CN100402605C - 含反应性阻燃剂膦酸酯低聚物和填料的环氧树脂组合物 - Google Patents
含反应性阻燃剂膦酸酯低聚物和填料的环氧树脂组合物 Download PDFInfo
- Publication number
- CN100402605C CN100402605C CNB2003801053608A CN200380105360A CN100402605C CN 100402605 C CN100402605 C CN 100402605C CN B2003801053608 A CNB2003801053608 A CN B2003801053608A CN 200380105360 A CN200380105360 A CN 200380105360A CN 100402605 C CN100402605 C CN 100402605C
- Authority
- CN
- China
- Prior art keywords
- composition
- total weight
- accounts
- epoxy
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
- C08K5/5333—Esters of phosphonic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42519602P | 2002-11-08 | 2002-11-08 | |
US60/425,196 | 2002-11-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1723243A CN1723243A (zh) | 2006-01-18 |
CN100402605C true CN100402605C (zh) | 2008-07-16 |
Family
ID=32312940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003801053608A Expired - Fee Related CN100402605C (zh) | 2002-11-08 | 2003-11-07 | 含反应性阻燃剂膦酸酯低聚物和填料的环氧树脂组合物 |
Country Status (12)
Country | Link |
---|---|
US (1) | US7427652B2 (zh) |
EP (2) | EP1570000B1 (zh) |
JP (1) | JP2006505679A (zh) |
KR (1) | KR101169658B1 (zh) |
CN (1) | CN100402605C (zh) |
AT (2) | ATE494329T1 (zh) |
AU (1) | AU2003290646A1 (zh) |
CA (1) | CA2505396A1 (zh) |
DE (2) | DE60308548T2 (zh) |
ES (2) | ES2273060T3 (zh) |
TW (1) | TWI335926B (zh) |
WO (1) | WO2004044054A1 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4518538B2 (ja) * | 2001-10-04 | 2010-08-04 | サプレスタ エルエルシー | ヒドロキシ末端化されたオリゴマー状ホスホネートを含む熱硬化性樹脂組成物 |
EP1625171A1 (en) * | 2003-05-22 | 2006-02-15 | Supresta LLC | Polyphosphonate flame retardant curing agent for epoxy resin |
US7910665B2 (en) * | 2004-05-19 | 2011-03-22 | Icl-Ip America Inc. | Composition of epoxy resin and epoxy-reactive polyphosphonate |
TW200916561A (en) * | 2007-05-07 | 2009-04-16 | Martinswerk Gmbh | Flame retarded thermosets |
US9348991B2 (en) * | 2008-05-20 | 2016-05-24 | International Business Machines Corporation | User management of authentication tokens |
TWI423741B (zh) * | 2009-02-13 | 2014-01-11 | Iteq Corp | An epoxy resin composition and a film and a substrate made of the epoxy resin composition |
WO2011109463A1 (en) * | 2010-03-05 | 2011-09-09 | Huntsman Advanced Materials Americas Llc | Low dielectric loss thermoset resin system at high frequency for use in electrical components |
US20120095132A1 (en) * | 2010-10-19 | 2012-04-19 | Chung-Hao Chang | Halogen- and phosphorus-free thermosetting resin composition |
JP5806333B2 (ja) | 2010-12-22 | 2015-11-10 | エフアールエックス ポリマーズ、インク. | ホスホン酸オリゴマーおよびこれを含む組成物 |
CN102408419B (zh) * | 2011-08-10 | 2014-11-05 | 哈尔滨理工大学 | 苯并噁嗪树脂的方法 |
JP2016510355A (ja) * | 2013-01-22 | 2016-04-07 | エフアールエックス ポリマーズ、インク. | リン含有エポキシ化合物およびそれからなる組成物 |
JP2015040289A (ja) * | 2013-08-23 | 2015-03-02 | 三菱化学株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板 |
CN105802127B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板 |
CN105801814B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
CN105802128B (zh) * | 2014-12-29 | 2018-05-04 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板 |
CN107151308B (zh) * | 2016-03-04 | 2019-06-14 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物及使用它的预浸料、印制电路用层压板 |
CN108117632B (zh) * | 2016-11-30 | 2019-08-23 | 广东生益科技股份有限公司 | 一种热固性树脂组合物 |
CN108117634B (zh) * | 2016-11-30 | 2019-08-27 | 广东生益科技股份有限公司 | 一种热固性树脂组合物 |
CN108164684B (zh) * | 2016-12-07 | 2019-08-27 | 广东生益科技股份有限公司 | 一种热固性树脂组合物 |
MX2020002460A (es) | 2017-09-13 | 2020-07-20 | Hexion Inc | Sistemas de resina epoxi. |
KR102346010B1 (ko) * | 2019-09-19 | 2021-12-31 | 코오롱인더스트리 주식회사 | 말단이 불포화기로 캡핑된 인 함유 수지, 이의 제조방법 및 상기 말단이 불포화기로 캡핑된 인 함유 수지를 포함하는 수지 조성물 |
CN114539313B (zh) * | 2022-02-23 | 2024-04-26 | 长春市兆兴新材料技术有限责任公司 | 一种双反应型膦酸酯交联阻燃剂及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0451101A2 (en) * | 1990-04-03 | 1991-10-09 | Fmc Corporation (Uk) Limited | Flame retardants for polymers |
JP2000226499A (ja) * | 1998-12-03 | 2000-08-15 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2001019746A (ja) * | 1999-07-09 | 2001-01-23 | Asahi Denka Kogyo Kk | 難燃性エポキシ樹脂組成物 |
WO2001074960A2 (en) * | 2000-03-31 | 2001-10-11 | Isola Laminate Systems, Corp. | Halogen free flame retardant adhesive resin coated composite |
JP2001302879A (ja) * | 2000-04-25 | 2001-10-31 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂組成物、ならびにそれを用いたプリプレグおよびプリント配線板 |
WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2682522A (en) * | 1952-09-10 | 1954-06-29 | Eastman Kodak Co | Process for preparing polymeric organo-phosphonates |
US2716101A (en) * | 1952-09-10 | 1955-08-23 | Eastman Kodak Co | Polymeric organo-phosphonates containing phosphato groups |
FR1438381A (fr) * | 1964-03-28 | 1966-05-13 | Gelsenberg Benzin Ag | Procédé de préparation de phosphonates contenant des groupes hydroxyle |
GB1308521A (en) * | 1970-03-23 | 1973-02-21 | Exxon Research Engineering Co | Phenolic stabilizers and compositions containing them |
IT1019221B (it) † | 1973-09-11 | 1977-11-10 | Sumitomo Bakelite Co | Composizione di resina termoindu rente inifiammabile e procedi mento per produrla |
DE2715589A1 (de) * | 1976-04-14 | 1977-10-27 | Ciba Geigy Ag | Neue phenol-stabilisatoren |
US4268633A (en) * | 1978-04-20 | 1981-05-19 | Stauffer Chemical Company | Polyurethanes containing a poly (oxyorganophosphate/phosphonate) flame retardant |
DE2925207A1 (de) * | 1979-06-22 | 1981-01-29 | Bayer Ag | Thermoplastische, verzweigte, aromatische polyphosphonate, ihre verwendung und ein verfahren zu ihrer herstellung |
DE3139958A1 (de) * | 1981-10-08 | 1983-04-28 | Basf Ag, 6700 Ludwigshafen | Selbstverloeschende thermoplastische formmassen |
DE3520296A1 (de) * | 1985-06-07 | 1986-12-11 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von copolyphosphonaten mit hoher zaehigkeit |
DE3800672A1 (de) * | 1988-01-13 | 1989-07-27 | Bayer Ag | Flammgeschuetzte polyethylenterephthalatformmassen |
DE3833694A1 (de) * | 1988-10-04 | 1990-04-05 | Bayer Ag | Flammgeschuetzte, gut kristallisierende polyethylenterephthalatformmassen |
US4952646A (en) † | 1989-07-20 | 1990-08-28 | Akzo America Inc. | Epoxy resin compositions containing a polyphosphoric/polyphosphonic anhydride curing agent |
FR2660302B1 (fr) * | 1990-03-30 | 1992-08-07 | Selas Sa | Installation pour le chauffage, le formage et la trempe de feuilles de verre. |
US6005064A (en) | 1993-12-27 | 1999-12-21 | Hitachi Chemical Company, Ltd. | Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound |
JPH08183835A (ja) | 1994-12-28 | 1996-07-16 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、接着剤シート及び接着剤付き 金属はく |
US6214455B1 (en) | 1995-09-29 | 2001-04-10 | Toshiba Chemical Corporation | Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin |
JP3487083B2 (ja) | 1996-02-09 | 2004-01-13 | 日立化成工業株式会社 | 熱硬化性樹脂組成物及びその硬化物 |
GB9713526D0 (en) | 1997-06-26 | 1997-09-03 | Dow Deutschland Inc | Flame retardant laminating formulations |
US6353080B1 (en) † | 1997-06-26 | 2002-03-05 | The Dow Chemical Company | Flame retardant epoxy resin composition |
JPH1180178A (ja) * | 1997-09-12 | 1999-03-26 | Hitachi Chem Co Ltd | リン含有フェノール末端オリゴマー及びその製造法 |
JP2000256633A (ja) | 1999-03-09 | 2000-09-19 | Hitachi Chem Co Ltd | 接着剤組成物 |
JP2001098273A (ja) * | 1999-09-30 | 2001-04-10 | Nippon Chem Ind Co Ltd | 難燃剤組成物および難燃性樹脂組成物 |
JP2001122948A (ja) * | 1999-10-28 | 2001-05-08 | Hitachi Chem Co Ltd | 難燃性樹脂組成物、プリプレグ及びプリント配線板用積層板 |
TW587094B (en) | 2000-01-17 | 2004-05-11 | Sumitomo Bakelite Co | Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition |
JP2002088138A (ja) * | 2000-09-14 | 2002-03-27 | Asahi Denka Kogyo Kk | エポキシ樹脂組成物 |
MY142518A (en) | 2001-01-10 | 2010-12-15 | Hitachi Chemical Co Ltd | Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin |
MY138485A (en) | 2001-03-12 | 2009-06-30 | Hitachi Chemical Co Ltd | Process for producing benzoxazine resin |
-
2003
- 2003-11-07 US US10/534,137 patent/US7427652B2/en not_active Expired - Lifetime
- 2003-11-07 AT AT06118096T patent/ATE494329T1/de not_active IP Right Cessation
- 2003-11-07 EP EP03783227A patent/EP1570000B1/en not_active Expired - Lifetime
- 2003-11-07 EP EP06118096.4A patent/EP1719802B2/en not_active Expired - Lifetime
- 2003-11-07 WO PCT/US2003/035519 patent/WO2004044054A1/en active IP Right Grant
- 2003-11-07 AT AT03783227T patent/ATE340220T1/de not_active IP Right Cessation
- 2003-11-07 DE DE60308548T patent/DE60308548T2/de not_active Expired - Lifetime
- 2003-11-07 ES ES03783227T patent/ES2273060T3/es not_active Expired - Lifetime
- 2003-11-07 KR KR1020057008048A patent/KR101169658B1/ko active IP Right Grant
- 2003-11-07 AU AU2003290646A patent/AU2003290646A1/en not_active Abandoned
- 2003-11-07 TW TW092131258A patent/TWI335926B/zh not_active IP Right Cessation
- 2003-11-07 JP JP2004551857A patent/JP2006505679A/ja active Pending
- 2003-11-07 CN CNB2003801053608A patent/CN100402605C/zh not_active Expired - Fee Related
- 2003-11-07 ES ES06118096T patent/ES2359226T3/es not_active Expired - Lifetime
- 2003-11-07 CA CA002505396A patent/CA2505396A1/en not_active Abandoned
- 2003-11-07 DE DE60335671T patent/DE60335671D1/de not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0451101A2 (en) * | 1990-04-03 | 1991-10-09 | Fmc Corporation (Uk) Limited | Flame retardants for polymers |
JP2000226499A (ja) * | 1998-12-03 | 2000-08-15 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2001019746A (ja) * | 1999-07-09 | 2001-01-23 | Asahi Denka Kogyo Kk | 難燃性エポキシ樹脂組成物 |
WO2001074960A2 (en) * | 2000-03-31 | 2001-10-11 | Isola Laminate Systems, Corp. | Halogen free flame retardant adhesive resin coated composite |
JP2001302879A (ja) * | 2000-04-25 | 2001-10-31 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂組成物、ならびにそれを用いたプリプレグおよびプリント配線板 |
WO2003029258A1 (en) * | 2001-10-04 | 2003-04-10 | Akzo Nobel N.V. | Oligomeric, hydroxy-terminated phosphonates |
Non-Patent Citations (2)
Title |
---|
WO01 74960A 2001.10.11 |
WO03 029258A 2003.04.10 |
Also Published As
Publication number | Publication date |
---|---|
WO2004044054A1 (en) | 2004-05-27 |
CN1723243A (zh) | 2006-01-18 |
US7427652B2 (en) | 2008-09-23 |
EP1570000A1 (en) | 2005-09-07 |
US20060142427A1 (en) | 2006-06-29 |
ATE340220T1 (de) | 2006-10-15 |
AU2003290646A1 (en) | 2004-06-03 |
TWI335926B (en) | 2011-01-11 |
EP1719802A1 (en) | 2006-11-08 |
JP2006505679A (ja) | 2006-02-16 |
DE60335671D1 (de) | 2011-02-17 |
TW200417575A (en) | 2004-09-16 |
KR20050087793A (ko) | 2005-08-31 |
ES2359226T3 (es) | 2011-05-19 |
CA2505396A1 (en) | 2004-05-27 |
DE60308548D1 (de) | 2006-11-02 |
DE60308548T2 (de) | 2007-09-20 |
ATE494329T1 (de) | 2011-01-15 |
EP1719802B2 (en) | 2015-11-25 |
ES2273060T3 (es) | 2007-05-01 |
KR101169658B1 (ko) | 2012-08-03 |
EP1719802B1 (en) | 2011-01-05 |
EP1570000B1 (en) | 2006-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100402605C (zh) | 含反应性阻燃剂膦酸酯低聚物和填料的环氧树脂组合物 | |
KR100904566B1 (ko) | 올리고머 히드록시-말단 포스포네이트 및 이를 포함하는 조성물 | |
US9988520B2 (en) | Flame retartdant epoxy resins comprising phosphorus containing flame retardants | |
US7910665B2 (en) | Composition of epoxy resin and epoxy-reactive polyphosphonate | |
KR20060019547A (ko) | 에폭시 수지용 폴리포스포네이트 난연성 경화제 | |
US20110065838A1 (en) | Hydroxyphenyl Phosphine Oxide Mixtures and their use as Flame Retardants for Epoxy Resins | |
EP2710068A1 (en) | Aluminum phosphorus acid salts as epoxy resin cure inhibitors | |
JP2661109B2 (ja) | 難燃性フェノール樹脂組成物 | |
JP5024605B2 (ja) | 硬化性樹脂組成物、その硬化物、新規フェノール樹脂及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: LE GI PROEKT VODOKHOZYAJSTVENN Free format text: FORMER OWNER: AKZO NOBEL CO. Effective date: 20060804 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20060804 Address after: American New York Applicant after: SUPRESTA LLC Address before: Holland Arnhem Applicant before: Akzo Nobel N.V. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080716 Termination date: 20211107 |