CN102746934B - 硅片切割液中水溶性切割液的回收方法 - Google Patents
硅片切割液中水溶性切割液的回收方法 Download PDFInfo
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- CN102746934B CN102746934B CN201210255990.4A CN201210255990A CN102746934B CN 102746934 B CN102746934 B CN 102746934B CN 201210255990 A CN201210255990 A CN 201210255990A CN 102746934 B CN102746934 B CN 102746934B
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- water
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- cutting liquid
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- soluble cutting
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- 238000000034 method Methods 0.000 title claims abstract description 90
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 48
- 239000010703 silicon Substances 0.000 title claims abstract description 48
- 239000002173 cutting fluid Substances 0.000 title claims abstract description 28
- 238000005520 cutting process Methods 0.000 claims abstract description 117
- 238000001704 evaporation Methods 0.000 claims abstract description 9
- 238000012545 processing Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 97
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 14
- 238000011084 recovery Methods 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 13
- 239000002699 waste material Substances 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 230000003311 flocculating effect Effects 0.000 claims description 12
- 235000013312 flour Nutrition 0.000 claims description 11
- 239000004615 ingredient Substances 0.000 claims description 10
- 230000008020 evaporation Effects 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 8
- 230000018044 dehydration Effects 0.000 claims description 7
- 238000006297 dehydration reaction Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 abstract description 9
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 8
- 239000004570 mortar (masonry) Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 239000000725 suspension Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 4
- 239000002202 Polyethylene glycol Substances 0.000 abstract 1
- 229910001651 emery Inorganic materials 0.000 abstract 1
- 229920001223 polyethylene glycol Polymers 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- -1 polyoxyethylene Polymers 0.000 description 8
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000004061 bleaching Methods 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 238000001311 chemical methods and process Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical group C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000003454 tympanic membrane Anatomy 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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CN102746934B true CN102746934B (zh) | 2014-03-26 |
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Families Citing this family (6)
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CN103630586B (zh) * | 2013-11-01 | 2016-02-17 | 河南易成新能源股份有限公司 | 晶硅片切割液pH值的检测方法 |
CN106433857B (zh) * | 2016-08-29 | 2019-03-15 | 徐州吉兴新材料有限公司 | 利用重醇回收液制备切割液的方法 |
CN107265695A (zh) * | 2017-07-12 | 2017-10-20 | 晶科能源有限公司 | 一种晶体硅金刚石线切割废料浆切削液回收方法和*** |
CN111015988A (zh) * | 2019-12-25 | 2020-04-17 | 无锡荣能半导体材料有限公司 | 一种硅片切割冷却浆液再利用的方法 |
CN112441588A (zh) * | 2020-12-31 | 2021-03-05 | 重庆大学 | 一种金刚石线切割硅废料的脱氧方法 |
CN115193101B (zh) * | 2021-04-09 | 2024-02-13 | 中国矿业大学 | 一种线切冷却液回收方法 |
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CN101032806B (zh) * | 2006-03-06 | 2011-03-16 | 张捷平 | 切削悬浮液回收的方法 |
CN102071092B (zh) * | 2010-12-03 | 2012-12-19 | 江阴浩博科技有限公司 | 硅片切割废砂浆回收循环利用方法 |
CN102352281B (zh) * | 2011-09-02 | 2013-07-31 | 江苏灵宏机电工程有限公司 | 一种硅片切割废砂浆中回收聚乙二醇和碳化硅颗粒的方法 |
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Effective date of registration: 20170720 Address after: 212211 Jiangsu city of Yangzhong Province along the Yangtze River Port Industrial Park Road No. 968 Patentee after: Jiangsu Meike Silicon Energy Co., Ltd. Address before: 212200 Yangzhong new material industrial park, Jiangsu, China, Zhenjiang Patentee before: Zhejiang Haoyu New Energy and Materials Co., Ltd. |
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Denomination of invention: Method for recovering water-soluble cutting fluid from silicon wafer cutting fluid Effective date of registration: 20191113 Granted publication date: 20140326 Pledgee: China Everbright Bank, Limited by Share Ltd, Nanjing branch Pledgor: Jiangsu Meike Silicon Energy Co., Ltd. Registration number: Y2019320000280 |
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Date of cancellation: 20210127 Granted publication date: 20140326 Pledgee: China Everbright Bank Limited by Share Ltd. Nanjing branch Pledgor: JIANGSU MEIKE SILICON ENERGY Co.,Ltd. Registration number: Y2019320000280 |
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Effective date of registration: 20210204 Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: 968 GANGLONG Road, Yanjiang Industrial Park, Yangzhong City, Jiangsu Province Patentee before: JIANGSU MEIKE SILICON ENERGY Co.,Ltd. |
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Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co., Ltd Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co., Ltd |
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