CN102003903B - 热管及采用该热管的散热装置 - Google Patents
热管及采用该热管的散热装置 Download PDFInfo
- Publication number
- CN102003903B CN102003903B CN200910306391.9A CN200910306391A CN102003903B CN 102003903 B CN102003903 B CN 102003903B CN 200910306391 A CN200910306391 A CN 200910306391A CN 102003903 B CN102003903 B CN 102003903B
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- support
- heat
- capillary structure
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Geometry (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910306391.9A CN102003903B (zh) | 2009-08-31 | 2009-08-31 | 热管及采用该热管的散热装置 |
US12/620,571 US20110048682A1 (en) | 2009-08-31 | 2009-11-17 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910306391.9A CN102003903B (zh) | 2009-08-31 | 2009-08-31 | 热管及采用该热管的散热装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102003903A CN102003903A (zh) | 2011-04-06 |
CN102003903B true CN102003903B (zh) | 2013-07-03 |
Family
ID=43623109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910306391.9A Active CN102003903B (zh) | 2009-08-31 | 2009-08-31 | 热管及采用该热管的散热装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20110048682A1 (zh) |
CN (1) | CN102003903B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100833497B1 (ko) * | 2006-09-29 | 2008-05-29 | 한국전자통신연구원 | 전자기기용 열균일화 장치 |
CN203177703U (zh) * | 2013-01-14 | 2013-09-04 | 深圳市万景华科技有限公司 | 立体式导热结构 |
GB2511354A (en) * | 2013-03-01 | 2014-09-03 | Iceotope Ltd | A module for cooling one or more heat generating components |
TWI534403B (zh) * | 2013-12-10 | 2016-05-21 | 建準電機工業股份有限公司 | 熱交換管 |
CN105241287A (zh) * | 2014-07-07 | 2016-01-13 | 杨积文 | 柱状传热装置及用于流体物质传热的管道及方法 |
CN105318755B (zh) * | 2014-07-29 | 2019-07-05 | 杨积文 | 双层柱状传热装置及用于流体物质传热的管道及方法 |
CN105318750B (zh) * | 2014-07-29 | 2018-11-06 | 杨积文 | 蜂窝状传热装置及其用途 |
CN106998813B (zh) | 2014-11-17 | 2020-05-01 | 麦克内尔股份公司 | 用于电子尼古丁递送***的一次性套筒 |
TR201910352T4 (tr) * | 2014-11-17 | 2019-07-22 | Mcneil Ab | Elektronik nikotin iletim sistemi. |
CN111577467B (zh) * | 2020-05-27 | 2021-08-31 | 中国航空发动机研究院 | 一种用于高速吸气式发动机的拼接式换热器 |
CN114459267B (zh) * | 2020-11-09 | 2023-10-31 | 欣兴电子股份有限公司 | 均温板装置及其制作方法 |
CN114046680B (zh) * | 2021-11-23 | 2023-07-21 | 联想(北京)有限公司 | 热管及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3892273A (en) * | 1973-07-09 | 1975-07-01 | Perkin Elmer Corp | Heat pipe lobar wicking arrangement |
US5632158A (en) * | 1995-03-20 | 1997-05-27 | Calsonic Corporation | Electronic component cooling unit |
CN1849049A (zh) * | 2006-04-20 | 2006-10-18 | 嘉善华昇电子热传科技有限公司 | 扁形柱状热管 |
CN101203117A (zh) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3603382A (en) * | 1969-11-03 | 1971-09-07 | Nasa | Radial heat flux transformer |
US4440215A (en) * | 1971-02-08 | 1984-04-03 | Q-Dot Corporation | Heat pipe |
US3901311A (en) * | 1973-01-12 | 1975-08-26 | Grumman Aerospace Corp | Self-filling hollow core arterial heat pipe |
DE3568631D1 (en) * | 1984-12-27 | 1989-04-13 | Toshiba Kk | Heat pipe |
US4883116A (en) * | 1989-01-31 | 1989-11-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Ceramic heat pipe wick |
US6490250B1 (en) * | 1999-03-09 | 2002-12-03 | Conexant Systems, Inc. | Elementary stream multiplexer |
JP3776281B2 (ja) * | 1999-04-13 | 2006-05-17 | アルプス電気株式会社 | インダクティブ素子 |
US20020144802A1 (en) * | 2001-04-06 | 2002-10-10 | Visteon Global Technologies | Evaporative cooling device and method |
TW577683U (en) * | 2003-06-02 | 2004-02-21 | Jiun-Guang Luo | Heat sink |
TWM246683U (en) * | 2003-08-13 | 2004-10-11 | Hon Hai Prec Ind Co Ltd | Heat sink assembly |
US20050274495A1 (en) * | 2004-05-28 | 2005-12-15 | Wang Chin W | Cylindrical heat pipe structure |
TW200635490A (en) * | 2005-03-25 | 2006-10-01 | Tai Sol Electronics Co Ltd | Combining method of heat dissipating device and conductivity bump and the combination assembly thereof |
US7423879B2 (en) * | 2006-05-31 | 2008-09-09 | Neng Tyi Precision Industries Co., Ltd. | Sleeve-tightening heat dissipating module |
-
2009
- 2009-08-31 CN CN200910306391.9A patent/CN102003903B/zh active Active
- 2009-11-17 US US12/620,571 patent/US20110048682A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3892273A (en) * | 1973-07-09 | 1975-07-01 | Perkin Elmer Corp | Heat pipe lobar wicking arrangement |
US5632158A (en) * | 1995-03-20 | 1997-05-27 | Calsonic Corporation | Electronic component cooling unit |
CN1849049A (zh) * | 2006-04-20 | 2006-10-18 | 嘉善华昇电子热传科技有限公司 | 扁形柱状热管 |
CN101203117A (zh) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | 散热装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110048682A1 (en) | 2011-03-03 |
CN102003903A (zh) | 2011-04-06 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD. Effective date: 20150115 Owner name: JIANGSU ZHIFANG CONSTRUCTION ENGINEERING CO., LTD. Effective date: 20150115 Owner name: STATE GRID SHANGHAI ELECTRIC POWER COMPANY Free format text: FORMER OWNER: SHENZHEN QICHUANGMEI TECHNOLOGY CO., LTD. Effective date: 20150115 Owner name: SHENZHEN QICHUANGMEI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20150115 |
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COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518000 SHENZHEN, GUANGDONG PROVINCE TO: 200001 HUANGPU, SHANGHAI Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20150115 Address after: 200001 Nanjing East Road, Shanghai, No. 181, No. Patentee after: STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER Co. Patentee after: JIANGSU ZHIFANG CONSTRUCTION ENGINEERING Co.,Ltd. Address before: Futian District King Road Shenzhen city Guangdong province 518000 No. 108 Tze Wei court 1218 Patentee before: Shenzhen Qichuangmei Technology Co.,Ltd. Effective date of registration: 20150115 Address after: Futian District King Road Shenzhen city Guangdong province 518000 No. 108 Tze Wei court 1218 Patentee after: Shenzhen Qichuangmei Technology Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuzhun Precision Industry (Shenzhen) Co.,Ltd. Patentee before: Foxconn Technology Co.,Ltd. |