CN103471899B - 硅片加工装置 - Google Patents
硅片加工装置 Download PDFInfo
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- CN103471899B CN103471899B CN201310383210.9A CN201310383210A CN103471899B CN 103471899 B CN103471899 B CN 103471899B CN 201310383210 A CN201310383210 A CN 201310383210A CN 103471899 B CN103471899 B CN 103471899B
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- Mechanical Treatment Of Semiconductor (AREA)
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CN201310383210.9A CN103471899B (zh) | 2013-08-28 | 2013-08-28 | 硅片加工装置 |
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CN201310383210.9A CN103471899B (zh) | 2013-08-28 | 2013-08-28 | 硅片加工装置 |
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CN103471899A CN103471899A (zh) | 2013-12-25 |
CN103471899B true CN103471899B (zh) | 2016-01-20 |
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CN201310383210.9A Active CN103471899B (zh) | 2013-08-28 | 2013-08-28 | 硅片加工装置 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108871892B (zh) * | 2018-06-04 | 2020-12-08 | 中钢集团新型材料(浙江)有限公司 | 一种用于石墨光学显微结构表征的样品制备方法 |
CN111002205B (zh) * | 2019-12-19 | 2022-02-01 | 山东欧思特新材料科技有限公司 | 一种半导体用晶圆抛光设备 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1279506A (zh) * | 1999-07-05 | 2001-01-10 | 日本电气株式会社 | 平面研磨装置 |
CN1479942A (zh) * | 2000-11-27 | 2004-03-03 | 摩托罗拉公司 | 确定终点的方法以及半导体圆片 |
DE102004017452A1 (de) * | 2004-04-08 | 2005-11-03 | Siltronic Ag | Vorrichtung zur flächigen, abrasiven Bearbeitung eines scheibenförmigen Werkstücks |
CN101733701A (zh) * | 2008-11-25 | 2010-06-16 | 上海华虹Nec电子有限公司 | 化学机械抛光设备 |
CN102092002A (zh) * | 2010-12-09 | 2011-06-15 | 郭兵健 | 单晶硅片液体抛光方法 |
CN102554760A (zh) * | 2012-01-19 | 2012-07-11 | 大连理工大学 | 一种多功能的基片磨抛装置及其磨抛方法 |
Family Cites Families (1)
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JP2005072039A (ja) * | 2003-08-25 | 2005-03-17 | Ibiden Co Ltd | 真空チャック |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1279506A (zh) * | 1999-07-05 | 2001-01-10 | 日本电气株式会社 | 平面研磨装置 |
CN1479942A (zh) * | 2000-11-27 | 2004-03-03 | 摩托罗拉公司 | 确定终点的方法以及半导体圆片 |
DE102004017452A1 (de) * | 2004-04-08 | 2005-11-03 | Siltronic Ag | Vorrichtung zur flächigen, abrasiven Bearbeitung eines scheibenförmigen Werkstücks |
CN101733701A (zh) * | 2008-11-25 | 2010-06-16 | 上海华虹Nec电子有限公司 | 化学机械抛光设备 |
CN102092002A (zh) * | 2010-12-09 | 2011-06-15 | 郭兵健 | 单晶硅片液体抛光方法 |
CN102554760A (zh) * | 2012-01-19 | 2012-07-11 | 大连理工大学 | 一种多功能的基片磨抛装置及其磨抛方法 |
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CN103471899A (zh) | 2013-12-25 |
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Address after: 710100 Changan District, Shaanxi Province, aerospace Road, No. 388, No. Co-patentee after: Wuxi LONGi Silicon Materials Corp. Patentee after: Longji green energy Polytron Technologies Inc Co-patentee after: Ningxia LONGi Silicon Material Co.,Ltd. Co-patentee after: Yinchuan LONGi Silicon Material Co.,Ltd. Address before: 710100 Changan District, Shaanxi Province, aerospace Road, No. 388, No. Co-patentee before: Wuxi LONGi Silicon Materials Corp. Patentee before: Xi'an Longji-Silicon Co., LTD. Co-patentee before: Ningxia LONGi Silicon Material Co.,Ltd. Co-patentee before: Yinchuan LONGi Silicon Material Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20211011 Address after: 710199 no.388 Hangtian Middle Road, Chang'an District, Xi'an City, Shaanxi Province Patentee after: LONGI GREEN ENERGY TECHNOLOGY Co.,Ltd. Address before: 710100 No. 388, middle route, Xi'an, Shaanxi, Changan District Patentee before: LONGI GREEN ENERGY TECHNOLOGY Co.,Ltd. Patentee before: WUXI LONGI SILICON MATERIALS Corp. Patentee before: NINGXIA LONGI SILICON MATERIALS Co.,Ltd. Patentee before: YINCHUAN LONGI SILICON MATERIALS Co.,Ltd. |
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