CN1041860A - 装在背面的印刷电路板 - Google Patents
装在背面的印刷电路板 Download PDFInfo
- Publication number
- CN1041860A CN1041860A CN89107235A CN89107235A CN1041860A CN 1041860 A CN1041860 A CN 1041860A CN 89107235 A CN89107235 A CN 89107235A CN 89107235 A CN89107235 A CN 89107235A CN 1041860 A CN1041860 A CN 1041860A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- inserted sheet
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/18—Construction of rack or frame
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Packaging Frangible Articles (AREA)
- Mirrors, Picture Frames, Photograph Stands, And Related Fastening Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
Abstract
一种带有电接触件(7)的印刷电路板(3),可装入一插片框(2)的背面从而构成一插片箱(1)。一组具有与印刷电路板上的接触件相对应的电接触件(8)的印刷电路插片(6)可垂直***到插片箱的背面中。因此,该电路板成为这些插片在插片箱背面的电连接单元。依据本发明,所述印刷电路板是一种夹层元件(10)形式的自支撑的和加强的构件。
Description
本发明涉及一种带有电接触件的印刷电路板,这种印刷电路板能装入一插片框的背面,从而构成供印刷电路插片用的插片箱。印刷电路插片可垂直***背面,并且具有与上述印刷电路板上接触件相对应的电接触件。上述印刷电路板成为一种电连接单元,其功能是能将印刷电路插片连接到插片箱的背面。
现有的用于容纳印刷电路插片的插片箱,例如电话交换***中的插片箱,通常包括一插片框和一块背板。插片框由两块端面板和几条与其分别螺接的型材部分组成;而背板装在插片框的背面,用于对在用的插片框起机械加强作用,并与型材部分一起,用于支撑一块印刷电路板,该印刷电路板在垂直***箱体并***印刷电路板的各印刷电路插片间形成了一种连接单元。所述印刷电路板和各印刷电路插片带有相互连接的器件,用于使插片与电路板达到电连接。
由于印刷电路板相当薄,因此实际上难以抵御弯曲力和扭力。当经插片箱的后面的型材部分和插片箱的背板将印刷电路插片***插片箱或由其取出插片时,就会出现这种力。当插片箱很大时,就需要在插片框的背面设置附加的型材部分以进一步加强印刷电路板。因此,箱体背面的机械结构通常变得很复杂苯重,印刷电路板的附件也复杂化了,所包含的各工作步骤也很费时。再有,对印刷电路板部件进行的必要的机械加固,就意味着增加印刷电路板表面的不可利用的部分,因为需安放必要的附件。
因此,本发明的目的在于克服已有插片箱的缺点,以一种具有扭曲刚性的夹层元件形式构成一种自支撑结构的印刷电路板。
按照本发明的一个最佳实施例,此夹层元件包括一隔层元件,它和一底板连接,也和印刷电路板连接。
较可取的是,上述隔层元件是一层泡沫塑料,而底板是由和印刷电路板的线膨胀系数相同的材料制成。
按照本发明的一个最佳实施例,该隔层元件覆盖印刷电路板的整个背面。最好沿该印刷电路板的边缘设置紧固件或通孔,以便用螺丝或类似的紧固件将印刷电路板连接到插片框上。
最好是在完成该电路板的组装并对其测试之后接着将隔层元件装在印刷电路板上。
按照本发明制造的印刷电路板有许多优点。一个优点是,在插片框的背面无须设置用于承力和加固插片箱的单独的结构件,因为这种将印刷电路插片***箱体和由箱体中取出该插片所产生的力可被印刷电路板自身吸收,该印刷电路板还可加固插片框。
另一优点是,因为不需要设置用于加固插片框中印刷电路板的单独的结构件,因此所述电路板的整个表面均可用于配合电接触件而起作用。所以各接触件可在所提供的表面上自由配置,并能使用不同类型的电接触件。
再一优点是,自支撑的、具有扭曲刚性的该印刷电路板的尺寸不受箱体背面中机械加固构件存在的限制,因此印刷电路板制成的尺寸与插片框的大小无关,也就是可生产一种通用的、同时可用于几种插片箱的印刷电路板。
所发明的一种印刷电路板的进一步的优点可从以下的描述和附图中看出。
图1为一种插片框和本发明的一种印刷电路板所形成的电路插片箱的透视图;
图2为本发明印刷电路板的侧视图。
以下描述实施本发明的最佳方案。
图1为一插片箱1的透视图。该插片箱包括一插片框2和本发明的一印刷电路板3。插片框2是常规结构型式的,由两块端面板4和四条与端面板连接在一起的、并分别在四个角被紧固(例如用螺钉紧固)的型材部分5构成。插片框2通常用铝制成。但是,插片箱1的背板是由印刷电路板3构成,它代替了通常的背板,其特性将在下面作更详细的描述。
印刷电路插片6可垂直地***这样构成的插片箱的背板中,也就是可垂直地***印刷电路板3。电路板3成为各个印刷电路插片6之间的电连接单元,为此,它带有电接触件7,因此,各印刷电路插片也带有与所述印刷电路板的接触件相对应的电接触件8,如图1所示。插片6借助于分别在插片框2中上下型材料部分5里延伸的导轨9(例如塑料导规)可导入插片框2中。
以下参看图2对印刷电路板3进行描述。该印刷电路板用例如玻璃纤维增强环氧树脂制成,并设置有导电通路,以使该电路板起到印刷电路插片6之间的电连接单元的作用。如前所述,电接触件7是装在电路板前面的,为使该电路板3成为自支撑单元,板的后面以夹层元件10的形式形成一种加强结构。按照一种最佳实施例,该夹层元件10包括一隔层元件11,它与底板12粘接,同时固定在电路板上。该隔层元件是一层泡沫塑料,例如PVC;而底板12是由和印刷电路板3线膨胀系数相同的材料制成,通常为玻璃纤维增强环氧树脂制成。最好在做完电路板3并进行了测试和安装上电接触件7之后接着将隔层元件11粘接到电路板上。
为了使电路板3能装在插片框2的背面,沿电路板3的边缘开有通孔13,用螺丝将电路板3螺紧到插片框2的型材部分5的后部,或以某些其他合适的方式使其紧固。另外,亦可沿该印刷电路板的边缘设置紧固件,以便将其紧固于插片框的型材部分上。
如前所述,因为该印刷电路板是一种自支撑的、加强的构件,因此在插片箱的背面无需设置单独的结构加强件使箱体加固和支撑印刷电路板。此外,由于只是沿电路板边缘表面将电路板固定到插片框上,因此整个板的表面均可用来设置电接触件,这样各电接触件就可在该可用表面范围内自由放置。
应当了解,本发明并不局限于以上所描述和图示的实施例,在本发明的权利要求范围内还可作出各种改型。
Claims (7)
1、一种带有电接触件(7)的印刷电路板,能装入一插片框(2)的背面,从而构成一插片箱(1);一组印刷电路插片(6)可垂直***所述插片框的背面;该电路插片也具有与上述印刷电路板上的接触件相对应的电接触件(8),从而使上述印刷电路板成为一种电连接单元,用于将所述印刷电路插片固定于插片箱的背面;其特征在于,所述印刷电路板(3)是一种夹层元件(10)形式的自支撑的和加强的构件。
2、如权利要求1所述的印刷电路板,其特征在于,所述夹层元件(10)包括一隔层元件(11),它与所述电路板及底板(12)粘接。
3、如权利要求2所述的印刷电路板,其特征在于,所述的隔层元件(11)是一层泡沫塑料。
4、如权利要求2所述的印刷电路板,其特征在于,所述底板(12)是由和印刷电路板(3)线膨胀系数相同的材料制成。
5、如权利要求2-4之一所述的印刷电路板,其特征在于,所述的隔层元件(11)覆盖电路板(3)的整个背面。
6、如权利要求2-5之一所述的印刷电路板,其特征在于,所述隔层元件(11)是在做完电路板(3)并进行了测试和安装上电接触件(7)之后接着被固定到该电路板上的。
7、如上述权利要求中任一项所述的印刷电路板,其特征在于,所述电路板(3)的边缘设置有紧固件或开有通孔(13),以便用螺丝紧固件或类似元件将该电路板固定到插片框(2)上。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8803634A SE500807C2 (sv) | 1988-10-12 | 1988-10-12 | Mönsterkort med kontaktdon avsett för montering i bakplan av en kortram |
SE8803634-8 | 1988-10-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1041860A true CN1041860A (zh) | 1990-05-02 |
CN1015773B CN1015773B (zh) | 1992-03-04 |
Family
ID=20373605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN89107235A Expired CN1015773B (zh) | 1988-10-12 | 1989-09-16 | 装在背面的印刷电路板 |
Country Status (21)
Country | Link |
---|---|
US (1) | US4947288A (zh) |
EP (1) | EP0364416B1 (zh) |
JP (1) | JP2804330B2 (zh) |
KR (1) | KR950003245B1 (zh) |
CN (1) | CN1015773B (zh) |
AU (1) | AU612059B2 (zh) |
BR (1) | BR8907117A (zh) |
CA (1) | CA1302588C (zh) |
DE (1) | DE68918794T2 (zh) |
DK (1) | DK164432C (zh) |
DZ (1) | DZ1364A1 (zh) |
ES (1) | ES2062101T3 (zh) |
FI (1) | FI902593A0 (zh) |
IE (1) | IE65169B1 (zh) |
MA (1) | MA21653A1 (zh) |
MX (1) | MX171782B (zh) |
NO (1) | NO175960C (zh) |
SA (1) | SA90100074B1 (zh) |
SE (1) | SE500807C2 (zh) |
TR (1) | TR26727A (zh) |
WO (1) | WO1990004321A1 (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US5172306A (en) * | 1991-04-01 | 1992-12-15 | E-Systems, Inc. | Adaptive card mounting system |
US5138525A (en) * | 1991-06-14 | 1992-08-11 | Dell Usa Corporation | Multi-purpose strut for digital computer chassis |
US5214572A (en) * | 1991-08-21 | 1993-05-25 | International Business Machines Corporation | One-piece electronic cage |
FR2689990A1 (fr) * | 1992-04-14 | 1993-10-15 | Bull Sa | Structure d'accueil pour adaptateurs de terminaux. |
US5331517A (en) * | 1992-08-21 | 1994-07-19 | Ag Communication Systems Corporation | Retrofit card file adapter assembly |
US5424914A (en) * | 1993-11-24 | 1995-06-13 | Unisys Corporation | Through backplane impingement cooling apparatus |
US5459474A (en) * | 1994-03-22 | 1995-10-17 | Martin Marietta Corporation | Active array antenna radar structure |
US5949656A (en) * | 1994-06-01 | 1999-09-07 | Davox Corporation | Electronic assembly interconnection system |
US5982634A (en) * | 1996-11-14 | 1999-11-09 | Systran Corporation | High speed switch package provides reduced path lengths for electrical paths through the package |
US6061249A (en) * | 1997-11-12 | 2000-05-09 | Ericsson Inc. | Sealing system and method for sealing circuit card connection sites |
US6147863A (en) * | 1997-12-05 | 2000-11-14 | Moore; Ronald L. | Industrial computer |
DE19952246A1 (de) * | 1998-11-04 | 2000-05-31 | Thomson Brandt Gmbh | Elektromechanisches Bauteil |
US6320750B2 (en) * | 1998-11-24 | 2001-11-20 | Trw Inc. | Sub-modular configurable avionics |
US6285563B1 (en) * | 1999-03-31 | 2001-09-04 | Emc Corporation | Support bracket for a printed circuit board connectable to daughter boards |
US6549027B1 (en) | 2000-02-01 | 2003-04-15 | Sun Microsystems, Inc. | Apparatus and method for testing for compatibility between circuit boards |
WO2002098196A1 (de) * | 2001-05-29 | 2002-12-05 | Siemens Aktiengesellschaft | Baugruppenträger mit einer anschlussleiste zur aufnahme von verbinderbauteilen |
US7251145B1 (en) * | 2004-08-18 | 2007-07-31 | Sun Microsystems, Inc. | Inject/eject mechanism for circuit boards |
WO2015185307A1 (de) * | 2014-06-05 | 2015-12-10 | Siemens Ag Österreich | Mittel und verfahren zur befestigung einer leiterplatte |
JP7041085B2 (ja) * | 2019-02-05 | 2022-03-23 | ファナック株式会社 | 電子装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3810433A (en) * | 1972-08-09 | 1974-05-14 | Ncr Co | Printed circuit card guide |
US3992686A (en) * | 1975-07-24 | 1976-11-16 | The Singer Company | Backplane transmission line system |
JPS5384171A (en) * | 1976-12-29 | 1978-07-25 | Fujitsu Ltd | Structure for mounting printed board |
US4131933A (en) * | 1977-04-29 | 1978-12-26 | International Business Machines Corporation | Quick disconnect card-on-board electronic package assembly |
US4134631A (en) * | 1977-09-13 | 1979-01-16 | Amp Incorporated | Modular plug board system |
US4511950A (en) * | 1983-06-27 | 1985-04-16 | Northern Telecom Limited | Backpanel assemblies |
US4697858A (en) * | 1986-02-07 | 1987-10-06 | National Semiconductor Corporation | Active bus backplane |
-
1988
- 1988-10-04 TR TR89/0860A patent/TR26727A/xx unknown
- 1988-10-12 SE SE8803634A patent/SE500807C2/sv unknown
-
1989
- 1989-08-23 KR KR1019900701200A patent/KR950003245B1/ko not_active IP Right Cessation
- 1989-08-23 JP JP1509031A patent/JP2804330B2/ja not_active Expired - Lifetime
- 1989-08-23 BR BR898907117A patent/BR8907117A/pt not_active IP Right Cessation
- 1989-08-23 AU AU40784/89A patent/AU612059B2/en not_active Ceased
- 1989-08-23 WO PCT/SE1989/000441 patent/WO1990004321A1/en active Application Filing
- 1989-08-23 ES ES89850267T patent/ES2062101T3/es not_active Expired - Lifetime
- 1989-08-23 DE DE68918794T patent/DE68918794T2/de not_active Expired - Fee Related
- 1989-08-23 EP EP89850267A patent/EP0364416B1/en not_active Expired - Lifetime
- 1989-08-31 US US07/401,165 patent/US4947288A/en not_active Expired - Lifetime
- 1989-09-07 IE IE286889A patent/IE65169B1/en not_active IP Right Cessation
- 1989-09-15 CA CA000611603A patent/CA1302588C/en not_active Expired - Lifetime
- 1989-09-16 CN CN89107235A patent/CN1015773B/zh not_active Expired
- 1989-09-21 MX MX017635A patent/MX171782B/es unknown
- 1989-10-08 DZ DZ890156A patent/DZ1364A1/fr active
- 1989-10-10 MA MA21905A patent/MA21653A1/fr unknown
-
1990
- 1990-01-03 SA SA90100074A patent/SA90100074B1/ar unknown
- 1990-05-24 FI FI902593A patent/FI902593A0/fi not_active IP Right Cessation
- 1990-06-01 NO NO902454A patent/NO175960C/no unknown
- 1990-06-08 DK DK141290A patent/DK164432C/da not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DZ1364A1 (fr) | 2004-09-13 |
WO1990004321A1 (en) | 1990-04-19 |
NO175960C (no) | 1995-01-04 |
MX171782B (es) | 1993-11-15 |
IE892868L (en) | 1990-04-12 |
ES2062101T3 (es) | 1994-12-16 |
CN1015773B (zh) | 1992-03-04 |
NO902454D0 (no) | 1990-06-01 |
SE8803634L (sv) | 1990-04-13 |
DK141290D0 (da) | 1990-06-08 |
DE68918794T2 (de) | 1995-02-23 |
AU612059B2 (en) | 1991-06-27 |
JPH03501793A (ja) | 1991-04-18 |
AU4078489A (en) | 1990-05-01 |
MA21653A1 (fr) | 1990-07-01 |
IE65169B1 (en) | 1995-10-04 |
NO902454L (no) | 1990-06-01 |
SE500807C2 (sv) | 1994-09-05 |
CA1302588C (en) | 1992-06-02 |
SA90100074B1 (ar) | 1995-12-23 |
NO175960B (no) | 1994-09-26 |
US4947288A (en) | 1990-08-07 |
EP0364416A1 (en) | 1990-04-18 |
SE8803634D0 (sv) | 1988-10-12 |
JP2804330B2 (ja) | 1998-09-24 |
DE68918794D1 (de) | 1994-11-17 |
BR8907117A (pt) | 1991-02-05 |
KR950003245B1 (ko) | 1995-04-06 |
KR900702760A (ko) | 1990-12-08 |
EP0364416B1 (en) | 1994-10-12 |
DK141290A (da) | 1990-06-08 |
DK164432C (da) | 1992-11-16 |
FI902593A0 (fi) | 1990-05-24 |
DK164432B (da) | 1992-06-22 |
TR26727A (tr) | 1994-07-06 |
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