CN101951340B - Backboard, board card and network device - Google Patents
Backboard, board card and network device Download PDFInfo
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- CN101951340B CN101951340B CN2010102827542A CN201010282754A CN101951340B CN 101951340 B CN101951340 B CN 101951340B CN 2010102827542 A CN2010102827542 A CN 2010102827542A CN 201010282754 A CN201010282754 A CN 201010282754A CN 101951340 B CN101951340 B CN 101951340B
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Abstract
The invention provides a backboard, a board card and a network device. The backboard comprises a substrate, a first locating tab and a power wire, wherein the substrate is provided with a power interface, a plurality of slots and a connecting wire connected among the slots; the first locating tab is arranged on the substrate and at one side of the slot, and is used for matching with a first pilot pin on the board card inserted into the slots to fix the board card; and the power wire is arranged on the surface of the substrate and is separately connected with the power interface and the first locating tab in order to supply power to the board card through the first locating tab and the first pilot pin. Adopting the technical scheme of the invention can ensure that the backboard provides higher currents which does not flow through the substrate, and thus the damage caused by the heat generated by the high currents on the backboard and the interference of the high currents on other signals are reduced.
Description
Technical field
The present invention relates to the backboard in the communication equipment, relate in particular to a kind of backboard, integrated circuit board and the network equipment.
Background technology
Modularization is meant the performance difference but function or interface, size of using the equipment that has identical point etc. carry out standardization, and standardized equipment is called as module; These modules are placed in the modular chassis, and with modular chassis composition module equipment, claim the modularization main frame again.Wherein, the user can select suitable module according to demand, and module is installed to the various functions of realization flexible in the modular chassis.
Usually, module can be divided into administration module, business module and power module according to its function, and the module of difference in functionality has different effects, and for example power module is used for to each module operating current being provided.And modularized equipment comprises cabinet and backboard; Cabinet is used for the placement of module and fixes; Backboard is mainly used in realizes interconnecting of intermodule.Wherein, backboard is a printed circuit board (Printed CircuitBoard; Abbreviate as: PCB), pcb board is provided with a plurality of connectors (being commonly called connector), and backboard is realized interconnecting of intermodule through these connectors.These connectors can be connected with power module, business module or administration module respectively, and can define various signals respectively, for example: power supply signal, low speed signal or high speed signal etc.On backboard, each connector is carried out interconnected, finally realize interconnecting of intermodule through connecting cabling.Wherein, connect cabling and be generally the copper sheet cabling.
Along with port density, the port speed of equipment are increasingly high, the power consumption of equipment is increasingly high, and the electric current of the backboard of then flowing through is increasing, and therefore, the conveying of carrying out big electric current becomes the backboard urgent problem.
A kind of technical scheme of transmitting big electric current is directly to utilize pcb board to carry out the conveying of big electric current in the prior art, and is as shown in Figure 1.Power supply backplane and the eutergum of comprising shown in Figure 1 wherein comprises slot 11-slot 14 and power connector 15 on the power supply backplane; Eutergum comprises power connector 16, power supply cabling 17 and power connector 31-power connector 34, and other connectors are with to be connected cabling not shown.Power connector 15 is connected with power connector 16; The corresponding respectively output of inserting 14, four power modules of slot 11-slot of power module 21-power module 24 synthesizes one the tunnel on power supply backplane, be sent on the eutergum through power connector 15 and power connector 16.Electric current is transferred to power connector 31-power connector 34 through power supply cabling 17 on eutergum.When integrated circuit board inserted eutergum, any one or several corresponding connection in the connector on the integrated circuit board and the power connector 31-power connector 34 were incorporated into electric current on the integrated circuit board, pass through various power source conversion generations then and satisfy the required voltage of each integrated circuit board work.
In technique scheme, generally can transmit bigger electric current through thickness or the width that increases the power supply cabling; But the on the one hand big electric current pcb board of flowing through unavoidably can produce great amount of heat, and these heats will damage pcb board as can't in time loosing; These current signals basically all can be passed by from other connector annexes on the other hand, can produce bigger interference to the signal on other connectors especially high speed signal.
The technical scheme of the big electric current of another kind of transmission is to adopt the switched-mode power supply mode in the prior art.As shown in Figure 2, power module 21 is given power connector 31 and power connector 32 power supplies respectively with power module 22; And power module 23 is given power connector 33 and power connector 34 power supplies respectively with power module 24.Supply power with this mode, the electric current on the single channel power supply cabling has reduced, and still, total electric current still fails to change on the eutergum, and therefore, heat problem and interference problem that these electric currents cause still exist.
Summary of the invention
The present invention provides a kind of backboard, integrated circuit board and the network equipment, in order to solve prior art when transmitting big electric current, heat dissipation problem and interference problem that big electric current causes.
The present invention provides a kind of backboard; Comprise substrate; Said substrate is provided with power interface, a plurality of slot and is connected in the connection cabling between a plurality of slots; Also comprise: first dowel, be arranged on the said substrate and be positioned at said slot one side, be used for the integrated circuit board that inserts said slot on first pilot pin match with fixing said integrated circuit board;
The power supply cabling is arranged at the surface of said substrate, is connected with said first dowel with said power interface respectively, to supply power to said integrated circuit board through said first dowel and said first pilot pin.
The present invention provides a kind of integrated circuit board, comprising:
First pilot pin is connected with the electric module that receives on the said integrated circuit board.
The present invention provides a kind of network equipment, comprises backboard provided by the invention.
The backboard provided by the invention and the network equipment, through first dowel and power supply cabling are set on substrate, the power supply cabling is arranged at substrate surface and is connected the integrated circuit board of realizing to the insertion slot with first dowel and supplies power.Because the power supply cabling is arranged on substrate surface rather than the substrate, make electric current without substrate, solved the influence of heat that big electric current causes to substrate; Simultaneously, irrelevant because the power supply cabling is arranged at substrate surface and supplies power to integrated circuit board through first dowel with other cablings on the substrate, can obviously reduce interference to other cablings; Integrated circuit board provided by the invention and backboard of the present invention adapt, and therefore, adopt technical scheme of the present invention, can transmit big electric current on the backboard, but can not receive the heat that big electric current causes and the influence of interference.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do one to the accompanying drawing of required use in embodiment or the description of the Prior Art below introduces simply; Obviously, the accompanying drawing in describing below is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 carries out the back board structure sketch map that big electric current is carried for directly utilizing pcb board in the prior art;
Fig. 2 carries out the back board structure sketch map that big electric current is carried for utilizing the switched-mode power supply mode in the prior art;
Fig. 3 a is the schematic top plan view of a kind of partial structurtes of the backboard that provides of the embodiment of the invention one;
Fig. 3 b is the structural representation of first dowel that provides of the embodiment of the invention one;
Fig. 3 c is the structural representation of first pilot pin that provides of the embodiment of the invention one;
Fig. 3 d is the schematic top plan view of the another kind of partial structurtes of the backboard that provides of the embodiment of the invention one;
The schematic top plan view of the partial structurtes of the backboard that Fig. 4 provides for the embodiment of the invention two;
Fig. 5 a is the schematic top plan view of the partial structurtes of the backboard that provides of the embodiment of the invention three;
Fig. 5 b is the schematic side view of the partial structurtes of the backboard that provides of the embodiment of the invention three.
Embodiment
For the purpose, technical scheme and the advantage that make the embodiment of the invention clearer; To combine the accompanying drawing in the embodiment of the invention below; Technical scheme in the embodiment of the invention is carried out clear, intactly description; Obviously, described embodiment is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
Usually, in modularized equipment, can be used for playing the guiding role in integrated circuit board plug process by the installing and locating tip, and on integrated circuit board, can pilot pin be arranged corresponding setting, dowel and pilot pin reach the fixation to integrated circuit board through supporting use.And the contact portion of dowel and pilot pin is generally used metal material usually.Technical scheme of the present invention can realize based on said structure.
Embodiment one
Fig. 3 a is the schematic top plan view of a kind of partial structurtes of the backboard that provides of the embodiment of the invention one.Shown in Fig. 3 a, the backboard of present embodiment comprises substrate 1, and substrate 1 is provided with power interface 2, a plurality of slot 3, first dowel 5 and power supply cabling 6; Connect through connecting cabling 4 between a plurality of slots 3, wherein connect cabling 4 shown in Fig. 3 a and be merely schematic example.The concrete laying that connects cabling 4 is determined by the interconnecting relation between each slot 3.In this area, this connection cabling 4 is generally the copper sheet cabling.
Wherein, power interface 2 is used for output current, and it can be the output port that directly is installed on the power module on the substrate 1, also can be on the substrate 1 with power supply backplane on the output port of the power connector that is connected of power connector.Present embodiment does not limit the concrete realization of power interface 2, and it is specifically decided by back board structure.For example; When backboard need be provided with independently power supply backplane; Power interface 2 is the output port of the power connector on the substrate 1 that is connected with the power connector of power supply backplane, and the electric current of this output port output is provided by the power module on the power supply backplane, and this structure can be as shown in Figure 1; When substrate 1 was provided with power supply slot, power module also can directly insert the power supply slot on the backboard, and then the output port of power supply slot is the power interface 2 in the present embodiment, and this structure can be as shown in Figure 2.
The backboard of present embodiment through the power supply cabling is set at substrate surface, makes electric current pass by via substrate surface; Bearing great current no longer on the substrate; Improved the heat dispersion of substrate, solved the heat dissipation problem that big electric current causes in the prior art, reduced the extent of damage of heat substrate; Simultaneously; Through walking the electric current signal separately at substrate surface; And electric current is offered integrated circuit board through connected first dowel; No longer carry big source current on the substrate, reduced the interference of power current signal, reduced the interference that big electric current causes high speed signal etc. when on substrate, walking big electric current in the prior art high speed signal.
Further, the backboard power supply cabling of present embodiment is arranged at substrate surface, but not is arranged on the substrate; In bearing great current, need not the lamination that backboard increases the power supply cabling, therefore; Can reduce the design difficulty of backboard, allow to use on the backboard cabling lamination still less.
In technique scheme, first dowel 5 of present embodiment can directly be arranged on the substrate 1, and links to each other with power supply cabling 6 with welding manner through extra connecting line.Wherein, extra connecting line is arranged at the surface of substrate 1 equally, and has certain safe distance with substrate 1.In addition, first dowel 5 of present embodiment can also be directly fixed on the power supply cabling 6 through screw, to realize fixing and to realize simultaneously and being connected of power supply cabling 6.This structure implementation is simple, and is convenient to follow-up replacing and maintenance.
Wherein, have electric conductivity preferably based on copper product, first dowel 5 in the above embodiment of the present invention has conductivity, and its material preferably adopts copper.Accordingly, also have conductivity with first dowel, the 5 first corresponding pilot pins, and preferred material is a copper.And power supply cabling 6 also is preferably with copper bar and makes its material, and promptly the power supply cabling in the embodiment of the invention 6 is a copper bar.Above-mentioned except copper, other conductive metal materials also can be used as the material of the present invention's first dowel 5 and power supply cabling 6 like aluminium, silver or alloy etc., and the present invention does not limit this.
Further, shown in Fig. 3 d, in order to adapt with existing back board structure; The substrate of backboard of the present invention is provided with slot 3; Except comprising the signal socket connector (not shown), also be provided with power connector 7 in the slot 3, power connector 7 is connected with power supply cabling 6.Under this structure, electric current offers integrated circuit board through first dowel 5 with power connector 7 respectively.Under this structure, still need not carry big source current on the substrate 1, therefore, can not receive the infringement of the heat that produces than the large power supply electric current; And this structure can simultaneously provide electric current by two paths to integrated circuit board, the burden when having alleviated first dowel 5 or power connector 7 and bearing alone; The most important thing is that this structure need not do big change to backboard or integrated circuit board, can realize compatibility with prior art.For example: when be not provided with on the integrated circuit board that the user uses first pilot pin or first pilot pin not with integrated circuit board on be connected by electric module the time; Source current can offer integrated circuit board through the power connector in this structure 7; When making backboard carry big electric current, realize compatibility to existing integrated circuit board.
Further again, in the above embodiment of the present invention, because power supply cabling 6 is arranged at the surface of substrate 1, making on the substrate 1 needn't bearing great current, has improved the heat dissipation problem of backboard; Simultaneously and since power supply cabling 6 be arranged at substrate 1 the outside its can dispel the heat preferably, technical scheme itself promptly of the present invention has had preferable heat dispersion, therefore, compared with prior art, can carry bigger electric current.And,, also being provided with the air channel on the substrate 1 of present embodiment with the ability of further raising loaded current in order further to improve heat-sinking capability, said air channel is used for power supply cabling 6 is dispelled the heat, so that carry bigger electric current.Wherein, the air channel can be realized by fan.And be the fan that power supply cabling 6 is dispelled the heat and is provided with, for example can be arranged at the opposite end of power supply cabling 6 on the backboard, or the positions such as the left and right sides of power supply cabling 6; Fan the influence that common needs are taken all factors into consideration many factors such as power supply cabling, size of current and casing structure specifically is set.
On the basis of technique scheme, technical scheme of the present invention is further to improve the bearing capacity of electric current, and the structure of another kind of backboard is provided, and specifically sees the description of embodiment two for details.
Embodiment two
The schematic top plan view of the partial structurtes of the backboard that Fig. 4 provides for the embodiment of the invention two.Present embodiment realizes that based on embodiment one as shown in Figure 4, the difference of present embodiment and embodiment one is that a side of each slot 3 is provided with a plurality of first dowels 5 on the substrate 1 of this enforcement, in Fig. 4, is example with 2.Wherein,, can constitute many supply accesses, utilize the mode of multiple-way supply can reduce the electric current on every road, and then improve whole current capacity through increasing the quantity of the first corresponding dowel 5 of each slot 3.Wherein, the number of each slot 3 corresponding first dowel 5 that are provided with can combine actual substrate layout and current requirements to confirm.
In addition, present embodiment can also further improve current capacity through increasing the width of power supply cabling 6 (being copper bar), has the simple advantage of enforcement.Further, because the power supply cabling 6 of present embodiment is arranged at the surface of substrate 1, the increase of the width of power supply cabling 6 can not influence the lamination of substrate 1 upward wiring, and therefore, this technical scheme does not influence the structure of substrate, but can improve current capacity.The width of the power supply cabling 6 of present embodiment can be confirmed by the thickness of size of current and power supply cabling 6 usually, therefore, and the power supply cabling 6 of definite suitable width that can easy and flexible.Through adopting technique scheme, can make the current capacity of the high prior art backboard of current capacity of backboard of the present invention far away.
Embodiment three
Fig. 5 a is the schematic top plan view of the partial structurtes of the backboard that provides of the embodiment of the invention three; Fig. 5 b is the schematic side view of the partial structurtes of the backboard that provides of the embodiment of the invention three.Present embodiment can be realized based on the foregoing description one or embodiment two; Shown in Fig. 5 a and Fig. 5 b; The difference of itself and the foregoing description is, also is provided with second dowel 8 on the substrate 1 of present embodiment, and second dowel 8 is positioned at the opposite side of the corresponding slot 3 of first dowel 5; Be used to provide earth signal, 5 to constitute current circuits slightly with first location.
Wherein, What walk on first dowel 5 among above-mentioned each embodiment of the present invention is power supply signal; Usually on backboard, also need earth signal, this earth signal can adopt the earth signal on the existing backboard, perhaps adopts and the set-up mode of existing earth signal on backboard is provided with.The backboard of present embodiment is through being provided with second dowel 8 so that earth signal to be provided.Second dowel 8 and first dowel, 5 common formation paths provide electric current to integrated circuit board.
Wherein, first dowel 5 and second dowel 8 can directly be fixed on the substrate 1 through screw 9 (shown in Fig. 5 b), and this set-up mode is easy to follow-up maintenance or replacing.
Further, on the basis of technique scheme,, require the height of second dowel 8 to be greater than the height (shown in Fig. 5 b) of first dowel 5 in order to support the function of hot plug.Can guarantee like this that in hot plug process integrated circuit board is signal contiguously earlier, i.e. second dowel 8 is to guarantee integrated circuit board safety.Wherein, because each power supply signal can a shared earth signal, therefore, the number of second dowel 8 of present embodiment can be identical with the number of first dowel 5, also can be different with the number of first dowel 5, and present embodiment does not limit this.But, because the path that ground is the cooperation power supply constitutes current reflux, number of power sources is one to one with the quantity on ground usually, therefore, optimal technical scheme is that first dowel 5 is identical with the quantity of second dowel 8.
Embodiment four
The embodiment of the invention four provides a kind of integrated circuit board, and it is provided with first pilot pin, be used for backboard provided by the invention on first dowel match with fixing integrated circuit board; This first pilot pin is connected with the electric module that receives on the integrated circuit board simultaneously, so that cooperate to integrated circuit board electric current is provided with power supply cabling and first dowel on the backboard.
The integrated circuit board of present embodiment is connected with receiving electric module through first pilot pin; And to integrated circuit board electric current is provided through it for first dowel on the backboard; Can solve the problem of bearing great current on the backboard; Make on the backboard no longer bearing great current, and then solved and walk heat dissipation problem and the signal interference problem that big electric current causes on the backboard.
Further, when backboard is provided with second dowel, can also be provided with second pilot pin that is used with second dowel on the integrated circuit board of present embodiment.And the structure of second dowel and second pilot pin and corresponding relation also can adopt the structure shown in Fig. 3 b and Fig. 3 c.Can improve integrated circuit board fixation stability degree and reliability through additional second dowel and second pilot pin.
Embodiment five
The embodiment of the invention five provides a kind of network equipment, comprises the backboard that the embodiment of the invention provides.The network equipment of present embodiment can be the equipment that larger switch or router etc. have big electric current backboard.
The network equipment of present embodiment through adopting the structure of the backboard that the embodiment of the invention provides, can realize carrying big electric current equally, but needn't worry heat dissipation problem that big electric current causes and high speed signal etc. is produced interference problem.
What should explain at last is: above embodiment is only in order to explaining technical scheme of the present invention, but not to its restriction; Although with reference to previous embodiment the present invention has been carried out detailed explanation, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these are revised or replacement, do not make the spirit and the scope of the essence disengaging various embodiments of the present invention technical scheme of relevant art scheme.
Claims (11)
1. a backboard comprises substrate, and said substrate is provided with power interface, a plurality of slot and is connected in the connection cabling between a plurality of slots, it is characterized in that: also comprise:
First dowel is arranged on the said substrate and is positioned at said slot one side, be used for the integrated circuit board that inserts said slot on first pilot pin match with fixing said integrated circuit board;
The power supply cabling is arranged at the surface of said substrate, is connected with said first dowel with said power interface respectively, to supply power to said integrated circuit board through said first dowel and said first pilot pin.
2. backboard according to claim 1 is characterized in that, said first dowel is fixed on the said power supply cabling through screw.
3. backboard according to claim 2 is characterized in that, the material of said first dowel is a copper.
4. backboard according to claim 1 is characterized in that each slot comprises power connector, and said power supply cabling is connected with said power connector.
5. backboard according to claim 1 is characterized in that, also comprises on the said substrate:
Second dowel is arranged on the said substrate, with the corresponding opposite side that is positioned at said slot of said first dowel, is used to provide earth signal, to constitute current circuit with said first dowel.
6. backboard according to claim 5 is characterized in that the height of said second dowel is greater than the height of said first dowel.
7. backboard according to claim 1 is characterized in that, is one or more corresponding to said first dowel of each slot.
8. backboard according to claim 1 is characterized in that said substrate is provided with the air channel, said power supply cabling is dispelled the heat being used for.
9. according to each described backboard of claim 1-8, it is characterized in that said power supply cabling is a copper bar.
10. an integrated circuit board is installed on the backboard, it is characterized in that, said integrated circuit board comprises:
First pilot pin is connected with the electric module that receives on the said integrated circuit board;
Wherein, said backboard comprises substrate, and said substrate is provided with power interface, a plurality of slot and is connected in the connection cabling between a plurality of slots, also comprises:
First dowel is arranged on the said substrate and is positioned at said slot one side, be used for the said integrated circuit board that inserts said slot on said first pilot pin match with fixing said integrated circuit board;
The power supply cabling is arranged at the surface of said substrate, is connected with said first dowel with said power interface respectively, to supply power to said integrated circuit board through said first dowel and said first pilot pin.
11. network equipment that comprises each described backboard of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102827542A CN101951340B (en) | 2010-09-14 | 2010-09-14 | Backboard, board card and network device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102827542A CN101951340B (en) | 2010-09-14 | 2010-09-14 | Backboard, board card and network device |
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| Publication Number | Publication Date |
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| CN101951340A CN101951340A (en) | 2011-01-19 |
| CN101951340B true CN101951340B (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102827542A Active CN101951340B (en) | 2010-09-14 | 2010-09-14 | Backboard, board card and network device |
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| CN (1) | CN101951340B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102354260A (en) * | 2011-05-27 | 2012-02-15 | 浪潮电子信息产业股份有限公司 | Design method for direct current-direct current (DC-DC) module circuit |
| CN104752851B (en) * | 2015-02-09 | 2017-08-18 | 华为技术有限公司 | A kind of system |
| CN105812005B (en) * | 2016-05-30 | 2018-04-17 | 魏春华 | A kind of TSM control systems back plane circuitry |
| CN113115539B (en) * | 2021-04-07 | 2022-11-18 | 深圳市优威电气技术有限公司 | Modular UVLED power supply |
| CN114527700A (en) * | 2022-02-25 | 2022-05-24 | 国网山东省电力公司威海供电公司 | State real-time monitoring device of intelligent substation measurement and control unit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1816583A1 (en) * | 2006-02-07 | 2007-08-08 | Lumberg Connect GmbH | Contact device for a chip card |
| CN101035423A (en) * | 2006-03-10 | 2007-09-12 | 富准精密工业(深圳)有限公司 | Rear board combination |
-
2010
- 2010-09-14 CN CN2010102827542A patent/CN101951340B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1816583A1 (en) * | 2006-02-07 | 2007-08-08 | Lumberg Connect GmbH | Contact device for a chip card |
| CN101035423A (en) * | 2006-03-10 | 2007-09-12 | 富准精密工业(深圳)有限公司 | Rear board combination |
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| CN101951340A (en) | 2011-01-19 |
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