CN101461048A - 热压接头和采用该热压接头的安装装置 - Google Patents

热压接头和采用该热压接头的安装装置 Download PDF

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CN101461048A
CN101461048A CNA2007800202054A CN200780020205A CN101461048A CN 101461048 A CN101461048 A CN 101461048A CN A2007800202054 A CNA2007800202054 A CN A2007800202054A CN 200780020205 A CN200780020205 A CN 200780020205A CN 101461048 A CN101461048 A CN 101461048A
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press section
elasticity
electric component
welded part
metal
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古田和隆
谷口雅树
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Abstract

本发明公开了一种可在布线基板上安装电气元件的热压接头和采用该热压接头的安装装置，不仅安装时间短，且连接可靠性更高。该热压接头具有在由可加热的金属制的头本体(5)上由弹性体形成的弹性压接部件(7)，在头本体(5)上一体设置有与作为压接对象的电气元件(20)相对应的金属按压部(5b)，并且将弹性压接部件(7)安装在头本体(5)上，金属按压部(5b)的按压面(50)在金属按压部(5b)的***呈凹状露出。头本体(5)由具有凹部(5a)的框状部件形成，在头本体(5)的凹部(5a)内所述金属按压部(5b)一体形成，并且弹性压接部件(7)被容纳在凹部(5a)内。

Description

热压接头和采用该热压接头的安装装置
技术领域
【0001】本发明涉及一种在布线基板上安装各种电气元件的技术，尤其涉及一种采用粘结剂来安装电气元件的热压接头和采用该热压接头的安装装置。
背景技术
【0002】一般地，在布线基板上安装电阻器或电容器等从动元件时，在回焊炉(reflow)中用作为连接材料的焊锡熔融来进行安装。
【0003】一方面，在布线基板上安装IC芯片等电器元件时，使其组件化并通过焊锡安装，在布线基板上直接搭载IC芯片，能够通过引线接合或倒装片进行安装。
【0004】在使用导电性粘结剂倒装安装这些电气元件时，通常使用金属、陶瓷等硬质压接头来进行热压接。
另一方面，近些年，也将硅橡胶等具有弹性的部件用到压接头上来进行热压接。
【0005】将这些弹性部件作为压接头使用时，就能够对高度不同的多个电气元件压接，并且具有能够同时对除了IC芯片之外的电阻器、电容器等不同种类的电子元件一并进行压接的优点(例如，参照专利文献1)。
【0006】但是，在使用由金属、陶瓷等形成的压接头时，由于热压接时对电气元件周围的粘结剂的嵌缝(fillet)部的加热不足而产生空隙，从而可能出现连接可靠性降低的问题。
另一方面，在采用由上述的弹性体形成的压接头时，由于热压接时压接头侧的加热并不充分，就会出现安装需要较长时间的问题。
专利文献1：特开2005-32952号公报
发明内容
【0007】为解决现有技术存在的问题，本发明目的在于提供一种可在布线基板上安装电气元件的热压接头和采用该热压接头的安装装置，不仅安装时间短，且连接可靠性更高。
【0008】为实现上述目的，本发明为热压接头，该热压接头具有在由可加热的金属制的头本体上由弹性体形成的弹性压接部件，在所述头本体上一体设置有与作为压接对象的电气元件相对应的金属按压部，并且所述弹性压接部件安装在所述头本体上，以使所述金属按压部的按压面在所述金属按压部的***呈凹状露出。
本发明在所述发明中，所述头本体由具有凹部状的容纳部的框状部件形成，在该头本体的容纳部内所述金属按压部一体地突出形成，并且所述弹性压接部件被容纳在该容纳部内。
本发明在所述发明中，所述金属按压部的按压面的大小比所述电气元件的被按压面的大小略小。
本发明在所述发明中，所述金属按压部的按压面与所述弹性压接部件表面的高度差大于电气元件的厚度。
本发明在所述发明中，所述弹性压接部件在所述金属按压部的周围的部分沿该金属按压部上的开口部的外方向形成锥状。
此外，本发明一种安装装置，具有可配置布线基板的基台和相对配置在所述基台上的上述任一的热压接头，对于配置在布线基板上的电气元件按预定的压力按压所述热压接头。
【0009】本发明由于在头本体上一体设置了与作为压接对象的电气元件相对应的金属按压部，并且在该金属按压部的周围由弹性体形成的弹性压接部件安装在头本体上，金属按压部的按压面呈凹状露出，因此在进行热压接时，对于电气元件的被压接面(顶部区域)可使金属按压部紧贴地进行加压加热；另一方面，对于周围的粘结剂的嵌缝部也可通过弹性压接部件进行加压加热。其结果是，可在短时间内进行电气元件的热压接，同时对于电气元件周围的粘结剂的嵌缝部可以不产生空隙地进行热压接，因此可使用粘结剂进行高可靠性的电气元件的连接。
【0010】在本发明中，头本体是由具有凹部状容纳部的框状部件形成，在该头本体的容纳部内金属按压部一体的突出形成，并且弹性压接部件被容纳在该容纳部内，这样通过简洁的结构就可得到将弹性压接部件安装在头本体上的热压接头。
【0011】在本发明中，金属按压部的按压面的大小比上述电气元件的被按压面的大小稍小一些，这样对于电气元件周围的粘结剂的嵌缝部可通过弹性压接部件可靠地进行加压加热，从而可以防止空隙的产生。
【0012】在本发明中，金属按压部的按压面与弹性压接部件表面的高度差大于电气元件的厚度，这样对于电气元件周围的粘结剂的嵌缝部通过弹性压接部件加上充足的压力，因此可以更可靠地防止在嵌缝部产生空隙。
【0013】在本发明中，弹性压接部件在金属按压部的周围的部分沿该金属按压部上的开口部的外方向形成锥状，这样通过使弹性压接部件的按压面侧的开口部比电气元件的顶部区域的大小大，在热压接时弹性压接部件的锥形部与电气元件的被按压面的边缘部相接，通过引导动作，电气元件与金属按压部的按压面光滑地附着。此外，通过弹性压接部件的锥形部的边缘部，能够可靠地对电气元件的周围的粘结剂的嵌缝部施压，从而能够可靠地防止空隙的产生。
【0014】通过本发明，可以提供一种可在布线基板上安装电气元件的热压接头和采用该热压接头的安装装置，不仅安装时间短，且连接可靠性更高。
附图说明
【0015】图1(a)为表示本实施方式的安装装置的概略部分截面图，图1(b)为表示在该安装装置中的热压接头的按压侧部分的图。
图2(a)、图2(b)为表示该热压接头的按压面与电器部件的顶部区域的尺寸关系的说明图。
符号说明
【0016】1-安装装置
    2-基台
    3-热压接头
    5a-凹部(容纳部)
    5b-金属按压部
    6-加热器
    7-弹性压接部件
    7a-锥形部
    8-开口部
    20-电气元件
    21-顶部区域(被按压面)
    30-粘结剂
    50-按压面
具体实施方式
【0017】以下，参照附图对本发明热压接头和采用该热压接头的安装装置的实施方式详细地说明。
图1(a)为表示本实施方式的安装装置的概略部分截面图，图1(b)为表示在该安装装置中的热压接头的按压侧部分的图。
此外，图2(a)、图2(b)为表示该热压接头的按压面与电器部件的顶部区域的尺寸关系的说明图。
【0018】如图1(a)、图1(b)所示，本实施方式的安装装置1具有：基台2，其搭载布线基板10，布线基板10形成有布线构图(未图示出)；热压接头3，其对作为压接对象的IC芯片等电气元件20进行加压并加热。
【0019】在此，基台2由预定的金属形成，在其内部设置有未图示出的加热用的加热器。并且，通过粘结剂30在载置于基台2上的布线基板10上的预定位置配置有电气元件20。
【0020】另外，在本发明中，作为粘结剂30可以使用绝缘性粘结剂或各沿异性导电性粘结剂。
另一方面，热压接头3，例如，具有由不锈钢等的金属材料形成的头本体5，在该头本体5的内部设置有加热用的加热器6。
【0021】本实施方式的头本体5，例如，由箱形框状的金属部件形成，在与基台2相对的部分设置有凹部(容纳部)5a。
并且，与头本体5的凹部5a的电气元件相对应的位置(例如在本实施方式中是中央部分)上，例如通过一体成形，与头本体一体设置有后述的金属按压部5b。
【0022】另外，在头本体5的凹部5a上，在凹部5a内紧贴地安装有弹性压接部件7，该弹性压接部件7由例如板状的橡胶体(硅橡胶等)形成。
【0023】本发明的弹性压接部件7安装有金属按压部5b的按压面50，在金属按压部5b的***呈凹状露出。
本实施方式的金属按压部5b形成方形柱状，在其前端部上形成有矩形平面状的按压面50。
【0024】本发明金属按压部5b的按压面50的大小并不特别地限定，但从通过弹性压接部件7进行可靠地加压加热，以对电气元件20周围的粘结剂30的嵌缝部不产生空隙的观点来讲，优选是比电气元件20的被按压面的大小稍微小些。
【0025】例如，本实施方式如图2(a)、图2(b)所示，优选是金属按压部5b的按压面50的大小(外形)比电气元件20的顶部区域(被按压面)21的大小(外形)稍微小些。
【0026】另一方面，虽然本发明并不特别地限定，但从施加可靠的压力，以对电气元件20的周围的粘结剂30的嵌缝部不产生空隙的观点来讲，例如，优选是如图2(a)所示，金属按压部5b的按压面50和弹性压接部件7的表面的高度差H大于电气元件的厚度h。
【0027】进一步，虽然本发明并不特别地限定，但从使金属按压部5b的按压面50与电气元件20的顶部区域21光滑地紧贴，并且，施加可靠的压力，以对周围的粘结剂30的嵌缝部不产生空隙的观点来讲，优选是使弹性压接部件7在金属按压部5b的周围的部分沿着开口部8的外方向形成锥状。
【0028】也就是说，在弹性按压部件7的开口壁面部分上形成预定角度的锥形部7a，通过使弹性压接部件7的按压面50上的开口部8大于电气元件20的顶部区域21的大小，在热压接时弹性压接部件7的锥形部7a与电气元件20的顶部区域21的边缘部相接，通过其引导动作，电气元件20与金属按压部5b的按压面50光滑地紧贴。此外，通过弹性压接部件7的锥形部7a的边缘部，能够可靠地对电气元件20的周围的粘结剂30的嵌缝部施压，能够防止空隙的产生。
【0029】另外，在弹性压接部件7上设置的锥形部7a的角度可与金属按压部5b的按压面50和电气元件20的顶部区域21的大小以及对于金属按压部5b的按压面50的弹性压接部件7的表面高度相对应适当地设定。
【0030】通过以上所述的本实施形态，由于在头本体5上一体设置了与作为压接对象的电气元件20相对应的金属按压部5b，并且在该金属按压部5b周围由橡胶体形成的弹性压接部件7安装在头本体5上，以使金属按压部5b的按压面50呈凹状露出，因此能够使金属按压部5b对电气元件20的顶部区域21紧贴并加压加热，另一方面，还能够通过弹性压接部件7对周围的粘结剂30的嵌缝部加压加热。其结果是，能够在短时间内进行电气元件20的热压接，同时，还能够进行热压接，以防止电气元件20的周围的粘结剂30的嵌缝部产生空隙，由此，采用粘结剂30，能够进行高可靠性的电气元件20的连接。
【0031】特别地，根据本实施方式，由于头本体5是由具有凹部5a的框状部件形成，金属按压部5b在该头本体5的凹部5a内一体的形成，并且弹性压接部件7被容纳在该容纳部内，因此，通过简洁的结构就可靠地得到将弹性压接部件7安装在头本体5上的热压接头。
【0032】另外，根据本实施方式，由于金属按压部5b的按压面50的大小比电气元件20的顶部区域21的大小稍小一些，因此对电气元件20周围的粘结剂30的嵌缝部可通过弹性压接部件7可靠地进行加压加热，从而能够防止空隙的产生。
【0033】另外，本发明并不限于上述实施方式，也可进行种种变更。
比如，在上述的实施方式中，在头本体上仅设置了一个金属按压部，本发明并不限于此，也可以在头本体上设置多个金属按压部，同时对多个的电气元件进行热压接。
【0034】另外，金属按压部及按压面的配置、形状也可根据作为热压接对象的电气元件进行相应的变更。
进一步，本发明可以适用于IC芯片、电容器等各种电气元件。

Claims (10)

1、一种热压接头，该热压接头具有在可加热的金属制的头本体上由弹性体形成的弹性压接部件，其特征在于，
在所述头本体上一体设置有与作为压接对象的电气元件相对应的金属按压部，
并且所述弹性压接部件安装在所述头本体上，以使所述金属按压部的按压面在所述金属按压部的***呈凹状露出。
2、如权利要求1所述的热压接头，其特征在于，所述头本体由具有凹部状的容纳部的框状部件形成，在该头本体的容纳部内所述金属按压部一体地形成，并且所述弹性压接部件被容纳在该容纳部内。
3、如权利要求1或2所述的热压接头，其特征在于，所述金属按压部的按压面的大小比所述电气元件的被按压面的大小略小。
4、如权利要求1至3的任意一项所述的热压接头，其特征在于，所述金属按压部的按压面与所述弹性压接部件表面的高度差大于电气元件的厚度。
5、如权利要求1至4的任意一项所述的热压接头，其特征在于，所述弹性压接部件在所述金属按压部的周围的部分沿该金属按压部上的开口部的外方向形成锥状。
6、一种安装装置，其特征在于，具有：
可配置布线基板的基台；
热压接头，相对配置在所述基台上，该热压接头具有在可加热的金属制的头本体上由弹性体形成的弹性压接部件，在所述头本体上一体设置了与作为压接对象的电气元件相对应的金属按压部，并且在所述金属按压部的周围所述弹性压接部件安装在所述头本体上，以使所述金属按压部的按压面呈凹状露出；
对于配置在所述基台的布线基板上的电气元件按预定的压力按压所述热压接头。
7、如权利要求6所述的安装装置，其特征在于，所述头本体由具有凹部状的框状部件形成，所述金属按压部在该头本体的容纳部内一体地形成，并且所述弹性压接部件被容纳在该容纳部内。
8、如权利要求6所述的安装装置，其特征在于，所述金属按压部的按压面的大小比所述电气元件的被按压面的大小略小。
9、如权利要求6所述的安装装置，其特征在于，所述金属按压部的按压面和所述弹性压接部件的表面的高度差大于所述电气元件的厚度。
10、如权利要求6所述的安装装置，其特征在于，所述弹性压接部件的所述金属按压部的周围部分沿该金属按压部上的开口部的外方向形成锥状。
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