CN103775983B - LED manufacture method - Google Patents
LED manufacture method Download PDFInfo
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- CN103775983B CN103775983B CN201410052344.7A CN201410052344A CN103775983B CN 103775983 B CN103775983 B CN 103775983B CN 201410052344 A CN201410052344 A CN 201410052344A CN 103775983 B CN103775983 B CN 103775983B
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- substrate
- flexible board
- led
- manufacture method
- circuit
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 131
- 239000011324 bead Substances 0.000 claims abstract description 28
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000005286 illumination Methods 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A kind of LED, including multiple lamp bead, multiple substrate and multiple flexible board；Lamp bead is arranged on substrate, and the two ends of flexible board are separately fixed on adjacent two substrate, and multiple substrate is connected by flexible board, and multiple substrates surround column, taper or frustum；The inside of substrate and flexible board is provided with circuit, and lamp bead electrically connects with the circuit in substrate, and the circuit in substrate electrically connects with the circuit of the flexible board being fixed on substrate.Above-mentioned LED, utilizes bent flexible board to connect the most bent substrate, and the heat conductivility of flexible board is poor, the heat conductivility of substrate is preferable, lamp bead can utilize the heat conductivility of substrate to dispel the heat, and LED utilizes the bent performance of flexible board to bend, it is achieved the illumination of multi-angle.Meanwhile, a kind of LED manufacture method for manufacturing above-mentioned LED is additionally provided.
Description
Technical field
The present invention relates to the technical field of light fixture, particularly relate to a kind of LED and preparation method thereof.
Background technology
In order to meet the illumination of multi-angle, the substrate of LED is sometimes for bending, but general substrate is
Rigid, it is impossible to realize bending.
Summary of the invention
Based on this, it is necessary to for the problem of the substrate bending of LED, it is provided that a kind of LED and making thereof
Method.
A kind of LED, including multiple lamp bead, multiple substrate and multiple flexible board；
Described lamp bead is arranged on the substrate, and the two ends of described flexible board are separately fixed at adjacent two institute
Stating on substrate, and multiple described substrate is connected by described flexible board, multiple described substrates surround column, cone
Shape or frustum；
The inside of described substrate and described flexible board is provided with circuit, described lamp bead and the electricity in described substrate
Road electrically connects, and the circuit in described substrate electrically connects with the circuit of fixing described flexible board on the substrate.
Wherein in an embodiment, the plurality of substrate includes N number of rectangular first substrate and a N
The second substrate of limit shape；
N number of described first substrate is sequentially connected with by described flexible board, and N number of described first substrate is around shape
Become prism；
Described second substrate is positioned at one end of described prism, and described second substrate with one of them described first
Substrate is connected by described flexible board；
Wherein, N is the natural number more than or equal to 3.
Wherein in an embodiment, also include that lamp housing and pedestal, the other end of described prism are fixedly connected on
On described pedestal, and described prism is positioned at described lamp housing, and described lamp housing is fixing with described pedestal to be connected.
Wherein in an embodiment, a described first substrate arranges multiple described lamp bead, and same
Multiple lamp bead on described first substrate are spaced along the bearing of trend of described first substrate.
Wherein in an embodiment, two adjacent described first substrates are connected by two described flexible boards,
And two described flexible boards are respectively close to the two ends of described first substrate.
Wherein in an embodiment, two adjacent described first substrates are connected by a described flexible board,
Two the described flexible boards being connected are fixed respectively close to the two of described first substrate with same described first substrate
End.
Wherein in an embodiment, the fixing mode on the substrate of described flexible board is for being welded and fixed.
Wherein in an embodiment, described substrate is aluminium base, copper base or iron substrate.
Wherein in an embodiment, described substrate is rigid printed circuit plate, and described flexible board is for flexible
The printed circuit board (PCB) made of insulating substrate.
A kind of LED manufacture method, for manufacturing described LED, comprises the steps:
On integral basis plate, V cuts, and forms multiple V and cuts groove；
The two ends of flexible board are respectively welded on described integral basis plate, the circuit of described flexible board is whole with described
The two ends of described flexible board are respectively arranged at described V and cut the both sides of groove by the circuit electrical connection in substrate；
Bend described integral basis plate, make described integral basis plate cut groove along described V and disconnect the multiple substrates of formation；
The plurality of substrate surrounds column, taper or frustum.
Above-mentioned LED, utilizes bent flexible board to connect the most bent substrate, the heat conductivility of substrate
Preferably, lamp bead can utilize the heat conductivility of substrate to dispel the heat, and LED utilizes the bent performance of flexible board to enter
Row bending, it is achieved the illumination of multi-angle.
Above-mentioned LED manufacture method, is cut by V on integral basis plate, welds flexible board, bends integral basis afterwards
Plate forms multiple substrate, in that context it may be convenient to manufacture above-mentioned LED.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of an embodiment LED；
Fig. 2 is the expansion schematic diagram of LED shown in Fig. 1；
Fig. 3 is the expansion schematic diagram of another embodiment LED；
Fig. 4 is the flow chart of an embodiment LED manufacture method.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, LED and preparation method thereof is carried out more
Comprehensively describe.Accompanying drawing gives the first-selected embodiment of LED and preparation method thereof.But, LED
And preparation method thereof can realize in many different forms, however it is not limited to embodiment described herein.
On the contrary, providing the purpose of these embodiments is to make the disclosure to LED and preparation method thereof more saturating
Thorough comprehensively.
Unless otherwise defined, all of technology used herein and scientific terminology and the technology belonging to the present invention
The implication that the technical staff in field is generally understood that is identical.Herein in the description of LED and preparation method thereof
Used in term be intended merely to describe specific embodiment purpose, it is not intended that in limit the present invention.
Term as used herein " and/or " include the arbitrary and all of one or more relevant Listed Items
Combination.
As it is shown in figure 1, the LED 100 of an embodiment, including multiple lamp bead 10, multiple substrate 20,
Multiple flexible boards 30, lamp housing 40 and pedestal 50.General substrate 20 heat conductivility is preferable, but not bendable
Folding, lamp bead 10 arranges on the base plate 20, and beneficially lamp bead 10 is dispelled the heat, and the two ends of flexible board 30 are fixed respectively
On two adjacent substrates 20, and multiple substrate 20 is connected by flexible board 30, and multiple substrates 20 enclose
Become column, taper or frustum.Wherein in an embodiment, flexible board 30 is fixed on the base plate 20
Mode is for being welded and fixed.The inside of substrate 20 and flexible board 30 is provided with circuit, lamp bead 10 and substrate 20
Interior circuit electrical connection, the circuit in substrate 20 is electrically connected with the circuit of fixing flexible board 30 on the base plate 20
Connect.Multiple lamp bead 10, multiple substrate 20, multiple flexible board 30 are arranged in lamp housing 40, and multiple lamp bead
10 are electrically connected with the circuit in pedestal 50 by the circuit of substrate 20 and flexible board 30.
Substrate 20 can be rigid printed circuit plate, and flexible board 30 can be made with flexible insulating substrate
Printed circuit board (PCB).Flexible PCB (Flexible Printed Circuit Board) also known as " FPC flexible board ",
The printed circuit made with flexible insulating substrate, can with free bend, but the heat conduction of flexible PCB
Poor performance, it is impossible to for high-power LED lamp.Wherein in an embodiment, substrate 20 is aluminium base
20, copper base 20 or iron substrate 20.Above-mentioned LED 100, utilizes bent flexible board 30 to connect not
Bent substrate 20, the heat conductivility of flexible board 30 is poor, and the heat conductivility of substrate 20 is preferable, lamp bead
10 can utilize the heat conductivility of substrate 20 to dispel the heat, and LED 100 utilizes the bent performance of flexible board 30
Bend, it is achieved the illumination of multi-angle.The technical scheme of the present embodiment is particularly well-suited to high-power LED
Lamp 100.Wherein in an embodiment, lamp housing 40 and pedestal 50 can be according to different types of LED
100 are set to different shapes and structure, or can be not provided with lamp housing 40 and pedestal according to need for environment
50。
Referring also to Fig. 2, multiple substrates 20 include N number of rectangular first substrate 220 and a N limit shape
Second substrate 240.Wherein, N is the natural number more than or equal to 3.N number of first substrate 220 is by soft
Property plate 30 be sequentially connected with, and N number of first substrate 220 around formed prism.Second substrate 240 is positioned at prism
One end, and second substrate 240 is connected by flexible board 30 with one of them first substrate 220.In figure
Embodiment is 6 rectangular first substrates 220 and a hexagonal second substrate 240.One wherein
In embodiment, the other end of prism is fixedly connected on pedestal 50, and prism is positioned at lamp housing 40, lamp housing
40 fixing with pedestal 50 are connected.Multiple lamp bead 10 can be set on one first substrate 220, and same
Multiple lamp bead 10 on first substrate 220 can be spaced along the bearing of trend of first substrate 220.Arrange
Multiple lamp bead 10 can meet the requirement of brightness, and multiple lamp bead 10 can be along the bearing of trend of first substrate 220
It is spaced and beneficially dispels the heat.Wherein in an embodiment, second substrate 240 can be offered for cabling
Cable hole 242.
Adjacent two first substrates 220 are connected by one or more flexible boards 30, the enforcement shown in Fig. 2
In example, adjacent two first substrates 220 are connected by two flexible boards 30, and two flexible boards 30 points
Not near the two ends of first substrate 220.Two flexible boards 30 can be respectively the lamp bead 10 near its junction
Conduction, makes electric current relative distribution, reduces the heating of flexible board 30.Referring also to Fig. 3, wherein a reality
Executing in example, adjacent two first substrates 220 are connected, with same first substrate by a flexible board 30
220 fixing two flexible boards 30 connected are respectively close to the two ends of first substrate 220.By a flexible board
30 connect the material that can save flexible board 30, and flexible board 30 is alternately arranged can reduce circuit in substrate 20
Length, save material and reduce energy loss.
As shown in Figure 4, LED 100 manufacture method of an embodiment, it is used for manufacturing Fig. 1 to Fig. 3 institute
The LED 100 shown, referring also to Fig. 1 to Fig. 3, LED 100 manufacture method comprises the steps:
S120, on integral basis plate 20, V cuts, and forms multiple V and cuts groove.
The two ends of flexible board 30 are respectively welded on integral basis plate 20 by S140, by the circuit of flexible board 30 with
The two ends of flexible board 30 are respectively arranged at V and cut the both sides of groove by the circuit electrical connection in integral basis plate 20.
S160, bends integral basis plate 20, makes integral basis plate 20 cut groove along V and disconnects the multiple substrates 20 of formation.
S180, multiple substrates 20 surround column, taper or frustum.
Wherein in an embodiment, substrate 20 is fixedly connected on the pedestal 50 of LED 100, and base
Plate 20 is positioned at the lamp housing 40 of LED 100, and LED 100 manufacture method also includes solid for substrate 20
Surely it is connected on the pedestal 50 of LED 100, and by fixing with pedestal 50 for lamp housing 40 step being connected.
The LED 100 manufactured by above-mentioned LED 100 manufacture method, it is possible to use bent flexibility
Plate 30 connects the most bent substrate 20, and the heat conductivility of flexible board 30 is poor, the heat conductivility of substrate 20
Preferably, fixing lamp bead 10 on the base plate 20 can utilize the heat conductivility of substrate 20 to dispel the heat, LED
100 utilize the bent performance of flexible board 30 to bend, it is achieved the illumination of multi-angle.Above-mentioned LED
100 manufacture methods, are cut by V on integral basis plate 20, weld flexible board 30, afterwards bending integral basis plate 20
Form multiple substrate 20, in that context it may be convenient to manufacture LED 100.
Above example only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that, for this area
For those of ordinary skill, without departing from the inventive concept of the premise, it is also possible to make some deformation and change
Entering, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be as the criterion.
Claims (8)
1. a LED manufacture method, it is characterised in that be used for manufacturing LED, described LED bag
Include multiple lamp bead, multiple substrate and multiple flexible board；Described lamp bead is arranged on the substrate, described flexibility
The two ends of plate are separately fixed on the described substrate of adjacent two, and multiple described substrate is by described flexible board
Connect；The inside of described substrate and described flexible board is provided with in circuit, described lamp bead and described substrate
Circuit electrically connects, and the circuit in described substrate is electrically connected with the circuit of fixing described flexible board on the substrate
Connect；The plurality of substrate includes N number of rectangular first substrate and the second substrate of a N limit shape；N number of
Described first substrate is sequentially connected with by described flexible board, and N number of described first substrate is around forming prism；
Described second substrate is positioned at one end of described prism, and described second substrate and one of them described first substrate
Connected by described flexible board；Wherein, N is the natural number more than or equal to 3；
Described LED manufacture method comprises the steps:
On integral basis plate, V cuts, and forms multiple V and cuts groove；
The two ends of flexible board are respectively welded on described integral basis plate, the circuit of described flexible board is whole with described
The two ends of described flexible board are respectively arranged at described V and cut the both sides of groove by the circuit electrical connection in substrate；
Bend described integral basis plate, make described integral basis plate cut groove along described V and disconnect the multiple substrates of formation；
Wherein, N number of described first substrate is around forming prism, and described second substrate is positioned at the one of described prism
End.
LED manufacture method the most according to claim 1, it is characterised in that described LED is also
Including lamp housing and pedestal, the other end of described prism is fixedly connected on described pedestal, and described prism is positioned at
In described lamp housing, described lamp housing is fixing with described pedestal to be connected.
LED manufacture method the most according to claim 1, it is characterised in that one described first
Multiple lamp bead in multiple described lamp bead, and same described first substrate are set on substrate along described first base
The bearing of trend of plate is spaced.
LED manufacture method the most according to claim 1, it is characterised in that two adjacent institutes
State first substrate to be connected by two described flexible boards, and two described flexible boards are respectively close to described first base
The two ends of plate.
LED manufacture method the most according to claim 1, it is characterised in that two adjacent institutes
State first substrate to be connected by a described flexible board, fix, with same described first substrate, two be connected
Described flexible board is respectively close to the two ends of described first substrate.
6. according to the LED manufacture method described in any one of claim 1 to 5, it is characterised in that institute
State the fixing mode on the substrate of flexible board for being welded and fixed.
7. according to the LED manufacture method described in any one of claim 1 to 5, it is characterised in that institute
Stating substrate is aluminium base, copper base or iron substrate.
8. according to the LED manufacture method described in any one of claim 1 to 5, it is characterised in that institute
Stating substrate is rigid printed circuit plate, and described flexible board is the printed circuit board (PCB) made with flexible insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410052344.7A CN103775983B (en) | 2014-02-14 | 2014-02-14 | LED manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410052344.7A CN103775983B (en) | 2014-02-14 | 2014-02-14 | LED manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103775983A CN103775983A (en) | 2014-05-07 |
| CN103775983B true CN103775983B (en) | 2017-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410052344.7A Active CN103775983B (en) | 2014-02-14 | 2014-02-14 | LED manufacture method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI579492B (en) * | 2015-05-11 | 2017-04-21 | 綠點高新科技股份有限公司 | Manufacturing method of a lamp and the lamp |
| JP6839701B2 (en) * | 2015-09-04 | 2021-03-10 | シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． | Lighting equipment with flexible circuit strips wrapped around a support |
| CN106545756A (en) * | 2016-10-18 | 2017-03-29 | 上海顿格电子贸易有限公司 | A kind of Universal LED substrate |
| CN106764779A (en) * | 2016-11-14 | 2017-05-31 | 广东雷腾智能光电有限公司 | A kind of manufacture method of vehicle lamp light source |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009032984B3 (en) * | 2009-07-14 | 2011-03-03 | Osram Gesellschaft mit beschränkter Haftung | Flexible lighting modules and method for producing bendable lighting modules |
| CN201636576U (en) * | 2009-12-30 | 2010-11-17 | 泰科电子(上海)有限公司 | Led lamp |
| CN202432286U (en) * | 2011-12-08 | 2012-09-12 | 深圳市众明半导体照明有限公司 | Light source module capable of being bent |
| CN203375241U (en) * | 2013-08-23 | 2014-01-01 | 佛山市崇达照明电器有限公司 | Flexible led lamp |
| CN203784852U (en) * | 2014-02-14 | 2014-08-20 | 深圳市裕富照明有限公司 | LED (light emitting diode) lamp |
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2014
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| Publication number | Publication date |
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| CN103775983A (en) | 2014-05-07 |
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Address after: Building A, B, C, and D, Industrial Park, No. 10 Huanping Road, Gaoqiao Community, Pingdi Street, Longgang District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Yufu Lighting Co.,Ltd. Country or region after: China Address before: 518000 Industrial Park, No. 6 Fugao East Road, Gaoqiao Community, Pingdi Street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Eastfield Lighting Co.,Ltd. Country or region before: China |
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