CN102900980A - 一种内置灌胶散热***的一体化led灯 - Google Patents

一种内置灌胶散热***的一体化led灯 Download PDF

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CN102900980A
CN102900980A CN2012103614561A CN201210361456A CN102900980A CN 102900980 A CN102900980 A CN 102900980A CN 2012103614561 A CN2012103614561 A CN 2012103614561A CN 201210361456 A CN201210361456 A CN 201210361456A CN 102900980 A CN102900980 A CN 102900980A
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heat
conducting plate
heat dissipation
lamp
glue
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CN2012103614561A
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瞿崧
娄永发
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Shanghai Dangoo Electronic Trading Co Ltd
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Shanghai Dangoo Electronic Trading Co Ltd
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Priority to CN2012103614561A priority Critical patent/CN102900980A/zh
Publication of CN102900980A publication Critical patent/CN102900980A/zh
Priority to PCT/CN2013/000142 priority patent/WO2014048049A1/zh
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种内置灌胶散热***的一体化LED灯,包括灯罩、灯头、散热壳体、导热板、电源、LED芯片,其特点是,所述灌胶散热***包括散热壳体、导热板、导热胶;所述散热壳体下部与灯头固接,上部和灯罩固接,导热板固接在散热壳体上部,LED芯片贴在导热板上,导热胶填充在导热板和散热壳体所组成的空间中,导热胶包裹着电源。由于LED芯片贴在导热板上,使LED芯片产生的热能迅速扩散开,导热胶填充在导热板和散热壳体所组成的空间中,导热胶包裹着电源,热量均匀扩散,传导到散热壳体表面。解决了热量传导途径单一且接触热阻大,局部温度高,导热效率不高的问题。

Description

一种内置灌胶散热***的一体化LED灯
技术领域
    本发明涉及一种内置灌胶散热***的一体化LED灯,属于LED照明光源技术领域。
背景技术
    目前,一体化LED灯作为LED光源应用的一个热门方向,一直是各厂家投入研究的热点,就一体化LED灯而言,LED芯片在较高温度下,容易出现光衰,其散热效果直接影响其使用效果和寿命,为此,现有一体化LED灯一般都配有散热器辅助散热,但现有散热器与热源接触不良,出现局部温度过高,又因为散热途径单一,散热效果差。
发明内容
    本发明为了克服现有一体化LED灯散热效果差和局部高温的缺点,提供了一种内置灌胶散热***,能达到散热效果好和温度均匀化的一体化LED灯。
 本发明的技术方案是,一种内置灌胶散热***的一体化LED灯,包括灯罩、灯头、散热壳体、导热板、电源、LED芯片,其特点是,所述灌胶散热***包括散热壳体、导热板、导热胶;所述散热壳体下部与灯头固接,上部和灯罩固接,导热板固接在散热壳体上部,LED芯片贴在导热板上,导热胶填充在导热板和散热壳体所组成的空间中,导热胶包裹着电源。
由于LED芯片贴在导热板上,使LED芯片产生的热能迅速扩散开,导热胶填充在导热板和散热壳体所组成的空间中,导热胶包裹着电源,热量均匀扩散,最终传导到散热壳体表面。解决了热量传导途径单一且接触热阻大,局部温度高,导热效率不高的问题。所述的导热胶初始为流动的液体,其与导热板和散热壳体充分接触。LED芯片产生的热量和电源产生的热量在同一个散热途径中,使LED灯各处温度均匀。
附图说明
图1为一种内置灌胶散热***的一体化LED灯结构示意图。
具体实施方式
一种内置灌胶散热***的一体化LED灯,如图1所示,包括灯罩1、灯头7、散热壳体6、导热板3、电源5、LED芯片2,其特点是,所述灌胶散热***包括散热壳体6、导热板3、导热胶4;所述散热壳体6下部与灯头7固接,上部和灯罩1固接,导热板3固接在散热壳体6上部,LED芯片2贴在导热板3上,导热胶4填充在导热板3和散热壳体6所组成的空间中,导热胶4包裹着电源5。
由于LED芯片2贴在导热板3上,使LED芯片2产生的热能迅速扩散开,导热胶4填充在导热板3和散热壳体6所组成的空间中,导热胶4包裹着电源5,热量均匀扩散,最终传导到散热壳体表面。解决了热量传导途径单一且接触热阻大,局部温度高,导热效率不高的问题。所述的导热胶4初始为流动的液体,其与导热板3和散热壳体6充分接触。LED芯片2产生的热量和电源5产生的热量在同一个散热途径中,使LED灯各处温度均匀。
所述的灯罩1的材质为透明的或者有色的添加有荧光粉的材质。
所述的导热胶4采用由上海卓尤化工科技有限公司生产的室温固化导热灌封硅胶 TPC-213。
本发明的灌胶散热***一种能够将LED和电源产生的热量很快导入到产品表面,再通过与空气接触的表面散发到空气中的散热***。该散热***采用一种介质在初期为液态的导热物,能够填充散热壳体和导热板组成的密闭空间,且能够渗入电源元器件间狭小的间隙中,经过一定时间段变化,液态导热物转变成一种软性导热固态物,且性能稳定。该散热***要求软性导热固体物和导热板大面积良好接触,导热板主要以软性导热固态物作为热传导的通路。具体热耗散原理是:LED芯片2产生的热传导到导热板3,再传导到软性导热固态物导热胶4,再传导散热外壳6,散热外壳6以良好的表面对流和表面辐射将热量散溢到空气中。电源5元器件产生的热,传导到软性导热固态物导热胶4,再传导到散热壳体6,散热壳体6以良好的表面对流和表面辐射将热量散溢到空气中。这样在一个***中,既解决了LED芯片2产生的热,也解决了电源5产生的热,而且***温度均匀,整体性能良好。

Claims (1)

1.一种内置灌胶散热***的一体化LED灯,包括灯罩(1)、灯头(7)、散热壳体(6)、导热板(3)、电源(5)、LED芯片(2),其特征在于,所述灌胶散热***包括散热壳体(6)、导热板(3)、导热胶(4);所述散热壳体(6)下部与灯头(7)固接,上部和灯罩(1)固接,导热板(3)固接在散热壳体(6)上部,LED芯片(2)贴在导热板(3)上,导热胶(4)填充在导热板(3)和散热壳体(6)所组成的空间中,导热胶(4)包裹着电源(5)。
CN2012103614561A 2012-09-26 2012-09-26 一种内置灌胶散热***的一体化led灯 Pending CN102900980A (zh)

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CN2012103614561A CN102900980A (zh) 2012-09-26 2012-09-26 一种内置灌胶散热***的一体化led灯
PCT/CN2013/000142 WO2014048049A1 (zh) 2012-09-26 2013-02-16 一种内置灌胶散热***的一体化led灯

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014048049A1 (zh) * 2012-09-26 2014-04-03 上海顿格电子贸易有限公司 一种内置灌胶散热***的一体化led灯
CN104806912A (zh) * 2015-04-08 2015-07-29 深圳博用科技有限公司 全周光可调光led灯具

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CN102230582A (zh) * 2011-06-20 2011-11-02 广州莱迪光电股份有限公司 一种安全的led球泡灯
CN103174950A (zh) * 2011-12-20 2013-06-26 富准精密工业(深圳)有限公司 发光二极管灯泡
CN203162584U (zh) * 2012-09-26 2013-08-28 上海顿格电子贸易有限公司 一种内置灌胶散热***的一体化led灯

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CN102338360A (zh) * 2010-07-26 2012-02-01 富士迈半导体精密工业(上海)有限公司 散热器及采用所述散热器之照明装置
CN202024114U (zh) * 2010-12-21 2011-11-02 宝霖科技股份有限公司 发光二极管灯
CN102200233A (zh) * 2011-06-20 2011-09-28 广州莱迪光电股份有限公司 一种led球泡灯结构
CN202382043U (zh) * 2011-11-23 2012-08-15 彩虹集团公司 一种球泡灯光源装置
CN102900980A (zh) * 2012-09-26 2013-01-30 上海顿格电子贸易有限公司 一种内置灌胶散热***的一体化led灯

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN102230582A (zh) * 2011-06-20 2011-11-02 广州莱迪光电股份有限公司 一种安全的led球泡灯
CN103174950A (zh) * 2011-12-20 2013-06-26 富准精密工业(深圳)有限公司 发光二极管灯泡
CN203162584U (zh) * 2012-09-26 2013-08-28 上海顿格电子贸易有限公司 一种内置灌胶散热***的一体化led灯

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014048049A1 (zh) * 2012-09-26 2014-04-03 上海顿格电子贸易有限公司 一种内置灌胶散热***的一体化led灯
CN104806912A (zh) * 2015-04-08 2015-07-29 深圳博用科技有限公司 全周光可调光led灯具

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Application publication date: 20130130