CN101759857A - 来自生物质的环氧化合物及其制造方法 - Google Patents
来自生物质的环氧化合物及其制造方法 Download PDFInfo
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- CN101759857A CN101759857A CN200910261446A CN200910261446A CN101759857A CN 101759857 A CN101759857 A CN 101759857A CN 200910261446 A CN200910261446 A CN 200910261446A CN 200910261446 A CN200910261446 A CN 200910261446A CN 101759857 A CN101759857 A CN 101759857A
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- Prior art keywords
- epoxy resin
- compound
- varnish
- epoxy compounds
- authigenic material
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- 238000000034 method Methods 0.000 claims abstract description 24
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Abstract
本发明提供:溶解性及耐热性两全的,同时对原料的收率高,制造工序数少的来自生物质的环氧化合物。该方法包括:把作为原料的来自生物质的化合物溶于碱性水溶液的工序、向该溶液添加表氯醇后进行加热的工序、以及使该表氯醇蒸发除去后使来自生物质的环氧化合物沉淀的工序;上述碱性水溶液的pH为13.5~11.0,采用此法得到来自生物质的环氧化合物,来自生物质的化合物环氧化后的重均分子量为600~20000,并且能溶于用来制造清漆的有机溶剂。
Description
技术领域
本发明涉及来自生物质(biomass)的环氧化合物及其制造方法。
背景技术
作为防止地球变暖的材料,从碳中性(nautral)的观点看,期待植物性生物质的利用。即使在各种树脂领域,人们也考虑植物性生物质的利用。此前,以玉米作原料的热塑性聚乳酸为中心的实用化已经取得进展。
然而,近年来,由于原料与食物发生竞争,耐热温度低等,利用未取得进展。
在此,以不与食物竞争的“非可食资源”作为原料,并且耐热性优良的树脂的开发已成为方向。特别是期待日本国内大量存在的木质废弃物,即,未利用的树木作为原料的来自生物质的树脂化。
具体的是,采用耐热性优良的多酚骨架的木质素等热固性的来自生物质的环氧化合物以及采用它的环氧树脂组合物正被人们期待。
木质素是植物性生物质,是以丙基苯酚为基本骨架的牢固的聚合物,木质素根据从树木取出的方法,有碱木质素、klason木质素、水蒸气分解木质素等。
另外,植物性生物质之一有木质酚。木质酚,如专利文献1所示,是由把木质纤维素类物质分离成木质酚类物质与烃的技术(三重大学松冈教授开发的相分离***)生成的木质酚。通过相分离***使木质素上结合酚,是分子形成线状、结构均匀、显示约130℃明确熔点的木质酚,溶解性优良的多酚树脂。
环氧树脂组合物为了适于各种制品,首先要求环氧树脂组合物的耐热性及溶解性。溶解性,如专利文献2所示,对溶于有机溶剂,制作树脂清漆是必要的。用该树脂清漆浸渍基材干燥而形成半预制件。把该半固化件重叠使热固化,形成镀铜膜层压板式马达的绝缘层而制成产品。含溶解性不充分的环氧化合物的树脂清漆时,环氧化合物与固化剂的配合比例发生改变,耐热性与其他物性有降低的倾向。
现有的苯酚化合物的环氧化方法中,如非专利文献1所记载的那样,通过往苯酚化合物的表氯醇溶液中添加碱金属水溶液后进行回流,由此得到溶解性优良的环氧化合物。然而,在现有的环氧化方法中,采用来自生物质的苯酚化合物时,所得到的环氧化合物的溶解性非常低。
认为其理由是,如非专利文献2所记载的那样,生物质具有复杂的结构,现有方法采用的碱金属,与生物质的羟基、羧基、羰基、醛基、苯乙烯基等作用,通过生物质的裂解·重聚,使分子量加大,故所得到的环氧化合物的溶解性降低。
对于采用木质素作为来自生物质的环氧化合物的情况,在专利文献3及专利文献4中有记载。
还有,对于采用木质酚作为来自生物质的环氧化合物的情况,在非专利文献3及专利文献5中有记载。
然而,在任何一个文献中,防止来自生物质的环氧化合物的分子量增大的方法及对有机溶剂的溶解性均未作记载。
专利文献1:特开平9-278904号公报
专利文献2:特开平9-235349号公报
专利文献3:特开2005-199209号公报
专利文献4:特开2006-066237号公报
专利文献5:特开2004-238539号公报
非专利文献1:H.Lee AND K.Neville,“Handbook of EpoxyResins”,McGraw-Hill,New York,1960,pp.2-3
非专利文献2:《ウツドケミカルスの新展開》,シ-エムシ-出版,2007,pp.53-56
非专利文献3:《植物由来プラスチツクの高機能化とリサイクル技术》サイエンス&テクノロジ-社,2007,pp.129
发明内容
发明要解决的课题
环氧树脂组合物含有环氧化合物与固化剂。
在现有方法中,当生物质的木质素或木质酚环氧化时,存在分子量增大,对有机溶剂的溶解性大大降低的问题。因此,环氧树脂组合物不能制成清漆,难以在来自生物质的环氧化合物制品中使用。
在此,发明人通过限定来自生物质的环氧化合物的分子量,悉心探讨了容易清漆化的技术。然而,即使采用该技术,存在来自生物质的环氧化合物相对原料的生物质的收率低,制造来自生物质的环氧化合物时的工序数增加等课题。
本发明的目的是提供:溶解性及耐热性两全的,同时相对原料的收率高,制造工序数少的来自生物质的环氧化合物。
本发明的又一目的是提供:采用该来自生物质的环氧化合物的清漆、粘接剂、涂料等环氧树脂组合物,用这些组合物作为半固化片或绝缘层的镀铜膜层压板,及采用这些组合物的马达制品等。
用于解决课题的手段
本发明的来自生物质的环氧化合物,其特征在于,以重均分子量300~10000的来自生物质的化合物作为原料,该来自生物质的化合物环氧化后的重均分子量为600~20000,并且,能溶于用于制造清漆的有机溶剂。
发明效果
按照本发明,可以得到溶解性及耐热性两全的,同时相对原料的收率高,制造工序数少的来自生物质的环氧化合物。
附图说明
图1为表示本发明孔格栅阵列实施例的模拟断面图。
符号的说明
1为布线电路基板,2为电镀金属,3为金属凸起,4为半导体元件,5为焊锡孔,6为树脂密封材料。
具体实施方式
本发明涉及以植物性生物质(来自生物质的化合物)作原料的、溶解性优良的、来自生物质的环氧化合物,涉及采用它的高耐热性的环氧树脂组合物。
在现有方法中,作为来自生物质的化合物的原料,采用木质素及木质酚,当这些进行环氧化时,由于来自生物质的环氧化合物的分子量(重均分子量)相对原料的分子量(重均分子量)之比增大至约10倍,存在对有机溶剂的溶解性大大下降的问题。因此,环氧树脂组合物不能清漆化,难以在来自生物质的环氧化合物的制品中使用。
另外,在现有方法中,由于在原料的环氧化过程中重均分子量达到约10倍,来自生物质的化合物中分子量比较高的成分被分离·除去,来自生物质的化合物中仅分子量比较低的成分用作原料。因此,来自生物质的化合物中可作为原料使用的部分非常有限。
本发明在来自生物质的化合物合成时,作为原料的生物质(来自生物质的化合物)的重均分子量(下面简称Mw)与合成的(环氧化的)来自生物质的环氧化合物的重均分子量(下面简称Mw′)之比Mw′/Mw达到2以下,以此作为具体目标,探讨了来自生物质的环氧化合物的合成法(制造方法)。
此时,目标是不增加制造工序数,同时得到溶解性优良的来自生物质的环氧化合物。
本发明的特征如下所述。
本发明的来自生物质的环氧化合物,其特征在于,以来自生物质的化合物作原料,该来自生物质的化合物环氧化后的重均分子量Mw′为600~20000,并且能溶于用来制造清漆的有机溶剂。
来自生物质的化合物包括木质素、木质酚、大豆油、蓖麻油等。
环氧化前的Mw的范围,优选300~10000。当Mw小于300时,羟基(OH)、醛基(CHO基)、羧基(COOH基)之数不充分,耐热性低,是不优选的。还有,当Mw大于10000时,环氧化后的Mw′大于20000,溶解性降低(难溶于用来制造树脂清漆的有机溶剂),是不优选的。
另外,从充分的耐热性及溶解性的观点看,Mw′的范围更优选大于1200且在20000以下。另外,当特别要求耐热性时,Mw′的范围优选大于12000且在20000以下。
本发明的环氧树脂组合物,其特征在于,含有上述来自生物质的环氧化合物及固化剂。
本发明的环氧树脂组合物,其特征在于,上述固化剂为来自生物质的化合物。
本发明的环氧树脂清漆,其特征在于,含有上述环氧树脂组合物与用来溶解该环氧树脂组合物的有机溶剂,该环氧树脂组合物的浓度为10~90重量%。
本发明的环氧树脂清漆,其特征在于,上述有机溶剂为醇类、酮类、芳香族类等。
本发明的环氧树脂清漆,其特征在于,上述醇类为2-甲氧基乙醇、2-乙氧基乙醇、2-丙氧基乙醇、2-丁氧基乙醇等,上述酮类为甲乙酮、异丁基乙酮、环己酮、γ-丁内酯、N,N-二甲基甲酰胺等,上述芳香族类为甲苯、二甲苯等。
本发明的半固化片,其特征在于,用上述环氧树脂清漆浸渍基材、加以干燥而制成。
采用该半固化片可以制造印刷布线板、电子仪器、旋转电机等。
本发明的来自生物质的环氧化合物的制造方法,该方法是生物质化合物与表氯醇在碱性水溶液中反应、制造来自生物质的环氧化合物的方法,其特征在于,碱性水溶液的pH为13.5~11.0。
本发明的来自生物质的环氧化合物的制造方法,其特征在于,上述碱性水溶液为有机铵水溶液、碱土类金属水溶液、碳酸盐水溶液。
上述有机铵水溶液,包含氢氧化四烷基铵。而且,该氢氧化四烷基铵是选自氢氧化四甲基铵、氢氧化四乙基铵、氢氧化四丙基铵及氢氧化四丁基铵的物质,其中1种或2种以上可混合使用。
作为上述碳酸盐,有碳酸钠、碳酸钾、碳酸钙等。
作为生物质固化剂,是具有羟基(OH基)、醛基(CHO基)、羧基(COOH基)的化合物,具体的可以举出水蒸气粉解低分子木质素、碱木质素、Klason木质素、木质酚等。
环氧化前的Mw的范围优选300~10000,当Mw小于300时,OH基、CHO基、羧基之数不充分,耐热性低,是不优选的。还有,当Mw大于10000,环氧化时,溶解性降低,是不优选的。
从充分的耐热性及溶解性的观点看,Mw的范围大于1200且10000以下是更优选的。
在清漆中存在未溶解物,当其为环氧树脂组合物时,环氧化合物及固化剂的部分配合比例与化学计量比不同,故固化物的耐热性及稳定性及耐吸水性等降低,是不优选的。因此,溶于有机溶剂是必需条件。
另一方面,来自石油的环氧化合物、来自石油的固化剂,化学结构明确,通过配合这些物质,可容易地进行环氧树脂组合物的物性控制。还有,形成溶解性优良的物质为多数。
本发明中使用的来自石油的环氧化合物及固化剂,具有溶解性及耐热性。对其未作特别限定,但具体的的环氧化合物可以举出,双酚A型、双酚F缩水甘油醚型、双酚S缩水甘油醚型、双酚AD型缩水甘油醚型、苯酚酚醛清漆型、甲酚酚醛清漆型、3,3′,5,5′-四甲基-4,4′-二羟基联苯基缩水甘油醚型等。这些作为环氧化合物时,优选Na+、Cl-等离子性物质尽可能少的物质。
另外,本发明中使用的来自石油的固化剂,可以举出线型结构的胺、脂环式胺、芳香族胺、环状结构的胺、改性胺、酸酐、马来酸酐、多元酚类固化剂、双酚类固化剂、聚酚类固化剂、酚醛清漆型酚类固化剂、亚烷基改性酚类固化剂等。这些既可单独使用也可2种以上混合使用。固化剂,优选Na+、Cl-等离子性物质尽可能少的物质。
本发明中使用的催化剂,在本发明的环氧树脂组合物中,可把一般使用的公知的固化促进剂,与1种或2种以上组合,根据需要配合。作为该固化促进剂,可以举出叔胺化合物、咪唑类、有机膦类、磷化合物、四苯基硼盐及这些的衍生物等。固化促进剂的配合量,只要是能达到固化促进效果的量即可而未作特别限定。
还有,在本发明的环氧树脂组合物中,可把公知的偶合剂1种或2种以上加以组合,根据需要进行配合。作为该偶合剂材料,可以举出环氧硅烷、氨基硅烷、脲基硅烷、乙烯基硅烷、烷基硅烷、有机钛酸酯、烷基化铝等。
还有,作为阻燃剂,可以把红磷、磷酸、磷酸酯、蜜胺、蜜胺衍生物、具有三嗪环的化合物、氰脲酸衍生物、异氰脲酸衍生物等含氮化合物、环膦嗪等含磷氮化合物、氧化锌、氧化铁、氧化钼、二茂铁等金属化合物、三氧化锑、四氧化锑、五氧化锑等氧化锑、溴化环氧树脂等1种或2种以上组合进行配合。
在本发明的环氧树脂组合物中,还可以混合一般采用的无机填充材料。无机填充材料是用于提高吸湿性、导热性及强度,降低热膨胀系数而配合的。具体的可以举出熔融二氧化硅、结晶二氧化硅、氧化铝、锆石、硅酸钙、碳酸钙、钛酸钾、碳化硅、氮化硅、氮化铝、氮化硼、氧化铍、氧化锆、锆石、镁橄榄石、滑石、尖晶石(スピレル)、莫来石、二氧化钛等粉体,还有,将这些加工成球形的珠粒、玻璃纤维等。
另外,作为具有阻燃效果的无机填料,可以举出氢氧化铝、氢氧化镁、硅酸锌、钼酸锌等。这些无机填料,既可用1种也可2种以上组合使用。
另外,在环氧树脂组合物中,既可根据需要添加其他树脂,也可添加用于促进反应的催化剂、阻燃剂、流平剂、消泡剂等添加剂。
在本发明的环氧树脂组合物中,还可配合用于提高电子仪器的耐湿性、高温放置特性(耐热性)的离子捕集剂。对离子捕集剂的种类未作特别限定,可以使用公知的物质。具体的可以举出水滑石类、镁、铝、钛、锆、铋等元素的含水氧化物等。既可用1种也可2种以上组合使用。
另外,在本发明的环氧树脂组合物中,作为其他添加物还可根据需要配合硅橡胶粉末等应力缓和剂、染料、炭黑等着色剂、流平剂、消泡剂等。
本发明的环氧树脂组合物,只要是能均匀混合所配合的构成要素(材料)的办法,可采用任何方法进行混合。一般,称量规定量后,采用球磨机、三辊磨机、真空粉碎机、加热研磨机、混合搅拌机等进行分散混合。
以本发明使用的来自生物质的环氧化合物作为成分的环氧树脂组合物,由于溶解性及耐热性优良,故采用它的制品的可靠性大幅提高。
在镀铜膜层压板制造时,用环氧树脂组合物清漆浸渍玻璃布的工序是必需的,故必需把环氧树脂组合物溶解于溶剂(有机溶剂)中。
还有,本发明使用的环氧树脂组合物,在加热成型时具有优良的成型性。例如,对安装倒装片的孔格栅阵列(FC-BGA)的间隙(100μm缝隙),采用毛细管流法封入含环氧树脂组合物时,成型性恶化,发生对芯片的隅角端部的填充不良及卷入气泡,使半导体装置的可靠性降低。
作为采用本发明的环氧树脂组合物的制品,可以举出如下。采用半固化片的镀铜膜层压板、内装成镀铜膜层压板的各种计算机及手机,以及线圈部采用半固化片绝缘的各种马达,安装了该马达的工业用自动装置及旋转机等。另外,采用本发明的密封材料密封元件的芯片尺寸组件,采用上述来自生物质的环氧树脂组合物的粘接剂及涂料等。
下面,对本发明的实施例加以具体的说明,但本发明又不受这些实施例的特别限定。
示出实施例中使用的供试材料。下面用商品名或简略号表示。
低分子木质素:以杉木质素作为原料的Mw1500(羟基当量400g/eq);木质酚:Mw4400(羟基当量160g/eq)东洋树脂(株)制造;HP850:日立化成工业(株)制造;邻-甲酚酚醛清漆树脂(环氧当量106g/eq);P-200:咪唑类固化催化剂(ジヤパンエポキシレジン(株)制造);KBM403:偶合剂(信越化学工业(株)制造;γ-缩水甘油氧基丙基三甲氧基硅烷);JER828:ジヤパンエポキシレジン(株)制造(双酚A型环氧树脂,环氧当量190g/eq);RE404S:日本化学(株)制造(双酚F型环氧树脂,环氧当量165g/eq);
カヤハ-ドAA:4,4′-亚甲基双(2-乙基苯胺)(日本化学(株)制造);
MHAC-P:甲基-3,6-端亚甲基-1,2,3,6-四氢酞酸酐(日立化成工业(株)制造)mw178。下面说明各种评价方法。
(评价方法)
(a)溶解性
环氧化生物质(来自生物质的环氧化合物)的溶解性,相对2-甲氧基乙醇及甲乙酮的混合溶剂(重量比:等重量)浓度50重量%的溶解性,采用目视法进行评价。此时,○表示完全溶解,×表示部分不溶解。
(b)重均分子量
重均分子量(聚苯乙烯换算值),检测器采用日立化成工业(株)制造的L-4000型(UV检测器270nm)进行测定。测定条件如下所示。
柱:Gelpak GL-S300 MDT-5×2,柱温度:30℃,流量:1.0mL/分,洗脱液:DMF/THF=1/1(升)+磷酸0.06M+LiBr 0.06M。在此,DMF为N,N-二甲基甲酰胺,THF为四氢呋喃。
(c)环氧当量
按照JIS K 7236(盐酸吡啶法)进行测定。
(d)羟基当量
按照JIS K 6755进行测定。
(e)环氧化的确认
溶剂采用重氢化的二甲亚砜,测定合成品的1H-NMR,从2.6ppm及2.8ppm确认导入的环氧基的质子。另外,采用FT-IR,从910cm-1的吸收,确认环氧基。
(f)玻璃化转变温度(Tg)
Tg,使表1所示的各实施例、比较例的组合物,在室温~250℃,进行固化1小时,得到100μm的膜,用DMA装置测定E′及E″(升温速度5℃/min),从作为其比的tanδ的峰温度求出。
(g)剪切强度
制造负型感光性聚酰亚胺(日立化成デユポンマイクロシステムズ(株)制造,PL-H708型)基板上具有4mm×4mm×1mm t的该环氧树脂固化物块的样品,采用万能粘接试验机(テイジ社制造,PC2400型),测定感光性聚酰亚胺及环氧树脂固化物间的剪切粘接强度,评价粘接性。把剪切刀具固定在感光性聚酰亚胺上50μm的高度,以刀具速度300μm/sec评价剪切强度。
(h)焊锡耐热性
镀铜膜层压板的焊锡耐热性按照JIS C 6481进行测定。把50mm镀铜膜层压板按照此规格蚀刻铜,于煮沸蒸馏水中放1小时,把吸水过的试样于260℃焊锡槽内浸渍3分钟,调查有无剥离。
(i)体积低效率,按照JIS C 6481,于25℃进行测定。
(j)铜剥离强度,按照JIS C 6481进行测定。
下面,对实施例进行说明。
实施例1
在安装了搅拌叶片、冷却管及温度计的2L(升)四口烧瓶里,加入低分子木质素100g及10%氢氧化四甲基铵水溶液300g,搅拌30分钟使溶解。
另外,添加表氯醇300g,用油浴加热至120℃,回流1小时。然后,把溶液冷却至室温后,移至分液漏斗中,用纯水把油层洗涤至中性。
除去水后,添加20%氢氧化四甲基铵水溶液50g,于120℃回流1小时,进行水洗。
将其用旋转蒸发器蒸发除去表氯醇、水及副产物约80%,加入2L乙醇,得到白色沉淀物。
在此,使用乙醇,但不限于此,其他的醇例如甲醇、丙醇、丁醇、戊醇、己醇等也可以使用。
过滤后进行真空干燥,得到环氧化低分子木质素EL1。
EL1从1H-NMR得到2.6ppm及2.8ppm的峰,还有,用FT-IR得到914cm-1的吸收,确认向木质素导入(加成)了环氧基。
在本实施例中得到产量106g,Mw′为2800。另外,在等重量的2 MOE(2-甲氧基乙醇)中良好地溶解。氢氧化四甲基铵水溶液的pH为12.9。在此,pH为氢离子浓度。
实施例2
采用pH=12.6的氢氧化四乙基铵水溶液,采用实施例1中所述的方法,合成环氧化的低分子木质素EL2。产量104g,Mw′为2590。另外,溶解于2MOE中。从1H-NMR及FT-IR确认环氧基的导入。
实施例3
采用pH=11.6的碳酸钾,按照实施例1,合成环氧化的低分子木质素EL3。产量110g,Mw′为2900。另外,溶解于2MOE中。从1H-NMR及FT-IR确认环氧基的导入。
实施例4
采用木质酚与pH=11.8的碳酸钾,按照实施例1,合成环氧化的木质酚ELP1。产量102g,Mw′为7600。另外,溶解于2MOE中。从1H-NMR及FT-IR确认环氧基的导入。
比较例1
在安装了搅拌叶片、冷却管及温度计的2L四口烧瓶里,加入低分子木质素100g及10%苛性钠水溶液300g,搅拌30分钟使溶解。
另外,添加表氯醇300g,92℃下回流1小时。
然后,把溶液冷却至室温后移至分液漏斗中,用纯水把油层洗涤至中性。除去水后,添加10%苛性钠水溶液30g,于92℃反应1小时,回流、进行水洗。从该溶液除去表氯醇、水及副产物约80%,加入2L乙醇,得到白色沉淀物。
将其过滤后进行真空干燥,得到环氧化的木质素ELh1。ELh1从1H-NMR及FT-IR确认导入了环氧基。产量106g,由于ELh1于GPC测定用溶剂四氢呋喃及N,N-二甲基甲酰胺中不溶解,故不能测定Mw′。另外,也不溶于2 MOE。苛性钠的pH为14.0。
比较例2
环氧基导入的反应条件变更为45℃、95mmHg、0.5小时的条件外,采用与比较例1同样的条件进行环氧化,得到环氧化的木质素ELh2。ELh2从1H-NMR及FT-IR确认导入了环氧基。ELh2产量105g,由于ELh2于四氢呋喃及N,N-二甲基甲酰胺中不溶解,故不能测定Mw′。另外,也不溶于2 MOE。
比较例3
除生物质化合物采用木质酚外,采用与比较例2同样的条件进行环氧化,得到环氧化的木质酚ELPh3。ELPh3从1H-NMR及FT-IR确认导入了环氧基。ELPh3产量106g,由于ELPh3于四氢呋喃及N,N-二甲基甲酰胺中不溶解,故不能测定Mw′。另外,也不溶于2MOE。
比较例4
采用低分子木质素及pH=10.9的碳酸钠,反应条件为92℃、2小时,按照比较例1,得到环氧化的木质素ELh4。产量106g,Mw′为1600。ELh4溶于2MOE,但从1H-NMR及FT-IR不能确认导入了环氧基。
从实施例1~4及比较例1~4可知,在低分子木质素及木质酚的情况,当碱水溶液的pH为13.5~11.0时,环氧化合物的Mw′达到原料Mw的2倍以内。因此,分子量的增加少,溶解性优良。
在比较例1~4的情况,作为碱水溶液,采用pH14.0的苛性钠,从1H-NMR及FT-IR可以确认所得到的物质的环氧化,但由于所得到的物质不溶于N,N-二甲基甲酰胺及四氢呋喃,无法测定Mw′。认为是因为在反应过程中的高分子量化的同时交联反应也部分发生。
当采用弱碱性的pH10.9的碳酸钠时,溶解性良好,但从1H-NMR不能确认环氧基的导入。
其次,进行所得到的物质的清漆化、采用该清漆的镀铜膜层压板的制造及其特性评价。
实施例5~11(采用环氧树脂组合物清漆的镀铜膜层压板的特性)在采用实施例1中得到的Mw′2800的环氧化木质素EL1(环氧当量395g/eq)中,作为固化剂加入以化学计量比的低分子木质素后,添加混合以使P-200(催化剂)达到环氧树脂组合物的0.5重量%、2-甲氧基乙醇及甲乙酮的等重量的混合溶剂中树脂成分浓度达到50重量%,得到环氧树脂组合物清漆。以此作为实施例5。
在实施例6~11中,按照上述混合方法,分别混合环氧化合物、固化剂等,得到清漆。环氧化舍物、固化剂及固化催化剂分别使用表1所示的材料。另外,有机溶剂采用上述混合溶剂。
对厚度100μm的玻璃布(30cm方形)浸渍在环氧树脂组合物清漆中,于130℃热风干燥机内8分钟,使环氧树脂组合物形成中间固化状态(称作B阶),得到6张不发粘的半固化片。把其6张重叠,再上下重叠厚度35μm的铜箔,在真空压力机内加热至220℃(升温速度6℃/分钟),得到进一步完全固化(220℃1小时)状态(C阶)的无缺陷镀铜膜层压板。
实施例5~11中得到的镀铜膜层压板的特性与组成一起示于表1。其中,“828”为JER 828之简称。
比较例5
一并列于表1的比较例5,由于不能清漆化,剥离强度小,焊锡耐热性评价中剥离。
表1
*=2-甲氧基乙醇/甲乙酮(等重量)
LP=木质酚
实施例12
(树脂密封材料)采用三辊磨机及真空粉碎机把环氧树脂组合物进行混炼,制成树脂密封材料。其组成如下所示。
把RE404S(双酚F型环氧树脂,日本化药(株)制造,环氧当量165g/eq)45g、EL1(55g)及木质素120g加以混合,添加催化剂P-200至环氧树脂组合物以使达到0.5重量%与偶合材料KBM403达到2重量%。
另外,添加离子捕集剂IWE500(东亚合成(株)制造)1.0重量%,得到环氧树脂组合物A。
另外,把高纯度球状填料3种加以混合,相对上述环氧树脂组合物A配合50vol%,得到树脂密封材料A。3种高纯度球状填料为SP-4B(扶桑化学(株)制造,平均粒径5.1μm)、QS4F2(三菱しイヨン(株)制造,平均粒径4.6μm)、SO25R((株)龙森制造,平均粒径0.68μm)。
树脂密封材料A的Tg为180℃,剪切强度为8.8MPa。
采用RE404S(55g)及MHAC-P(59g)的组成,按照树脂密封材料A制造树脂密封材料B。
结果是,树脂密封材料B的Tg为170℃,剪切强度为3.8MPa。这可以认为是生物质化合物特征的固化物中含有大量羟基所致。
树脂密封材料A适于图1所示的倒装片型孔格栅阵列(FC-BGA)。
在该图中,1为布线电路基板,2为电镀金属,3为金属凸起(焊锡凸起),4为半导体元件,5为焊锡孔,6为树脂密封材料。布线电路基板1的电镀金属2及半导体元件4,采用金属凸起3连接。布线电路基板1与半导体元件4之间的缝隙,涂布树脂密封材料6,采用毛细管流法、加热(180℃)密封。该缝隙为100μm,凸起节距(金属凸起3的节距)为150μm。
如上所述,确认树脂密封材料A可以适用于FC-BGA。
以上当对实施例与比较例进行比较时,本发明的来自生物质的环氧树脂,高Tg(耐热性)与溶解性两全。具有当比较剪切强度时示出比现有例高的值的特征。
Claims (16)
1.来自生物质的环氧化合物,其特征在于,以重均分子量300~10000的来自生物质的化合物作原料,该来自生物质的化合物环氧化后的重均分子量为600~2000,并且能溶于用来制造清漆的有机溶剂。
2.按照权利要求1所述的来自生物质的环氧化合物,其特征在于,来自生物质的化合物为木质素、木质酚。
3.环氧树脂组合物,其特征在于,含有权利要求1所述的来自生物质的环氧化合物及固化剂。
4.按照权利要求3所述的环氧树脂组合物,其特征在于,上述固化剂为来自生物质的化合物。
5.按照权利要求4所述的环氧树脂组合物,其特征在于,含有用来促进环氧化合物与上述固化剂反应的催化剂。
6.清漆,其特征在于,含有权利要求3所述的环氧树脂组合物与用来溶解该环氧树脂组合物的有机溶剂,该环氧树脂组合物的浓度为10~90重量%。
7.按照权利要求6所述的清漆,其特征在于,上述有机溶剂含有选自醇类、酮类、芳香族类的1种。
8.按照权利要求7所述的清漆,其特征在于,上述醇类为选自2-甲氧基乙醇、2-乙氧基乙醇、2-丙氧基乙醇以及2-丁氧基乙醇的1种。
9.按照权利要求7所述的清漆,其特征在于,上述酮类为选自甲乙酮、异丁基乙酮、环己酮、γ-丁内酯及N,N-二甲基甲酰胺的1种。
10.按照权利要求7所述的清漆,其特征在于,上述芳香族类为选自甲苯、二甲苯的1种。
11.半固化片,其特征在于,用权利要求6所述的清漆浸渍基材、加以干燥而制成。
12.印刷布线板,其特征在于,采用权利要求11所述的半固化片。
13.电子仪器,其特征在于,采用权利要求11所述的半固化片。
14.旋转电机,其特征在于,采用权利要求11所述的半固化片。
15.来自生物质的环氧化合物的制造方法,其特征在于,该方法包括:把作为原料的来自生物质的化合物溶于碱性水溶液的工序、向该溶液添加表氯醇进行加热的工序、以及使该表氯醇蒸发除去后使来自生物质的环氧化合物沉淀的工序,上述碱性水溶液的pH为13.5~11.0。
16.按照权利要求15所述的来自生物质的环氧化合物的制造方法,其特征在于,上述碱性水溶液为有机铵水溶液、碱土类金属水溶液、碳酸盐水溶液。
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Granted publication date: 20130320 Termination date: 20161215 |