CN104898010A - Contact circuit pattern detecting device and detecting method thereof - Google Patents
Contact circuit pattern detecting device and detecting method thereof Download PDFInfo
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- CN104898010A CN104898010A CN201510161578.XA CN201510161578A CN104898010A CN 104898010 A CN104898010 A CN 104898010A CN 201510161578 A CN201510161578 A CN 201510161578A CN 104898010 A CN104898010 A CN 104898010A
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Abstract
The invention provides a contact circuit pattern detecting device and a method capable of shooting and detecting a plurality of printed circuit board monolithics. The contact circuit pattern detecting device for detecting the printed circuit boards including a plurality of printed circuit board monolithic includes a probe unit provided with a camera unit and a detection section. Each monolithic is provided with a position alignment character point. The camera unit shoots the position alignment character point. The detection section is contacted with the monolithic so as to detect the conductive pattern of the monolithic. The device further includes: a moving mechanism for moving the probe unit, and a calculation section for calculating, shooting and detecting a minimum moving path of the probe unit. The minimum moving path is obtained by calculating the plurality of monolithics through a condition in which after shooting that all the positions on the monolithics are aligned with the character point, the detection of the monithics is carried out through one monolithic of the plurality of monolithic.
Description
Technical field
The present invention relates to the contact by making on the pin contact print circuit board corresponding with probe unit, leading to galvanoscopic contact-type circuit pattern inspection device and inspection method thereof to carry out printed circuit board (PCB).
Background technology
For the printed circuit board (PCB) of the conductive pattern comprised as wiring, general passing through is energized inspection with or without broken string and short circuit.Such as, Patent Document 1 discloses a kind of contact-type circuit pattern inspection device, wherein, by making by the contact on the inspection pin formed for acusector and detection pin and printed circuit board (PCB), thus provide inspection signal by for acusector guide electrical pattern, and connecting via detecting inspection input that pin returns as detection signal after conductive pattern, according to presence or absence or its damping capacity of detection signal, check with or without broken string and short circuit.
Such as, in such a device, the inspection pin that on the probe unit on movable part, installation is corresponding with the printed circuit board contact as check object is being installed on.When implementing to check, first, printed circuit board (PCB) position alignment arranges by platform.Then, movable part is declined above printed circuit board (PCB), to make the contact of inspection pin contact print circuit board.
In addition, in such a device, the inspection pin making probe unit is needed to contact all multiple contacts as check object on 1 monolithic respectively.Therefore, on monolithic, general setting is used for checking that pin and contact carry out the position alignment unique point of position alignment exactly.
When starting circuit pattern and checking, first, the position alignment unique point on monolithic is taken by the camera be set up in parallel with fixture unit, to obtain the positional information of monolithic.Further, based on the positional information obtained, judge whether monolithic is positioned at exactly and check on position.When the position skew of monolithic, make probe unit move to carry out position alignment, thus make all inspection pins and the contact of check object.Further, after position alignment, circuit pattern inspection as above is implemented.
Prior art document
Patent documentation
Patent documentation 1:(Japan) Unexamined Patent 11-340588 publication
Summary of the invention
In contact-type circuit pattern inspection device as above, need, by the position alignment unique point on camera shooting printed circuit board (PCB), after confirming that its position is suitable (position alignment feature point detection), to start to check.But, when checking the multiple monolithics on printed circuit board (PCB), do not need to check after taken the position alignment unique point on all monolithics by camera, only need for 1 monolithic, check after position alignment unique points all on this unit sheet of shooting.Such as, when N number of monolithic is check object, as long as the position alignment feature point detection of the 1st monolithic terminates, need not wait until that the position alignment feature point detection of all N number of monolithics terminates, just can carry out the inspection of the 1st monolithic.
Even so, but in such a device, be generally just start to check after the position alignment unique point that have taken all multiple monolithics.This be due to the probe unit of movement on monolithic again get back to before process path near, the displacement of probe unit can be increased, efficiency is reduced.
Therefore, the object of this invention is to provide and a kind ofly effectively can carry out the shooting of the printed circuit board (PCB) comprising multiple printed circuit board (PCB) monolithic and the contact-type circuit pattern inspection device of inspection and method.
A kind of contact-type circuit pattern inspection device for checking the printed circuit board (PCB) comprising multiple printed circuit board (PCB) monolithic in one embodiment of the present invention, each described multiple printed circuit board (PCB) monolithic arranges the conductive pattern with multiple contact and at least one position alignment unique point, this contact-type circuit pattern inspection device comprises: probe unit, be provided with the camera unit of the described position alignment unique point on the described printed circuit board (PCB) monolithic of shooting, check that signal checks the inspection portion of described conductive pattern with being provided by the described contact with described printed circuit board (PCB) monolithic, travel mechanism, makes described probe unit move, and operational part, calculate the minimum mobile route of the described probe unit when being carried out the shooting of described position alignment unique point by described camera unit and being checked by described inspection portion, described minimum mobile route is by 1 printed circuit board (PCB) monolithic in described multiple printed circuit board (PCB) monolithic, carry out the condition of the inspection of described 1 printed circuit board (PCB) monolithic after adopting all position alignment unique points on described 1 the printed circuit board (PCB) monolithic of shooting, and adopt above-mentioned condition to calculate to all described multiple printed circuit board (PCB) monolithics.
In addition, a kind of method calculating the minimum mobile route of probe unit in the contact-type circuit pattern inspection device for checking printed circuit board (PCB) in another embodiment of the present invention, this printed circuit board (PCB) comprises multiple printed circuit board (PCB) monolithic, and on each described multiple printed circuit board (PCB) monolithic, the conductive pattern with multiple contact and at least one position alignment unique point are set, this contact-type circuit pattern inspection device comprises: probe unit, be provided with the camera unit of the described position alignment unique point on the described printed circuit board (PCB) monolithic of shooting, check that signal checks the inspection portion of described conductive pattern with being provided by the described contact with described printed circuit board (PCB) monolithic, and travel mechanism, described probe unit is moved, the method calculates the minimum mobile route of the described probe unit when being carried out the shooting of described position alignment unique point by described camera unit and being checked by described inspection portion, and, described minimum mobile route is by 1 printed circuit board (PCB) monolithic in described multiple printed circuit board (PCB) monolithic, the condition of the inspection of described 1 printed circuit board (PCB) monolithic is carried out after adopting all position alignment unique points on described 1 the printed circuit board (PCB) monolithic of shooting, and adopt described condition to calculate to all described multiple printed circuit board (PCB) monolithics.
According to the present invention, can provide a kind of and effectively can carry out the shooting of the printed circuit board (PCB) comprising multiple printed circuit board (PCB) monolithic and the contact-type circuit pattern inspection device of inspection and method.
Accompanying drawing explanation
Fig. 1 is the calcspar of the structure that contact-type circuit pattern inspection device is roughly shown.
Fig. 2 is the vertical view that the printed circuit board (PCB) comprising the monolithic configured in 3 × 3 modes is roughly shown.
Fig. 3 is the vertical view of the structure of the printed circuit board (PCB) inspection body that contact-type circuit pattern inspection device is shown.
Fig. 4 is the vertical view of the handle sturcture only illustrated in the printed circuit board (PCB) inspection body of Fig. 3.
Fig. 5 is the vertical view of the inspection portion illustrated in the printed circuit board (PCB) inspection body of Fig. 3, travel mechanism, travel mechanism's control part and camera unit.
Fig. 6 is the side view of probe unit.
Fig. 7 is the vertical view of probe unit.
Fig. 8 is the process flow diagram checked by contact-type circuit pattern inspection device.
The vertical view of central point when Fig. 9 is the inspection that the configuration of the probe unit when checking 1 monolithic on the printed circuit board (PCB) shown in Fig. 2 and the fixture when checking each monolithic are roughly shown.
Figure 10 is the vertical view of the configuration that the probe unit when taking an alignment mark of 1 monolithic on the printed circuit board (PCB) shown in Fig. 2 is roughly shown.
The vertical view of central point when Figure 11 is central point and shooting when inspection is shown.
Figure 12 be pattern figure for the printed circuit board (PCB) by minimum mobile route computing formula is shown.
Figure 13 is the figure of the set N of central point and position alignment unique point when inspection is shown.
The figure of central point and initial point when Figure 14 is central point when being extracted the inspection of fixture unit relative to the printed circuit board (PCB) shown in Fig. 2, shooting.
Figure 15 (a) be shooting of the prior art and check time fixture unit central point mobile route.
Figure 15 (b) is the mobile route after being minimized by present embodiment.
Figure 16 illustrates the skeleton diagram comprising and arrange the printed circuit board (PCB) of the monolithic that-3 row modes configure with 3 row-2.
The figure of central point and initial point when Figure 17 is central point when being extracted the inspection of fixture unit relative to the printed circuit board (PCB) shown in Figure 16, shooting.
Figure 18 (a) be shooting of the prior art and check time fixture unit central point mobile route.
Figure 18 (b) is the mobile route after being minimized by present embodiment.
Figure 19 is the skeleton diagram that the printed circuit board (PCB) comprising the monolithic configured in 4 × 2 modes is shown.
The figure of central point and initial point when Figure 20 is central point when being extracted the inspection of fixture unit relative to the printed circuit board (PCB) shown in Figure 19, shooting.
Figure 21 (a) be shooting of the prior art and check time fixture unit central point mobile route.
Figure 21 (b) is the mobile route after being minimized by present embodiment.
Figure 22 is the skeleton diagram that the printed circuit board (PCB) configuring the monolithic comprising an alignment mark in 4 × 3 modes is shown.
The figure of central point and initial point when Figure 23 is central point when being extracted the inspection of fixture unit relative to the printed circuit board (PCB) shown in Figure 22, shooting.
Figure 24 (a) be shooting of the prior art and check time fixture unit central point mobile route.
Figure 24 (b) is the mobile route after being minimized by present embodiment.
Figure 25 is the vertical view of the example that alignment mark is shown.
Embodiment
Hereinafter, with reference to accompanying drawing, embodiments of the present invention are described.
Contact-type circuit pattern inspection device (hereinafter referred to as circuit pattern inspection device) 1 is according to the present embodiment in course of manufacturing printed circuit board, give and provide inspection signal as on the conductive pattern of wiring (circuit pattern) that the printed circuit board (PCB) before parts installation is formed, to detect the device of the defects such as the broken string that formed poor prognostic cause or short circuit.In the present embodiment, printed circuit board (PCB) can be flexible substrate, also can be rigid substrates.
(structure of circuit pattern inspection device)
Fig. 1 is the calcspar of the structure that circuit pattern inspection device 1 is roughly shown.Circuit pattern inspection device 1 has: the handle sturcture 2 holding printed circuit board (PCB); Comprise following probe unit 36 and printed circuit board (PCB) carried out to the inspection portion 3 of circuit pattern inspection; Check signal provision portion 5; Detection signal handling part 6; Make the travel mechanism 7 of inspection portion 3 movement; The drive control part 8 of drived control travel mechanism 7; Camera unit 9; Control the camera unit control part 10 of camera unit 9; Apparatus control portion 11; Input part 12; And display part 13.
Check that signal provision portion 5 receives order from apparatus control portion 11, such as, generate the inspection signal that is made up of d. c. voltage signal and be supplied to inspection portion 3.Check that signal processing part 6 receives detection signal from inspection portion 3, and implement signal transacting, output to apparatus control portion 11.
Camera unit 9 has: the optical system 14 generating the optical image comprising setting position alignment unique point on a printed circuit (example alignment mark 103 described as follows); And comprise optical image light-to-current inversion the image pickup part 15 of the imaging apparatus such as CCD or CMOS being electric signal.Camera unit control part 10 has: image processing part 16 and position skew judging part 17.Image processing part 16 receives electric signal and synthetic image signal from image pickup part 15.Position skew judging part 17 is based on the picture signal from image processing part 16, judge whether position alignment unique point is in the position of expectation, namely whether be in the assigned position that following inspection pin 32 contacts with contact (example contact pad 104 described as follows).
Input part 12 is the keyboard of input action instruction or various data etc. or touch panel etc.Display part 13 is liquid crystal display etc. that display comprises the fox message of check result.Display part 13, except display check result, offset in place can also show warning when moving.
Apparatus control portion 11 has: defect dipoles portion 18, storer 19 and operational part 20.Apparatus control portion 11 needs not to be special control part, such as, also can be general personal computer.
Defect dipoles portion 18 based on by the presence or absence of the detection signal after detection signal handling part 6 processing signals or damping capacity (voltage reduction), judges the conductive pattern that formed on the printed circuit board (PCB) of check object whether defectiveness.Particularly, when providing inspection signal but not obtaining detection signal, defect dipoles portion 18 is judged as occurring due to the defect caused that breaks on conductive pattern, in addition, if the half of signal value when detection signal is normal (or the judgment value preset) below, be then judged as being electrically connected to by bridge etc. the defect that on adjacent conductive pattern, generation is caused by short circuit.Or, when defect dipoles portion 18 also can detect the detection signal of more than level of noise from conductive pattern that is adjacent and configuration side by side on the conductive pattern of check object, be judged as the defect be short-circuited.
Storer 19 is such as the general-purpose storage such as ROM, RAM or flash memory.The imposing a condition of user, control program, various computing program and data (form) etc. store as storage information in the mode that can rewrite by storer 19.Operational part 20 carries out calculation process by the calculation condition of program or setting.
Fig. 2 be roughly illustrate as carry out the object of circuit pattern inspection by inspection portion 3, the vertical view of the printed circuit board (PCB) 101 that comprises printed circuit board (PCB) monolithic (hereinafter referred to as monolithic) 102.Monolithic 102 is equivalent to as the substrate obtained after the printed circuit board (PCB) 101 of a sheet material cuts into the size of a product, and namely each monolithic 102 is printed circuit board (PCB)s.Printed circuit board (PCB) 101 cuts the size into monolithic 102 after check, and is mounted to product.
In the example shown in fig. 2, a printed circuit board (PCB) 101 arranges 9 monolithics 102 alignedly in 3 × 3 modes.But the number of monolithic 102 and layout (layout) are not limited thereto, and also can be arbitrary quantity and layout.In the present embodiment, each monolithic 102 is identical.
On monolithic 102, the alignment mark 103 for carrying out position alignment is set.In fig. 2, on 1 monolithic 102, two alignment marks 103 are arranged on roughly on diagonal line.But quantity and the position of alignment mark 103 are not limited thereto, also can arrange with arbitrary quantity and position.
In addition, even if when there is not alignment mark on monolithic, also can utilize the position with the feature replacing alignment mark, carry out position cooperation.In this manual, the position with alignment mark or similar feature is called position alignment unique point.In the present embodiment, position alignment unique point is alignment mark 103.
In addition, on monolithic 102, the conductive pattern with multiple contact pad 104 is set.These contact pads 104 contact with the inspection pin (probe) 32 of the following probe unit 36 of inspection portion 3 and form the electrode of electric connection point.Contact pad 104 is designed to relative to the electrode area checking the contact area at top of pin 32, the position skew movement of pin 32 (check) etc. that caused by foozle or surrounding environment (air themperature) is taken into account.
In the example shown in fig. 2, although only illustrate contact pad 104 on 1 monolithic 102, each monolithic is all provided with same contact pad 104.When using direct current to check signal, contact pad 104 is arranged on the two ends of conductive pattern substantially.In addition, due to when adopting interchange to check signal, can be judged by the change etc. of amplitude variations, phase offset and peak/peak value, so the position of pad is not necessarily limited to the two ends of conductive pattern.
In addition, even if when there is not contact pad on monolithic, also can contact pad be replaced, and make to contact and check the conductive pattern of pin 32 and check that pin 32 directly contacts to check.In this manual, by contact pad and contact pad can be replaced to contact and the point carried out on logical galvanoscopic monolithic is called contact with inspection pin.In the present embodiment, contact is contact pad 104, and checks that when checking pin 32 contacts with all contact pads 104 as check object on monolithic 102 respectively, checks energising between pin 32 and contact pad 104.
Fig. 3 is the vertical view of the structure of the printed circuit board (PCB) inspection body 50 that circuit pattern inspection device 1 is shown.Printed circuit board (PCB) inspection body 50 is mechanisms of the handle sturcture 2 at least comprised in Fig. 1, inspection portion 3, travel mechanism 7, drive control part 8 and camera unit 9.Fig. 4 is the vertical view of the handle sturcture 2 only illustrated in the printed circuit board (PCB) inspection body 50 of Fig. 3.Fig. 5 is the vertical view of the inspection portion 3 illustrated in the printed circuit board (PCB) inspection body 50 of Fig. 3, travel mechanism 7, drive control part 8 and camera unit 9.
Handle sturcture 2 has: two clamp device base shafts 21 and two clamp device base portions 22.These clamp device base portions 22 are vertical with the clamp device base shaft 21 be parallel to each other that X-direction in figs. 3 and 4 extends, and Y direction in figs. 3 and 4 extend and is configured in parallel to each other on these clamp device base shafts 21.In addition, on clamp device base portion 22,1 clamp device base portion 22 arranges 2 clamp devices thus 4 clamp devices 23 are set on 2 clamp device base portions 22.These clamp devices 23, in the space surrounded by clamp device base shaft 21 and clamp device base portion 22, are configured on the direction of holding printed circuit board (PCB) 101.
In addition, handle sturcture 2 has when checking beginning for loading the platform 24 of printed circuit board (PCB) 101.Check time, first, printed circuit board (PCB) 101 is positioned on platform 24, then, held by clamp device 23 printed circuit board (PCB) 101 end and traction and apply tension force state under, held on the clamped position in the diagram shown in dotted line.
Inspection portion 3 has fixture unit 31, and this fixture unit 31 comprises the fixture 33 being provided with multiple inspection pin 32.Check that pin 32 contacts the contact pad 104 of each monolithic 102 forming printed circuit board (PCB) 101 respectively when checking.Fixture unit 31 is arranged on and adheres on platform 35 together with camera unit 9, and fixture unit 31 and camera unit 9 form probe unit 36.
Fig. 6 is the side view of probe unit 36.Fig. 7 is the vertical view of probe unit 36.Fixture unit 31 has: the servomotor 8H of multiple inspection pin 32, the fixtures 33 fixing these inspection pins 32, fixture exchange cylinder 37 and formation drive control part 8.
Check that the type of pin 32 is at least divided into for checking that signal is supplied to the confession acusector of contact pad 104, and this two class of inspection pin for detecting provided inspection signal.In addition, in wiring, in the conductive pattern with branch part, also can for one for the multiple inspection pin of acusector.In addition, utilize to adjoin with the conductive pattern of check object and the inspection pin that contacts of the contact pad 104 of the conductive pattern configured arranged side by side as test for short-circuit pin, further, the inspection pin that distance a little can be utilized to carry out the position (distance of several pattern amount) of the inspection pin checked checks pin as detecting from the noise of the surrounding noise overlapping with monolithic 102.
Further, about checking the power supply/detection between pin 32 and contact pad 104, if electrically separated conductive pattern, then sequentially need not power one by one/detecting, but can the contact pad 104 of multiple conductive pattern be powered simultaneously/be detected.
Fixture 33 is arranged on fixture exchange cylinder 37, and is connected with servomotor 8H.Servoamplifier drives servomotor 8H when receiving the movement directive from apparatus control portion 11, and fixture 33 rotates centered by θ axle, and angle can be changed around vertical Z axis on the direction, face of printed circuit board (PCB) 101.
As shown in Figure 7, the attachment platform 35 of probe unit 36 is arranged on the Z axis ball screw 34 of formation Z-direction travel mechanism 7Z.Therefore, by driving the motor 8Z (not shown in Fig. 6 and Fig. 7, with reference to figure 1) be connected on Z axis ball screw 34, probe unit 36 can be upper mobile in Z-direction (lifting direction).
Further, as shown in Figure 5, travel mechanism 7 has: the Y direction travel mechanism 7Y be made up of the Y-axis ball screw 40 extended in the Y-axis direction and rectilinear guide (line slideway and line block) 41; And on the line block being arranged on rectilinear guide 41 on Y direction travel mechanism 7Y and the X-direction travel mechanism 7X be made up of the X-axis ball screw 42 extended in the X-axis direction and rectilinear guide 43 perpendicularly.
On the X-axis ball screw 42 and rectilinear guide 43, install thereon along the movable member 44 that X-direction is slided.In addition, on movable member 44, Z axis ball screw 34 has been installed.Therefore, the travel mechanism 7 of probe unit 36 by being made up of X-direction travel mechanism 7X, Y direction travel mechanism 7Y, Z-direction travel mechanism 7Z and θ direction of principal axis travel mechanism 7H, can move on three direction of principal axis and θ direction of principal axis.
In addition, drive control part 8 has: to be connected on Y-axis ball screw 40 and to move forward into the Y direction of probe unit 36 the motor 8Y that row cutting controls; And to be connected on X-axis ball screw 42 and the motor 8X that row cutting controls is moved forward into the X-direction of probe unit 36.Like this, motor 8X, 8Y, 8Z, 8H forms drive control part 8.
Therefore, probe unit 36 by by motor 8Z, 8Y, 8X of forming drive control part 8 respectively drived control form the Z axis ball screw 34 of travel mechanism 7, Y-axis ball screw 40 and X-axis ball screw 42, thus can to move on orthogonal three direction of principal axis.In addition, the fixture 33 of probe unit 36 can rotate centered by θ axle.
(summary that way of contact pattern checks)
Next, illustrate that the way of contact pattern of circuit pattern inspection device 1 checks.Fig. 8 is the process flow diagram checked by the contact-type circuit pattern inspection device 1 of present embodiment.
First, in step sl, the printed circuit board (PCB) 101 comprising multiple monolithic 102 is positioned on platform 24.Further, hold printed circuit board (PCB) 101 by clamp device 23 in step s 2, in step s3 tension force applied to printed circuit board (PCB) 101 and strain.Now, as required, the origin position that can carry out the position of the printed circuit board (PCB) 101 as rough position alignment is aimed at.
Afterwards, in step s 4 which, while platform 24 starts to decline, operational part 20 make the shooting of the alignment mark 103 undertaken by camera unit 9 and undertaken by the inspection pin 32 of inspection portion 3 (probe unit 36) inspection time the mobile route of probe unit 36 be set to minimum, namely the minimum mobile route (computing method will be described hereinafter) carrying out the most efficiently taking and checking is calculated, to make it possible to after platform 24 has declined, carry out at once taking and checking.
Afterwards, in step s 5, according to the minimum mobile route traveling probe unit 36 calculated by step S4, camera unit 9 takes the alignment mark 103 on monolithic 102 simultaneously, the position skew that position skew judging part 17 carries out alignment mark 103 judges, and the inspection pin 32 of inspection portion 3 (probe unit 36) contacts with the contact pad 104 on monolithic 102 and provides inspection signal, thus check conductive pattern.
At the end of shooting and energising check, in step s 6, platform 24 is made to increase.Further, in the step s 7, the tension force that printed circuit board (PCB) 101 is applied is alleviated.Further, in step s 8, printed circuit board (PCB) 101 is discharged from clamp device 23.Further, terminate to check.
In addition, in step s 5, offset in place moves judging part 17 being judged as that captured alignment mark 103 offsets from desired locations, arranges the position skew of the monolithic 102 of this alignment mark 103.Due to when there is skew, all inspection pins 32 do not contact the contact pad 104 of monolithic 102, so can not carry out correct energising inspection.Therefore, when finding such skew, by driving motor 8X, 8Y, 8H, thus the X-direction of alignment jig 33 and the angle (the axle anglec of rotation of the axle vertical with the interarea direction of monolithic 102) on the position of Y direction and θ direction of principal axis, can contact with the alignment mark 103 on monolithic 102 to make all inspection pins 32.
In addition, in the flow process shown in Fig. 8, in step s 5, also can be that operational part 20 calculates the minimum mobile route of the probe unit 36 when taking and check by simulation, but, also can be following form: the data in advance of the minimum mobile route layout of the monolithic 102 based on printed circuit board (PCB) 101, the quantity of position alignment unique point and the information of position calculated by following method is stored in storer 19 or external memory storage, thus calls these data and carry out taking and checking.That is, operational part 20 also can be the personal computer etc. different from circuit pattern inspection device 1.
(computing method of the minimum mobile route of shooting and probe unit when checking)
Next, illustrate in contact-type circuit pattern inspection device 1, the computing method of the minimum mobile route of the probe unit 36 when the shooting of the alignment mark 103 undertaken by the camera unit 9 of probe unit 36 and the way of contact pattern undertaken by the inspection pin 32 of fixture unit 31 check.Below, as an example, the minimum mobile route of the shooting of the printed circuit board (PCB) 101 shown in key diagram 2 and the probe unit 36 when checking.
Fig. 9 is the vertical view of the position of the probe unit 36 (optical system 14 of fixture unit 31 and camera unit 9 is only roughly shown) illustrated when printed circuit board (PCB) 101 shown in figure 2 checking monolithic 102a.Central point A1 during using the central point in the XY plane of fixture unit 31 now as inspection.The central point of the fixture unit 31 when checking monolithic 102b ~ 102i is represented by central point A2 ~ A9 when checking respectively.
Figure 10 illustrates alignment mark 103a printed circuit board (PCB) 101 shown in figure 2 being taken monolithic 102a by camera unit 9
1time the vertical view of position of probe unit 36 (optical system 14 of fixture unit 31 and camera unit 9 is only roughly shown).Central point B1 during using the central point of fixture unit 31 now as shooting.At shooting alignment mark 103a
2, 103b
1, 103b
2..., 103i
1, 103i
2time the central point of fixture unit 31 respectively as central point B2 ~ B18 during shooting.The figure of central point B1 ~ B18 when Figure 11 is central point A1 ~ A9 and shooting when inspection is shown.
The minimum mobile route of shooting and the probe unit 36 when checking by the central point of trying to achieve fixture unit 31 each time touring all some A1 ~ A9, B1 ~ B18 path and calculate.Try to achieve and make to become minimum path from starting point, each time touring the total displacement turning back to the touring path of starting point a little afterwards, be widely known by the people as " travelling salesman " problem (traveling salesman problem:TSP).The minimum mobile route of probe unit 36 is in the present embodiment by considering using the initial position of probe unit 36 as starting point, and the mobile route returning starting point after making touring all some A1 ~ A9, B1 ~ B18 each time minimizes thus tries to achieve.
But, in the way of contact pattern of present embodiment checks, there is following restriction: when being conceived to 1 monolithic, only after have taken the position alignment unique point (such as alignment mark) on this monolithic, just can check.This is because by taking all position alignment unique points be arranged on 1 monolithic, its positional information must be obtained and judge that position offsets, thus making all inspection pins contact with all contacts (such as contact pad) of this monolithic.
Such as, in the relation of monolithic 102a and 102b, at all alignment mark 103a of shooting monolithic 102a
1, 103a
2afterwards, can check monolithic 102a, also can to the alignment mark 103b of monolithic 102b
1or 103b
2take, but, can not check taking the monolithic 102b also do not terminated.The minimum mobile route that the basis considering such restriction calculates probe unit 36 is very important.
In other words, the minimum mobile route of probe unit 36 is by the monolithic of 1 in multiple monolithic, carry out the condition of the inspection of this monolithic after adopting all position alignment unique points on this monolithic of shooting, and this condition is adopted to all multiple monolithics thus calculates.In the present embodiment, this minimum mobile route is in the plane (XY plane) of printed circuit board (PCB) 101, the path of central point A1 ~ A9 when the inspection pin 32 of central point B1 ~ B18 and inspection portion 3 (probe unit 36) contacts when checking inspection during the shooting of the probe unit 36 when touring camera unit 9 takes alignment mark 103 each time with the contact pad 104 of monolithic 102.
Figure 12 be pattern figure for the printed circuit board (PCB) 1001 by minimum mobile route computing formula is shown.The quantity of the monolithic 1002 comprised in printed circuit board (PCB) 1001 is n, and the quantity being arranged on the position alignment unique point in each monolithic 1002 is m.The quantity of position alignment unique point is identical with the quantity of central point during shooting.In addition, each monolithic 1002 have one check time central point.Therefore, for each monolithic 1002, there is m+1 the point needing shooting or check.Printed circuit board (PCB) 1001 needs the sum of point taken or check, during shooting namely for printed circuit board (PCB) 1001 central point and when checking the quantity of central point be (m+1) × n=mn+n.At this, the set of the numbering of each monolithic 1002 is set to B={1,2,3 ..., 1}, considers the set N (Figure 13) of mn+n point.
In set N, the mobile route between some i, some j as any 2 is set to c
ij.In addition, the set of the position alignment unique point of the monolithic of being numbered by p is set to A
p, the set of central point during the inspection of the monolithic of p numbering is set to I
p.At this, be x by relating dot i and the 0-1 variable-definition of some j
ijtime, obtain mathematical expression 1.
[mathematical expression 1]
In addition, relating dot i and the continuous variable of some j are defined as y
ijtime, obtain mathematical expression 2.
[mathematical expression 2]
Further, minimum mobile route is derived by mathematical expression 3.
[mathematical expression 3]
Based on above concept and computing method, the minimum mobile route of the probe unit 36 (fixture unit 31) that the way of contact pattern calculating shooting and the monolithic 102 carrying out alignment mark 103 efficiently checks.Below, several concrete examples of the minimum mobile route adopting these computing method to calculate will be enumerated.
(example 1)
The skeleton diagram of central point B1 ~ B18 and initial point (initial position at the center of fixture unit 31) when Figure 14 is central point A1 ~ A9, shooting when being extracted the inspection of fixture unit relative to the printed circuit board (PCB) 101 shown in Fig. 2.Figure 15 (a) be shooting of the prior art and check time fixture unit 31 the mobile route of central point, Figure 15 (b) is the mobile route after being minimized by present embodiment.
In the existing route that Figure 15 (a) illustrates, from initial point, by taking two alignment marks on 1 monolithic successively with after taking all alignment marks on all monolithics, check successively from substrate belonging to the alignment mark of last shooting.This path is if the shooting of alignment mark and the inspection of substrate caught as process independently, then its each is shorter path, but, if caught as a process of carrying out continuously taking and checking, near the path of movement when then again being taken by (intersection of arrows) when checking, therefore useless movement is many.
To this, as long as the mobile route that minimizes of the present embodiment shown in Figure 15 (b) is based on after two alignment marks be arranged in shooting on 1 monolithic, this substrate can be checked, also can take other substrate, and the optimal path calculated.This path can touring all points very efficiently.When total displacement in the path shown in Figure 15 (a) is set to about 100, total displacement in the path shown in Figure 15 (b) is about 75.Therefore, by present embodiment, displacement can be shortened about 25%, and can carry out efficiently taking and checking.
(example 2)
Figure 16 roughly illustrates the vertical view comprising and arrange the printed circuit board (PCB) 201 of the monolithic 202 that-3 row modes arrange circuitously with 3 row-2.1 monolithic 202 is provided with 2 alignment marks 203.
Figure 17 is central point when being extracted the shooting of fixture unit for the printed circuit board (PCB) 201 shown in Figure 16, the skeleton diagram of central point and initial point (initial position of clamp central) when checking.Figure 18 (a) be shooting of the prior art and check time fixture unit central point mobile route, Figure 18 (b) is the mobile route after being minimized by present embodiment.
Total displacement in the path shown in Figure 18 (a) is about 94, in contrast, total displacement in the path shown in Figure 18 (b) is about 72.Therefore, by present embodiment, displacement can be shortened about 24%, and can carry out efficiently taking and checking.
(example 3)
Figure 19 is the vertical view that the printed circuit board (PCB) 300 comprising the monolithic 302 arranged in 4 × 2 modes is roughly shown.1 monolithic 302 is provided with 2 alignment marks 303.
Figure 20 is central point when being extracted the shooting of fixture unit for the printed circuit board (PCB) 301 shown in Figure 19, the skeleton diagram of central point and initial point (initial position of clamp central) when checking.Figure 21 (a) be shooting of the prior art and check time fixture unit central point mobile route, Figure 21 (b) is the mobile route after being minimized by present embodiment.Further, in Figure 21 (a), (b), in order to clearer and more definite, movement when representing inspection by partial trace between central point, in fact, movement during inspection between central point is all the movement of linearity.
Total displacement in the path shown in Figure 21 (a) is about 86, and to this, total displacement in the path shown in Figure 21 (b) is about 69.Therefore, by present embodiment, displacement can be shortened about 19%, and can carry out efficiently taking and checking.
(example 4)
Although in above-mentioned example 1 ~ example 3,1 monolithic is provided with 2 alignment marks, the quantity of the alignment mark that 1 monolithic is arranged is not limited thereto.Figure 22 is the vertical view that the printed circuit board (PCB) 401 comprising the monolithic 402 arranged in 4 × 3 modes is roughly shown.1 monolithic 402 is provided with 1 alignment mark 403.Further, the monolithic of central array is in fig. 22 configured to rotate the state after 180 ° (reversion) relative to the monolithic of left column and right row.
Figure 23 is central point when being extracted the shooting of fixture unit for the printed circuit board (PCB) 401 shown in Figure 20, the skeleton diagram of central point and initial point (initial position of clamp central) when checking.Figure 24 (a) be shooting of the prior art and check time fixture unit central point mobile route, Figure 24 (b) is the mobile route after being minimized by present embodiment.
Total displacement in the path shown in Figure 24 (a) is about 61, in contrast, total displacement in the path shown in Figure 24 (b) is about 54.Therefore, displacement can shorten about 12%, even if the alignment mark arranged on 1 monolithic is 1, also can shorten displacement by present embodiment, and carries out efficiently taking and checking.
In addition, the alignment mark that 1 monolithic is arranged is 1, alignment mark can be the shape that cruciform etc. as shown in Figure 25 can judge position and direction.If alignment mark is circular, then be difficult to by only taking 1 alignment mark, detect/judge the position skew of the sense of rotation of the substrate with this alignment mark, but if the alignment mark of cruciform etc., then can be held the position skew of the X-direction of monolithic, Y direction or sense of rotation by the shooting of 1 alignment mark.Therefore, even 1 alignment mark, also position alignment can be carried out more accurately.
As explained above ground, according to the present embodiment, when being conceived to 1 monolithic, based on only just carrying out the restriction contacting electric checking after all alignment marks of this monolithic of shooting, calculate the minimum mobile route of probe unit, carry out shooting and the energising inspection of contact-type circuit pattern inspection device according to this minimum mobile route.Therefore, it is possible to omit the mobile route of waste, can more efficiently carry out taking and checking.
In addition, by shortening displacement, when adopting the travel mechanism of performance same as the prior art and drive control part, can shorten its check needed for time.
In addition, in the present embodiment, although central point and the minimum mobile route of central point when checking when trying to achieve the shooting of touring fixture unit 31 each time, touring point is not limited to these, also can be the miscellaneous stipulations of the probe unit 36 comprising fixture unit 31 and camera unit 9 a bit.Namely, as long as minimum mobile route is in the plane of printed circuit board (PCB) 101, the path of the some when point of the described regulation that the some during shooting that the point (central point of the optical system 14 of such as camera unit 9) of the regulation of touring probe unit 36 when taking alignment mark 103 with camera unit 9 is corresponding each time contacts when checking with the contact pad 104 of monolithic 102 with inspection portion 3 checks is just passable.
In addition, when the quantity of the monolithic of every a slice printed circuit board (PCB) more (such as tens), multiple monolithic can be collected as inspection group, manufacture fixture with the size pooled together by multiple monolithic and check.For a fairly large number of printed circuit board (PCB) comprising monolithic, when coordinating a monolithic to manufacture fixture, check that number of times increases and supervision time also corresponding increase.Therefore, if consider the cost relevant to the size of fixture and the balance of supervision time, then it is effective in units of inspection group, carrying out inspection.
Be explained above embodiments of the present invention, but the invention is not restricted to above-mentioned embodiment, those skilled in the art are known, without departing from the scope of the subject in the invention, can various improvement and amendment be carried out.
Label declaration
1 ... contact-type circuit pattern inspection device, 2 ... handle sturcture, 3 ... inspection portion, 5 ... check signal provision portion, 6 ... check signal processing part, 7 ... travel mechanism, 8 ... drive control part, 9 ... camera unit, 10 ... camera unit control part, 11 ... apparatus control portion, 12 ... input part, 13 ... display part, 14 ... optical system, 15 ... image pickup part, 16 ... image processing part, 17 ... position skew judging part, 18 ... defect dipoles portion, 19 ... storer, 20 ... operational part, 21 ... clamp device base shaft, 22 ... clamp device base portion, 23 ... clamp device, 24 ... platform, 31 ... fixture unit, 32 ... check pin, 33 ... fixture, 34 ... Z axis ball screw, 35 ... attachment platform, 36 ... probe unit, 37 ... fixture exchange cylinder, 40 ... Y-axis ball screw, 41 ... rectilinear guide, 42 ... X-axis ball screw, 43 ... rectilinear guide, 44 ... movable member, 50 ... printed circuit board (PCB) inspection body, 101 ... printed circuit board (PCB), 102 ... printed circuit board (PCB) monolithic, 103 ... alignment mark, 104 ... contact pad.
Claims (4)
1. a contact-type circuit pattern inspection device, for checking the printed circuit board (PCB) comprising multiple printed circuit board (PCB) monolithics, each described multiple printed circuit board (PCB) monolithic arranges the conductive pattern with multiple contact and at least one position alignment unique point, it is characterized in that
This contact-type circuit pattern inspection device comprises:
Probe unit, is provided with the camera unit of the described position alignment unique point on the described printed circuit board (PCB) monolithic of shooting and is provided by the described contact with described printed circuit board (PCB) monolithic and check that signal checks the inspection portion of described conductive pattern;
Travel mechanism, makes described probe unit move; And
Operational part, calculates the minimum mobile route of the described probe unit when being carried out the shooting of described position alignment unique point by described camera unit and being checked by described inspection portion,
Described minimum mobile route is by 1 printed circuit board (PCB) monolithic in described multiple printed circuit board (PCB) monolithic, carry out the condition of the inspection of described 1 printed circuit board (PCB) monolithic after adopting all position alignment unique points on described 1 the printed circuit board (PCB) monolithic of shooting, and adopt described condition to calculate to all described multiple printed circuit board (PCB) monolithics.
2. contact-type circuit pattern inspection device according to claim 1, is characterized in that,
Described minimum mobile route is in the plane of described printed circuit board (PCB), the path of the some when point each time during touring shooting and inspection, wherein, point during this shooting corresponds to the point of the regulation of described probe unit when described camera unit takes described position alignment unique point, the point of described regulation when point during this inspection corresponds to the described contact of described inspection portion and described printed circuit board (PCB) monolithic and checks.
3. in the contact-type circuit pattern inspection device for checking printed circuit board (PCB), calculate a method for the minimum mobile route of probe unit,
This printed circuit board (PCB) comprises multiple printed circuit board (PCB) monolithic, and on each described multiple printed circuit board (PCB) monolithic, be provided with the conductive pattern and at least one position alignment unique point with multiple contact,
This contact-type circuit pattern inspection device comprises:
Probe unit, is provided with the camera unit of the described position alignment unique point on the described printed circuit board (PCB) monolithic of shooting and is provided by the described contact with described printed circuit board (PCB) monolithic and check that signal checks the inspection portion of described conductive pattern; And
Travel mechanism, makes described probe unit move,
The method calculates the minimum mobile route of the described probe unit when being carried out the shooting of described position alignment unique point by described camera unit and being checked by described inspection portion,
It is characterized in that,
Described minimum mobile route is by 1 printed circuit board (PCB) monolithic in described multiple printed circuit board (PCB) monolithic, carry out the condition of the inspection of described 1 printed circuit board (PCB) monolithic after adopting all position alignment unique points on described 1 the printed circuit board (PCB) monolithic of shooting, and adopt described condition to calculate to all described multiple printed circuit board (PCB) monolithics.
4. method according to claim 3, is characterized in that,
Described minimum mobile route is in the plane of described printed circuit board (PCB), the path of the some when point each time during touring shooting and inspection, wherein, point during this shooting corresponds to the point of the regulation of described probe unit when described camera unit takes described position alignment unique point, the point of described regulation when point during this inspection corresponds to the described contact of described inspection portion and described printed circuit board (PCB) monolithic and checks.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-040637 | 2014-03-03 | ||
| JP2014040637A JP5943523B2 (en) | 2014-03-03 | 2014-03-03 | Contact circuit pattern inspection apparatus and inspection method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104898010A true CN104898010A (en) | 2015-09-09 |
| CN104898010B CN104898010B (en) | 2017-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510161578.XA Expired - Fee Related CN104898010B (en) | 2014-03-03 | 2015-03-03 | Contact-type circuit pattern inspection device and its inspection method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5943523B2 (en) |
| CN (1) | CN104898010B (en) |
| TW (1) | TWI542870B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105223389A (en) * | 2015-09-28 | 2016-01-06 | 大族激光科技产业集团股份有限公司 | A kind of alignment method of flying probe tester |
| CN109725228A (en) * | 2018-12-24 | 2019-05-07 | 安徽省大富光电科技有限公司 | A kind of flexible circuit board conductive pattern on-Line Monitor Device |
| CN111627364A (en) * | 2019-02-27 | 2020-09-04 | 利尔富(苏州)科技设备有限公司 | Two-side detection device of display panel |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105911405B (en) * | 2016-03-30 | 2019-03-15 | 业成光电（深圳）有限公司 | The production method of anti-breaking formula electrical property loop |
| JP7303543B2 (en) * | 2019-08-30 | 2023-07-05 | ヤマハファインテック株式会社 | High-frequency characteristic inspection device and high-frequency characteristic inspection method |
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| CN111627364A (en) * | 2019-02-27 | 2020-09-04 | 利尔富(苏州)科技设备有限公司 | Two-side detection device of display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI542870B (en) | 2016-07-21 |
| JP2015166680A (en) | 2015-09-24 |
| CN104898010B (en) | 2017-10-13 |
| TW201546445A (en) | 2015-12-16 |
| JP5943523B2 (en) | 2016-07-05 |
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