CN103943619B - A kind of great power LED COB flip-chip packaged structure of automobile lighting - Google Patents
A kind of great power LED COB flip-chip packaged structure of automobile lighting Download PDFInfo
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- CN103943619B CN103943619B CN201410191968.7A CN201410191968A CN103943619B CN 103943619 B CN103943619 B CN 103943619B CN 201410191968 A CN201410191968 A CN 201410191968A CN 103943619 B CN103943619 B CN 103943619B
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Abstract
The great power LED COB flip-chip packaged structure of a kind of automobile lighting, including support (1), ESD protector (2), LED chip (3), ceramic fluorescent sheet (4), box dam (5), printed circuit (6) and electrode (7).Printed circuit (6) is positioned at the top of support (1), and printed circuit (6) is welded with the electrode (7) needed for power supply, and LED chip (3) is packaged on the printed circuit (6) of support (1), and ceramic fluorescent sheet (4) is fixed on box dam (5).LED chip (3) is connected in series on electrode (7), and ESD protector (2) is connected in parallel with LED chip (3) group.The present invention has good illuminating effect, and the LED chip of its light-source structure uses flip-chip packaged method, and its performance such as radiating effect, light output efficiency is the most excellent.
Description
Technical field
The invention belongs to technical field of semiconductor illumination, be specifically related to the great power LED COB encapsulation of a kind of automobile lighting
Structure.
Technical background
Now with LED as novel illumination light source in the gradually rise of illumination market, its range covers from platform
The home lightings such as lamp are to the various aspects of the public illuminations such as street lamp.Have benefited from LED illuminating source specular removal, small size, low-power consumption
Etc. advantage so that it is at the illuminating effect beyond tradition light source far away of multiple illumination occasion.Especially in automotive lighting industry,
It has been inundant trend that LED replaces conventional light source.But it is limited by the requirement that GB designs for car headlamp, general
The LED illumination light source of logical encapsulating structure can not well meet design requirement.
At present, both at home and abroad for using directly encapsulation the encapsulation of normal illumination sources, it is then coated with the encapsulation of fluorescent glue more
Technique, this structure and technique range of application are quite varied, but in the bright design of Special use occasion, such as vehicle front lighting
In, this encapsulating structure there is problems in that the power of 1. automotive lighting list chips can get to 2 ∽ 3W, when using COB envelope
The when of dress, heat density is the highest, and directly the Sapphire Substrate of encapsulation chip have impact on the transmission of heat；2. automotive lighting light source is
Light efficiency utilizes the highest a kind of occasion, and directly the light extraction efficiency of encapsulation chip is lower by more than 20% than flip-chip, have impact on light
Directly utilize；3. the highest due to the heat density of automotive lighting light source, long-time use fluorescent glue can cause its ageing failure.
Summary of the invention
For drawbacks described above, it is an object of the invention to provide the high-power LE encapsulating structure of a kind of automobile lighting, this
Structure can use COB flip-chip packaged, coordinates Ceramics Ceramic flourescent sheet and esd protection circuit, it is achieved efficient, stable big merit
The COB encapsulation of rate LED chip.
The technical scheme is that and be accomplished by: the great power LED COB upside-down mounting of a kind of automobile lighting
Encapsulating structure, is made up of support, ESD protector, LED chip, ceramic fluorescent sheet, box dam, printed circuit and electrode, described print
Brush circuit is positioned at the top of support, and printed circuit is welded with the electrode needed for power supply, and LED chip is packaged in the printing electricity of support
Lu Shang, ceramic fluorescent sheet is mounted on the top of LED chip and is fixed on box dam；It is characterized in that: described LED chip series connection
Being connected on electrode, ESD protector is connected in parallel with LED chip group.
The material of described support is aluminium nitride ceramics, and thickness is 0.5-1.6mm.
Described printed circuit is positioned at the top of support, and the upside-down mounting eutectic for LED chip welds and the connection of electrode,
And power for LED chip.
Described LED chip is to be connected in series by multiple chips, and four chips are 2 × 1,3 × 1,4 × 1,5 × 1,6 × 1
Mode arranges, and is spaced apart 0.1-0.5mm between every two.
Mount ceramic fluorescent sheet in described LED chip, and fixed by box dam.
Described ESD protector is in parallel with COB LED chip.
The present invention, with LED as light source, power is little, and system energy consumption is little, and the life-span is long；May be used for upside-down mounting and formal dress two kinds
Packaged type；LED chip, good heat dissipation effect, light extraction efficiency is high；By multiple LED chip Series Packages, there is stronger innovation
Property；Use the COB encapsulation mode of N × 1, at illuminator before and after automobile.
Accompanying drawing explanation
Fig. 1 is the COB encapsulating structure figure of the 4 × 1 of automobile lighting LED chip of the present invention.
Fig. 2 is the COB circuit diagram of the 4 × 1 of automobile lighting LED chip of the present invention.
Detailed description of the invention
The great power LED COB flip-chip packaged structure of automobile lighting by support 1, ESD protector 2, LED chip 3, pottery glimmering
Mating plate 4, box dam 5, printed circuit 6 and electrode 7 form, and support 1 is aluminium nitride ceramics, and printed circuit 6 is positioned at support 1 top, print
Being welded with the electrode 7 needed for power supply on brush circuit 6, LED chip 3 is positioned at printed circuit 6 top of support 1, and ceramic fluorescent sheet 4 pastes
It is loaded on LED chip 3 top and is fixed on box dam 5.LED chip 3 is connected in series on electrode 7, ESD protector 2 and LED chip
3 modules in parallel connect.The great power LED COB flip-chip packaged structure of automobile lighting is formed with this.
Embodiment 1:
As shown in Figure 1 and Figure 2, be the present invention for the 4 × 1 of car headlamp LED chip COB encapsulating structure schematic diagram,
Support 1 is aluminium nitride ceramics, and thickness is 0.6mm.Upper width is 10mm, and height is 8mm；Printed circuit 6 is positioned at the upper of support 1
Portion, for fixed electrode 7, and powers for ESD protector 2 and LED chip 3；ESD protector 2 is by printed circuit 2 and LED
Chip 3 is connected in parallel, and LED chip 3 is to be formed flip-chip packaged by 4 CREE DA1000 chip-in series, and four chips are 4 × 1 sides
Formula arranges, and is spaced apart 0.2mm between every two；Electrode 7 is positioned on printed circuit board (PCB) 1, is used for connecting external electric supply installation；Pottery
Porcelain flourescent sheet 4 is mounted on LED chip 3 top and is fixed on box dam 5.
Claims (5)
1. a great power LED COB flip-chip packaged structure for automobile lighting, by support (1), ESD protector (2), LED chip
(3), ceramic fluorescent sheet (4), box dam (5), printed circuit (6) and electrode (7) composition；Described printed circuit (6) is positioned at support
(1) top, printed circuit (6) is welded with the electrode (7) needed for power supply, and LED chip (3) is packaged in the printing of support (1)
On circuit (6), ceramic fluorescent sheet (4) is mounted on the top of LED chip (3) and is fixed on box dam (5)；It is characterized in that: institute
The LED chip (3) stated is connected in series on electrode (7), and ESD protector (2) is connected in parallel with LED chip (3) group.
The great power LED COB flip-chip packaged structure of a kind of automobile lighting the most according to claim 1, it is characterised in that:
Described support (1) is aluminium nitride ceramics, and thickness is 0.5-1.6mm.
The great power LED COB flip-chip packaged structure of a kind of automobile lighting the most according to claim 1, it is characterised in that:
Described printed circuit (6) is positioned at the top of support (1), for LED chip (3) upside-down mounting eutectic weld and with electrode (7)
Connection, and be LED chip (3) power supply.
The great power LED COB flip-chip packaged structure of a kind of automobile lighting the most according to claim 1, it is characterised in that:
Described LED chip (3) is to be connected in series by multiple chips, and four chips are that 2 × 1,3 × 1,4 × 1,5 × 1,6 × 1 modes are arranged
Row, are spaced apart 0.1-0.5mm between every two.
The great power LED COB flip-chip packaged structure of a kind of automobile lighting the most according to claim 1, it is characterised in that:
Described electrode (7) is positioned on printed circuit (6), is used for connecting external electric supply installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410191968.7A CN103943619B (en) | 2014-05-08 | 2014-05-08 | A kind of great power LED COB flip-chip packaged structure of automobile lighting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410191968.7A CN103943619B (en) | 2014-05-08 | 2014-05-08 | A kind of great power LED COB flip-chip packaged structure of automobile lighting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103943619A CN103943619A (en) | 2014-07-23 |
| CN103943619B true CN103943619B (en) | 2016-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410191968.7A Active CN103943619B (en) | 2014-05-08 | 2014-05-08 | A kind of great power LED COB flip-chip packaged structure of automobile lighting |
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| CN (1) | CN103943619B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119386A (en) * | 2018-08-06 | 2019-01-01 | 扬州虹扬科技发展有限公司 | Diode package structure and diode with its structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| CN102214652A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light emitting diode) packaging structure and preparation method thereof |
| CN203883000U (en) * | 2014-05-08 | 2014-10-15 | 江苏洪昌科技股份有限公司 | Large power LED COB inverted packaging structure for automotive lighting |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090190277A1 (en) * | 2007-09-28 | 2009-07-30 | Super Talent Electronics, Inc. | ESD Protection For USB Memory Devices |
| WO2011036981A1 (en) * | 2009-09-24 | 2011-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR101900423B1 (en) * | 2011-09-19 | 2018-09-21 | 삼성전자주식회사 | Semiconductor memory device |
-
2014
- 2014-05-08 CN CN201410191968.7A patent/CN103943619B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102214649A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light-emitting diode) packaging structure and manufacturing method thereof |
| CN102214652A (en) * | 2011-05-25 | 2011-10-12 | 映瑞光电科技(上海)有限公司 | LED (light emitting diode) packaging structure and preparation method thereof |
| CN203883000U (en) * | 2014-05-08 | 2014-10-15 | 江苏洪昌科技股份有限公司 | Large power LED COB inverted packaging structure for automotive lighting |
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| Publication number | Publication date |
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| CN103943619A (en) | 2014-07-23 |
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