cooling down heating element.Additionally, it is preferred that the cooling heating element has at least one party of the configuration section of the trucking department for carrying the electronic unit and the configuration electronic unit.
Description
Technical field
The present invention relates to electronic component conveying device and electronic component inspection device.
Background technology
In the past, for example, be known to the electrical characteristic of the electronic units such as IC devices is checked electronic unit inspection dress
Put, the electronic unit that the maintaining part for IC devices to be carried to inspection portion is provided with the electronic component inspection device carries dress
Put.When carrying out the inspection of IC devices, IC devices are configured at maintaining part, and make the multiple probes and IC devices for being arranged at maintaining part
Each termination contact of part.
There is a situation where IC devices being cooled to set point of temperature to carry out the inspection of such IC devices.In this case,
IC devices are cooled down by being cooled down to the arrangement components for configuring IC devices, and not produce condensation, freeze (freezing)
Mode reduces the humidity (humidity in device) of the surrounding atmosphere of above-mentioned arrangement components.
In addition, in electronic component conveying device, in action, such as situation, the arrangement components generation of casey are being produced
Condensation, freeze in the case of etc., it is necessary to temporarily cease the action of electronic component conveying device eliminate casey or remove condensation,
Freeze.In the case where producing casey, condensation, icing etc., operator presses defined operation button, temporarily ceases electronic unit
The action of handling device, and operation as defined in progress.
In existing electronic component conveying device, if pressing aforesaid operations button, stopping action, and carry out following
Processing.
First, electronic component conveying device stops the cooling of arrangement components, and is initially configured the heating of component, and standby
Untill room temperature is changed into.Thus, in the case where arrangement components produce condensation, freeze, it is removed.Then, electronic unit
Handling device after internal oxygen concentration becomes enough concentration, opens door lock standby.Operator opens door, and is producing
Raw condensation, in the case of freezing, confirm that above-mentioned condensation, icing are removed.In addition, operator makes in the case where producing casey
IC devices are moved to appropriate position.
For operator, if the end of job, action start button is pressed.Carry and fill accordingly, for electronic unit
For putting, if stop arrangement components heating and the standby stipulated time and inside humidity fully reduce, begin to configure
The cooling of component.Moreover, electronic component conveying device it is standby until arrangement components temperature fully reduce after, start (again
Start) action.
Patent document 1：Japanese Unexamined Patent Publication 11-111802 publications
However, in existing electronic component conveying device, if above-mentioned defined operation button is pressed, no matter eliminating
In the case that the situation of casey still removes condensation, icing, the temperature of arrangement components is set to be back to room temperature without exception.Tied removing
, it is necessary to make the temperature of arrangement components be back to room temperature in the case of dew, icing, but in the case where eliminating casey, it is not necessary to
The temperature of arrangement components is set to be back to room temperature.Therefore, in existing electronic component conveying device, the situation of casey is being eliminated
It is lower, it is necessary to spend the original unwanted temperature for making arrangement components be back to room temperature untill time, in addition, in the end of job
Afterwards, it is necessary to which the temperature of arrangement components is cooled to set point of temperature by longer time.
In addition, in patent document 1, describe in the case of being automatically stopped with substrate board treatment in automatic operating
Automatically what is operated restarts relevant content, but can not be solved the problems, such as in the patent document 1 above-mentioned existing.
The content of the invention
It is an object of the invention to provide in the case of operation as defined in progress, can shorten from one side to cool down the ministry of electronics industry
The electronic component conveying device and electricity of time of the state of part one side execution action untill stopping is acted, restarted
Subassembly check device.
The present invention is at least a portion in order to solve above-mentioned problem and proposes, its can as following mode or
Person application examples is realized.
Application examples 1
The electronic component conveying device of the present invention is characterized in that possessing：Heating element is cooled down, it can configure the ministry of electronics industry
Part, and any one at least cooling down or heating can be carried out；And operation portion, it can stop above-mentioned cooling heating part
First pattern of the cooling of part and the cooling of the above-mentioned cooling heating element of stopping simultaneously heating above-mentioned cooling heating element
Made choice between second pattern.
Thus, temporarily ceasing while to cooling down the electronic component conveying device of execution action when heating element is cooling down
Action, such as carry out in the case of eliminating removing of the operation of casey, condensation or icing etc., if situation for eliminating casey etc. no
Situation about heating is needed, then by selecting the first pattern, cooling heating element is cooled down so as to shorten from side
Time of the state of side execution action untill stopping acts, carries out operation and restarts.
Application examples 2
In the electronic component conveying device of the present invention, it is preferable that above-mentioned cooling heating element, which has, carries the above-mentioned ministry of electronics industry
At least one party in the trucking department of part and the configuration section of the above-mentioned electronic unit of configuration.
Thus, in trucking department, configuration section, such as eliminate the removing of the operation of casey, condensation or icing etc.
In situation, situation about need not be heated if the situation etc. for eliminating casey, then by selecting the first pattern, so as to contract
The state of short execution action while trucking department, configuration section is being cooled down is untill stopping acts, carries out operation and restarts
Time.
Application examples 3
In the electronic component conveying device of the present invention, it is preferable that position as defined in not being configured in above-mentioned electronic unit
In the case of select above-mentioned first pattern.
Thus, as defined in not being configured in electronic unit in the case of position, when being configured at rule into being about to the electronic unit
During the operation of fixed position, the state that can shorten from the execution action when being cooled down to cooling heating element is moved to stopping
Make, carry out operation and the time untill restarting.
Application examples 4
In the electronic component conveying device of the present invention, it is preferable that to being configured in above-mentioned electronic component conveying device
The component in portion selects above-mentioned first pattern in the case of being adjusted.
Thus, in the case where the component of the inside to being configured at electronic component conveying device is adjusted, can shorten
From the state of the execution action when being cooled down to cooling heating element to stopping action, carry out operation and restart
Untill time.
Application examples 5
In the electronic component conveying device of the present invention, it is preferable that in the feelings that above-mentioned cooling heating element condenses or freezes
Above-mentioned second pattern is selected under condition.
Thus, by selecting the second pattern, condensation can be removed, frozen.
Application examples 6
In the electronic component conveying device of the present invention, it is preferable that in above-mentioned second pattern, heated in above-mentioned cooling
Component heats the energy of above-mentioned cooling heating element in the case of freezing, than adding in the case of above-mentioned cooling heating element condensation
The energy of the above-mentioned cooling heating element of heat is big.
Thereby, it is possible to efficiently remove condensation with freezing.
Application examples 7
In the electronic component conveying device of the present invention, it is preferable that there is touch panel to pass through the touch surface in aforesaid operations portion
Plate and display for selecting above-mentioned first pattern and above-mentioned second pattern and above-mentioned for selecting can be carried out
The input of first pattern and above-mentioned second pattern.
Thereby, it is possible to be readily selected the first pattern and the second pattern.
Application examples 8
In the electronic component conveying device of the present invention, it is preferable that aforesaid operations portion has：Display unit, it can be used
In the display for selecting above-mentioned first pattern and above-mentioned second pattern；And input unit, it can carry out being used to select
Select the input of above-mentioned first pattern and above-mentioned second pattern.
Thereby, it is possible to be readily selected the first pattern and the second pattern.
Application examples 9
In the electronic component conveying device of the present invention, it is preferable that for selecting the display location of above-mentioned first pattern
Than the display location for selecting above-mentioned second pattern more by above vertical.
Thereby, it is possible to easily and promptly select the first high pattern of usage frequency.
Application examples 10
The electronic component inspection device of the present invention is characterized in that possessing：Heating element is cooled down, it can configure the ministry of electronics industry
Part, and any one at least cooling down or heating can be carried out；Operation portion, it can stop above-mentioned cooling heating element
First pattern of cooling and the cooling of the above-mentioned cooling heating element of stopping simultaneously heating the second of above-mentioned cooling heating element
Made choice between pattern；And inspection portion, it checks above-mentioned electronic unit.
Thus, temporarily ceasing while to cooling down the electronic component inspection device of execution action when heating element is cooling down
Action, such as carry out in the case of eliminating removing of the operation of casey, condensation or icing etc., when to eliminate situation of casey etc. no
When needing situation about heating, the first pattern is selected, is held so as to shorten from when being cooled down to cooling heating element
Time of the state made of taking action untill stopping acts, carries out operation and restarts.
Application examples 11
In the electronic component inspection device of the present invention, it is preferable that above-mentioned cooling heating element, which has, carries the above-mentioned ministry of electronics industry
The trucking department of part, the configuration section of the above-mentioned electronic unit of configuration, keep above-mentioned in the case where checking above-mentioned electronic unit
The maintaining part of electronic unit and make at least one in the abutting part that above-mentioned electronic unit abuts with above-mentioned maintaining part.
Thus, in trucking department, configuration section, maintaining part, abutting part, for example, carry out eliminate casey operation, condensation or
In the case of removing of icing etc., when to eliminate the situation of casey when situation about need not heat, the first pattern is selected,
So as to shorten from while cool down trucking department, configuration section, maintaining part, abutting part while execution action state to stopping action, into
Row operation and the time untill restarting.
Brief description of the drawings
Fig. 1 is the approximate vertical view for the embodiment for representing the electronic component inspection device of the present invention.
Fig. 2 is the block diagram of the electronic component inspection device shown in Fig. 1.
Fig. 3 is the figure of the display picture for the display unit for representing the electronic component inspection device shown in Fig. 1.
Fig. 4 is the flow chart for the control action for representing the electronic component inspection device shown in Fig. 1.
Fig. 5 is the flow chart for the control action for representing the electronic component inspection device shown in Fig. 1.
Fig. 6 is the flow chart for the control action for representing the electronic component inspection device shown in Fig. 1.
Embodiment
Hereinafter, electronic component conveying device and electronic unit inspection of the embodiment shown with reference to the accompanying drawings to the present invention
Device is described in detail.
Embodiment
Fig. 1 is the approximate vertical view for the embodiment for representing the electronic component inspection device of the present invention.Fig. 2 is shown in Fig. 1
Electronic component inspection device block diagram.Fig. 3 is the display picture for the display unit for representing the electronic component inspection device shown in Fig. 1
Figure.Fig. 4~Fig. 6 is the flow chart for the control action for representing the electronic component inspection device shown in Fig. 1 respectively.
In addition, it is following, for convenience of description, as shown in Figure 1,3 mutually orthogonal axis are set to X-axis, Y-axis and Z axis.Separately
Outside, the X/Y plane comprising X-axis and Y-axis is formed as horizontal, and Z axis is formed as vertical.In addition, also the direction parallel with X-axis is known as
" X-direction ", is also known as " Y-direction " by the direction parallel with Y-axis, and the direction parallel with Z axis also is known as " Z-direction ".In addition, will
The direction of the arrow of each axis of X-axis, Y-axis and Z axis is known as positive side, and the direction opposite with arrow is known as negative side.In addition, also will
The upstream side in the carrying direction of electronic unit is referred to as " upstream side ", is also referred to as in downstream " downstream ".In addition, the application
Described " level " is not limited to complete level in specification, as long as not hindering the carrying of electronic unit, just also includes phase
For horizontal somewhat (such as degree less than 5 °) inclined state.
Check device (electronic component inspection device) 1 shown in Fig. 1 is, for example, to be used for BGA (Ball grid array：
Ball grid array) encapsulation or LGA (Land grid array：Grid array) encapsulation etc. IC devices, LCD (Liquid Crystal
Display：Liquid crystal display), CIS (CMOS Image Sensor：Cmos image sensor) etc. electronic unit electrical characteristic
Carry out the device of checkout facility (hereinafter referred to as " checking ").In addition, it is following, for convenience of description, typically to using
IC devices are illustrated as the situation of the above-mentioned electronic unit checked, and it is known as " IC devices 90 ".
As shown in Figure 1, check device 1 is divided into pallet supply area A1, the (hereinafter referred to as " supply of device supply area
Region ") A2, inspection area A3, device recovery zone (hereinafter referred to as " recovery zone ") A4 and pallet removing region A5.
Moreover, IC devices 90 remove region A5 from pallet supply area A1 to pallet passes through above-mentioned each region successively, and in the inspection of midway
Region A3 is looked into be checked.In this way, check device 1 possesses：IC devices 90 and the electricity with control unit 80 are carried in each region
Subassembly handling device；The inspection portion 16 checked in the A3 of inspection area；And inspection control unit (not shown).In addition,
In check device 1, electronic component conveying device is formed by the structure in addition to inspection portion 16 and inspection control unit.
Pallet supply area A1 is supplied with the region of the pallet 200 for the multiple IC devices 90 for being arranged with non-inspection state.
In the A1 of pallet supply area, multiple pallets 200 can be laminated.
Supply area A2 is to be respectively fed to examine by multiple IC devices 90 on the pallet 200 from pallet supply area A1
Look into the region of region A3.In addition, in a manner of across pallet supply area A1 and supply area A2, it is provided with and singly removes
Transport tray conveying mechanism 11A, 11B of pallet 200.
In supply area A2, the temperature adjustment part (immersion plate) 12 as the configuration section for configuring IC devices 90, device are provided with
Part carries head (handling article) 13 and tray conveying mechanism 15.
Temperature adjustment part 12 is that multiple IC devices 90 are heated or cooled down, so that the IC devices 90 are adjusted (control) extremely
Suitable for the device of the temperature of inspection.That is, temperature adjustment part 12 is can to configure IC devices 90 and can carry out to the IC devices 90
Cooling with heating at least one party cooling heating element.In the construction shown in fig. 1, configured along Y-direction, be fixed with two
Temperature adjustment part 12.Moreover, by tray conveying mechanism 11A from the pallet 200 that pallet supply area A1 moves into (carrying comes out)
IC devices 90 be handled upside down and be placed in one of temperature adjustment part 12.
Device carries first 13 and is supported to move in the A2 of supply area.Thus, device is carried first 13 and can be responsible for
The carrying of IC devices 90 between A1 is moved into from pallet supply area pallet 200 and temperature adjustment part 12 and temperature adjustment
The carrying of IC devices 90 between portion 12 and aftermentioned device supply unit 14.In addition, device, which carries first 13, has holding IC devices 90
Multiple handle parts (not shown), each handle part possesses adsorption nozzle, and is held by adsorbing IC devices 90.
Tray conveying mechanism 15 is to carry the empty pallet 200 eliminated in the state of all IC devices 90 in X direction
Mechanism.Moreover, after the carrying, empty pallet 200 is back to pallet by tray conveying mechanism 11B from supply area A2
Supply area A1.
Inspection area A3 is the region for checking IC devices 90.In the A3 of the inspection area, it is provided with as carrying IC devices
Device supply unit (supply shuttle) 14, inspection portion 16, the device of 90 electronic unit trucking department carry head (abutting part) 17, Yi Jiqi
Part recoverer (recycling shuttle) 18.
Device supply unit 14 is that temperature is adjusted to the dress that the IC devices 90 after (temperature control) are carried near inspection portion 16
Put.The device supply unit 14 is supported to move in X direction between supply area A2 and inspection area A3.In addition,
In structure shown in Fig. 1, two device supply units 14 are configured with along Y-direction, the IC devices 90 in temperature adjustment part 12 are handled upside down
And it is placed in one of device supply unit 14.In addition, in device supply unit 14, identically with temperature adjustment part 12, can
IC devices 90 are heated or cooled down, so as to adjusting the IC devices 90 to the temperature suitable for inspection.That is, device supply unit 14 is
IC devices 90 can be configured, and the cooling to the IC devices 90 and the cooling heating element of at least one party of heating can be carried out.
Inspection portion 16 is the unit that checkout facility is carried out to the electrical characteristic of IC devices 90, is to check IC devices 90
In the case of keep the maintaining parts of the IC devices 90.In inspection portion 16, it is provided with the state of IC devices 90 are kept and the IC
Multiple probes that the terminal of device 90 is electrically connected.Moreover, the terminal of IC devices 90 is electrically connected (contact) with probe, and via probe
And carry out the inspection of IC devices 90.The inspection control that the tester (not shown) being connected according to being stored in inspection portion 16 possesses
The program of the storage part in portion carries out the inspection of IC devices 90.In addition, in inspection portion 16, identically with temperature adjustment part 12,
IC devices 90 can be heated or cooled down, so as to adjusting the IC devices 90 to the temperature suitable for inspection.That is, inspection portion 16 is
IC devices 90 can be configured, and the cooling to the IC devices 90 and the cooling heating element of at least one party of heating can be carried out.
Device carries first 17 and is supported to move in the A3 of inspection area.Thus, device carry first 17 can will be from
The IC devices 90 on device supply unit 14 that supply area A2 is moved into are carried and are placed in inspection portion 16.In addition, to IC devices
In the case that part 90 is checked, device carries first 17 and presses IC devices 90 to inspection portion 16, thus, makes IC devices 90 and inspection
Portion 16 is looked into abut.Thus, as described above, the terminal of IC devices 90 is electrically connected with the probe in inspection portion 16.In addition, device is carried
First 17 have the multiple handle parts (not shown) for holding IC devices 90, and each handle part possesses adsorption nozzle, and by adsorbing IC devices
Part 90 is held.In addition, in device carries first 17, identically with temperature adjustment part 12, IC devices 90 can be heated
Or cooling, so as to adjusting IC devices 90 to the temperature suitable for inspection.That is, it is that can configure IC devices that device, which carries first 17,
90, and the cooling to the IC devices 90 and the cooling heating element of at least one party of heating can be carried out.
Device recoverer 18 is the device that the IC devices 90 that the inspection in inspection portion 16 terminates are carried to recovery zone A4.
The device recoverer 18 is supported to move in X direction between inspection area A3 and recovery zone A4.In addition, in Fig. 1
In shown structure, device recoverer 18 is configured with two in the Y direction identically with device supply unit 14, in inspection portion 16
IC devices 90 are handled upside down and are placed in one of device recoverer 18.First 17 are carried by device to carry out the carrying.
Recovery zone A4 is the region that recycling checks the IC devices 90 terminated.In the A4 of the recovery zone, recycling is provided with
Head (handling article) 20 and tray conveying mechanism 21 are carried with pallet 19, device.In addition, it has been ready in recovery zone A4
Empty pallet 200.
Recycling pallet 19 is fixed in the A4 of recovery zone, in the construction shown in fig. 1, is configured with three in X direction and is returned
Receipts use pallet 19.In addition, empty pallet 200 is also configured with three in X direction.Moreover, the device for being moved to recovery zone A4 returns
IC devices 90 in receipts portion 18 be handled upside down and be placed in above-mentioned recycling pallet 19 and empty pallet 200 in one.Thus,
For each inspection result recycling IC devices 90 and classify.
Device carries first 20 and is supported to move in the A4 of recovery zone.Thus, device carrying first 20 can be by IC
Pallet 200 of the device 90 from device recoverer 18 to recycling pallet 19, empty is carried.In addition, device, which carries first 20, has holding
Multiple handle parts (not shown) of IC devices 90, each handle part possesses adsorption nozzle, and carries out handle by adsorbing IC devices 90
Hold.
Tray conveying mechanism 21 is will to remove the mechanism that the empty pallet 200 that region A5 moves into carries in X direction from pallet.
Moreover, after the carrying, empty pallet 200 can be configured to the position of recycling IC devices 90, i.e. become above three
One in empty pallet 200.
It is to recycle and remove the pallet 200 for being arranged with and checking the multiple IC devices 90 finished under state that pallet, which removes region A5,
Region.In pallet removes region A5, multiple pallets 200 can be laminated.
In addition, in a manner of removing region A5 across recovery zone A4 and pallet, singly transportation tray is provided with
200 tray conveying mechanism 22A, 22B.Tray conveying mechanism 22A is will to be placed with the pallet 200 for checking the IC devices 90 finished
The mechanism that region A5 is carried is removed from recovery zone A4 to pallet.Tray conveying mechanism 22B is by for recycling IC devices 90
The mechanism that empty pallet 200 is carried from pallet removing region A5 to recovery zone A4.
The inspection control unit of above-mentioned tester for example according to the program for being stored in storage part (not shown), carries out being configured at inspection
Look into the inspection of electrical characteristic of IC devices 90 in portion 16 etc..
In addition, control unit 80 for example controls the first tray conveying mechanism 11A, the second tray conveying mechanism 11B, temperature adjustment
First 13, device supply unit 14, the 3rd tray conveying mechanism 15, inspection portion 16, the second device carrying head are carried by portion 12, the first device
17th, device recoverer 18, the 3rd device carry first 20, the 6th tray conveying mechanism 21, the 4th tray conveying mechanism 22A and the 5th
The driving in each portion of tray conveying mechanism 22B.
In addition, check device 1 is configured to, the gases such as the low air of humidity, nitrogen can be made (hereinafter also referred to as dry gas)
In defined each portion's flowing (can supply).In the case of being checked IC devices 90 are cooled to set point of temperature, therewith
Accordingly each portion needed for cooling, but by making dry gas be flowed in required each portion, can prevent from condensing, freeze and (freeze).This
Outside, in the present embodiment, dry gas is made in temperature adjustment part 12, device supply unit 14, inspection portion 16 and device recoverer
18 flowings.
In addition, as described above, in the present embodiment, contact and can be carried out to the IC devices as confession IC devices 90
90 cooling and the cooling heating element of at least one party of heating, are provided with temperature adjustment part 12, device supply unit 14, inspection portion
16 and device carry first 17, but in the following description, using temperature adjustment part 12 be cool down heating element situation as generation
Table illustrates, device supply unit 14, inspection portion 16 and device carry first 17 be cooling heating element in the case of, respectively
From identical with the situation of temperature adjustment part 12, therefore the description thereof will be omitted.
In addition, as shown in Fig. 2, check device 1 has：The temperature sensor 41 of detection temperature；The humidity for detecting humidity passes
Sensor 42；Detect the oxygen concentration sensor 43 of oxygen concentration；The heating arrangements 51 of heating-up temperature adjustment part 12；Cooling temperature adjustment part
12 cooling body 52；The drying gas feed mechanism 53 of the dry gas of defined position supply to the inside of check device 1；And
Carry out the operation portion 6 respectively operated of check device 1.Temperature sensor 41, humidity sensor 42 and oxygen concentration sensor 43 divide
Not Wei Yu check device 1 inside defined position, utilize above-mentioned temperature sensor 41, humidity sensor 42 and oxygen concentration
Sensor 43, is able to temperature, humidity and the oxygen concentration of the inside of detection check device 1.
In addition, operation portion 6 has the input unit 61 for carrying out each input and the display unit 62 for showing image.As input
Portion 61, there is no particular limitation, such as can enumerate keyboard, mouse etc..In addition, as display unit 62, there is no particular limitation, example
Liquid crystal display panel, organic EL display panel can such as be enumerated.In addition, one in each operation button shown by display unit 62
Divide or can all be provided as the mechanical operation button such as press button.In addition, as operation portion 6, it's not limited to that, such as
Touch panel etc., which can be enumerated, can be inputted and the device of the display of image etc..
In addition, as heating arrangements 51, there is no particular limitation, such as can enumerate heater etc..In addition, as cooler
Structure 52, there is no particular limitation, such as can enumerate makes refrigerant (for example, gas of low temperature) be configured at the attached of cooling object
The interior device for flowing to be cooled down of near tube body, Peltier element etc..In addition, in the present embodiment, cooling body 52 makes
With making refrigerant flow the device to be cooled down in the tube body being configured near above-mentioned cooling object, and use makes
The nitrogen gas that liquid nitrogen gasification forms are as refrigerant.
In addition, for dry gas used in dry gas feed mechanism 53, in the present embodiment, by cooler
In the case that structure 52 is cooled down, it is the gaseous mixture of nitrogen gas in cooling body 52 after the use air low with humidity
Body, in the case where stopping above-mentioned cooling, it is only the low air of above-mentioned humidity.Therefore, the oxygen concentration of the inside of check device 1
It is relatively low in the case where being cooled down by cooling body 52, and oxygen concentration increases if above-mentioned cooling is stopped.
The check device 1 is configured to, and as pattern (service mode), having the first pattern, (LN2 stops mould
Formula) and the second pattern (defrosting mode), and can optionally set above-mentioned first pattern and the second action mould
Formula.
First pattern and the second pattern are to carry out the inspection of IC devices 90 in cooling IC devices 90 respectively
When, cooling check device 1 temperature adjustment part (cooling heating element) 12 and side the inside of check device 1 is removed
During wet side execution action, temporarily cease the action of check device 1, and institute in the case of operation as defined in such as being safeguarded
The pattern of setting.For first pattern and the second pattern, operator (operator) can operate
Make the input unit 61 in portion 6 to make choice.
For example, in generation casey so as to carry out eliminating the situation of the operation of the casey, be configured in check device 1
The situation of adjustment of defined component in portion etc., need not make temperature adjustment part 12 temperature be temporarily returned to room temperature in the case of
Select the first pattern.
Above-mentioned casey is such as referring to that IC devices 90 are not configured at defined position (appropriate position).
In addition, the adjustment as above-mentioned defined component, for example, can enumerate with illuminating part and light receiver and to
Whether temperature adjustment part 12 is configured with the position of the optical sensor that IC devices 90 are detected, posture, optical receiver sensitivity etc.
Adjustment, device carry first 13 adjustment of hold (adsorption capacity) of handle part etc..
In first pattern, although temporarily ceasing the cooling of the temperature adjustment part 12 of check device 1, not into
The temperature for exercising temperature adjustment part 12 is back to the processing of room temperature.
In addition, for example, in the inside of check device 1, for example temperature adjustment part 12 produce condensation, freeze (freezing) so as to
Remove second pattern of lower selection such as the condensation, situation about freezing.In second pattern, check device is temporarily ceased
The cooling of 1 temperature adjustment part 12, and the temperature adjustment part 12 of heating test device 1 and into exercise the temperature adjustment part 12 temperature
Degree is temporarily returned to the processing of room temperature.Thus, above-mentioned condensation, icing are removed.
Next, the control action of check device 1 is illustrated.
In addition, in the present embodiment, such as operation inputting part 61, and make each operation shown by cursor to display unit 62
The position of button (icon) is moved to select (click) so as to carry out operation of the operator to operation portion 6, but below, also should
Operation referred to as " presses the operation button ".In addition, as described above, using temperature adjustment part 12 be cool down heating element situation as representative
Illustrate, device supply unit 14, inspection portion 16 and device carry first 17 be cooling heating element in the case of, each with
The situation of temperature adjustment part 12 is identical, therefore the description thereof will be omitted.
As shown in Fig. 4~Fig. 6, check device 1 is by the control of control unit 80, and lateral dominance is with cooling body 52 come cooling temperature
Adjustment part 12, using dry gas feed mechanism 53 supply dry gas, and side performs action.In addition, it will be cooled down by cooling body 52
Temperature t be set to temperature t1.In addition, the door of check device 1 is locked.First, control unit 80 judges whether in above-mentioned action
Stopping acts (step S101).
For operator, as described above, for example produce casey so as to eliminate the situation of the operation of the casey,
Be configured at the situation of the adjustment of the defined component of the inside of check device 1, temperature adjustment part 12 produces condensation, freeze from
And in the case of removing the condensation, freezing etc., operator presses action stop button and temporarily ceases the action of check device 1.
In step S101, in the case where above-mentioned action stop button is pressed, it is judged as that stopping acts.
In addition, as described above, temperature adjustment part 12 is provided with the optical sensor (not shown) of detection IC devices 90.Utilize
The optical sensor carries whether the first 13 IC devices 90 for being carried to from pallet 200 temperature adjustment part 12 are configured to detect by device
Temperature adjustment part 12.Moreover, in the case where being not detected by above-mentioned IC devices 90, it is characterized as generating casey, so that in step
It is judged as that stopping acts in S101.In this way, in the case that operator does not press action stop button, there is also be judged as
The situation of stopping action.
In step S101, in the case where being judged as stopping action, stop device carrying it is first 13,17,20, device supply
The action (step S102) of portion 14, device recoverer 18, tray conveying mechanism 11A, 11B, 15,21,22A, 22B etc..Wherein, no
The cooling for the temperature adjustment part 12 for stopping and continuing to be performed by cooling body 52, performed by dry gas feed mechanism 53 it is dry
The supply of pathogenic dryness.
Next, show the image (step S103) shown in Fig. 3 in display unit 62.
Image shown in the Fig. 3 has the display for being used for selecting the first pattern and the second pattern.It is specific and
Speech, first, the upper left side in Fig. 3 of the picture 621 of display unit 62 is shown " in stopping ".In addition, in the center of picture 621
In the rectangular frame 622 in portion, show and be recited as the first pattern select button 623 of " LN2 stop modes ", be recited as
The second pattern select button 624 of " defrosting mode " and it is recited as the cancel button 625 " cancelled ".
If operation inputting part 61 is inputted and pressed the first pattern select button 623, the first action is selected
Pattern, and pattern is set as the first pattern.
In addition, if operation inputting part 61 is inputted and pressed the second pattern select button 624, second is selected
Pattern, and pattern is set as the second pattern.
In addition, if operation inputting part 61 is inputted and pressed cancel button 625, selection is cancelled, so that will not be dynamic
Operation mode is set as any one in the first pattern and the second pattern, and makes the image changing of display unit 62 not show
Show any one in the first pattern select button 623, the second pattern select button 624 and cancel button 625
Other images.
Here, the first pattern select button 623 and the second pattern select button 624 are in vertical (in Fig. 3
Above-below direction) on configure side by side.Selected in addition, the first pattern select button 623 is configured at than the second pattern
Button 624 is more by the position above vertical.That is, the display location ratio for selecting the first pattern is used to select second
The display location of pattern is more by above vertical.For the position of operation button, compared with below vertical
Top is easier to make for operating, in addition, the first pattern is higher than the second pattern usage frequency, therefore by the way that first is moved
Operation mode select button 623 is configured at than the second pattern select button 624 more by the position above vertical, Neng Gourong
Easily and promptly operation selects the first pattern select button 623 of the first high pattern of above-mentioned usage frequency.
Alternatively, it is also possible to more emphatically show the first pattern select button than the second pattern select button 624
623.Thereby, it is possible to easily and promptly grasp the position of the first pattern select button 623.As being highlighted, example
The situation of increased in size (size) can such as be enumerated, improve the situation of brightness.That is, can enumerate makes the first pattern select button
The big situation of the size of 623 the second pattern of size ratio select button 624 and make the first pattern select button
High situation of the brightness of 623 the second pattern of brightness ratio select button 624 etc..
Next, it is determined whether have selected the first pattern (step S104), it is being judged as have selected the first action mould
In the case of formula, pattern is set as the first pattern, and move to step S107.
In addition, in step S104, in the case where being judged as non-selected first pattern, judge whether to have selected
Two patterns (step S105), in the case where being judged as have selected the second pattern, are set as second by pattern
Pattern, and move to step S120.
In addition, in step S105, in the case where being judged as non-selected second pattern, judge whether have selected and take
Disappear (step S106), in the case where being judged as have selected cancellation, pattern is not set as the first pattern and second
Any one in pattern, and be defined image by the image changing of display unit 62, and move to following step.This
Outside, the explanation of following action is omitted.
In addition, in step s 106, in the case where being judged as non-selected cancellation, step S104 is returned to, and perform again
The processing of below step S104.
In the case where pattern is set to the first pattern, stop the driving of cooling body 52 first, and stop
The only cooling (step S107) of temperature adjustment part 12.Thus, the drying gas supplied by dry gas feed mechanism 53 only becomes humidity
Low air, and the oxygen concentration increase of the inside of check device 1.
Next, the oxygen concentration a (step S108) of the inside of check device 1 is detected using oxygen concentration sensor 43, and
Oxygen concentration a is judged whether more than threshold alpha (step S109), in the case where being judged as oxygen concentration a not more than threshold alpha, is returned
To step S108, and the processing of below step S108 is performed again.
In addition, in step S109, in the case where being judged as oxygen concentration a more than threshold alpha, unlock check device 1
Door (step S110).Thus, the anaerobic condition of the inside of check device 1 is eliminated, thus allows for its internal operation.Operation
Person opens operation as defined in door and progress.In addition, operator presses action start button after the end of job.
In addition, there is no particular limitation for threshold alpha, can suitably be set according to each condition, it is preferred that being set in
In more than 16%, less than 20% scope, more preferably it is set in more than 17%, less than 19% scope.Next, it is judged that it is
It is no to press action start button (step S111), in the case where being judged as pressing action start button, passed using temperature
Sensor 41 detects current temperature (step S112), and detects current humidity RH (steps using humidity sensor 42
S113)。
Next, obtain relative humidity RHS (step S114).
There is no particular limitation for the computational methods of relative humidity RHS in step S114, such as can enumerate following methods.
First, using following (formula 1), and detected according in the temperature and step S113 detected in step S112
Humidity RH, the steam vapour amount M that the current gas of the inside of arithmetic check device 1 is included.
Steam vapour amount M=(the saturated steam amount MN of current temperature) × (humidity RH/100) ... (formula 1)
In addition, the saturated steam amount ML difference such as basis under saturated steam amount MN and set point of temperature t1 described later
The calibration curve of form, the operational formula of the storage part of control unit 80 etc. is pre-stored within to obtain.
Next, carry out the relative humidity RHS in the case that computing is cooled to set point of temperature t1 using following (formula 2).
Relative humidity RHS=(the saturated steam amount ML under steam vapour amount M/ set points of temperature t1) × 100 ... (formula 2)
In addition, in theory, in the case where being cooled to above-mentioned set point of temperature t1, if relative humidity RHS is 100%, produce
Raw condensation, freeze, if relative humidity RHS less than 100%, does not produce condensation, freezes.
Next, it is judged that relative humidity RHS whether below threshold value beta (step S115), is being judged as relative humidity RHS not
In the case of below threshold value beta, step S112 is returned to, and performs the processing of below step S112 again.
In addition, in step sl 15, in the case where being judged as relative humidity RHS below threshold value beta, drive cooling body
52 and start temperature adjustment part 12 cooling (step S116).Thereby, it is possible to prevent in the case where being cooled to set point of temperature t1
Produce condensation, freeze.
As long as in addition, threshold value beta is not having particularly in the case of being cooled to temperature t1 without producing condensation, the value to freeze
Limit, can suitably be set according to each condition, it is preferred that be set in more than 50%, less than 100% in the range of, it is more excellent
Choosing be set in more than 80%, less than 100% in the range of, be further preferably set in more than 80%, less than 90% scope.
Next, detecting the temperature t (step S117) of the inside of check device 1 using temperature sensor 41, and judge
Whether temperature t is in temperature (threshold value) below t1 (step S118), in the case where being judged as temperature t not below temperature t1, returns
To step S117, and the processing of below step S117 is performed again.In addition, in first pattern, without aftermentioned
The heating of temperature adjustment part 12 as two patterns, therefore, it is possible to cause times of the temperature t below temperature t1 than second
Pattern is short.
In addition, in step S118, in the case where being judged as temperature t below temperature t1, door is locked, and start (weight
It is new to start) device carries first 13,17,20, device supply unit 14, device recoverer 18, tray conveying mechanism 11A, 11B, 15,
21st, the action (step S119) of 22A, 22B etc., and move to following step.In addition, omit the explanation of following action.
Next, the situation that the second pattern is set to pattern illustrates, but omit and above-mentioned first
The explanation of the identical item of pattern.
In the case where pattern is set to the second pattern, stop the driving of cooling body 52 first, and stop
The only cooling (step S120) of temperature adjustment part 12.Thus, the drying gas supplied by dry gas feed mechanism 53 only becomes humidity
Low air, and the oxygen concentration increase of the inside of check device 1.
Next, driving heating arrangements 51, and the heating (step S121) of start temperature adjustment part 12.Thus, dress is checked
The temperature for putting 1 inside also rises with together with the temperature of temperature adjustment part 12.Thus, condensation, knot are produced in temperature adjustment part 12
In the case of ice, remove the condensation, freeze.
Here, it is preferred that the situation of condensation and the situation of the generation icing of temperature adjustment part 12 are produced according to temperature adjustment part 12
To change the energy of heating-up temperature adjustment part 12.That is, the heating-up temperature tune preferably in the case where temperature adjustment part 12 produces icing
The energy of heating-up temperature adjustment part 12 is big in the case of the whole 12 generation condensation of energy ratio temperature adjustment part 12.Thereby, it is possible to
Efficiently remove condensation and freeze.
Next, the oxygen concentration a (step S122) of the inside of check device 1 is detected using oxygen concentration sensor 43, and
Oxygen concentration a is judged whether more than threshold alpha (step S123), in the case where being judged as oxygen concentration a not more than threshold alpha, is returned
To step S122, and the processing of below step S122 is performed again.
In addition, in step S123, in the case where being judged as oxygen concentration a more than threshold alpha, temperature sensor 41 is utilized
To detect the temperature t (step S124) of the inside of check device 1.Thus, the anaerobic condition of the inside of check device 1 is eliminated, from
And the operation inside it can be carried out.
Next, it is judged that whether temperature t is being judged as temperature t not in temperature in temperature (threshold value) more than t2 (step S125)
In the case of spending more than t2, step S124 is returned to, and performs the processing of below step S124 again.
In addition, in step s 125, in the case where being judged as temperature t more than temperature t2, unlock the door of check device 1
(step S126).Operator opens operation as defined in door and execution.In addition, operator produces condensation, knot in temperature adjustment part 12
In the case of ice, confirm that the condensation, icing are removed.Operator presses action start button after the end of job.
In addition, there is no particular limitation by temperature t2, can suitably be set according to each condition, it is preferred that being set in 25
More than DEG C, in less than 35 DEG C of scope, more than 27 DEG C are more preferably set in, in less than 33 DEG C of scope.
Next, it is determined whether press action start button (step S127), be judged as pressing action start by
In the case of button, stop the driving of heating arrangements 51, and stop the heating (step S128) of temperature adjustment part 12.
Next, detecting current temperature (step S129) using temperature sensor 41, and utilize humidity sensor 42
To detect current humidity RH (step S130), so as to obtain relative humidity RHS (step S131).In addition, in step S131
There is no particular limitation for the computational methods of relative humidity RHS, such as identical with above-mentioned steps S114.
Next, it is judged that relative humidity RHS whether below threshold value beta (step S132), is being judged as relative humidity RHS not
In the case of below threshold value beta, step S129 is returned to, and performs the processing of below step S129 again.
In addition, in step S132, in the case where being judged as relative humidity RHS below threshold value beta, cooling body is driven
52, and the cooling (step S133) of start temperature adjustment part 12.Thereby, it is possible to prevent in the case where being cooled to set point of temperature t1
Produce condensation, freeze.
Next, detecting the temperature t (step S134) of the inside of check device 1 using temperature sensor 41, and judge
Whether temperature t is in temperature (threshold value) below t1 (step S135), in the case where being judged as temperature t not below temperature t1, returns
To step S134, and the processing of below step S134 is performed again.
In addition, in step S135, in the case where being judged as temperature t below temperature t1, door is locked, and start (weight
It is new to start) device carries first 13,17,20, device supply unit 14, device recoverer 18, tray conveying mechanism 11A, 11B, 15,
21st, the action (step S136) of 22A, 22B etc., and move to following step.In addition, omit the explanation of following action.
As described above, according to the check device 1, performed when temporarily ceasing in cooling temperature adjustment part 12 dynamic
The action of the check device 1 of work, and for example carry out eliminating the operation of casey, be configured at the defined portion of the inside of check device 1
When the removing of the adjustment of part, condensation or icing, when eliminate the feelings of the operation of casey, the adjustment of defined component
Condition selects the first pattern, is held so as to shorten from cooling temperature adjustment part 12 when situation about need not heat
Time of the state made of taking action untill stopping acts, carries out operation and restarts.
More than, electronic component conveying device and electronic component inspection device according to embodiment illustrated to the present invention
Be illustrated, but the present invention is not limited to this, the structure in each portion can be replaced into have the function of it is identical arbitrary
Structure.Alternatively, it is also possible to additional any other works.
In addition, in the above-described embodiment, the cooling heating element in electronic component inspection device be temperature adjustment part 12,
Device supply unit 14, inspection portion 16 and device carry first 17, but it's not limited to that in the present invention, such as can also be
Temperature adjustment part 12, device supply unit 14, inspection portion 16 and device carry one or two or three in first 17.
The explanation of reference numeral
1... check device (electronic component inspection device)；11A, 11B... tray conveying mechanism；12... temperature adjustment part
(immersion plate (soak plate))；13... device carries head；14... device supply unit (supply shuttle)；15... pallet carrying machine
Structure；16... inspection portion；17... device carries head；18... device recoverer (recycling shuttle)；19... recycling pallet；20...
Device carries head；21... tray conveying mechanism；22A, 22B... tray conveying mechanism；41... temperature sensor；42... humidity
Sensor；43... oxygen concentration sensor；51... heating arrangements；52... cooling body；53... gas feed mechanism is dried；6...
Operation portion；61... input unit；62... display unit；621... picture；622... frame；623... the first pattern selection is pressed
Button；624... the second pattern select button；625... cancel button；80... control unit；90...IC device；200... support
Disk；A1... pallet supply area；A2... device supply area (supply area)；A3... inspection area；A4... device recycles
Region (recovery zone)；A5... pallet removes region；S101~S136... steps.
Claims (9)
1. a kind of electronic component conveying device, it is characterised in that possess：
Heating element is cooled down, it can configure electronic unit, and can carry out any one at least cooling down or heating；And
Operation portion, it can stop the first pattern of the cooling of the cooling heating element and stop the cooling
The cooling of heating element and heat it is described cooling heating element the second pattern between make choice,
In the case of position as defined in not being configured in the electronic unit or carrying dress to being configured at the electronic unit
The component for the inside put selects first pattern in the case of being adjusted；It is described cooling heating element condensation or
Second pattern is selected in the case of icing.
2. electronic component conveying device according to claim 1, it is characterised in that
The cooling heating element has the configuration section of the trucking department for carrying the electronic unit and the configuration electronic unit
In at least one party.
3. electronic component conveying device according to claim 1 or 2, it is characterised in that
In second pattern, the cooling heating element is heated in the case where the cooling heating element freezes
Energy, the energy than heating the cooling heating element in the case of the cooling heating element condensation are big.
4. electronic component conveying device according to claim 1 or 2, it is characterised in that
The operation portion has touch panel, by the touch panel and can carry out be used for select first pattern with
And display and the input for selecting first pattern and second pattern of second pattern.
5. electronic component conveying device according to claim 1 or 2, it is characterised in that
The operation portion has：
Display unit, it can carry out the display for selecting first pattern and second pattern；And
Input unit, it can carry out the input for selecting first pattern and second pattern.
6. electronic component conveying device according to claim 4, it is characterised in that
For selecting the display location of first pattern than the display location for selecting second pattern more
By above vertical.
7. electronic component conveying device according to claim 5, it is characterised in that
For selecting the display location of first pattern than the display location for selecting second pattern more
By above vertical.
8. a kind of electronic component inspection device, it is characterised in that possess：
Heating element is cooled down, it can configure electronic unit, and can carry out any one at least cooling down or heating；
Operation portion, it can stop the first pattern of the cooling of the cooling heating element and stop the cooling
The cooling of heating element and heat it is described cooling heating element the second pattern between make choice；And
Inspection portion, it checks the electronic unit,
In the case of position as defined in not being configured in the electronic unit or carrying dress to being configured at the electronic unit
The component for the inside put selects first pattern in the case of being adjusted；It is described cooling heating element condensation or
Second pattern is selected in the case of icing.
9. electronic component inspection device according to claim 8, it is characterised in that
The cooling heating element have the trucking department for carrying the electronic unit, the configuration electronic unit configuration section,
The maintaining part of the electronic unit is kept in the case of checking the electronic unit and makes the electronic unit and institute
State at least one in the abutting part of maintaining part abutting.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-146289 | 2014-07-16 | ||
| JP2014146289A JP2016024511A (en) | 2014-07-16 | 2014-07-16 | Electronic component conveying apparatus and electronic component inspection apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105301473A CN105301473A (en) | 2016-02-03 |
| CN105301473B true CN105301473B (en) | 2018-04-27 |
Family
ID=55198968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510142209.6A Expired - Fee Related CN105301473B (en) | 2014-07-16 | 2015-03-27 | Electronic component conveying device and electronic component inspection device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016024511A (en) |
| KR (1) | KR101680844B1 (en) |
| CN (1) | CN105301473B (en) |
| TW (2) | TWI577995B (en) |
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| CN1188238A (en) * | 1996-06-04 | 1998-07-22 | 株式会社爱德万测试 | Semiconductor device testing apparatus |
| CN102099669A (en) * | 2008-07-22 | 2011-06-15 | 爱斯佩克株式会社 | Environment testing apparatus capable of controlling condensation amount, and control method therefor |
| CN202305712U (en) * | 2011-11-09 | 2012-07-04 | 高见泽电脑科技股份有限公司 | Temperature testing device |
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| JP2915969B2 (en) | 1990-07-06 | 1999-07-05 | 株式会社アドバンテスト | Constant temperature bath for IC testing |
| JPH11111802A (en) | 1997-10-03 | 1999-04-23 | Kokusai Electric Co Ltd | Device and method for stopping and restarting automatic operation |
| JP4037962B2 (en) * | 1998-06-24 | 2008-01-23 | 株式会社アドバンテスト | Parts testing equipment |
| JP4789125B2 (en) * | 2000-12-07 | 2011-10-12 | 株式会社アドバンテスト | Electronic component test socket and electronic component test apparatus using the same |
| US6678517B2 (en) * | 2001-06-21 | 2004-01-13 | Spatial Wireless, Inc. | Method and system for providing continuous voice and packet data services to a mobile station |
| JP4119104B2 (en) * | 2001-07-12 | 2008-07-16 | 株式会社アドバンテスト | Pusher with heater, electronic component handling apparatus, and electronic component temperature control method |
| JP2004273967A (en) | 2003-03-12 | 2004-09-30 | Sumitomo Heavy Ind Ltd | Chamber temperature control system |
| JP4377276B2 (en) * | 2004-04-09 | 2009-12-02 | 富士通株式会社 | Semiconductor test equipment with condensation removal |
| US20120060758A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
| JP5161335B2 (en) * | 2011-04-06 | 2013-03-13 | 中外炉工業株式会社 | Substrate transport apparatus and substrate processing apparatus provided with the same |
| JP5936853B2 (en) * | 2011-12-05 | 2016-06-22 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | Substrate processing apparatus and substrate processing method |
| JP5874427B2 (en) * | 2012-02-14 | 2016-03-02 | セイコーエプソン株式会社 | Parts inspection device and handler |
| JP6001961B2 (en) * | 2012-08-29 | 2016-10-05 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | Substrate processing apparatus and substrate processing method |
| JP2014224785A (en) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | Handler and test device |
| JP2014228297A (en) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | Handler and inspection device |
| JP6331271B2 (en) * | 2013-06-10 | 2018-05-30 | セイコーエプソン株式会社 | Electronic component pressing unit, electronic component transport device, and electronic component inspection device |
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2014
- 2014-07-16 JP JP2014146289A patent/JP2016024511A/en active Pending
-
2015
- 2015-01-30 KR KR1020150014811A patent/KR101680844B1/en active IP Right Grant
- 2015-03-27 CN CN201510142209.6A patent/CN105301473B/en not_active Expired - Fee Related
- 2015-07-13 TW TW104122622A patent/TWI577995B/en not_active IP Right Cessation
- 2015-07-13 TW TW106104965A patent/TWI603091B/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1188238A (en) * | 1996-06-04 | 1998-07-22 | 株式会社爱德万测试 | Semiconductor device testing apparatus |
| CN102099669A (en) * | 2008-07-22 | 2011-06-15 | 爱斯佩克株式会社 | Environment testing apparatus capable of controlling condensation amount, and control method therefor |
| CN202305712U (en) * | 2011-11-09 | 2012-07-04 | 高见泽电脑科技股份有限公司 | Temperature testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101680844B1 (en) | 2016-11-29 |
| JP2016024511A (en) | 2016-02-08 |
| TWI577995B (en) | 2017-04-11 |
| KR20160009483A (en) | 2016-01-26 |
| CN105301473A (en) | 2016-02-03 |
| TW201732300A (en) | 2017-09-16 |
| TW201604552A (en) | 2016-02-01 |
| TWI603091B (en) | 2017-10-21 |
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