CN101794089B - 电子束胶光掩模板的去胶方法及其装置 - Google Patents
电子束胶光掩模板的去胶方法及其装置 Download PDFInfo
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Families Citing this family (5)
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CN103186036A (zh) * | 2013-04-08 | 2013-07-03 | 常州同泰光电有限公司 | 一种简易清洗掩膜的方法 |
CN103913959B (zh) * | 2014-03-27 | 2017-09-26 | 京东方科技集团股份有限公司 | 一种光刻胶的剥离装置及剥离方法 |
CN104362123B (zh) * | 2014-10-10 | 2017-07-11 | 中国电子科技集团公司第四十一研究所 | 一种用于去除方形基片光刻蚀过程中边缘堆胶的夹具及方法 |
CN105789025A (zh) * | 2014-12-25 | 2016-07-20 | 上海旭福电子有限公司 | 一种新型的晶圆镀膜片光罩清洗工艺 |
CN115772653A (zh) * | 2022-11-24 | 2023-03-10 | 常州瑞择微电子科技有限公司 | Hdms处理机构及处理工艺 |
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JP2003045842A (ja) * | 2001-08-01 | 2003-02-14 | Pyuarekkusu:Kk | 表面付着異質物質の除去方法及び除去装置 |
JP2004172493A (ja) * | 2002-11-21 | 2004-06-17 | Dainippon Screen Mfg Co Ltd | レジスト剥離方法およびレジスト剥離装置 |
CN1622281A (zh) * | 2003-11-25 | 2005-06-01 | 恩益禧电子股份有限公司 | 半导体器件的制造方法及用于剥离抗蚀剂的清洗装置 |
CN1677247A (zh) * | 2004-03-29 | 2005-10-05 | Hoya株式会社 | 正相抗蚀膜的剥离方法、曝光用掩模的制造方法以及抗蚀剂剥离装置 |
CN1941292A (zh) * | 2006-09-18 | 2007-04-04 | 无锡华润华晶微电子有限公司 | 半导体晶圆片的清洗方法及其清洗设备 |
CN101114592A (zh) * | 2006-07-27 | 2008-01-30 | 三洋电机株式会社 | 半导体装置及其制造方法 |
JP2008310231A (ja) * | 2007-06-18 | 2008-12-25 | Nsk Ltd | マスク及び露光装置 |
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JP3512322B2 (ja) * | 1997-12-15 | 2004-03-29 | 大日本スクリーン製造株式会社 | 枚葉式基板処理装置 |
US20050087209A1 (en) * | 2001-07-16 | 2005-04-28 | Nicolosi Thomas J.Jr. | Megasonic processing system with gasified fluid |
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US6440871B1 (en) * | 2000-08-16 | 2002-08-27 | Micron Technology, Inc. | Gas assisted method for applying resist stripper and gas-resist stripper combinations |
JP2003045842A (ja) * | 2001-08-01 | 2003-02-14 | Pyuarekkusu:Kk | 表面付着異質物質の除去方法及び除去装置 |
JP2004172493A (ja) * | 2002-11-21 | 2004-06-17 | Dainippon Screen Mfg Co Ltd | レジスト剥離方法およびレジスト剥離装置 |
CN1622281A (zh) * | 2003-11-25 | 2005-06-01 | 恩益禧电子股份有限公司 | 半导体器件的制造方法及用于剥离抗蚀剂的清洗装置 |
CN1677247A (zh) * | 2004-03-29 | 2005-10-05 | Hoya株式会社 | 正相抗蚀膜的剥离方法、曝光用掩模的制造方法以及抗蚀剂剥离装置 |
CN101114592A (zh) * | 2006-07-27 | 2008-01-30 | 三洋电机株式会社 | 半导体装置及其制造方法 |
CN1941292A (zh) * | 2006-09-18 | 2007-04-04 | 无锡华润华晶微电子有限公司 | 半导体晶圆片的清洗方法及其清洗设备 |
JP2008310231A (ja) * | 2007-06-18 | 2008-12-25 | Nsk Ltd | マスク及び露光装置 |
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Address after: 213022, Changzhou, Jiangsu province north of the Yangtze River North Road No. 3 Building No. 25, West first floor Co-patentee after: Wuxi China Resources Microelectronics Co., Ltd. Patentee after: Changzhou Ruize Microelectronics Technology Co., Ltd. Address before: 213022, No. 25 middle Yangtze Road, Xinbei District, Jiangsu, Changzhou 3-318 Co-patentee before: Wuxi China Resources Microelectronics Co., Ltd. Patentee before: Changzhou Ruize Microelectronics Technology Co., Ltd. |
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Effective date of registration: 20180622 Address after: 213022 west of West Tower 3, No. 25 Changjiang North Road, Xinbei District, Changzhou, Jiangsu, China Co-patentee after: WUXI DISI MICROELECTRONIC CO., LTD. Patentee after: Changzhou Ruize Microelectronics Technology Co., Ltd. Address before: 213022 west of West Tower 3, No. 25 Changjiang North Road, Xinbei District, Changzhou, Jiangsu, China Co-patentee before: Wuxi China Resources Microelectronics Co., Ltd. Patentee before: Changzhou Ruize Microelectronics Technology Co., Ltd. |