CN104894537B - 一种单面导电的聚酰亚胺复合材料及其制备方法 - Google Patents
一种单面导电的聚酰亚胺复合材料及其制备方法 Download PDFInfo
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- CN104894537B CN104894537B CN201510376701.XA CN201510376701A CN104894537B CN 104894537 B CN104894537 B CN 104894537B CN 201510376701 A CN201510376701 A CN 201510376701A CN 104894537 B CN104894537 B CN 104894537B
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- preparation
- sided conductive
- composite polyimide
- polyimide material
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- 239000000463 material Substances 0.000 title claims abstract description 101
- 239000002131 composite material Substances 0.000 title claims abstract description 50
- 239000004642 Polyimide Substances 0.000 title claims abstract description 45
- 229920001721 polyimide Polymers 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 66
- 239000007921 spray Substances 0.000 claims abstract description 64
- 238000007747 plating Methods 0.000 claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 33
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 238000001035 drying Methods 0.000 claims abstract description 19
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 14
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 claims abstract description 13
- 238000005554 pickling Methods 0.000 claims abstract description 9
- 238000010926 purge Methods 0.000 claims abstract description 9
- 230000004913 activation Effects 0.000 claims abstract description 8
- 239000012528 membrane Substances 0.000 claims abstract description 8
- 238000007788 roughening Methods 0.000 claims abstract description 8
- 206010070834 Sensitisation Diseases 0.000 claims abstract description 6
- 230000008313 sensitization Effects 0.000 claims abstract description 6
- 239000012530 fluid Substances 0.000 claims description 37
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 36
- 239000000243 solution Substances 0.000 claims description 32
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Inorganic materials [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 22
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 20
- 230000003213 activating effect Effects 0.000 claims description 19
- 229910052763 palladium Inorganic materials 0.000 claims description 18
- 239000002585 base Substances 0.000 claims description 16
- 239000005543 nano-size silicon particle Substances 0.000 claims description 16
- 239000008367 deionised water Substances 0.000 claims description 13
- 229910021641 deionized water Inorganic materials 0.000 claims description 13
- 239000003513 alkali Substances 0.000 claims description 11
- 239000002202 Polyethylene glycol Substances 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 229920001223 polyethylene glycol Polymers 0.000 claims description 10
- 239000011780 sodium chloride Substances 0.000 claims description 10
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical group [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- 239000011259 mixed solution Substances 0.000 claims description 6
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 229940113088 dimethylacetamide Drugs 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000010408 sweeping Methods 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 10
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000007655 standard test method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- -1 N, N- dimethylacetamide Amine Chemical class 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 206010054949 Metaplasia Diseases 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- SDLBJIZEEMKQKY-UHFFFAOYSA-M silver chlorate Chemical compound [Ag+].[O-]Cl(=O)=O SDLBJIZEEMKQKY-UHFFFAOYSA-M 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
Claims (18)
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CN201510376701.XA CN104894537B (zh) | 2015-07-01 | 2015-07-01 | 一种单面导电的聚酰亚胺复合材料及其制备方法 |
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CN201510376701.XA CN104894537B (zh) | 2015-07-01 | 2015-07-01 | 一种单面导电的聚酰亚胺复合材料及其制备方法 |
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CN104894537A CN104894537A (zh) | 2015-09-09 |
CN104894537B true CN104894537B (zh) | 2018-04-06 |
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CN201510376701.XA Expired - Fee Related CN104894537B (zh) | 2015-07-01 | 2015-07-01 | 一种单面导电的聚酰亚胺复合材料及其制备方法 |
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Families Citing this family (2)
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CN114059050B (zh) * | 2020-08-03 | 2023-03-28 | 比亚迪股份有限公司 | 一种聚苯硫醚基材的表面粗化方法及金属化方法 |
CN117467990B (zh) * | 2023-10-11 | 2024-07-16 | 深圳中科利尔科技有限公司 | 一种提高铜层韧性的pcb化学镀铜方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1621603A (zh) * | 2004-12-14 | 2005-06-01 | 东华大学 | 一种锡包铜电磁屏蔽纺织品及其制备方法 |
CN101414496A (zh) * | 2008-11-13 | 2009-04-22 | 天津亿鑫通科技股份有限公司 | 双层分屏蔽信号传输同轴电缆 |
CN101476150A (zh) * | 2008-12-29 | 2009-07-08 | 广州电器科学研究院 | 一种电镀Sn-Cu合金的装置及其方法 |
CN201311792Y (zh) * | 2008-10-09 | 2009-09-16 | 天津亿鑫通科技股份有限公司 | 一种数字信号传输电缆 |
CN201477912U (zh) * | 2009-08-18 | 2010-05-19 | 王建荣 | 一种镀锡铜包铜合金线 |
CN202054913U (zh) * | 2011-03-01 | 2011-11-30 | 无锡新大中薄板有限公司 | 可焊性镀锡铝合金带 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4950553A (en) * | 1987-02-24 | 1990-08-21 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from polyimide film |
JPH05112872A (ja) * | 1991-10-21 | 1993-05-07 | Okuno Seiyaku Kogyo Kk | ポリイミド系樹脂の無電解めつき方法及びプリエツチング用組成物 |
JP4038985B2 (ja) * | 2000-12-28 | 2008-01-30 | 日立電線株式会社 | 半導体装置用テープキャリア |
CN1546727A (zh) * | 2003-12-11 | 2004-11-17 | �Ϻ���ͨ��ѧ | 一种聚合物薄膜表面的化学镀镍导电薄膜及其制备方法 |
KR100947608B1 (ko) * | 2007-12-28 | 2010-03-15 | 엘지전자 주식회사 | 연성 필름 |
CN102031505B (zh) * | 2009-09-25 | 2013-01-09 | 比亚迪股份有限公司 | 一种用于聚酰亚胺粗化活化的处理液和一种聚酰亚胺表面粗化活化的方法 |
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2015
- 2015-07-01 CN CN201510376701.XA patent/CN104894537B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1621603A (zh) * | 2004-12-14 | 2005-06-01 | 东华大学 | 一种锡包铜电磁屏蔽纺织品及其制备方法 |
CN201311792Y (zh) * | 2008-10-09 | 2009-09-16 | 天津亿鑫通科技股份有限公司 | 一种数字信号传输电缆 |
CN101414496A (zh) * | 2008-11-13 | 2009-04-22 | 天津亿鑫通科技股份有限公司 | 双层分屏蔽信号传输同轴电缆 |
CN101476150A (zh) * | 2008-12-29 | 2009-07-08 | 广州电器科学研究院 | 一种电镀Sn-Cu合金的装置及其方法 |
CN201477912U (zh) * | 2009-08-18 | 2010-05-19 | 王建荣 | 一种镀锡铜包铜合金线 |
CN202054913U (zh) * | 2011-03-01 | 2011-11-30 | 无锡新大中薄板有限公司 | 可焊性镀锡铝合金带 |
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Inventor after: Chen Honghui Inventor before: Yang Fang Inventor before: Sun Aixiang Inventor before: Gan Yong Inventor before: Zhang Xiaoli Inventor before: Chen Yuandao Inventor before: Gao Yuan |
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Effective date of registration: 20180302 Address after: No. 22, No. 415001, Longmei street, Changde economic and Technological Development Zone, Hunan Province, No. 1, No. 3, medium and small enterprise garden, 13. Applicant after: Chang Rui Rui Xin Materials Co., Ltd. Address before: No. 3150, Dongting Avenue, Chang Jiashan community, Wuling District, Changde City, Hunan Applicant before: Changde Vincellar metal material Co., Ltd |
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Effective date of registration: 20190322 Address after: 415001 No. 11 Songlin Road, Changde Economic and Technological Development Zone, Hunan Province Patentee after: Changde Dexin Enterprise Management Partnership (Limited Partnership) Address before: 415001 No. 22 Longmei Street, Changde Economic and Technological Development Zone, Hunan Province (Floor 3, Floor 13, Building 1, Small and Medium-sized Enterprise Park) Patentee before: Chang Rui Rui Xin Materials Co., Ltd. |
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