CN102021576B - 一种连续生产挠性覆铜板的方法 - Google Patents
一种连续生产挠性覆铜板的方法 Download PDFInfo
- Publication number
- CN102021576B CN102021576B CN2010105103580A CN201010510358A CN102021576B CN 102021576 B CN102021576 B CN 102021576B CN 2010105103580 A CN2010105103580 A CN 2010105103580A CN 201010510358 A CN201010510358 A CN 201010510358A CN 102021576 B CN102021576 B CN 102021576B
- Authority
- CN
- China
- Prior art keywords
- conductive rollers
- film
- group
- roll
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/221—Ion beam deposition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/48—Ion implantation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
- C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (19)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105103580A CN102021576B (zh) | 2010-09-30 | 2010-09-30 | 一种连续生产挠性覆铜板的方法 |
JP2013520947A JP5636104B2 (ja) | 2010-09-30 | 2011-05-10 | フレキシブル銅張積層板の連続生産方法 |
US13/823,569 US9587318B2 (en) | 2010-09-30 | 2011-05-10 | Method for continuously producing flexible copper clad laminates |
KR1020137006506A KR101465674B1 (ko) | 2010-09-30 | 2011-05-10 | 연성 동박 적층판의 연속 생산 방법 |
EP11827891.0A EP2623638B1 (en) | 2010-09-30 | 2011-05-10 | Method for continuously producing flexible copper clad laminates |
PCT/CN2011/000811 WO2012040993A1 (zh) | 2010-09-30 | 2011-05-10 | 一种连续生产挠性覆铜板的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105103580A CN102021576B (zh) | 2010-09-30 | 2010-09-30 | 一种连续生产挠性覆铜板的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102021576A CN102021576A (zh) | 2011-04-20 |
CN102021576B true CN102021576B (zh) | 2012-06-27 |
Family
ID=43863341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105103580A Active CN102021576B (zh) | 2010-09-30 | 2010-09-30 | 一种连续生产挠性覆铜板的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9587318B2 (zh) |
EP (1) | EP2623638B1 (zh) |
JP (1) | JP5636104B2 (zh) |
KR (1) | KR101465674B1 (zh) |
CN (1) | CN102021576B (zh) |
WO (1) | WO2012040993A1 (zh) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102021576B (zh) * | 2010-09-30 | 2012-06-27 | 深圳市信诺泰创业投资企业(普通合伙) | 一种连续生产挠性覆铜板的方法 |
CN102717554B (zh) * | 2012-07-02 | 2015-08-19 | 武汉光谷创元电子有限公司 | 一种两层型挠性覆铜板 |
CN102995028B (zh) * | 2012-11-27 | 2015-04-15 | 天津大学 | 基于辐照损伤扩散合金化的铜/钼/铜复合材料及制备方法 |
JP6060854B2 (ja) * | 2013-08-21 | 2017-01-18 | 住友金属鉱山株式会社 | 樹脂フィルムの表面処理方法及びこれを含んだ銅張積層板の製造方法 |
CN104372295B (zh) * | 2014-09-23 | 2018-02-16 | 北京师范大学 | 柔性基材电路板及金属钉扎层的制备方法和设备 |
CN107636209B (zh) * | 2015-06-26 | 2021-07-02 | 住友金属矿山股份有限公司 | 导电性基板 |
CN105112863A (zh) * | 2015-07-23 | 2015-12-02 | 珠海元盛电子科技股份有限公司 | 一种在挠性印制电路板上磁控溅射镀铜的方法 |
CN105873371B (zh) * | 2015-11-06 | 2019-11-01 | 武汉光谷创元电子有限公司 | 基板及其制造方法 |
CN105899003B (zh) | 2015-11-06 | 2019-11-26 | 武汉光谷创元电子有限公司 | 单层电路板、多层电路板以及它们的制造方法 |
CN106098927B (zh) * | 2016-08-09 | 2019-11-15 | 江苏艾伦摩尔微电子科技有限公司 | 一种三明治式柔性电容式压力传感器及其制备方法 |
CN106298118B (zh) * | 2016-08-12 | 2019-04-09 | 武汉光谷创元电子有限公司 | 薄膜电阻器及其制造方法 |
KR102274906B1 (ko) * | 2016-09-12 | 2021-07-09 | 후루카와 덴키 고교 가부시키가이샤 | 구리박 및 이것을 갖는 동장 적층판 |
CN106868510A (zh) * | 2017-03-01 | 2017-06-20 | 东莞市航晨纳米材料有限公司 | 一种软体离子双面复合膜低电阻的制备方法 |
CN107620051B (zh) * | 2017-09-04 | 2021-06-22 | 武汉光谷创元电子有限公司 | 覆铜板及其制造方法 |
CN107805833A (zh) * | 2017-12-14 | 2018-03-16 | 安徽展鑫电子材料有限公司 | 一种挠性覆铜板电镀装置 |
CN109097748A (zh) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | 挠性覆铜板的制备方法 |
CN109097750A (zh) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | 挠性覆铜板的制备方法 |
CN109097751A (zh) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | 挠性覆铜板的制备方法 |
CN109097772A (zh) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | 挠性覆铜板的制备方法 |
CN109097749A (zh) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | 挠性覆铜板的制备方法 |
CN108688278A (zh) * | 2018-04-11 | 2018-10-23 | 南京大学 | 一种ptfe基pcb覆铜板及压合方法 |
CN109137035B (zh) * | 2018-08-29 | 2020-10-30 | 谢新林 | 一种铝基覆铜板的制备方法 |
CN109554653B (zh) * | 2018-12-21 | 2020-09-01 | 浙江协和薄钢科技有限公司 | 一种用于带钢热镀锌生产线的带钢收卷机构 |
CN110629185A (zh) * | 2019-09-11 | 2019-12-31 | 佛山市佛欣真空技术有限公司 | 一种钢板的连续真空镀膜机 |
CN110923773B (zh) * | 2019-12-12 | 2021-06-25 | 铜陵蓝盾丰山微电子有限公司 | 一种挠性覆铜板电镀装置 |
CN111263529A (zh) * | 2020-01-20 | 2020-06-09 | 安捷利(番禺)电子实业有限公司 | 高频柔性电路板的制备方法、高频柔性电路板及电子设备 |
CN111613385B (zh) * | 2020-04-16 | 2022-01-18 | 信维通信(江苏)有限公司 | 用于5g高频通信的ptfe覆铜板及其制作方法 |
CN111556662A (zh) * | 2020-04-27 | 2020-08-18 | 安捷利(番禺)电子实业有限公司 | 柔性电路板制备方法、柔性电路板及电子设备 |
CN111748764B (zh) * | 2020-07-10 | 2022-11-04 | 北京市辐射中心 | 一种负极集流体的制备方法及其装置 |
CN111876743A (zh) * | 2020-09-05 | 2020-11-03 | 昆山鑫美源电子科技有限公司 | 柔性导电薄膜的生产加工***及制备工艺 |
CN113386416B (zh) * | 2021-07-08 | 2022-12-16 | 江西柔顺科技有限公司 | 一种导热双面覆铜板及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101157077A (zh) * | 2007-09-18 | 2008-04-09 | 湖北省化学研究院 | 一种无胶型挠性覆铜板的制备方法 |
CN101538728A (zh) * | 2009-03-13 | 2009-09-23 | 谢新林 | 挠性覆铜板的生产方法、设备及挠性覆铜板 |
KR20100004804A (ko) * | 2008-07-04 | 2010-01-13 | 에스디플렉스(주) | 양면 연성 동박 적층판 및 이를 제조하는 방법 |
TW201032688A (en) * | 2009-02-19 | 2010-09-01 | Azotek Co Ltd | Single-sided flexible copper-clad laminate and manufacturing method thereof |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53115069A (en) * | 1977-03-18 | 1978-10-07 | Nippon Mining Co | Method of producing printed circuit board |
US4313815A (en) * | 1978-04-07 | 1982-02-02 | Varian Associates, Inc. | Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor |
JPS54145965A (en) * | 1978-05-08 | 1979-11-14 | Nippon Mining Co | Method of and apparatus for producing board for printed circuit |
US4447773A (en) * | 1981-06-22 | 1984-05-08 | California Institute Of Technology | Ion beam accelerator system |
JPS60141869A (ja) * | 1983-12-29 | 1985-07-26 | Nissin Electric Co Ltd | 膜形成方法および膜形成装置 |
US4645977A (en) * | 1984-08-31 | 1987-02-24 | Matsushita Electric Industrial Co., Ltd. | Plasma CVD apparatus and method for forming a diamond like carbon film |
US4601260A (en) * | 1985-04-01 | 1986-07-22 | Sovonics Solar Systems | Vertical semiconductor processor |
JPS61159569A (ja) | 1985-12-13 | 1986-07-19 | Kakogawa Plast Kk | 可撓性導電フイルムの製造方法 |
JPS63282393A (ja) * | 1987-05-09 | 1988-11-18 | 株式会社ササクラ | 回転ローラ式冷却装置 |
DE69312989T2 (de) * | 1992-03-13 | 1997-12-18 | Matsushita Electric Ind Co Ltd | Plasma-CVD-Anlage und entsprechendes Verfahren |
US5685970A (en) * | 1992-07-01 | 1997-11-11 | Gould Electronics Inc. | Method and apparatus for sequentially metalized polymeric films and products made thereby |
DE4229403C2 (de) * | 1992-09-03 | 1995-04-13 | Hoellmueller Maschbau H | Vorrichtung zum Galvanisieren dünner, ein- oder beidseits mit einer leitfähigen Beschichtung versehener Kunststoffolien |
JPH07263843A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | プリント配線板のメッキ方法及びメッキ装置 |
US6209481B1 (en) * | 1996-08-30 | 2001-04-03 | University Of Maryland Baltimore County | Sequential ion implantation and deposition (SIID) system |
JPH11335837A (ja) * | 1998-05-20 | 1999-12-07 | Sony Corp | 磁気媒体製造装置 |
US6036758A (en) * | 1998-08-10 | 2000-03-14 | Pmd (U.K.) Limited | Surface treatment of copper |
JP2000307139A (ja) | 1999-04-21 | 2000-11-02 | Fuji Electric Co Ltd | 薄膜太陽電池の製造方法及び薄膜電極層形成装置 |
JP2000340166A (ja) * | 1999-05-27 | 2000-12-08 | Sony Corp | 成膜方法及び成膜物 |
TWI255871B (en) * | 2000-12-20 | 2006-06-01 | Learonal Japan Inc | Electrolytic copper plating solution and process for electrolytic plating using the same |
JP2004018949A (ja) * | 2002-06-17 | 2004-01-22 | Toray Ind Inc | めっき用陰極ロールおよびめっき被膜付きフィルムの製造方法 |
EP1514957B1 (en) | 2002-06-17 | 2009-08-26 | Toray Industries, Inc. | Method for manufacturing plated resin film |
JP3443420B1 (ja) | 2002-09-18 | 2003-09-02 | テクノロジーシードインキュベーション株式会社 | フレキシブルプリント配線板の製造装置及び製造方法 |
JP4116469B2 (ja) * | 2003-02-28 | 2008-07-09 | 東レ株式会社 | シートの搬送方法と製造方法および装置 |
JP4479184B2 (ja) * | 2003-08-07 | 2010-06-09 | パナソニック株式会社 | プラスチックフィルムの製造方法及びそれを応用したフレキシブルプリント回路基板 |
JP4397702B2 (ja) | 2004-02-04 | 2010-01-13 | 三菱伸銅株式会社 | 金属化ポリイミドフィルムの製造方法 |
KR100701641B1 (ko) * | 2004-08-02 | 2007-03-30 | 도레이새한 주식회사 | 진공증착에 의해 구리도금층을 형성하는 연성회로기판용 적층구조체의 제조방법 및 그 장치 |
JP2006283044A (ja) * | 2005-03-31 | 2006-10-19 | Hyomen Shori System:Kk | フィルムへの連続めっき装置および方法 |
KR101045149B1 (ko) * | 2005-08-04 | 2011-06-30 | 가부시키가이샤 가네카 | 금속 피복 폴리이미드 필름 |
US7767126B2 (en) * | 2005-08-22 | 2010-08-03 | Sipix Imaging, Inc. | Embossing assembly and methods of preparation |
CN101410545B (zh) * | 2006-03-31 | 2011-06-15 | Hoya株式会社 | 离子枪***、蒸镀装置及透镜的制造方法 |
CN1952209A (zh) | 2006-11-09 | 2007-04-25 | 中国矿业大学 | 聚合物表面化学镀前的离子注入铜、镍预处理工艺 |
JP5194602B2 (ja) | 2007-07-20 | 2013-05-08 | 住友金属鉱山株式会社 | 金属被覆ポリイミド基板の製造方法 |
KR20080087622A (ko) * | 2007-08-02 | 2008-10-01 | 주식회사 피앤아이 | 무접착 양면 fccl, 및 이를 이용한 fpcb 및 그제조 방법 |
ES2336870B1 (es) * | 2007-08-20 | 2011-02-18 | Novogenio, S.L. | Sistema y procedimiento para el recubrimiento en vacio y en continuo de un material en forma de banda. |
KR20090101738A (ko) * | 2008-03-24 | 2009-09-29 | 삼성전기주식회사 | 진공증착장치 및 그 제어방법 |
JP5241383B2 (ja) * | 2008-08-27 | 2013-07-17 | 株式会社神戸製鋼所 | 連続成膜装置 |
CN102021576B (zh) * | 2010-09-30 | 2012-06-27 | 深圳市信诺泰创业投资企业(普通合伙) | 一种连续生产挠性覆铜板的方法 |
-
2010
- 2010-09-30 CN CN2010105103580A patent/CN102021576B/zh active Active
-
2011
- 2011-05-10 WO PCT/CN2011/000811 patent/WO2012040993A1/zh active Application Filing
- 2011-05-10 US US13/823,569 patent/US9587318B2/en active Active
- 2011-05-10 JP JP2013520947A patent/JP5636104B2/ja active Active
- 2011-05-10 EP EP11827891.0A patent/EP2623638B1/en active Active
- 2011-05-10 KR KR1020137006506A patent/KR101465674B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101157077A (zh) * | 2007-09-18 | 2008-04-09 | 湖北省化学研究院 | 一种无胶型挠性覆铜板的制备方法 |
KR20100004804A (ko) * | 2008-07-04 | 2010-01-13 | 에스디플렉스(주) | 양면 연성 동박 적층판 및 이를 제조하는 방법 |
TW201032688A (en) * | 2009-02-19 | 2010-09-01 | Azotek Co Ltd | Single-sided flexible copper-clad laminate and manufacturing method thereof |
CN101538728A (zh) * | 2009-03-13 | 2009-09-23 | 谢新林 | 挠性覆铜板的生产方法、设备及挠性覆铜板 |
Also Published As
Publication number | Publication date |
---|---|
EP2623638A4 (en) | 2017-01-04 |
JP5636104B2 (ja) | 2014-12-03 |
EP2623638B1 (en) | 2021-09-22 |
JP2013540197A (ja) | 2013-10-31 |
US20130228468A1 (en) | 2013-09-05 |
KR101465674B1 (ko) | 2014-11-27 |
US9587318B2 (en) | 2017-03-07 |
KR20130060300A (ko) | 2013-06-07 |
WO2012040993A1 (zh) | 2012-04-05 |
CN102021576A (zh) | 2011-04-20 |
EP2623638A1 (en) | 2013-08-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102021576B (zh) | 一种连续生产挠性覆铜板的方法 | |
CN102717554B (zh) | 一种两层型挠性覆铜板 | |
TWI462827B (zh) | Liquid crystal polymer film base copper clad laminate and manufacturing method thereof | |
KR101344952B1 (ko) | 구리 피복 적층판 및 그 제조 방법 | |
US20090291319A1 (en) | Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, surface-treated copper foil with carrier sheet and copper-clad laminate using the surface-treated copper foil with carrier sheet | |
JP5659807B2 (ja) | ロール・トゥ・ロール方式真空両面成膜装置および両面金属ベース層付樹脂フィルム製造装置 | |
EP2893781B1 (en) | Method for making flexible circuits | |
JP4341023B2 (ja) | 金属被覆液晶ポリマーフィルムの製造方法 | |
KR101391510B1 (ko) | 금속 나노와이어를 구비한 다층 투명 전극 소자 | |
KR20150003854A (ko) | 2층 플렉시블 배선용 기판 및 플렉시블 배선판 및 이들의 제조 방법 | |
TW201446988A (zh) | 透明氣體障蔽薄膜之製造方法、及透明氣體障蔽薄膜之製造裝置 | |
CN101996891B (zh) | 覆金属聚酰亚胺薄膜及其制造方法 | |
JP2014053410A (ja) | 両面金属積層フィルムの製造方法とその製造装置、および、フレキシブル両面プリント配線基板の製造方法 | |
JP2012026025A (ja) | 成膜方法、金属ベース層付樹脂フィルムの製造方法及びスパッタリング装置 | |
KR101705078B1 (ko) | 양면 금속적층 필름의 제조방법 및 그로부터 제조되는 양면 금속적층 필름 | |
US8246809B2 (en) | Apparatus and method for electroplating a substrate in a continuous way | |
EP3872237B1 (en) | Apparatus and method for manufacturing resin film provided with metal membrane | |
CN105856792A (zh) | 单面薄型金属基板的制造方法 | |
JP6880810B2 (ja) | 樹脂フィルムの表面処理法及びこれを有する銅張積層基板の製造方法 | |
KR20140057008A (ko) | 구리호일 제조방법 | |
KR101985729B1 (ko) | 초박막 구리포일의 제조방법 및 이로 제조된 초박막 구리포일 | |
JP2003342787A (ja) | フレキシブルプリント配線用基板の製造方法 | |
CN116884671A (zh) | 一种高分子导电膜、制备方法和锂离子电芯 | |
KR20240114991A (ko) | 두께 균일성 및 부착성이 향상된 극박동박 | |
TW202323594A (zh) | 粗化處理銅箔及銅箔積層板、與印刷配線板之製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN XINNUOTAI VENTURE CAPITAL ENTERPRISE (LIM Free format text: FORMER NAME: SHENZHEN XINNUOTAI VENTURE CAPITAL ENTERPRISE (GENERAL PARTNERSHIP) |
|
CP03 | Change of name, title or address |
Address after: Shenzhen City, Guangdong province Nanshan District 518053 Industrial Zone Nanyou second Deng Liang Road 206 Building 2 layer 205B7 (hancon centre B) Patentee after: Shenzhen Sino Thai venture investment enterprises (limited partnership) Address before: 518057, Guangdong, Shenzhen province Nanshan District Nanhai Road, sea king building residential building 26B Patentee before: Shenzhen Xinnuotai Enterprises Investment (Ordinary Joint) Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: ZHUHAI CHUANGYUAN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: SHENZHEN XINNUOTAI VENTURE CAPITAL ENTERPRISE (LIM Effective date: 20121019 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518053 SHENZHEN, GUANGDONG PROVINCE TO: 519031 ZHUHAI, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121019 Address after: 519031, room 19, 713 Haihe street, Hengqin Town, Guangdong, Zhuhai Patentee after: ZHUHAI CHUANGYUAN ELECTRONIC CO., LTD. Address before: Shenzhen City, Guangdong province Nanshan District 518053 Industrial Zone Nanyou second Deng Liang Road 206 Building 2 layer 205B7 (hancon centre B) Patentee before: Shenzhen Sino Thai venture investment enterprises (limited partnership) |
|
C56 | Change in the name or address of the patentee |
Owner name: WUHAN GUANGGU CHUANGYUAN ELECTRONIC CO., LTD. Free format text: FORMER NAME: ZHUHAI CHUANGYUAN ELECTRONIC CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 430000 Hubei city of Wuhan Province, East Lake New Technology Development Zone, Road No. 519, the Great Wall city coordinates room 6 1-201 Patentee after: Wuhan optical valley Chuan Yuan Electronics Co., Ltd. Address before: 519031, room 19, 713 Haihe street, Hengqin Town, Guangdong, Zhuhai Patentee before: ZHUHAI CHUANGYUAN ELECTRONIC CO., LTD. |