CN101076805B - 跟踪并标记具有缺陷的试样 - Google Patents
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Abstract
一种方法和***(10),其提高了在靶材的激光加工中加工的试样产量,其中所述靶材包括共衬底上形成的多个试样。优选实施例实现了一个能在激光加工***中存储一列有缺陷试样的特征,所述有缺陷的试样在某种程度上在激光加工期间已经受到了错误的影响。一旦已经完全加工所述共衬底,***警示操作员不适当加工试样的数量,并给予操作员运行软件程序(12)的机会,在一个优选实施例中,该软件程序使用激光在每个没有适当加工的试样的顶面上划上标记。
Description
相关申请的交叉引用
本申请要求提交于2004年11月15日的美国临时专利申请号60/628,278的权益。
技术领域
本发明涉及在以重复图案为特征的靶材上通孔的激光打孔,并且更具体地,涉及一种通过跟踪并标记布置在共用面板上的在激光通孔打孔过程中形成的有缺陷的通孔的集成电路(IC)封装,来提高IC封装产量的技术。
背景技术
额定相同的IC封装典型地被布置成共用面板上的多个阵列。图1通过例子显示了面板2,面板2的80个IC封装4被布置在4个象限6,每个象限有20个IC封装(IC封装中的三个封装每个的“X”标记表示根据本发明所做的缺陷指示,并且其在现有技术中是没有的)。典型的面板是由树脂材料(诸如ABF)和导电材料(诸如铜)的有图案的层构成的多层结构。激光打孔在ABF材料上形成一定深度的盲孔,在这一深度有铜层出现以在IC封装的不同的层之间能形成通孔互连(在接下来的步骤中,气态的铜对孔进行电镀以完成互连)。
激光打孔的技术发展水平就是一旦检测到打孔过程中有错误发生立即停止激光打孔过程。在停止打孔后,操作员拿掉并丢弃一般仅在几个IC封装上出现打孔错误的整个面板。丢弃整个面板的原因是目前没有可用的方法来识别面板上什么地方出现错误。本发明大量减少了未受打孔错误影响却被认为是废料(因为它们出现在某处已经发生可恢复错误的被丢弃的面板上)的IC封装的数量。可恢复错误是一种在其出现之后激光打孔***仍能继续加工的错误。
发明内容
本发明提供了一种方法和***(10),其提高了在靶材的激光加工中加工的试样产量,其中所述靶材包括共衬底上形成的多个试样。该方法包括:形成激光束和关联于所述共衬底的基准点之间的相对运动的记录;形成用于相对运动的靶材的激光加工实例的记录;响应于由于激光加工产生的可恢复错误情况的出现,产生可恢复错误指示;和将相对运动的记录和激光加工实例的记录相关联,以确定当产生可恢复错误指示时,所述激光加工实例的记录中哪一个激光加工实例会发生。该***包括:运动控制器,其响应于***控制计算机,在激光束和关联于共衬底的基准点之间发起相对运动;命令子***,其运行以生成有关激光束和基准点之间的相对运动路径的信息;存储器,其用于记录沿相对运动的路径在特定位置发生的激光加工的实例;和错误信号发生器,其响应于可恢复错误情况的发生,产生可恢复错误指示信号,并开始记录沿相对运动的路径对应于可恢复错误情况的位置,从而识别经受可恢复错误情况发生的每一试样并使其能够从共衬底分离。本发明的优选实施例适合于在目前可用的激光打孔***上运行的软件中实施,并且能够跟踪并标记激光打孔过程中的IC封装面板上的可恢复错误。尽管这种实施方式是对于IC封装描述的,但该跟踪和标记技术(下文称为“X-Out特征”或“删除特征”)适用于图案在材料(如,高密度互连(HDI)和柔性(Flex)电路)上重复的任何激光打孔领域。
X-Out特征使激光打孔***中能存储一列在激光通孔打孔加工中在某些程度上已经误打孔的有缺陷IC封装或图案。一旦面板完全打孔完毕,***会警示操作员误打孔的IC封装的数量,并提供操作员一运行X-Out程序的机会,在优选实施例中,该程序使用激光在已识别的每个误打孔的IC封装的顶面上划上“X”。这种从物理上标记有缺陷的封装或图案的过程不仅准确识别面板上的哪个IC封装有缺陷,还能在面板上生成物理标记(X)以易于识别。在现有技术中,既不能识别有缺陷的IC封装,也不能具体标记识别的IC封装。当面板被切割时,这些有缺陷的IC封装会被丢弃,从而保全了面板上的其他IC封装。因为典型的面板可以有100-300个IC封装,识别少数有缺陷的IC封装能使客户节约大概97%-99%的面板。
X-Out特征是在软件和固件中具体实现的,其使激光打孔***在可恢复错误发生时,跟踪哪个(哪些)通孔被误打孔。可恢复错误的来源的例子包括超出公差激光功率,面板定位阶段偏移,和激光束引导电流计偏移。然后该软件存储该信息直到***完成打孔。一旦完成打孔,软件从算法上将误打孔的通孔和面板上具体的IC封装或图案相关联。之后,使用可缩放的工具路径文件在这些IC封装或图案的顶面上划上“X”。此技术的扩展需要客户指定其自己的X-Out标记。用户定制的X-Out标记的一个例子是被设计成使特定的封装或图案不能通过电测试的专用工具路径。这种X-Out标记使用户能跟踪并识别有缺陷的IC封装,而不用人工检查。
从以下参考附图对优选实施例的详细描述中,本发明其他的目标和优势将是显而易见的。
附图说明
图1是面板的示意图,面板的80个IC封装被布置在4个象限,每象限20个IC封装,该面板的左上侧象限的3个IC封装被标记有根据本发明形成的X-Out特征。
图2是实施本发明示例的激光打孔***的计算机结构的简化方框图。
具体实施方式
在其上实施X-Out特征的优选实施例的示例性的激光打孔***为型号5530激光打孔(Model 5530 Laser Drill),它由本发明申请的受让人,电力科学工业公司(Eletro Scientific Industries,Inc.)生产。型号5530激光打孔***其及前身***不支持通孔跟踪装置。因此,在打孔过程中,型号5530在遇到可恢复错误的情况时会停止打孔。尽管采用停止打孔来最小化对面板造成的损害量,但没有可用的装置来识别面板上受影响的部分。引起错误的问题被诊断并被修复,但整个面板将被废弃以确保有缺陷的IC封装不会在客户的生产线中向前传播。优选实施例在型号5530***中实施(也可在其它的激光打孔***中实施)索引装置,其用于跟踪激光束和面板之间的相对运动路径(即运动命令序列),以能够识别出现可恢复错误的位置。
参考图2,激光打孔***10(诸如型号5530)包括***控制计算机(SCC)12、实时控制计算机(RTC)14、以及协调运动控制模块(CMCM)16。SCC 12存储由定位装置执行的运动命令的简档(profile),该定位装置响应于CMCM 16,引起激光束和关联于面板2的基准点之间的相对运动。运动命令引导激光束来到存储的面板2上的位置,在面板2上进行通孔打孔。通过产生每组运动命令的孔数实现通孔跟踪,该运动命令通过RTC 14的实时控制模块(RC)20传送到CMCM 16。在第一实施例中,孔数连同每一运动命令相应的dT值之和(递增时间变化),被存储在RTC 14内的查询表(LUT)22中。这提供了从运动命令返回到通孔数的跟踪能力,因此在可接受的公差内,具有当发生可恢复错误时跟踪哪一个通孔被打孔的能力。存储在LUT 22内的每一运动命令的dT值之和由添加到CMCM 16的寄存器提供,该寄存器能保存其接收到的dT值的连续和。
根据所述第一实施例的索引方法实施的***运行如下。在***运行过程中,CMCM 16生成可恢复错误消息信号并将其送到SCC 12以暂停运行。CMCM 16将发生可恢复错误消息的运动时间(dT值之和)锁存在寄存器内。操作员使激光打孔继续直到下一次运行暂停或完成面板加工。然后,SCC 12激活面板恢复运行,其中运动命令的简档与存储在LUT 22内孔数信息关联,以在每次暂停时确定激光钻头的位置。SCC 12提供指令激活存在的标记软件以在发生可恢复错误时在每个IC封装4上划上“X”标记。标记软件可以调节“X”标记的大小或在上述跟踪容错范围内在面板2上的任何地方设置其位置。
技术人员会意识到从***运行的可恢复错误产生情况发生的时间和操作暂停的时间之间一般有时间迟延。因此,此时间迟延的结果可能使几个IC封装4被损坏。图1显示了划有“X”标记的3个相邻的IC封装4,以说明由操作暂停延迟产生的激光错误情况的影响。
在第二实施例中,每一组运动命令的孔数并不与每个运动命令相应的dT值之和关联使用。而是,在CMCM 16产生可恢复错误消息之后,SCC 12暂停运行,确定面板加工停止的位置,并确定与停止位置最近的加工过的通孔的位置。实施于SCC 12中的软件有自动运行(而无需操作员介入)恢复激光打孔的选项,或由操作员促使恢复激光打孔,直到下一个运行暂停或完成面板加工。之后,SCC 12如关于第一实施例描述的那样运行,在运动命令序列中向前或向后检查以识别可能的被损害的IC封装。
第三实施例表示通孔跟踪的更为复杂的实施方式,其包括使用与每一运动命令时间关联的通孔位置索引。无论何时,当可恢复错误消息发生时,通孔位置索引被返回到SCC 12中以提供有关错误发生时刻的激光钻头的位置的立即信息。(上述的第一实施例使用积累的运动时间信息,其经历检查过程以确定通孔位置。)
优选实施例的优选实施方式需加入可执行的指令和固件,而无需另外的硬件。
对本领域技术人员而言显然的是,在不偏离本发明基本原理的情况下,可以对上述实施例的细节做许多改变。因此,本发明的范围应该仅由所附的权利要求确定。
Claims (18)
1.一种在靶材的激光加工中提高加工的试样产量的方法,该靶材包括在共衬底上形成的多个试样,该方法包括:
形成激光束和关联于所述共衬底的基准点之间的相对运动的记录;
形成用于所述相对运动的所述靶材的激光加工实例的记录;
响应于由于所述激光加工产生的可恢复错误情况的出现,产生可恢复错误指示;和
将所述相对运动的记录和所述激光加工实例的记录相关联,以确定当产生可恢复错误指示时,所述激光加工实例的记录中哪一个激光加工实例会发生。
2.根据权利要求1所述的方法,其中所述激光加工实例的记录包括与所述激光加工实例的记录中的每一个激光加工实例相关联的时间指示,所述可恢复错误指示的产生包括给所述可恢复错误指示赋予时间指示,并且所述相对运动的记录和所述激光加工实例的记录的所述关联包括在容错范围内将可恢复错误发生的所述时间指示与激光加工的最接近时间实例相匹配。
3.根据权利要求1所述的方法,其中所述相对运动的记录包括运动命令序列。
4.根据权利要求1所述的方法,其中所述多个试样包括重复图案。
5.根据权利要求4所述的方法,其中所述重复图案表示高密度互连HDI或柔性Flex电路。
6.根据权利要求1所述的方法,其中所述多个试样包括多个封装。
7.根据权利要求6所述的方法,其中所述多个封装是集成电路封装。
8.根据权利要求1所述的方法,进一步包括在所述共衬底上提供标记,指示可恢复错误指示对应的所述试样。
9.根据权利要求8所述的方法,其中所述标记被放置在所述试样上。
10.根据权利要求8所述的方法,其中所述试样包括电路并且所述标记使所述试样不能通过电测试。
11.根据权利要求1所述的方法,其中所述激光加工包括靶材移除。
12.根据权利要求11所述的方法,其中所述靶材移除包括通孔打孔。
13.一种被实施来在靶材的激光加工中实现提高加工的试样产量的***,所述靶材包括在共衬底上形成的多个试样,所述***包括:
运动控制器,其响应于***控制计算机,在激光束和关联于所述共衬底的基准点之间发起相对运动;
命令子***,其运行以生成有关所述激光束和所述基准点之间的相对运动路径的信息;
存储器,其用于记录沿所述相对运动的路径在特定位置发生的激光加工的实例;和
错误信号发生器,其响应于可恢复错误情况的发生,产生可恢复错误指示信号,并开始记录沿所述相对运动的路径对应于所述可恢复错误情况的位置,从而识别经受所述可恢复错误情况发生的每一试样并使其能够从所述共衬底分离。
14.根据权利要求13所述的***,其中响应于所述可恢复错误指示信号,所述***控制计算机使激光束在所述衬底上形成标记,该标记指示所述可恢复错误指示信号对应的每一试样。
15.根据权利要求13所述的***,其中所述有关相对运动路径的信息包括运动命令序列。
16.根据权利要求13所述的***,其中所述***控制计算机提供指令信号,所述指令信号使标记被放置,该标记指示可恢复错误指示器对应的试样。
17.根据权利要求16所述的***,其中所述标记被放置到所述试样上。
18.根据权利要求16所述的***,其中所述试样包括电路,并且所述标记使所述试样不能通过电测试。
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CN1219757A (zh) * | 1997-12-08 | 1999-06-16 | 三菱电机株式会社 | 半导体衬底处理装置及其控制方法 |
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