CN102321831B - High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof - Google Patents
High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof Download PDFInfo
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- CN102321831B CN102321831B CN2011103238713A CN201110323871A CN102321831B CN 102321831 B CN102321831 B CN 102321831B CN 2011103238713 A CN2011103238713 A CN 2011103238713A CN 201110323871 A CN201110323871 A CN 201110323871A CN 102321831 B CN102321831 B CN 102321831B
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 79
- 239000000956 alloy Substances 0.000 title claims abstract description 79
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 title abstract description 5
- 229910052761 rare earth metal Inorganic materials 0.000 title abstract description 3
- 238000010791 quenching Methods 0.000 claims abstract description 16
- 230000000171 quenching effect Effects 0.000 claims abstract description 16
- 230000006698 induction Effects 0.000 claims abstract description 15
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 238000003723 Smelting Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims description 16
- 238000012216 screening Methods 0.000 claims description 14
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims description 11
- 238000005275 alloying Methods 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 abstract description 6
- 229910052738 indium Inorganic materials 0.000 abstract description 4
- 229910052779 Neodymium Inorganic materials 0.000 abstract description 3
- 229910052772 Samarium Inorganic materials 0.000 abstract description 3
- 229910052787 antimony Inorganic materials 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract 2
- 229910052786 argon Inorganic materials 0.000 abstract 1
- 229910052793 cadmium Inorganic materials 0.000 abstract 1
- 238000007873 sieving Methods 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000010008 shearing Methods 0.000 description 5
- 229910052684 Cerium Inorganic materials 0.000 description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910020938 Sn-Ni Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 229910008937 Sn—Ni Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- -1 tin bismuth cuprum series Chemical class 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011103238713A CN102321831B (en) | 2011-10-24 | 2011-10-24 | High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof |
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CN2011103238713A CN102321831B (en) | 2011-10-24 | 2011-10-24 | High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
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CN102321831A CN102321831A (en) | 2012-01-18 |
CN102321831B true CN102321831B (en) | 2012-11-28 |
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CN2011103238713A Active CN102321831B (en) | 2011-10-24 | 2011-10-24 | High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof |
Country Status (1)
Country | Link |
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CN (1) | CN102321831B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6197253B1 (en) * | 1998-12-21 | 2001-03-06 | Allen Broomfield | Lead-free and cadmium-free white metal casting alloy |
CN1868022A (en) * | 2003-10-15 | 2006-11-22 | 松下电器产业株式会社 | Lamp |
CN101351297A (en) * | 2005-09-26 | 2009-01-21 | 美国铟泰公司 | Low melting temperature compliant solders |
-
2011
- 2011-10-24 CN CN2011103238713A patent/CN102321831B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6197253B1 (en) * | 1998-12-21 | 2001-03-06 | Allen Broomfield | Lead-free and cadmium-free white metal casting alloy |
CN1868022A (en) * | 2003-10-15 | 2006-11-22 | 松下电器产业株式会社 | Lamp |
CN101351297A (en) * | 2005-09-26 | 2009-01-21 | 美国铟泰公司 | Low melting temperature compliant solders |
Non-Patent Citations (1)
Title |
---|
黄乐 等.铅基快淬焊料与电子焊膏可焊性的比较.《金属功能材料》.1991,(第1期), * |
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CN102321831A (en) | 2012-01-18 |
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Effective date of registration: 20160719 Address after: Xinghua City, Jiangsu province 225700 Taizhou City Dai Yao Industrial Park No. 19 Patentee after: Jiangsu Yuxin Polytron Technologies Inc Address before: 210044 Nanjing City, Pukou Province, Nanjing Road, No. 219, No. six, No. Patentee before: Nanjing University of Information Science and Technology |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof Effective date of registration: 20181016 Granted publication date: 20121128 Pledgee: Bank of China Limited by Share Ltd Xinghua branch Pledgor: Jiangsu Yuxin Polytron Technologies Inc Registration number: 2018320000230 |
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Date of cancellation: 20191008 Granted publication date: 20121128 Pledgee: Bank of China Limited by Share Ltd Xinghua branch Pledgor: Jiangsu Yuxin Polytron Technologies Inc Registration number: 2018320000230 |
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Denomination of invention: High-spreadability tin-antimony-rare earth lead-free solder alloy and preparation method thereof Effective date of registration: 20191012 Granted publication date: 20121128 Pledgee: Bank of China Limited by Share Ltd Xinghua branch Pledgor: Jiangsu Yuxin Polytron Technologies Inc Registration number: Y2019320000184 |