CN101277006B - 基板搬运装置和电缆配线构造 - Google Patents

基板搬运装置和电缆配线构造 Download PDF

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Publication number
CN101277006B
CN101277006B CN2008100885372A CN200810088537A CN101277006B CN 101277006 B CN101277006 B CN 101277006B CN 2008100885372 A CN2008100885372 A CN 2008100885372A CN 200810088537 A CN200810088537 A CN 200810088537A CN 101277006 B CN101277006 B CN 101277006B
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CN
China
Prior art keywords
cable
housing
rotating parts
flat cable
rotation
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Expired - Fee Related
Application number
CN2008100885372A
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English (en)
Chinese (zh)
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CN101277006A (zh
Inventor
末木英人
大野仁久
中山秀树
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN101277006A publication Critical patent/CN101277006A/zh
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Publication of CN101277006B publication Critical patent/CN101277006B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G11/00—Arrangements of electric cables or lines between relatively-movable parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Cable Arrangement Between Relatively Moving Parts (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2008100885372A 2007-03-27 2008-03-27 基板搬运装置和电缆配线构造 Expired - Fee Related CN101277006B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-080639 2007-03-27
JP2007080639A JP5037191B2 (ja) 2007-03-27 2007-03-27 基板搬送装置及びケーブル配線構造

Publications (2)

Publication Number Publication Date
CN101277006A CN101277006A (zh) 2008-10-01
CN101277006B true CN101277006B (zh) 2010-11-10

Family

ID=39916063

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100885372A Expired - Fee Related CN101277006B (zh) 2007-03-27 2008-03-27 基板搬运装置和电缆配线构造

Country Status (4)

Country Link
JP (1) JP5037191B2 (ja)
KR (1) KR100978409B1 (ja)
CN (1) CN101277006B (ja)
TW (1) TWI445115B (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5628509B2 (ja) * 2009-10-21 2014-11-19 株式会社アイエイアイ 電動プレス装置
JP5149942B2 (ja) * 2010-07-21 2013-02-20 ヤマハ発動機株式会社 ヘッド駆動装置および部品実装装置
KR20130126602A (ko) * 2010-10-27 2013-11-20 고어 엔터프라이즈 홀딩즈, 인코포레이티드 회전 가능한 어레이를 포함하는 이미징 카테터
JP5718134B2 (ja) * 2011-04-11 2015-05-13 ヤマハ発動機株式会社 ロボット
LU91826B1 (de) 2011-06-17 2012-12-18 Ipalco Bv Vorrichtung zum Ab- und Aufwickeln einer oder mehreren Leitungen
EP4029789A1 (en) 2013-03-31 2022-07-20 SZ DJI Technology Co., Ltd. Payload mounting platform
CN104515633B (zh) * 2013-09-26 2016-09-07 纳米新能源（唐山）有限责任公司 摩擦电压力感应电缆
CN104552289A (zh) * 2013-10-29 2015-04-29 精工爱普生株式会社 机器人
CN106044397B (zh) * 2016-07-07 2018-09-21 诺力机械股份有限公司 一种盘线盒
JP7031958B2 (ja) * 2016-12-27 2022-03-08 株式会社ディスコ 伝達線カバーアセンブリ及び加工装置
JP6859756B2 (ja) * 2017-03-03 2021-04-14 オムロン株式会社 制御システム、コントローラ、制御方法、および制御プログラム
CN107766667B (zh) * 2017-10-27 2021-04-13 中国空间技术研究院 一种空间运动电缆走向设计方法
CN107866820A (zh) * 2017-12-26 2018-04-03 哈尔滨思哲睿智能医疗设备有限公司 一种连杆结构机械臂旋转过线结构
JP7081311B2 (ja) * 2018-06-04 2022-06-07 京セラドキュメントソリューションズ株式会社 画像形成装置
JP7290312B2 (ja) * 2018-07-03 2023-06-13 株式会社アイエイアイ アクチュエータ及びスカラロボット
JP2020088995A (ja) * 2018-11-21 2020-06-04 ゲイツ・ユニッタ・アジア株式会社 回転部材間の配線構造
JP7016326B2 (ja) * 2019-01-09 2022-02-04 上銀科技股▲分▼有限公司 連結モジュール
US10836052B2 (en) 2019-02-06 2020-11-17 Hiwin Technologies Corp. Connection module using in robot
JP7022091B2 (ja) * 2019-03-11 2022-02-17 ファナック株式会社 ロボット
CN113905852B (zh) * 2019-07-17 2023-08-25 Abb瑞士股份有限公司 机器人臂连杆和机器人
JP2022083199A (ja) * 2020-11-24 2022-06-03 日本電産サンキョー株式会社 産業用ロボット

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316516B2 (ja) * 1972-06-12 1978-06-01
JPS6113530U (ja) * 1984-06-25 1986-01-27 三菱電線工業株式会社 光・電力複合ケ−ブルの巻取装置
JPS6146191U (ja) * 1984-08-29 1986-03-27 ぺんてる株式会社 多関節型ロボツトのア−ム間配線装置
JPS62207114A (ja) * 1986-03-05 1987-09-11 三菱電機株式会社 旋回部におけるケ−ブルの配線構造
JPH06318045A (ja) * 1993-05-07 1994-11-15 Kokusai Electric Co Ltd 回動表示装置
KR200152377Y1 (ko) * 1996-09-30 1999-07-15 김재복 로보트의 이동부위 또는 회전부위용 컬케이블
JP3284936B2 (ja) * 1997-08-25 2002-05-27 住友電装株式会社 移動用ケーブル
JP4635301B2 (ja) * 2000-06-28 2011-02-23 シンフォニアテクノロジー株式会社 産業用ロボット

Also Published As

Publication number Publication date
JP5037191B2 (ja) 2012-09-26
TW200908187A (en) 2009-02-16
CN101277006A (zh) 2008-10-01
KR100978409B1 (ko) 2010-08-26
JP2008245390A (ja) 2008-10-09
KR20080087739A (ko) 2008-10-01
TWI445115B (zh) 2014-07-11

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Granted publication date: 20101110

Termination date: 20170327