CN100510853C - 显示装置及其制造方法 - Google Patents
显示装置及其制造方法 Download PDFInfo
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- CN100510853C CN100510853C CNB2007101534519A CN200710153451A CN100510853C CN 100510853 C CN100510853 C CN 100510853C CN B2007101534519 A CNB2007101534519 A CN B2007101534519A CN 200710153451 A CN200710153451 A CN 200710153451A CN 100510853 C CN100510853 C CN 100510853C
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Abstract
Description
Claims (17)
Applications Claiming Priority (2)
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JP2004119263A JP2005301056A (ja) | 2004-04-14 | 2004-04-14 | 表示装置とその製造方法 |
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JP (1) | JP2005301056A (zh) |
CN (2) | CN100349044C (zh) |
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JP2005301056A (ja) * | 2004-04-14 | 2005-10-27 | Hitachi Displays Ltd | 表示装置とその製造方法 |
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TWI305390B (en) * | 2005-09-07 | 2009-01-11 | Ind Tech Res Inst | Chip structure, chip package structure and manufacturing thereof |
JP4305667B2 (ja) * | 2005-11-07 | 2009-07-29 | セイコーエプソン株式会社 | 半導体装置 |
JP4980709B2 (ja) * | 2006-12-25 | 2012-07-18 | ローム株式会社 | 半導体装置 |
KR100798896B1 (ko) * | 2007-06-07 | 2008-01-29 | 주식회사 실리콘웍스 | 반도체 칩의 패드 배치 구조 |
US7713860B2 (en) * | 2007-10-13 | 2010-05-11 | Wan-Ling Yu | Method of forming metallic bump on I/O pad |
JP2009260008A (ja) * | 2008-04-16 | 2009-11-05 | Nikon Corp | 半導体装置製造装置および半導体装置の製造方法 |
TWI368973B (en) * | 2008-09-24 | 2012-07-21 | Ind Tech Res Inst | Package and substrate structure with alignment pattern and analysis method about its yield |
KR101319348B1 (ko) * | 2009-12-21 | 2013-10-16 | 엘지디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
JP5452290B2 (ja) * | 2010-03-05 | 2014-03-26 | ラピスセミコンダクタ株式会社 | 表示パネル |
JP5477105B2 (ja) * | 2010-03-26 | 2014-04-23 | 大日本印刷株式会社 | ディスプレイ装置用基板、ディスプレイ装置及びディスプレイ装置の製造方法 |
US8624392B2 (en) | 2011-06-03 | 2014-01-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrical connection for chip scale packaging |
US9548281B2 (en) * | 2011-10-07 | 2017-01-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrical connection for chip scale packaging |
US8912668B2 (en) | 2012-03-01 | 2014-12-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrical connections for chip scale packaging |
US8546194B2 (en) * | 2011-12-14 | 2013-10-01 | Stats Chippac Ltd. | Integrated circuit packaging system with interconnects and method of manufacture thereof |
US9196573B2 (en) | 2012-07-31 | 2015-11-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bump on pad (BOP) bonding structure |
US8829673B2 (en) | 2012-08-17 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bonded structures for package and substrate |
US9673161B2 (en) | 2012-08-17 | 2017-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bonded structures for package and substrate |
CN104377190B (zh) * | 2013-08-14 | 2017-02-15 | 北大方正集团有限公司 | 用于监控集成电路工艺中多晶硅层光刻对准偏差的装置 |
CN103794588A (zh) * | 2014-01-29 | 2014-05-14 | 成都京东方光电科技有限公司 | 一种集成电路芯片和显示装置 |
JP2016167544A (ja) * | 2015-03-10 | 2016-09-15 | ソニー株式会社 | 電子部品、電子部品実装基板及び電子部品の実装方法 |
US10170444B2 (en) | 2015-06-30 | 2019-01-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices |
CN205028275U (zh) * | 2015-09-23 | 2016-02-10 | 深圳信炜科技有限公司 | 芯片组以及电子设备 |
KR20170113748A (ko) * | 2016-03-24 | 2017-10-13 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
KR102666884B1 (ko) * | 2016-07-15 | 2024-05-17 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
CN106848081B (zh) * | 2017-03-08 | 2018-11-09 | 武汉华星光电技术有限公司 | 柔性amoled显示屏及导电胶膜层的制作方法 |
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CN112309834B (zh) * | 2020-11-02 | 2021-06-29 | 江苏纳沛斯半导体有限公司 | 一种驱动显示芯片中偏移金凸块的处理方法 |
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JP2003179091A (ja) * | 2002-09-02 | 2003-06-27 | Seiko Epson Corp | Icチップ、icチップの実装構造、液晶パネル、液晶装置及びインクジェット装置 |
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JP2005301056A (ja) * | 2004-04-14 | 2005-10-27 | Hitachi Displays Ltd | 表示装置とその製造方法 |
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CN1683960A (zh) | 2005-10-19 |
US7141877B2 (en) | 2006-11-28 |
US20090273080A1 (en) | 2009-11-05 |
US7679189B2 (en) | 2010-03-16 |
US20050242436A1 (en) | 2005-11-03 |
CN101122690A (zh) | 2008-02-13 |
US20070063346A1 (en) | 2007-03-22 |
JP2005301056A (ja) | 2005-10-27 |
US7948080B2 (en) | 2011-05-24 |
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