CN102437045A - 湿法刻蚀方法以及湿法刻蚀设备 - Google Patents
湿法刻蚀方法以及湿法刻蚀设备 Download PDFInfo
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- CN102437045A CN102437045A CN2011103884621A CN201110388462A CN102437045A CN 102437045 A CN102437045 A CN 102437045A CN 2011103884621 A CN2011103884621 A CN 2011103884621A CN 201110388462 A CN201110388462 A CN 201110388462A CN 102437045 A CN102437045 A CN 102437045A
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CN2011103884621A CN102437045A (zh) | 2011-11-29 | 2011-11-29 | 湿法刻蚀方法以及湿法刻蚀设备 |
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CN102437045A true CN102437045A (zh) | 2012-05-02 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1091859A (zh) * | 1993-01-20 | 1994-09-07 | 株式会社日立制作所 | 防止液体中杂质附着的溶液和使用它的腐蚀方法及装置 |
JPH11214351A (ja) * | 1998-01-13 | 1999-08-06 | Naoetsu Electronics Co Ltd | シリコン半導体ウエハのエッチング方法 |
CN2632848Y (zh) * | 2003-05-27 | 2004-08-11 | 矽统科技股份有限公司 | 晶圆清洗装置 |
CN1683817A (zh) * | 2004-01-06 | 2005-10-19 | 波克股份有限公司 | 控制流体流动的装置、方法和*** |
CN201309966Y (zh) * | 2008-12-11 | 2009-09-16 | 北京有色金属研究总院 | 一种12英寸硅片腐蚀机上装硅片用花篮 |
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- 2011-11-29 CN CN2011103884621A patent/CN102437045A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1091859A (zh) * | 1993-01-20 | 1994-09-07 | 株式会社日立制作所 | 防止液体中杂质附着的溶液和使用它的腐蚀方法及装置 |
JPH11214351A (ja) * | 1998-01-13 | 1999-08-06 | Naoetsu Electronics Co Ltd | シリコン半導体ウエハのエッチング方法 |
CN2632848Y (zh) * | 2003-05-27 | 2004-08-11 | 矽统科技股份有限公司 | 晶圆清洗装置 |
CN1683817A (zh) * | 2004-01-06 | 2005-10-19 | 波克股份有限公司 | 控制流体流动的装置、方法和*** |
CN201309966Y (zh) * | 2008-12-11 | 2009-09-16 | 北京有色金属研究总院 | 一种12英寸硅片腐蚀机上装硅片用花篮 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140507 |
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Effective date of registration: 20140507 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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Application publication date: 20120502 |