CN102403236A - 芯片外露的半导体器件及其生产方法 - Google Patents
芯片外露的半导体器件及其生产方法 Download PDFInfo
- Publication number
- CN102403236A CN102403236A CN2010102822182A CN201010282218A CN102403236A CN 102403236 A CN102403236 A CN 102403236A CN 2010102822182 A CN2010102822182 A CN 2010102822182A CN 201010282218 A CN201010282218 A CN 201010282218A CN 102403236 A CN102403236 A CN 102403236A
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- metal
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- gate pads
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 78
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 280
- 239000002184 metal Substances 0.000 claims abstract description 280
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 35
- 239000005022 packaging material Substances 0.000 claims description 31
- 238000005520 cutting process Methods 0.000 claims description 28
- 210000003205 muscle Anatomy 0.000 claims description 20
- 238000004026 adhesive bonding Methods 0.000 claims description 17
- 239000002390 adhesive tape Substances 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 14
- 239000010936 titanium Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 5
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- 239000011248 coating agent Substances 0.000 claims description 3
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- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 41
- 230000005855 radiation Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
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- 239000004411 aluminium Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
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- 239000010974 bronze Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000272168 Laridae Species 0.000 description 1
- 229910004337 Ti-Ni Inorganic materials 0.000 description 1
- 229910011209 Ti—Ni Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
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- 238000000227 grinding Methods 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
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- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (22)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010282218.2A CN102403236B (zh) | 2010-09-07 | 2010-09-07 | 芯片外露的半导体器件及其生产方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010282218.2A CN102403236B (zh) | 2010-09-07 | 2010-09-07 | 芯片外露的半导体器件及其生产方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102403236A true CN102403236A (zh) | 2012-04-04 |
CN102403236B CN102403236B (zh) | 2015-03-04 |
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Family Applications (1)
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CN201010282218.2A Active CN102403236B (zh) | 2010-09-07 | 2010-09-07 | 芯片外露的半导体器件及其生产方法 |
Country Status (1)
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CN (1) | CN102403236B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103972073A (zh) * | 2014-04-18 | 2014-08-06 | 丽智电子(昆山)有限公司 | 芯片背面及侧面涂布保护材料的方法 |
CN104793298A (zh) * | 2015-04-13 | 2015-07-22 | 华进半导体封装先导技术研发中心有限公司 | 一种带侧面焊盘的载板结构及其制作方法 |
CN109192715A (zh) * | 2018-09-20 | 2019-01-11 | 江苏长电科技股份有限公司 | 引线框结构、封装结构及其制造方法 |
WO2021097756A1 (en) * | 2019-11-21 | 2021-05-27 | Texas Instruments Incorporated | Packaged electronic device with low resistance backside contact |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1337065A (zh) * | 1999-11-11 | 2002-02-20 | 卡西欧计算机株式会社 | 半导体器件及其制造方法 |
US7166496B1 (en) * | 2005-08-17 | 2007-01-23 | Ciclon Semiconductor Device Corp. | Method of making a packaged semiconductor device |
US7211877B1 (en) * | 1999-09-13 | 2007-05-01 | Vishay-Siliconix | Chip scale surface mount package for semiconductor device and process of fabricating the same |
US20090194880A1 (en) * | 2008-01-31 | 2009-08-06 | Alpha & Omega Semiconductor, Ltd. | Wafer level chip scale package and process of manufacture |
-
2010
- 2010-09-07 CN CN201010282218.2A patent/CN102403236B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7211877B1 (en) * | 1999-09-13 | 2007-05-01 | Vishay-Siliconix | Chip scale surface mount package for semiconductor device and process of fabricating the same |
CN1337065A (zh) * | 1999-11-11 | 2002-02-20 | 卡西欧计算机株式会社 | 半导体器件及其制造方法 |
US7166496B1 (en) * | 2005-08-17 | 2007-01-23 | Ciclon Semiconductor Device Corp. | Method of making a packaged semiconductor device |
US20090194880A1 (en) * | 2008-01-31 | 2009-08-06 | Alpha & Omega Semiconductor, Ltd. | Wafer level chip scale package and process of manufacture |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103972073A (zh) * | 2014-04-18 | 2014-08-06 | 丽智电子(昆山)有限公司 | 芯片背面及侧面涂布保护材料的方法 |
CN103972073B (zh) * | 2014-04-18 | 2016-12-07 | 丽智电子(昆山)有限公司 | 芯片背面及侧面涂布保护材料的方法 |
CN104793298A (zh) * | 2015-04-13 | 2015-07-22 | 华进半导体封装先导技术研发中心有限公司 | 一种带侧面焊盘的载板结构及其制作方法 |
CN109192715A (zh) * | 2018-09-20 | 2019-01-11 | 江苏长电科技股份有限公司 | 引线框结构、封装结构及其制造方法 |
CN109192715B (zh) * | 2018-09-20 | 2024-03-22 | 江苏长电科技股份有限公司 | 引线框结构、封装结构及其制造方法 |
WO2021097756A1 (en) * | 2019-11-21 | 2021-05-27 | Texas Instruments Incorporated | Packaged electronic device with low resistance backside contact |
US11404385B2 (en) | 2019-11-21 | 2022-08-02 | Texas Instruments Incorporated | Packaged electronic device with low resistance roughened backside contact |
Also Published As
Publication number | Publication date |
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CN102403236B (zh) | 2015-03-04 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170619 Address after: Chongqing city Beibei district and high tech Industrial Park the road No. 5 of 407 Patentee after: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Address before: Bermuda Hamilton Church 2 Cola Lunden House Street Patentee before: ALPHA & OMEGA SEMICONDUCTOR, Ltd. Effective date of registration: 20170619 Address after: Bermuda Hamilton Church 2 Cola Lunden House Street Patentee after: ALPHA & OMEGA SEMICONDUCTOR, Ltd. Address before: The British West Indies Dakaiman Cayman Island KY1-1107 No. 122 Marie street P.O.709 mailbox Patentee before: Alpha and Omega Semiconductor (Cayman) Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chip exposed semiconductor device and production method thereof Effective date of registration: 20191210 Granted publication date: 20150304 Pledgee: Chongqing Branch of China Development Bank Pledgor: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Registration number: Y2019500000007 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20150304 Pledgee: Chongqing Branch of China Development Bank Pledgor: Chongqing Wanguo Semiconductor Technology Co.,Ltd. Registration number: Y2019500000007 |