CN102510680A - Manufacturing process for circuit board with long and short gold fingers - Google Patents
Manufacturing process for circuit board with long and short gold fingers Download PDFInfo
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- CN102510680A CN102510680A CN2011103203362A CN201110320336A CN102510680A CN 102510680 A CN102510680 A CN 102510680A CN 2011103203362 A CN2011103203362 A CN 2011103203362A CN 201110320336 A CN201110320336 A CN 201110320336A CN 102510680 A CN102510680 A CN 102510680A
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Abstract
The invention relates to a manufacturing process for a circuit board with long and short gold fingers, which comprises the following steps: supplying a base plate; arranging a plurality of gold finger patterns on the surface of the base plate; arranging a gold-plated lead with tip structures on the surface of the base plate; correspondingly and electrically connecting the tip structures of the gold-plated lead with the gold finger patterns; performing gold-plating treatment on the gold finger patterns so as to form the gold fingers; and tearing off and removing the gold-plated lead, thereby separating the tip structures of the gold-plated lead from the gold fingers. According to the manufacturing process for the circuit board provided by the invention, the tip structures are arranged at the end parts of the gold-plated lead, so that the gold-plated lead and the gold fingers are electrically connected while an area of a physical connecting structure between the gold-plated lead and the gold fingers is greatly reduced. When a test is finished, an operator can easily remove the gold-plated lead in the manner of pulling and tearing by hand, and the gold-plated lead is prevented from being remained, so that the change in electric properties of the gold fingers caused by the remained gold-plated lead is avoided, the short circuit risk is eliminated and the reliability of products is increased.
Description
Technical field
The present invention relates to a kind of process for manufacturing circuit board, relate in particular to a kind of process for manufacturing circuit board with long and short golden finger.
Background technology
(Printed Circuit Board almost is the basis of any electronic product PCB) to printed circuit board (PCB), appears at almost in each electronic equipment or the product.Generally speaking, if in some equipment or product, electronic functional module is arranged, they also all are the PCB surfaces that is installed in different sizes so.It is thus clear that the optimization of printed circuit board (PCB) and manufacture craft thereof is followed the market demand of printed circuit board (PCB) and is important further.
Development along with present electronic product field; It is the withdrawing pattern formula that the design of each electronic functional module then is more prone to support promptly to insert; Promptly need not to cut off the electricity supply, electronic functional module promptly can be connected with equipment or break off, because electronic functional module is a hot swap type; System need not to close with regard to scalable and expanding system, can not cause what influence to the online user.Maintenance workload has also been simplified in the design of hot plug property, and makes the end user can better manage their electronic functional module.Simultaneously, because this switching performance, this electronic functional module can make administrative staff all network topologies carried out overall planning, and need not system board is all replaced according to the system upgrade requirement.
Support the electronic functional module of hot plug to require the golden finger of related circuit plate different in size, thereby it is inconsistent to be grounded order.Because golden finger plates the needs of thick gold, when its gold plated lead connected the golden finger after gold-plated, residual part was different in size, and this gold plated lead and this golden finger contact position structure are as shown in Figure 1.The two ends of this lead-in wire 11 connect golden finger 13 and this frame 15 respectively.This lead-in wire 11 is consistent with the width of these golden finger 13 contact positions.Because this golden finger 13 is different in size, this lead-in wire 11 is uneven equally naturally, so this lead-in wire 11 can not be got rid of through simple machine cuts, need realize through special technology.
Conventional manufacturing approach is to adopt dry film method or wet film method.So-called dried mould film promptly utilizes dry film 14 to cover the lead-in wire position and points gold-platedly, takes off the film after etching and falls lead-in wire.So-called wet film method, the method for employing are to etch golden finger, conductive circuit pattern and lead-in wire at circuit board surface earlier.This lead-in wire makes mutual conduction between the golden finger, and seal wet film 14 and show solid on circuit board then with the protection plated with nickel gold that goes between, carries out gold-platedly more then to long and short golden finger, utilize acid etching to etch away gold plated lead behind gold-plated the finishing again.
Above-mentioned lead-in wire is a kind of technology boost line in fact, and it is not retained in final product.
Yet; When adopting said method that the circuit board of tool long and short golden finger is made; Still have following limitation: (1) flow process is complicated, not only will be provided with, remove lead-in wire, also will be at pilot process protection lead-in wire; The plated with nickel gold that prevents to go between, otherwise in the program process of back, may cause and can not fallen by acid etching.
(2) production cycle long because the flow process spended time that lead-in wire is protected and removed is long, generally to spend time this type of special disposal flow process of 2-4 days, cost is higher.
(3) etchback appears in golden finger root easily, because of gold-plated zone and lead-in wire interconnect, etch away lead-in wire after, golden finger is etched a part easily with copper layer under the nickel-gold layer that lead is connected, produces etchback and carves, and when salt mist test, occurs defective easily;
(4) control of golden finger critical size is difficult: need to shift, for making figure in the plate, comprise golden finger and lead-in wire for the first time through outer figure through secondary image, and the resistance weldering of carrying out when avoiding its plated with nickel gold for the protection lead-in wire for the second time, its figure and dimensional accuracy are relatively poor.
The present invention provides a kind of process for manufacturing circuit board of new tool long and short golden finger in order to improve or to solve the above problems.
Summary of the invention
To the printed circuit edge connector complex process of prior art tool long and short golden finger, the problem that the production cycle is long and production reliability is low, the present invention provides the process for manufacturing circuit board of simple, the with short production cycle and tool long and short golden finger that reliability is high of a kind of golden finger technology.
A kind of process for manufacturing circuit board of tool long and short golden finger, it comprises the steps: to provide a substrate; At this substrate surface a plurality of golden finger figures are set; At this substrate surface the gold plated lead of tool cutting-edge structure, the cutting-edge structure of this gold plated lead and the corresponding electrical connection of this golden finger figure are set; Gold-plated processing forms golden finger to the golden finger figure; Gold plated lead is removed in tearing, makes the cutting-edge structure of this gold plated lead and this golden finger be separated from each other.
As the further improvement of foregoing circuit plate manufacture craft, these a plurality of golden fingers are different in size.
As the further improvement of foregoing circuit plate manufacture craft, this substrate comprises the golden finger weld zone, and these a plurality of golden finger correspondences are arranged in this golden finger weld zone.
As the further improvement of foregoing circuit plate manufacture craft, this golden finger and this gold plated lead are formed on the golden finger weld pattern place of this golden finger weld zone through the mode of electroplating.
As the further improvement of foregoing circuit plate manufacture craft, this gold plated lead one end is connected to the end of this golden finger, and its another section is drawn to this frame.
As the further improvement of foregoing circuit plate manufacture craft, this gold plated lead comprises first cutting-edge structure that is positioned at the end, and wherein this first cutting-edge structure is electrically connected to this golden finger end.
As the further improvement of foregoing circuit plate manufacture craft, this gold plated lead also comprises second cutting-edge structure that is positioned at the end, the frame of this second cutting-edge structure traction to this substrate, and extend this substrate.
As the further improvement of foregoing circuit plate manufacture craft, its also comprise provide one be located at the substrate outside test circuit, the corresponding electrical connection of this second cutting-edge structure with this test circuit.
As the further improvement of foregoing circuit plate manufacture craft, comprise also a cutting device is provided that it cuts off being connected between this second cutting-edge structure and this test circuit.
Further improvement as foregoing circuit plate manufacture craft; When this gold plated lead is removed in tearing; Apply external force from the manual tearing of this second cutting-edge structure, one side, make this gold plated lead peel off separation from this substrate surface, and in first cutting-edge structure and the fracture of this golden finger junction.
Compared with prior art; In the print circuit plates making technology of the present invention; End in gold plated lead is provided with cutting-edge structure, makes to satisfy when being electrically connected between this gold plated lead and this golden finger, and the physical connection structural area between the two reduces greatly; That is, reduce bonding strength between the two.When test finishes, can remove gold plated lead easily through the mode of manual tearing, simplify technological process greatly, avoid complicated technologies such as etching, shorten the production cycle, reduce cost.Secondly, when avoiding gold plated lead residual, and the guarantee fund points excellently, makes golden finger can not cause electric property to change because of residual lead-in wire, eliminates short-circuit risks, improves production reliability.
Description of drawings
Fig. 1 is a kind of printed circuit board technology of prior art structural plan sketch map.
Fig. 2 is the planar structure sketch map in a kind of circuit board course of processing of the present invention.
Fig. 3 is the floor map of gold plated lead shown in Figure 2.
Fig. 4 is the planar structure sketch map after the circuit board processing shown in Figure 2.
Fig. 5 is a circuit board work flow sketch map shown in Figure 2.
Embodiment
Specify the embodiment of tool long and short golden finger process for manufacturing circuit board of the present invention below in conjunction with accompanying drawing.
Seeing also Fig. 2, is the planar structure sketch map of a kind of circuit board of the present invention in the course of processing.This circuit board 2 is rigid printed circuit boards of a tool long and short golden finger structure.This circuit board 2 comprises a substrate 20, be formed on the lip-deep a plurality of conductive pattern of this substrate 20 21, a plurality of golden finger 23, frame 25 and gold plated lead 27.
This substrate 20 is bearing substrates that a dielectric resin material is processed into, in order to carry this conductive pattern 21, a plurality of golden finger 23, frame 25, gold plated lead 27 in its surface.This gold plated lead 27 and these a plurality of golden finger 23 corresponding electrical connections.Simultaneously, this gold plated lead 27 and the corresponding electrical connection of the outside test circuit that is provided (figure does not show) are arranged on this circuit board 2 outsides, and this test circuit passes through these gold plated lead 27 transmitted test signals to this circuit board 2.This substrate 20 comprises formation district, conducting wire (not indicating) that is positioned at zone line and the golden finger weld zone (not indicating) that is positioned at fringe region.This conducting wire district is in order to form conductive pattern 21.This golden finger weld zone is in order to form golden finger 23.
This conductive pattern 21 is the conducting wires that are formed on the formation district, conducting wire on these substrate 20 surfaces through technologies such as etching, depositions, and different conducting wires cooperates the different functions components and parts to realize the electronic functional module of difference in functionality.Usually, this conductive pattern 21 is copper layers.
These a plurality of golden fingers 23 are to be covered with one deck gold in the golden finger weld zone on copper-clad base plate 20 surfaces again through special process to form non-oxidizability that tool is stronger and signal transmission performance.
This gold plated lead 27 is technology boost lines, and it is electrically connected to these a plurality of golden fingers 23 simultaneously and forms path, in order to realize that test signal transfers to golden finger 23.With regard to the circuit board after the machine-shaping, this gold plated lead 27 can not be retained on this circuit board 2.The concrete structure of this gold plated lead 27 is as shown in Figure 3, and this gold plated lead 27 comprises first cutting-edge structure 271 and second cutting-edge structure 273.This two cutting-edge structure 271,273 is separately positioned on two free ends of this gold plated lead 27.These first cutting-edge structure, 271 correspondences are electrically connected to the end of this golden finger 23.These second cutting-edge structure, 273 correspondences are electrically connected to this test circuit.These first cutting-edge structure, 271 integral body are the isosceles trapezoid shape, and its integral width is less than the width of this gold plated lead 27.The minimum widith place of this first cutting-edge structure 271 directly is electrically connected with this golden finger 23; Certainly; Its physics contact nature correspondence reduces; That is to say that the contact area of this first cutting-edge structure 271 and this golden finger 23 is contracted to and satisfies the test signal transmission and get final product, the width of contact position is less than the width of its interlude.Just because of this design, this first cutting-edge structure 271 reduces with the power that is connected between this golden finger 23 greatly.When external force is applied to this gold plated lead 23,,, make this gold plated lead 27 divide each other with this golden finger 23 so fracture appears in this junction easily because stress concentrates on the junction of this first cutting-edge structure 27 and this golden finger 23.
This second cutting-edge structure 273 is located at another free end of this gold plated lead 27, and it is the structure that integral body is trapezoidal shape equally.This second cutting-edge structure 273 leads this gold plated lead 27 to extend to frame 25 outsides of this substrate 20, and exceeds this frame 25.The minimum place of the width of this second cutting-edge structure 273 is electrically connected to this test circuit.This second cutting-edge structure 273 makes things convenient for the staff to spur the end of this gold plated lead 27 easily, comes off mutually with the surface of this substrate 20 to realize this gold plated lead 27,, separates this substrate 20 that is.
This test circuit applies test signal to this circuit board 2, in order to the performance and the yield of testing circuit board 2.Equally, this test circuit can not be retained on the circuit board 2 after the machine-shaping equally, and the board structure of circuit after the processing is as shown in Figure 4, has removed the gold plated lead 27 of being located at circuit board 2 surfaces.
When making this circuit board 2, its manufacture craft is as shown in Figure 5, and is specific as follows:
Step S1 provides substrate 20;
This substrate 20 comprises formation district, conducting wire and golden finger weld zone.This conducting wire district is positioned at the zone line of this substrate 2, and this golden finger weld zone is positioned at the fringe region of this substrate 20.
Step S2 is provided with a plurality of golden finger figures on these substrate 20 surfaces;
This golden finger figure is formed in the steel structure that covers on substrate 20 surfaces, and it is arranged on the golden finger weld zone of substrate 20.
Step S3 is provided with gold plated lead 27 on these substrate 20 surfaces, and this gold plated lead 27 comprises first cutting-edge structure 271 of corresponding electrical connection with this golden finger figure and is connected to second cutting-edge structure 273 of this test circuit;
This gold plated lead 27 comprises it being a technology boost line, and it comprises first cutting-edge structure 271 and second cutting-edge structure 273.This first cutting-edge structure 271 connects this golden finger figure.This second cutting-edge structure 273 extends this gold plated lead 27 to these frame 25 sides, and is electrically connected this test circuit.
Step S4 is to the gold-plated processing of golden finger figure;
This golden finger 23 is made up of numerous flavous conductive contact blades, because of its surface gold-plating and conductive contact blade are arranged like finger-shaped, so be called " golden finger ".Golden finger is actually in copper-clad plate and is covered with one deck gold again through special process, because the non-oxidizability of gold is extremely strong, and conductibility is also very strong.The zinc-plated gold of present more employing replaces.Gold-plated treatment process as this area common technology means, can adopt dry film method or wet film method to handle.Particularly, the dry film method promptly utilizes dry film to cover gold plated lead 27 and a plurality of conductive pattern 21, and the golden finger figure is carried out gold-plated processing, takes off film then, obtains golden finger 23.So-called wet film method promptly, at first, is printed the resistance postwelding to circuit board, implements the process of surface treatment of spray tin or heavy Sillim; Then, make silk screen, smear wet film at conductive pattern 21 and gold plated lead zone, golden finger figure region windowing is handled; Then, to the gold-plated processing of golden finger figure; At last, take off wet film, obtain golden finger 23.
Step S5, gold plated lead 27 is removed in tearing, makes first cutting-edge structure 271 of this gold plated lead 27 be separated from each other with this golden finger 23, thus, makes circuit board as shown in Figure 42.
Particularly, a cutting device is provided, these second cutting-edge structure, 273 places cut off this test circuit certainly; Operating personnel manually apply dilatory these second cutting-edge structure, 273 places of external force, make this gold plated lead 27 peel off each other with this substrate 20, simultaneously; This external force size is enough to thus, remove this gold plated lead 27 in this first cutting-edge structure 271 and this golden finger 23 contact positions fracture; Avoid any gold plated lead 27 and test circuit etc. to remain in the surface of circuit board 2, make this circuit board 2.
In this embodiment; Because this golden finger 23 is arranged to structure different in size, that is, it is variant apart from the spacing between the frame at these substrate 20 edges; So the length correspondence of this gold plated lead 27 is also inequality, is inappropriate for and adopts cutting mode to remove this gold plated lead 27.The first less cutting-edge structure 271 of width is set in the end of this gold plated lead 27, reduces the contact area of this gold plated lead 27 and this golden finger 23, reduce the adhesion between this gold plated lead 27 and this golden finger 23, handled easily personnel manually tear.Simultaneously, the second less cutting-edge structure 273 of width is set in the other end of this gold plated lead 27, reduces the adhesive force between its end and this substrate 20, this gold plated lead 27 of the manual tearing of handled easily personnel.
As the further improvement of above-mentioned execution mode, can be only cutting-edge structure be set in these golden finger 23 1 sides of vicinity of this gold plated lead 27, be purpose with the adhesion that reduces between this gold plated lead 27 and this golden finger 23.
Certainly; The shape of this cutting-edge structure is not limited to trapezoidal; Can also be other different shapes, every other deformation programs that are intended to reduce adhesion between this gold plated lead 27 and this golden finger 23 all belong to the invention original intention of this case, all belong within the protection range of this case.
Compared to prior art, in circuit board 2 processing technologys of this case, the end that this gold plated lead 27 is set is a cutting-edge structure 271,273, makes operating personnel remove this gold plated lead 27 easily through manual tearing mode, avoids gold plated lead 27 residual.Adopt etching mode to remove the gold plated lead pattern compared to prior art, both simplified technology, reduce cost again, the more important thing is, improve product yield and reliability greatly.
The above is merely preferred embodiments of the present invention; Protection scope of the present invention is not exceeded with above-mentioned execution mode; As long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (10)
1. the process for manufacturing circuit board of a tool long and short golden finger, it comprises the steps:
One substrate is provided;
At this substrate surface a plurality of golden finger figures are set;
At this substrate surface the gold plated lead of tool cutting-edge structure, the cutting-edge structure of this gold plated lead and the corresponding electrical connection of this golden finger figure are set;
Gold-plated processing forms golden finger to this golden finger figure;
This gold plated lead is removed in tearing, makes the cutting-edge structure of this gold plated lead and this golden finger be separated from each other.
2. the process for manufacturing circuit board of tool long and short golden finger according to claim 1 is characterized in that: these a plurality of golden fingers are different in size.
3. the process for manufacturing circuit board of tool long and short golden finger according to claim 1 is characterized in that: this substrate comprises the golden finger weld zone, and these a plurality of golden finger correspondences are arranged in this golden finger weld zone.
4. the process for manufacturing circuit board of tool long and short golden finger according to claim 4; It is characterized in that: this golden finger figure and this gold plated lead are formed on this substrate surface through the mode of electroplating, and this golden finger is formed on this golden finger weld zone through wet film technology or dry film technology.
5. the process for manufacturing circuit board of tool long and short golden finger according to claim 1 is characterized in that: this gold plated lead one end is connected to the end of this golden finger, and its another section is drawn to this frame.
6. the process for manufacturing circuit board of tool long and short golden finger according to claim 5 is characterized in that: this gold plated lead comprises first cutting-edge structure that is positioned at the end, and wherein this first cutting-edge structure is electrically connected to this golden finger end.
7. the process for manufacturing circuit board of tool long and short golden finger according to claim 6 is characterized in that: this gold plated lead also comprises second cutting-edge structure that is positioned at the end, the frame of this second cutting-edge structure traction to this substrate, and extend this substrate.
8. the process for manufacturing circuit board of tool long and short golden finger according to claim 7 is characterized in that: also comprise the test circuit of being located at the substrate outside, the corresponding electrical connection with this test circuit of this second cutting-edge structure.
9. the process for manufacturing circuit board of tool long and short golden finger according to claim 8 is characterized in that: comprise also a cutting device is provided that it cuts off being connected between this second cutting-edge structure and this test circuit.
10. the process for manufacturing circuit board of tool long and short golden finger according to claim 9; It is characterized in that: when this gold plated lead is removed in tearing; Apply external force from the manual tearing of this second cutting-edge structure, one side; Make this gold plated lead peel off separation from this substrate surface, and in first cutting-edge structure and the fracture of this golden finger junction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103203362A CN102510680A (en) | 2011-10-20 | 2011-10-20 | Manufacturing process for circuit board with long and short gold fingers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103203362A CN102510680A (en) | 2011-10-20 | 2011-10-20 | Manufacturing process for circuit board with long and short gold fingers |
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| Publication Number | Publication Date |
|---|---|
| CN102510680A true CN102510680A (en) | 2012-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103203362A Pending CN102510680A (en) | 2011-10-20 | 2011-10-20 | Manufacturing process for circuit board with long and short gold fingers |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106961789A (en) * | 2017-05-19 | 2017-07-18 | 台山市精诚达电路有限公司 | A kind of target of FPC wiring boards rushes structure |
| CN107484354A (en) * | 2017-08-15 | 2017-12-15 | 胜宏科技（惠州）股份有限公司 | A kind of method for manufacturing gold finger of no lead residual |
| CN111417265A (en) * | 2020-05-14 | 2020-07-14 | 广德牧泰莱电路技术有限公司 | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB |
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| CN87105669A (en) * | 1986-08-19 | 1988-06-01 | 国际商用机器公司 | Removable shared |
| KR100960973B1 (en) * | 2007-07-16 | 2010-06-03 | 난야 테크놀러지 코포레이션 | Gold finger of circuit board and fabricating method thereof |
| EP2264837A1 (en) * | 2008-02-29 | 2010-12-22 | ZTE Corporation | Method for reducing the fitting thrust of golden finger and pcb |
| CN102006729A (en) * | 2010-11-11 | 2011-04-06 | 广州杰赛科技股份有限公司 | Method for manufacturing printed board with long and short connectors |
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2011
- 2011-10-20 CN CN2011103203362A patent/CN102510680A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87105669A (en) * | 1986-08-19 | 1988-06-01 | 国际商用机器公司 | Removable shared |
| KR100960973B1 (en) * | 2007-07-16 | 2010-06-03 | 난야 테크놀러지 코포레이션 | Gold finger of circuit board and fabricating method thereof |
| EP2264837A1 (en) * | 2008-02-29 | 2010-12-22 | ZTE Corporation | Method for reducing the fitting thrust of golden finger and pcb |
| CN102006729A (en) * | 2010-11-11 | 2011-04-06 | 广州杰赛科技股份有限公司 | Method for manufacturing printed board with long and short connectors |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106961789A (en) * | 2017-05-19 | 2017-07-18 | 台山市精诚达电路有限公司 | A kind of target of FPC wiring boards rushes structure |
| CN106961789B (en) * | 2017-05-19 | 2024-01-02 | 台山市精诚达电路有限公司 | Target punching structure of FPC circuit board |
| CN107484354A (en) * | 2017-08-15 | 2017-12-15 | 胜宏科技（惠州）股份有限公司 | A kind of method for manufacturing gold finger of no lead residual |
| CN111417265A (en) * | 2020-05-14 | 2020-07-14 | 广德牧泰莱电路技术有限公司 | Manufacturing method of PCB (printed circuit board) containing long and short golden fingers and PCB |
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Address after: 518035 bell industrial estate, West Township, Shenzhen, Baoan District, Guangdong Applicant after: Shenzhen Wuzhu Technology Co., Ltd. Co-applicant after: Dongguan Wuzhu Electronic Technology Co., Ltd. Address before: 518035 bell industrial estate, West Township, Shenzhen, Baoan District, Guangdong Applicant before: Shenzhen City Wuzhou Circuit Group Ltd. Co-applicant before: Dongguan Wuzhu Electronic Technology Co., Ltd. |
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Application publication date: 20120620 |