CN1042861C - 给半导体产品的基片涂膜装置和方法 - Google Patents
给半导体产品的基片涂膜装置和方法 Download PDFInfo
- Publication number
- CN1042861C CN1042861C CN94115782A CN94115782A CN1042861C CN 1042861 C CN1042861 C CN 1042861C CN 94115782 A CN94115782 A CN 94115782A CN 94115782 A CN94115782 A CN 94115782A CN 1042861 C CN1042861 C CN 1042861C
- Authority
- CN
- China
- Prior art keywords
- substrate
- spin coating
- whirligig
- guard circle
- filming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/105—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material by capillary action, e.g. using wicks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEPCT/DE93/00778 | 1993-08-26 | ||
SG1995001632A SG41944A1 (en) | 1993-08-26 | 1993-08-26 | Device for coating substrates in semiconductor production |
PCT/DE1993/000778 WO1995005901A1 (de) | 1993-08-26 | 1993-08-26 | Vorrichtung zur belackung von substraten in der halbleiterfertigung |
DEPCT/DE93/0778 | 1993-08-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1104372A CN1104372A (zh) | 1995-06-28 |
CN1042861C true CN1042861C (zh) | 1999-04-07 |
Family
ID=25960382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN94115782A Expired - Lifetime CN1042861C (zh) | 1993-08-26 | 1994-08-23 | 给半导体产品的基片涂膜装置和方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2657044B2 (zh) |
CN (1) | CN1042861C (zh) |
WO (1) | WO1995005901A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102641823B (zh) * | 2012-05-14 | 2015-10-28 | 中国科学院微电子研究所 | 一种微波匀胶装置及匀胶方法 |
CN102744538B (zh) * | 2012-06-11 | 2015-01-21 | 台州欧信环保净化器有限公司 | 一种金属蜂窝载体波峰去膏装置 |
JP6272138B2 (ja) * | 2014-05-22 | 2018-01-31 | 東京エレクトロン株式会社 | 塗布処理装置 |
CN104289386B (zh) * | 2014-09-16 | 2016-09-21 | 宁波大学 | 一种制备薄膜的高温旋涂装置及方法 |
EP3520906A4 (en) * | 2016-09-27 | 2019-08-28 | FUJIFILM Corporation | METHOD FOR PRODUCING A FILM |
CN107731661A (zh) * | 2017-11-14 | 2018-02-23 | 山东芯诺电子科技股份有限公司 | 一种玻璃钝化晶片玻璃胶涂覆方法及装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0180078A2 (en) * | 1984-10-29 | 1986-05-07 | International Business Machines Corporation | Apparatus and method for applying coating material |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2046596A (en) * | 1932-01-13 | 1936-07-07 | Patent Button Co | Apparatus for uniformly coating flat surfaces |
JPS5776835A (en) * | 1980-10-30 | 1982-05-14 | Nec Corp | Apparatus for applying liquid on semiconductor substrate |
US4370356A (en) * | 1981-05-20 | 1983-01-25 | Integrated Technologies, Inc. | Method of meniscus coating |
US5199990A (en) * | 1990-05-08 | 1993-04-06 | Zeniya Industry Co., Ltd. | Apparatus for solder-plating a lead-frame carrying electronic components |
-
1993
- 1993-08-26 WO PCT/DE1993/000778 patent/WO1995005901A1/de active IP Right Grant
-
1994
- 1994-08-23 CN CN94115782A patent/CN1042861C/zh not_active Expired - Lifetime
- 1994-08-26 JP JP6202338A patent/JP2657044B2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0180078A2 (en) * | 1984-10-29 | 1986-05-07 | International Business Machines Corporation | Apparatus and method for applying coating material |
Also Published As
Publication number | Publication date |
---|---|
JP2657044B2 (ja) | 1997-09-24 |
JPH07232126A (ja) | 1995-09-05 |
CN1104372A (zh) | 1995-06-28 |
WO1995005901A1 (de) | 1995-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6402845B1 (en) | Process liquid dispense method and apparatus | |
CA1237953A (en) | Inverted apply using bubble dispense | |
CN1042861C (zh) | 给半导体产品的基片涂膜装置和方法 | |
JPH10294261A (ja) | レジスト塗布装置 | |
CN102059197A (zh) | 喷涂***及方法 | |
CN109856914B (zh) | 涂胶装置及方法 | |
US6805900B2 (en) | Method of coating a substance on a surface of an article using a single meniscus | |
US6689419B2 (en) | Method for manufacturing semiconductor device | |
US6179031B1 (en) | Process for the adhesion of a flat plastic substrate in the form of a circular disk to a like second substrate for a digital video disc and apparatus for implementation of the process | |
KR100671071B1 (ko) | 두 판 형상의 대상물을 접착하는 장치 및 방법 | |
KR20020041418A (ko) | 스피닝 마이크로전자 기판 위의 공기를 제어하기 위한방법 및 장치 | |
US5650196A (en) | Device for coating substrates in semiconductor production | |
CA2165069C (en) | Device for coating substrates in semiconductor manufacture | |
JPH0969482A (ja) | 回転塗布装置 | |
JPH05329421A (ja) | ボンド塗布装置 | |
JPS63111961A (ja) | スピンコ−ト方法及びスピンコ−タ | |
JP3230891B2 (ja) | 塗布装置 | |
JPS62160171A (ja) | 樹脂の塗布方法 | |
JPH0824768A (ja) | 接着剤塗布方法 | |
JPS6265765A (ja) | 半導体装置用液体塗布装置 | |
JPH07308626A (ja) | ディスク用被膜形成装置及び方法 | |
JP2003059129A (ja) | 貼合型光メディア貼合方法、貼合型光メディア貼合装置及び貼合型光メディア | |
JPH04184913A (ja) | スピン方式塗布装置 | |
JPH0824877B2 (ja) | 回転式塗布装置 | |
JPH01286139A (ja) | 光ディスク製造装置における接着剤塗布装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Applicant after: STEAG MICROTECH GmbH Applicant before: Stig micro tech Fels Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: ROEHM + HAAS GMBH TO: STEAG MICRO/TECH GMBH STERNENFELS |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C53 | Correction of patent of invention or patent application | ||
COR | Change of bibliographic data |
Free format text: CORRECT: PATENTEE; FROM: STEAG MICRO/TECH GMBH STERNENFELS TO: STEGGE HAAM TECHNOLOGY STOCK CO., LTD. |
|
CP03 | Change of name, title or address |
Patentee after: STEAG HAMATECH AG Address before: German prietz Schoenberg Patentee before: STEAG MICROTECH GmbH |
|
ASS | Succession or assignment of patent right |
Owner name: SINGULUS TECHNOLOGIES AG Free format text: FORMER OWNER: HAMATECH AG Effective date: 20120828 Owner name: HAMATECH APE GMBH + CO. KG Free format text: FORMER OWNER: SINGULUS TECHNOLOGIES AG Effective date: 20120828 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: HAMATECH AG Free format text: FORMER NAME: STEAG HAMATECH GMBH MACHINES |
|
CP01 | Change in the name or title of a patent holder |
Address after: Don Fels, Germany Patentee after: HAMA Technologies AG Address before: Don Fels, Germany Patentee before: STEAG HAMATECH AG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20120828 Address after: Don Fels, Germany Patentee after: Hama Technology APE Lianghe Address before: German Messe Carle Patentee before: Singulus Technologies AG Effective date of registration: 20120828 Address after: German Messe Carle Patentee after: Singulus Technologies AG Address before: Don Fels, Germany Patentee before: HAMA Technologies AG |
|
C17 | Cessation of patent right | ||
CX01 | Expiry of patent term |
Expiration termination date: 20140823 Granted publication date: 19990407 |