CN100517783C - 发光二极管安装基板 - Google Patents
发光二极管安装基板 Download PDFInfo
- Publication number
- CN100517783C CN100517783C CNB200610143616XA CN200610143616A CN100517783C CN 100517783 C CN100517783 C CN 100517783C CN B200610143616X A CNB200610143616X A CN B200610143616XA CN 200610143616 A CN200610143616 A CN 200610143616A CN 100517783 C CN100517783 C CN 100517783C
- Authority
- CN
- China
- Prior art keywords
- hole
- reach
- mentioned
- emitting diode
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C5/00—Reinforcing elements, e.g. for concrete; Auxiliary elements therefor
- E04C5/16—Auxiliary parts for reinforcements, e.g. connectors, spacers, stirrups
- E04C5/168—Spacers connecting parts for reinforcements and spacing the reinforcements from the form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005320161 | 2005-11-02 | ||
JP2005320161 | 2005-11-02 | ||
JP200689520 | 2006-03-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1967888A CN1967888A (zh) | 2007-05-23 |
CN100517783C true CN100517783C (zh) | 2009-07-22 |
Family
ID=38076515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB200610143616XA Expired - Fee Related CN100517783C (zh) | 2005-11-02 | 2006-11-02 | 发光二极管安装基板 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20070047676A (zh) |
CN (1) | CN100517783C (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5238366B2 (ja) * | 2008-06-09 | 2013-07-17 | スタンレー電気株式会社 | 半導体発光装置 |
JP5471180B2 (ja) * | 2008-09-11 | 2014-04-16 | 信越化学工業株式会社 | シリコーン積層基板、その製造方法、シリコーン積層基板製造用シリコーン樹脂組成物及びled装置 |
JP5481987B2 (ja) * | 2009-07-17 | 2014-04-23 | 富士ゼロックス株式会社 | 画像読み取り装置 |
CN103098247B (zh) * | 2010-04-16 | 2015-10-21 | 日亚化学工业株式会社 | 发光装置以及发光装置的制造方法 |
CN102437267B (zh) * | 2010-12-10 | 2014-05-14 | 罗容 | 金属基底板发光芯片封装结构 |
TWI546916B (zh) * | 2011-03-09 | 2016-08-21 | 聯京光電股份有限公司 | 半導體封裝結構與其製造方法 |
CN102694081B (zh) * | 2011-03-21 | 2014-11-05 | 展晶科技(深圳)有限公司 | 发光二极管制造方法 |
CN107706286B (zh) * | 2017-09-27 | 2019-10-11 | 开发晶照明(厦门)有限公司 | Led发光装置和led支架 |
US10763414B2 (en) * | 2017-12-18 | 2020-09-01 | Rohm Co., Ltd. | Semiconductor light-emitting device |
KR20210105894A (ko) | 2018-12-27 | 2021-08-27 | 덴카 주식회사 | 형광체 기판, 발광 기판 및 조명 장치 |
US12027652B2 (en) | 2018-12-27 | 2024-07-02 | Denka Company Limited | Phosphor substrate, light emitting substrate, and lighting device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1344015A (zh) * | 2000-09-13 | 2002-04-10 | Esec贸易公司 | 半导体芯片安装设备 |
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2006
- 2006-01-26 KR KR1020060008014A patent/KR20070047676A/ko not_active Application Discontinuation
- 2006-11-02 CN CNB200610143616XA patent/CN100517783C/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1344015A (zh) * | 2000-09-13 | 2002-04-10 | Esec贸易公司 | 半导体芯片安装设备 |
Also Published As
Publication number | Publication date |
---|---|
CN1967888A (zh) | 2007-05-23 |
KR20070047676A (ko) | 2007-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C53 | Correction of patent for invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Kendo Nobuo Inventor after: Ueda Ryoo Inventor before: Kendo Nobuo Inventor before: Ueda Ryoo |
|
ASS | Succession or assignment of patent right |
Owner name: CHINA INVESTMENT AND DEVELOPMENT CO., LTD. Free format text: FORMER OWNER: TORYON CO., LTD. Effective date: 20100715 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: AICHI PREFECTURE, JAPAN TO: NO.1,DAIJIUEKI 1747, SUE TOWN, KASUYA GUN,FUKUOKA PREFECTURE, JAPAN |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100715 Address after: Japan's Fukuoka County kasuya District Hui ting to 1747 times to 1 big trees Patentee after: China Investment Development Corporation Address before: Aichi Patentee before: Toryon Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090722 Termination date: 20151102 |
|
EXPY | Termination of patent right or utility model |