CN100383919C - Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program - Google Patents

Recovery processing method to be adopted in substrate processing apparatus, substrate processing apparatus and program Download PDF

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CN100383919C
CN100383919C CNB2006100069197A CN200610006919A CN100383919C CN 100383919 C CN100383919 C CN 100383919C CN B2006100069197 A CNB2006100069197 A CN B2006100069197A CN 200610006919 A CN200610006919 A CN 200610006919A CN 100383919 C CN100383919 C CN 100383919C
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substrate
processing
wafer
board treatment
chamber
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CN1819112A (en
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清水宣昭
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60B—VEHICLE WHEELS; CASTORS; AXLES FOR WHEELS OR CASTORS; INCREASING WHEEL ADHESION
    • B60B17/00—Wheels characterised by rail-engaging elements
    • B60B17/0006—Construction of wheel bodies, e.g. disc wheels
    • B60B17/0013—Construction of wheel bodies, e.g. disc wheels formed by two or more axially spaced discs
    • B60B17/0017—Construction of wheel bodies, e.g. disc wheels formed by two or more axially spaced discs with insonorisation means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60B—VEHICLE WHEELS; CASTORS; AXLES FOR WHEELS OR CASTORS; INCREASING WHEEL ADHESION
    • B60B17/00—Wheels characterised by rail-engaging elements
    • B60B17/0006—Construction of wheel bodies, e.g. disc wheels
    • B60B17/0024—Construction of wheel bodies, e.g. disc wheels with noise reducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61F—RAIL VEHICLE SUSPENSIONS, e.g. UNDERFRAMES, BOGIES OR ARRANGEMENTS OF WHEEL AXLES; RAIL VEHICLES FOR USE ON TRACKS OF DIFFERENT WIDTH; PREVENTING DERAILING OF RAIL VEHICLES; WHEEL GUARDS, OBSTRUCTION REMOVERS OR THE LIKE FOR RAIL VEHICLES
    • B61F13/00—Rail vehicles characterised by wheel arrangements, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60B—VEHICLE WHEELS; CASTORS; AXLES FOR WHEELS OR CASTORS; INCREASING WHEEL ADHESION
    • B60B2900/00—Purpose of invention
    • B60B2900/10—Reduction of
    • B60B2900/133—Noise

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

Description

The restoration processing method of substrate board treatment, substrate board treatment
Technical field
For example the present invention relates to processed substrate such as semiconductor wafer or crystal liquid substrate is implemented the substrate board treatment of predetermined processing, restoration processing method, substrate board treatment, the program of the substrate board treatment when taking place to quit work unusually.
Background technology
Generally, this substrate board treatment comprises: have the processing unit that processed substrate is for example carried out a plurality of process chambers of predetermined processing to semiconductor wafer (following all abbreviate as " wafer "); For example be connected the supply unit on this processing unit by load locking room (load lock chamber).
For example, in the substrate board treatment of combination bench-type, generally be with described a plurality of process chambers and load locking room be connected with the state of air seal the common transfer chamber that forms rectangle around, constitute described processing unit.At the indoor processing unit side conveying mechanism that constitutes by conveying arm etc. that is provided with of common transfer,, between a plurality of process chambers and load locking room, carry out sending into and taking out of wafer by this processing unit side conveying mechanism.In supply unit, also be provided with the supply unit side conveying mechanism that constitutes by conveying arm etc., by this supply unit side conveying mechanism, carry out sending into and taking out of wafer between box container of wafer (substrate accommodation container) and the described load locking room containing.
In such substrate board treatment, when will at first, in supply unit, from box container, taking out untreated wafer to being housed in wafer in the substrate accommodation container (for example box container) when implementing predetermined processing by supply unit side conveying mechanism.Before the untreated wafer that will take out from box container is being sent to load locking room, is sent to earlier on the positioner that is arranged on the supply unit (for example locator, give the location objective table) and positions.Untreated wafer behind the location is taken out from positioner, and be sent to load locking room.
Untreated wafer to load locking room is sent into is removed from load locking room by processing unit side conveying mechanism, and sends into to process chamber, implements predetermined processing.End process wafer after processing in process chamber finishes takes out from process chamber by processing unit side conveying mechanism, and turns back to load locking room.The end process wafer that turns back to load locking room turns back to box container by supply unit side conveying mechanism.
In order to improve the treatment effeciency of each process chamber in this substrate board treatment, preferably make untreated wafer be positioned as close to the process chamber standby, so, even during in process chamber, handling, also untreated wafer to be taken out from box container successively, and make these wafers in standbies such as common transfer chamber, load locking room, positioners.Then, in process chamber, finished the processing of a wafer after, the wafer of end process directly is housed in the box container, and, next untreated wafer is directly carried to process chamber the untreated wafer batch transportation in described each standby.
Yet in this substrate board treatment, if abnormal conditions such as this substrate board treatment breaks down, has a power failure at work, electric leakages, described substrate board treatment cut off the power supply etc. promptly quits work it.The processing of the wafer of for example handling in process chamber in this case, is interrupted midway and is trapped in the process chamber.In addition, in supply unit, the wafer of each indoor standby such as common transfer is indoor, load-lock is indoor is trapped in intactly also that each is indoor.And, when each indoor vacuumizing equal pressure when control, also stop because of the work of substrate board treatment stops to cause pressure control, so for example worry rubbish or dust from exhaust one side adverse current, perhaps the particulates such as attachment that cause because of the processing of wafer are floating.
In the prior art, when substrate board treatment stops unusually because of producing, after this unusual elimination, each indoor wafer that operating personnel will be trapped in substrate board treatment takes out, simultaneously by manual operations to each indoor cleanings such as supply unit, process chamber, common transfer chamber, load locking rooms, so that the state restoration of substrate board treatment.
Patent documentation 1: Japanese kokai publication hei 11-330185 communique.
As mentioned above, when substrate board treatment promptly stops, in the prior art, carry out the comeback job of substrate board treatment by manual operations, therefore, have operation trouble and time-consuming problem by operating personnel.And, wafer for Interrupt Process in process chamber, because will be according to the record of the etching state of for example memory chip etc. etc., judge and after this how this wafer is remained processing (with reference to patent documentation 1), also need spended time and time so save the processing of wafer, simultaneously, the experience and knowledge that needs operating personnel.
About this point, producing under the unusual and out-of-work situation because of substrate board treatment, when removing unusual back input power supply, also need to make described each conveying mechanism action, each indoor all wafers such as being trapped in supply unit, process chamber, common transfer chamber, load locking room is recovered in the original box container automatically, the wafer that reclaims is handled by operating personnel.But, under these circumstances, reclaim the time that wafer spent though can save, but the residue that is recovered wafer is handled, identical with described situation, owing to need operating personnel's experience and knowledge, and be not easy it is judged the problem that still exists the processing of saving wafer to need spended time and time.
In addition, when as mentioned above like that substrate board treatment produce when unusual, all wafers in will being trapped in this substrate board treatment is recovered in the process of original box container automatically, do not consider when the work of substrate board treatment stops wafer the processing stage, because the wafer that is trapped in the substrate board treatment all is recycled in the box container, so all wafer all is exposed in the atmosphere.Yet, continuous processing in a plurality of process chambers is necessary wafer, carry midway to next process chamber, be trapped in the situation of common transfer chamber, and midway being interrupted of the processed in certain process chamber and under the situation about being trapped in this process chamber etc., according to wafer the processing stage, if be exposed in the atmosphere, then can not save wafer sometimes in this stage.For example, as the processed of cluster etc., because interrupted processing midway, and cause this wafer can not remain processings (for example replenishing etch processes etc.), so can not save wafer.
Summary of the invention
Therefore, the present invention proposes in view of the above problems, its purpose is to provide a kind of restoration processing method, substrate board treatment, program of substrate board treatment, in the work of substrate board treatment because of producing when unusually quitting work, can save the time that the recovery of this substrate board treatment handles and the time of cost, in addition, when producing unusual quitting work because of substrate board treatment, by the processed substrate that is trapped in the substrate board treatment is saved processing reliably, and can save processed substrate as much as possible.
In order to solve described problem, in one aspect of the invention, a kind of restoration processing method of substrate board treatment can be provided, be the substrate board treatment of forming by a plurality of chamber that comprises the process chamber that the processed substrate that transports from substrate accommodation container is handled at least, produce in owing to the work of this substrate board treatment when causing work to stop unusually, after this unusual releasing, restore the restoration processing method of substrate board treatment of the state of described substrate board treatment, wherein, the restoration processing method of described substrate board treatment comprises: the substrate recovery process, for each the indoor described processed substrate that is trapped in described substrate board treatment, carry out corresponding to when described work stops, implementing the processing stage substrate save and handle, described processed substrate is reclaimed to described substrate accommodation container; With the cuttling of device internal state, make each indoor state restoration of described substrate board treatment.
In such the present invention, when causing work to stop unusually because of producing in the work of substrate board treatment, can make the processing of the state restoration of substrate board treatment automatically, just be trapped in the recovery of the processed substrate in the substrate board treatment and the processing of the state restoration in the substrate board treatment can be carried out automatically.Like this, with of the prior art manually restore to handle by operating personnel compare, can save significantly and restore the time and the time of handling.In addition, for the processed substrate that is trapped in the substrate board treatment, corresponding to up to because of substrate board treatment cause work to stop unusually the time implement the processing stage, carry out corresponding correct redemption and handle, can save processed substrate as much as possible.
In addition, the substrate in described method is saved and is handled and can constitute in the mode with following operation, and for example: substrate detects operation, detects the described processed substrate that is detained in described substrate board treatment; The processing stage detect operation, for detecting the detected processed substrate of operation by described substrate, detect when described work stops enforcement the processing stage; Save operation with substrate, for detecting the detected processed substrate of operation,, implement corresponding substrate redemption processing corresponding to detecting operation by described the processing stage detected the processing stage by described substrate.
In this case, described substrate is saved operation and is for example being detected processed substrate by described substrate detection operation in described process chamber, detect by described the processing stage operation detect this processed substrate the processing stage be the also residual processing that processing in this process chamber arranged midway under the situation in stage, in this process chamber, this processed substrate is implemented remaining processing.Like this, be trapped in the wafer in the substrate board treatment, under the situation of for example being detained under the interrupted midway state of the processing in process chamber, be in the stage midway of handling, be implemented in the remaining processing of this process chamber for this processed substrate after, be recycled in the substrate accommodation container.Like this, the residue that is in the process chamber is handled the processed substrate in stage midway, owing to not being that direct recovery is exposed in the atmosphere as prior art, so can save this processed substrate.
In addition, described substrate board treatment has the storage device of the processing record information of processed substrate in the work that is stored in this substrate board treatment, detect operation by described substrate, in described process chamber, detect processed substrate, detect operation by described the processing stage, detect this processed substrate the processing stage be to be trapped in the processing of processing of this process chamber midway under the situation in stage, described substrate is saved operation according to the processing record information that is stored in the processed substrate in the described storage device, set the residue processing time of processed substrate, can only implement the residue in this residue processing time to this processed substrate and handle.Like this, by set the residue processing time of processed substrate according to the processing record information of processed substrate, can set the best residue processing time to this processed substrate, so can correctly save processed substrate.
In addition, after described substrate board treatment can be included in the treatment state that detects described processed substrate, carry out the defect inspection chamber of defect inspection, in described process chamber, detect processed substrate when detecting operation by described substrate, and detect by described the processing stage operation detect this processed substrate the processing stage be to be trapped in the processing of processing of this process chamber midway under the situation in stage, described substrate is saved operation should be transported to described defect inspection chamber by processed substrate, in this defect inspection chamber, set residue processing time of this processed substrate according to the treatment state of the processed substrate that is detected, this processed substrate is only implemented the residue in this residue processing time and handled.Like this, according to treatment state at the detected processed substrate in defect inspection chamber, by setting the residue processing time of processed substrate, can set the residue processing time corresponding to the actual treatment situation of this processed substrate, can more correctly save processed substrate.
In addition, detect the processed substrate of carrying to other process chamber from certain process chamber midway when detecting operation by described substrate, and detect by described the processing stage operation detect this processed substrate the processing stage be residual have in necessity of other process chamber handle under the situation in the stage of also not handling, described substrate is saved operation is implemented in remaining process chamber to this processed substrate processing.Like this, wafer finishing dealing with in certain process chamber for example in substrate board treatment, but owing to be left in necessity processing of process chamber in addition, so in the situation that is in the uncompleted stage of processing that necessary whole processing do not finish, after this processed substrate being implemented in the processing of remaining other process chamber, be recovered in the substrate accommodation container.Like this, be in the processed substrate that the stage is not finished in processing, owing to not being that direct recovery is exposed in the atmosphere as in the prior art, so can save this processed substrate.
In addition, indoor detect processed substrate when detect operation by described substrate at certain, and detect by described the processing stage operation detect this processed substrate the processing stage be under the situation in the stage of being untreated or the stage of finishing dealing with, described substrate is saved operation and should be reclaimed to described substrate accommodation container by processed substrate.Because for the processed substrate in the stage of being untreated or the stage of finishing dealing with, though directly be recovered to substrate accommodation container be exposed in the atmosphere also no problem.Like this by corresponding to processed substrate the processing stage save processing, can save the processed substrate that is trapped in the substrate board treatment as far as possible.
In addition, in the cuttling of described device internal state, each chamber of described substrate board treatment comprises the gas delivery system that can import purge gas at least and can be by vacuumizing and adjust to atmosphere opening the gas extraction system of pressure, for example, each the indoor cleaning that can implement described substrate board treatment is handled.For example each chamber of the described processing unit of described substrate board treatment and described supply unit has the gas delivery system that can import purge gas at least and can be by vacuumizing and adjust to atmosphere opening the gas extraction system of pressure, it for example can be with purge gas (for example, N by described gas delivery system that described cleaning is handled 2Gas and inert gas etc.) import to substrate board treatment each is indoor, vacuumize or repeat repeatedly predetermined process by described gas extraction system to atmosphere opening.Like this, can remove and swim in each indoor particulate of substrate board treatment (for example attachment, dust, waste residue etc.).In addition, because by vacuumizing repeatedly and, also peel off and force floatingly, can remove them attached to the particulate on the wall of each chamber and each indoor institute configured parts etc. to atmosphere opening.
In addition, detecting whether the processed substrate detection that is recycled in the described substrate accommodation container is the stage of being untreated, is the stage of being untreated if detect, and then also can have the treatment process again that this processed substrate enforcement is handled again.In a single day the treatment process again that is in the processed substrate the processing stage of not having is like this carried out after being recycled to substrate accommodation container, so also can carry out after the cuttling in device.The same carrying out before can making the processing that is in the processed substrate the processing stage of not having like this and substrate board treatment restoring.
In addition, described substrate board treatment has the measuring fine particles chamber, and, described substrate recovery process, before described processed substrate is recovered to described substrate accommodation container, be transported to described measuring fine particles chamber, carry out the measurement of the particulate loading on the described processed substrate in this measuring fine particles chamber, and this measurement result is corresponding with described processed substrate and be stored in the storage device.Like this, restore the processed substrate of handling, can judge whether it is the processed substrate that to handle again according to the particulate loading measurement result about having implemented.
In order to solve described problem, in another aspect of this invention, a kind of restoration processing method of substrate board treatment can be provided, be in substrate board treatment, in owing to the work of this substrate board treatment, produce when unusually work being stopped, after this unusual releasing, make the restoration processing method of substrate board treatment of the state restoration of described substrate board treatment, and, described substrate board treatment comprises: processing unit is made of a plurality of chamber that comprises a plurality of process chambers of handling processed substrate at least; Supply unit is connected on the described processing unit, have and take in the conveying chamber that carries out the handing-over of described processed substrate between the substrate accommodation container of described processed substrate; Supply unit side conveying mechanism is set in the described supply unit, and described processed substrate is sent into and taken out to described processing unit; With processing unit side conveying mechanism, be set in the described processing unit, described processed substrate is sent into and taken out to described process chamber, wherein, described restoration processing method comprises: the substrate recovery process, for the described processed substrate in described processing unit that is trapped in described substrate board treatment and/or the described supply unit, carry out substrate corresponding to the stage of the processing of when described work stops, having implemented and save processing, by described processing unit side conveying mechanism and/or described supply unit side conveying mechanism, described processed substrate is reclaimed to described substrate accommodation container; With the cuttling of device internal state, make the state restoration that described processing unit is interior and described supply unit is interior of described substrate board treatment.
In this case, described substrate recovery process is for the processed substrate that is trapped in the described processing unit, detect this processed substrate the processing stage whether be the necessary processing of this processed substrate of residue the processing stage, the necessary processing of residue the processing stage situation under, implement remaining processing, by described processing unit side conveying mechanism and described supply unit side conveying mechanism, reclaim to described substrate accommodation container, be not the necessary processing of residue the processing stage situation under, by described processing unit side conveying mechanism and described supply unit side conveying mechanism, the substrate of enforcement in the processing unit that described substrate accommodation container reclaims saved and handled, for the processed substrate that is trapped in the described supply unit, the substrate that also can implement in the supply unit that described substrate accommodation container reclaims is saved processing.
In such the present invention, when unusually work being stopped because of producing in the work of substrate board treatment, can make the processing of the state restoration of substrate board treatment automatically, just can be trapped in the processing unit automatically and/or described supply unit in processed substrate recovery, make in described processing unit and/or the processing of the state restoration in the described supply unit.Like this, compare with manually restoring to handle by operating personnel, can save significantly and restore the time and the time of handling with of the prior art.In addition, as described in processing unit, in the supply unit like that, by according to processed substrate delay place save processing, corresponding to processed substrate the processing stage, can correctly save processing.Can save processed substrate as much as possible like this.
In addition, described substrate board treatment is included in the storage device of the processing record information of the processed substrate of storage in the work of this substrate board treatment, substrate is saved the processing record information of handling according to being stored in the processed substrate in the described storage device in the described processing unit, detection be trapped in processed substrate in the described processing unit the processing stage whether be this processed substrate of residue must handle the processing stage, according to the result of this detection, implement remaining processing; In addition, described substrate board treatment comprises the defect inspection chamber of carrying out defect inspection behind the treatment state that detects described processed substrate, substrate is saved the treatment state of handling according to detected processed substrate in described defect inspection chamber in the described processing unit, detection be trapped in processed substrate in the described processing unit the processing stage whether be residue this processed substrate the processing stage necessary to be processed, implement remaining processing according to this testing result.Like this, according to the processing record information of processed substrate or in the check result of defect inspection chamber, by implementing the remaining processing of processed substrate, can set the residue processing time of this processed substrate the best, so can correctly save processed substrate.
In addition, in the cuttling of described device internal state, for example also can implement the described processing unit cleaning interior and each chamber that described supply unit is interior of described substrate board treatment and handle.For example each chamber of the described processing unit of described substrate board treatment and described supply unit has the gas delivery system that can import purge gas at least, the gas extraction system by vacuumizing and adjusting to the pressure of atmosphere opening, described cleaning is handled behind each indoor importing purge gas of described processing unit and described supply unit, can repeated multiple times vacuumizes and to the processing of atmosphere opening.In addition, whether being recycled to processed substrate in the described substrate accommodation container, to detect processed substrate be the stage of being untreated, and is the stage of being untreated in case detect, and also can have the treatment process again that this processed substrate is handled again.Described in addition substrate board treatment has the measuring fine particles chamber, make before described processed substrate is recovered to described substrate accommodation container, be transported to described measuring fine particles chamber, carry out the measurement of the particulate loading on the described processed substrate in this measuring fine particles chamber, can be corresponding with described processed substrate this measurement result, store in the storage device.
In order to solve described problem, in another aspect of this invention, a kind of restoration processing method of substrate board treatment can be provided, be in substrate board treatment, in owing to the work of this substrate board treatment, produce when unusually work being stopped, after this unusual releasing, make the restoration processing method of substrate board treatment of the state restoration of described substrate board treatment, and, described substrate board treatment comprises: supply unit, and take in the conveying chamber that has the handing-over of carrying out described processed substrate between the placement processing substrate container of processed substrate; Processing unit has a plurality of process chambers that will handle described processed substrate and is connected common transfer chamber on every side and the load locking room that connects the conveying chamber of this common transfer chamber and described supply unit; Supply unit side conveying mechanism is set in the described supply unit, and described processed substrate is sent into and taken out to described load locking room; With processing unit side conveying mechanism, the common transfer that is set at described processing unit is indoor, described processed substrate is sent into and taken out between described load locking room and described chambers, wherein, the restoration processing method of described substrate board treatment comprises: the substrate recovery process, each indoor described processed substrate for described processing unit that is trapped in described substrate board treatment and/or described supply unit, corresponding to the stage of the processing of when described work stops, having implemented, carry out substrate and save processing, by described processing unit side conveying mechanism and/or described supply unit side conveying mechanism, described processed substrate is reclaimed to described substrate accommodation container; With the cuttling of device internal state, make each indoor state restoration of described substrate board treatment.
In this case, described substrate recovery process is if detect processed substrate in described supply unit, the substrate of then implementing in the supply unit that described substrate accommodation container reclaims is saved processing, if detect processed substrate in that load-lock is indoor, after then carrying out the pump-down process of this load locking room, the indoor substrate of load-lock that enforcement carries out reclaiming to described substrate accommodation container to this processed substrate is saved and is handled, if detect processed substrate in described common transfer chamber, just judge this processed substrate the processing stage whether be the stage of not finishing processing, if do not finish the stage of processing, reclaim to described substrate accommodation container after then being implemented in the processing of remaining process chamber, if not the stage of not finishing processing, the indoor substrate of common transfer of just implementing to reclaim to described substrate accommodation container is saved and is handled, if detect processed substrate at described process chamber, then judge this processed substrate the processing stage whether be the stage of handling midway, handle the stage midway in this way, after just being implemented in the remaining processing of this process chamber, reclaim to described substrate accommodation container, as not being the stage of handling midway, the substrate that just can implement in the process chamber that described substrate accommodation container reclaims is saved processing.
As adopt the present invention, in owing to the work of substrate board treatment, produce and work when stopping unusually, can make the processing of the state restoration of substrate board treatment automatically, just can be trapped in automatically each indoor processed substrate of processing unit and/or described supply unit recovery, make processing at each indoor state restoration of processing unit and/or described supply unit.Compare with manually restoring to handle with present operating personnel like this, can save significantly and restore the time and the time of handling.The substrate of saving in processing, the process chamber as the said substrate that the substrate redemption is handled, common transfer is indoor that the substrate redemption is handled, load-lock is indoor in supply unit is saved processing in addition, save processing by the place of being detained according to processed substrate, corresponding to processed substrate the processing stage, can correctly save processing.Like this, can save processed substrate as much as possible.
In addition, described substrate board treatment has the storage device of the processing record information of the processed substrate of storage in the work of this substrate board treatment, in the described process chamber substrate save the processed substrate handled in judging described process chamber the processing stage be to handle under the situation in stage midway, according to the processing record information that is stored in the processed substrate in the described storage device, set the residue processing time of this processed substrate, can handle substrate to this and only implement the residue processing of this remaining time, described in addition substrate board treatment has the defect inspection chamber of carrying out defect inspection behind the treatment state that detects described processed substrate, substrate in the described process chamber save the processed substrate handled in judging described process chamber the processing stage be to handle under the situation in stage midway, this processed substrate is carried to described defect inspection chamber, in this defect inspection chamber according to the treatment state of detected processed substrate, set the residue processing time of this processed substrate, can only carry out the residue of this remaining time to this processed substrate and handle.According to the processing record information of processed substrate or in the check result of defect inspection chamber, by implementing the remaining processing of processed substrate, can set the residue processing time of this processed substrate the best, like this so can correctly save processed substrate.
In addition, in the cuttling of described device internal state, also can implement described processing unit each indoor cleaning interior and described supply unit of described substrate board treatment and handle.In addition, the described processing unit of described substrate board treatment and each chamber of described supply unit have the gas delivery system that can import purge gas at least, by vacuumizing the gas extraction system of adjusting with the pressure of atmosphere opening mutually, described cleaning is handled can be behind each indoor importing purge gas of described processing unit and described supply unit, can repeated multiple times vacuumizes and to the processing of atmosphere opening.Whether being recycled to processed substrate in the described substrate accommodation container in addition, to detect processed substrate be the stage of being untreated, and is the stage of being untreated if detect, and then also can have the treatment process again that this processed substrate is handled again.In addition, described substrate board treatment has the measuring fine particles chamber, make described processed substrate recovery process before described processed substrate is recovered to substrate accommodation container, be transported to described measuring fine particles chamber, carry out the measurement of the particulate loading on the described processed substrate in this measuring fine particles chamber, can be corresponding with described processed substrate this measurement result, store in the storage device.
In order to solve described problem, in the present invention on the other hand, provide a kind of substrate board treatment of handling processed substrate, it is characterized in that comprise: processing unit is made of a plurality of chamber that comprises a plurality of process chambers of handling described processed substrate at least; Supply unit is connected on the described processing unit, have and take between the substrate accommodation container of described processed substrate, carry out the conveying chamber of the handing-over of described processed substrate; Supply unit side conveying mechanism is set in the described supply unit, and described processed substrate is sent into and taken out to described processing unit; Processing unit side conveying mechanism is set in the described processing unit, and described processed substrate is sent into and taken out to described process chamber; And control device, because when the generation abnormal work stops in the work of described substrate board treatment, at this unusual state of removing the described substrate board treatment of back recovery, wherein, described control device comprises: the substrate retracting device, for in the described processing unit that is trapped in described substrate board treatment and/or the described processed substrate in the described supply unit, carry out substrate corresponding to the stage of the processing of when described work stops, implementing and save processing, by described processing unit side conveying mechanism and/or described supply unit side conveying mechanism, described processed substrate is reclaimed to described substrate accommodation container; With device internal state restoring means, with in the described processing unit of described substrate board treatment and the state restoration in the described supply unit.
In such the present invention, in owing to the work of substrate board treatment, produce and work when stopping unusually, the processing of the state restoration of substrate board treatment can be carried out automatically, and just being trapped in the processing interior and/or state restoration that described supply unit is interior of described processing unit recovery, processing unit interior and/or the processed substrate that described supply unit is interior can carry out automatically.Compare with manually restoring to handle with present operating personnel like this, can save significantly and restore the time and the time of handling.In addition by corresponding to processed substrate the processing stage, carry out corresponding correct redemption and handle, can save processed substrate as much as possible.
In order to solve described problem, in another aspect of this invention, provide a kind of substrate board treatment of handling processed substrate, it is characterized in that, comprise: supply unit, and take in the conveying chamber that has the handing-over of carrying out described processed substrate between the substrate accommodation container of described processed substrate; Processing unit has a plurality of process chambers that will handle described processed substrate and is connected common transfer chamber on every side and the load locking room that connects the conveying chamber of this common transfer chamber and described supply unit; Supply unit side conveying mechanism is set in the conveying chamber of described supply unit, and described processed substrate is sent into and taken out to described load locking room; Processing unit side conveying mechanism, the common transfer that is set at described processing unit is indoor, and described processed substrate is sent into and taken out between each chamber of described load locking room and described chambers; And control device, when the generation abnormal work stops in the work of this substrate board treatment, after this unusual releasing, make the state restoration of described substrate board treatment, wherein, described control device comprises: the substrate retracting device, for in the described processing unit that is trapped in described substrate board treatment and/or each indoor described processed substrate of described supply unit, carry out substrate corresponding to the stage of the processing of when described work stops, implementing and save processing, by described processing unit side conveying mechanism and/or described supply unit side conveying mechanism, described processed substrate is reclaimed to described substrate accommodation container; Device internal state restoring means is with each indoor state restoration of described substrate board treatment.
In such the present invention, in owing to the work of substrate board treatment, produce and work when stopping unusually, the processing of the state restoration of substrate board treatment can be carried out automatically, and the processing of each indoor state restoration of recovery, processing unit and/or described supply unit that just is trapped in each indoor processed substrate of described processing unit and/or described supply unit can be carried out automatically.Compare with manually restoring to handle with present operating personnel like this, can save significantly and restore the time and the time of handling.In addition by corresponding to processed substrate the processing stage, carry out correct redemption and handle, can save processed substrate as much as possible.
In order to solve described problem, in the present invention on the other hand, a kind of program is provided, a kind of the substrate board treatment that constitutes by many each chambers that comprise the process chamber that the processed substrate that transports from substrate accommodation container is handled at least, in owing to the work of this substrate board treatment, produce and work when stopping unusually, the program of handling in the recovery of the substrate board treatment of this unusual state restoration of removing the described substrate board treatment of laggard enforcement, wherein, in computer, implement following processing: the substrate recycling, for each the indoor described processed substrate that is trapped in described substrate board treatment, corresponding to the stage of the processing of when described work stops, implementing, carry out substrate and save processing, described processed substrate is reclaimed to described substrate accommodation container; Restore processing with the device internal state, make each indoor state restoration of described substrate board treatment.
In addition, described substrate is saved to handle for example has substrate to detect processing, detects the described processed substrate that is trapped in the described substrate board treatment; Processing stage, detect to handle, and handles detected processed substrate for detecting with described substrate, detects the stage of the processing of enforcement when described work stops; Substrate save to be handled, and handles detected processed substrate for detecting with described substrate, handles detected the processing stage corresponding to detecting with described the processing stage, implements substrate redemption processing.
In such the present invention, when causing work to stop unusually because of producing in the work of substrate board treatment, the processing of the state restoration of substrate board treatment can be carried out automatically by computer, just be trapped in the recovery of the processed substrate in the substrate board treatment and the processing of the state restoration in the substrate board treatment can be carried out automatically by computer.Compare with manually restoring to handle with present operating personnel like this, can save significantly and restore the time and the time of handling.In addition for the processed substrate that is trapped in the substrate board treatment, corresponding to up to because of substrate board treatment cause work to stop unusually the time implement the processing stage, carry out corresponding correct redemption and handle, can save processed substrate as much as possible.
The invention effect:
In the present invention, when causing work to stop unusually because of producing in the work of substrate board treatment, the processing of the state restoration by making substrate board treatment automatically can be saved and be restored the time and the time of handling.In addition, for the processed substrate that is trapped in the substrate board treatment, corresponding to up to because of substrate board treatment cause work to stop unusually the time implement the processing stage, carry out corresponding correct redemption and handle, can save processed substrate as much as possible.
Description of drawings
Fig. 1 is the sectional view of the substrate board treatment structure of expression embodiment of the present invention.
Fig. 2 is the block diagram of the configuration example of expression control part shown in Figure 1.
Fig. 3 is the figure of the concrete example of expression wafer storage information shown in Figure 2.
Fig. 4 is the figure of the concrete example of expression processing of wafers record information shown in Figure 2.
Fig. 5 is the flow chart of the concrete example handled of the recovery of the same execution mode of expression.
Fig. 6 is the flow chart that the wafer in the expression supply unit shown in Figure 5 is saved the concrete example of handling.
Fig. 7 is the flow chart that the indoor wafer of expression load-lock shown in Figure 5 is saved the concrete example of handling.
Fig. 8 is the flow chart that the indoor wafer of expression common transfer shown in Figure 5 is saved the concrete example of handling.
Fig. 9 is the flow chart of expression concrete example to the processing of handling the wafer of not finishing shown in Figure 8.
Figure 10 is the flow chart that the wafer in the expression process chamber shown in Figure 5 is saved the concrete example of handling.
Figure 11 is the flow chart of expression concrete example to the processing of handling wafer midway shown in Figure 10.
Figure 12 is the figure of the treatment process of expression wafer, this figure (a) is the stabilizing process figure of the out-of-work situation of substrate board treatment midway that is illustrated in the process chamber, and this figure (b) is the stabilizing process figure that handles of the residue of the wafer W under the out-of-work situation of substrate board treatment midway that is illustrated in the process chamber.
Figure 13 is the figure of the treatment process of expression wafer, this figure (a) is the etching work procedure figure of the out-of-work situation of substrate board treatment midway that is illustrated in the process chamber, and this figure (b) is the etching work procedure figure that handles of the residue of the wafer W under the out-of-work situation of substrate board treatment midway that is illustrated in the process chamber.
Figure 14 is the figure of the treatment process of expression wafer, this figure (a) is the end operation figure of the out-of-work situation of substrate board treatment midway that is illustrated in the process chamber, and this figure (b) is the end operation figure that handles of the residue of the wafer W under the out-of-work situation of substrate board treatment midway that is illustrated in the process chamber.
Label declaration
100 substrate board treatments
110 processing units
120 supply units
130 conveying chambers
131 (the box platforms of 131A～131C)
132 (the box containers of 132A～132C)
133 (the gate valves of 133A～133C)
Measuring fine particles chambers 134
135 objective tables
135a wafer transducer
136 locators
138 rotatable stages
138a wafer transducer
139 optical pickocffs
140 (the process chambers of 140A～140F)
142 (the objective tables of 142A～142F)
144 (the gate valves of 144A～144F)
Common transfer chambers 150
164M, 164N join platform
165M, 165N wafer transducer
170 supply unit side conveying mechanisms
172 pedestals
173a, 173b wafer transducer
173A, 173B pick-up
174 guide rails
176 linear electric motor mechanisms
180 processing unit side conveying mechanisms
182 pedestals
183a, 183b wafer transducer
183A, 183B pick-up
184 guide rails
186 arm mechanisms
188 (the wafer transducers of 188A～188F)
189 position transducers
200 control parts
210CPU
220ROM
230RAM
240 time sets
250 display unit
260 input/output units
270 aviso devices
280 various controllers
290 storage devices
292 wafer storage information
194 processing of wafers record informations
Embodiment
Below, with reference to accompanying drawing preferred implementation of the present invention is elaborated.In this specification and accompanying drawing, to actual inscape with identical function structure, the mark prosign, and the repetitive description thereof will be omitted.
(configuration example of substrate board treatment)
At first, describe with reference to the substrate board treatment of accompanying drawing embodiments of the present invention.Fig. 1 is the figure of brief configuration of the substrate board treatment of expression embodiments of the present invention.This substrate board treatment 100 comprises: processed substrate is for example carried out a plurality of processing units 110 of various processing such as film forming processing, etch processes to semiconductor wafer (following all abbreviate as " wafer ") W, and the supply unit 120 that wafer W is sent into or taken out to this processing unit 110.
At first, the configuration example to supply unit 120 describes.As shown in Figure 1, supply unit 120 has that (132A～132C) and between the processing unit 110 sends into or take out the conveying chamber 130 of wafer at the box container 132 that substrate accommodation container is for example narrated later.Conveying chamber 130 forms the cross section and is polygonal box shape substantially.The cross section that constitutes on the conveying chamber 130 is roughly on the side on polygonal long limit, is set side by side with a plurality of box platforms 131 (131A～131C).These box platforms 131A～131C constitutes the box container 132A～132C that can place respectively as an example of substrate accommodation container.
(among the 132A～132C), for example equally spaced multilayer is placed and is contained maximum 25 wafer W, and inside becomes by N at each box container 132 2The hermetically-sealed construction that atmosphere is full of.Conveying chamber 130 constitutes can be by gate valve 133 (133A～133C) send into and take out wafer W to inside.In addition, the quantity of box platform 131 and box container 132 is not limited to situation shown in Figure 1.
On 130 1 sides of described conveying chamber, dispose measuring fine particles chamber (Particle Monitor) 134.Measuring fine particles chamber 134 has the objective table 135 of placing wafer W, constitutes and can measure the particulate loadings such as attachment that are attached on the wafer W that is placed on this objective table 135.Wherein, the structure in the measuring fine particles chamber 134 can be used well-known structure, has omitted the detailed description to this structure here.On the objective table 135 of measuring fine particles chamber 134, dispose and to detect wafer W and whether be placed on wafer transducer 135a on the objective table 135.Wafer transducer 135a for example can be made of well-known pick-up transducer (pickup sensor).
When the particulate loading of measuring on the wafer W by such measuring fine particles chamber 134, for example can send into measuring fine particles chamber 134, directly to measuring attached to the particulate loading on this wafer W by the wafer W that supply unit side conveying mechanism 170 will be wanted to measure particulate loading.According to the measurement result of this particulate loading, judge whether it is the wafer W that to handle again.
In addition, when measuring supply unit 120, common transfer chamber 150, load locking room 160M, 160N, chambers 140A～each indoor particulate loading such as 140F, can measure with wafer by being different from measuring fine particles wafer, other that carries out processing of wafers.Specifically, for example suppose in box container 132C, to have taken in the measuring fine particles wafer, measuring fine particles is temporarily delivered to the chamber that will measure particulate loading with wafer from box container 132C, wait for through official hour.Then,, make measuring fine particles turn back to measuring fine particles chamber 134 with wafer through after the stipulated time, in measuring fine particles chamber 134 to measuring with the particulate loading on the wafer attached to measuring fine particles.
The control part of narrating later 200 is connected on the measuring fine particles chamber 134, and measurement results such as the particulate loading after the measurement are sent to control part 200, for example is stored in the storage device 290 that is arranged in the control part 200 and the memory etc. as record.
In the end of described conveying chamber 130, promptly constitute on the side that the cross section is polygonal minor face substantially, be provided with as having rotatable stage 138 in inside and the peripheral position of wafer W being carried out the locator (giving the location objective table) 136 of the optical pickocff 139 of optical detection.For example detect the plane of orientation of wafer W and breach etc. and position by this locator 136.Can detect the wafer transducer 138a that on this rotatable stage 138, whether places wafer W disposing on the rotatable stage 138.Wafer transducer 138a for example is made of well-known pick-up transducer.
In described conveying chamber 130, be provided with along its length the supply unit side conveying mechanism (conveying mechanism in the conveying chamber) 170 of (direction of arrow shown in Figure 1) transfer wafers W.Fixedly the pedestal 172 of supply unit side conveying mechanism 170 is supported on the guide rail 174 that alongst is arranged in the conveying chamber 130 slidably.On this pedestal 172 and guide rail 174, be respectively arranged with the movable member and the fixed part of linear motor.Be provided with the linear electric motor mechanism 176 that is used to drive this linear motor in the end of guide rail 174.Control part 200 is connected in the linear electric motor mechanism 176.Therefore, according to the control signal from control part 200, linear electric motor mechanism 176 drives, and makes supply unit side conveying mechanism 170 move to the direction of arrow along guide rail 174 with pedestal 172.
Supply unit side conveying mechanism 170 is made of the both arms mechanism with two pick-ups (pick) 173A, 173B, can once get two wafers.Therefore, for example when box container 132, locator 136, each load locking room 160M, 160N etc. send into or take out wafer, can send into or take out in the mode of exchange wafer.On pick-up 173A, the 173B of supply unit side conveying mechanism 170, be respectively arranged with and detect wafer transducer 173a, the 173b that whether clamps wafer W.Wafer transducer 173a, 173b can for example be made of well-known pick-up transducer respectively.Wherein, the number of the pick-up of processing unit side conveying mechanism 180 is not limited to described situation, for example also can be the single armed mechanism that has only a pick-up.
Below, the configuration example of processing unit 110 is described.For example under the situation of the substrate board treatment that makes up bench-type, as shown in Figure 1, processing unit 110 constitutes around the common transfer chamber 150 that forms rectangle (for example hexagon), and air-tightness is connected with for example to be implemented film forming to wafer W and handle (for example plasma CVD processing) and etch processes (for example plasma etch process) and wait a plurality of process chambers 140 of stipulating processing (first～the 6th process chamber 140A～140F) and load locking room 160M, 160N.
Chambers 140A～140F for example implements processing of the same race or processing not of the same race to wafer W.Manage chamber 140 throughout and (be respectively arranged with the objective table 142 that is used to place wafer W (142A～142F) in the 140A～140F).Wherein, the number of process chamber 140 is not to be defined in situation shown in Figure 1.
Manage throughout among the 140A～140F of chamber, be stored in the processing of wafers information of the processing method etc. of treatment process in storage device 290 grades of control part 200 etc. according to expression in advance, manage chamber 140A～140F throughout and implement predetermined process.Processing of wafers information is different with condition because of the treatment types of wafer.Handle as on wafer W, implementing operation, for example implement the process information of the wafer under the situation of etch processes, exemplified treatment process shown in Figure 12.
Treatment process shown in Figure 12 is made of stabilizing process, etching work procedure (treatment process), end operation.Wherein so-called stabilizing process is in the follow-up etch processes operation, for wafer W is implemented etch processes, adjusts the operation of the state in the process chamber 140.In stabilizing process, for example be included in the operation that vacuumizes in the process chamber 140 that carries out after being placed on wafer W on the objective table 142; Import the operation of predetermined process gas; Plasma chemical industry preface applies the high-frequency electrical of regulation on the electrode of lower electrode of double as objective table 142 usefulness etc., carry out plasmaization, makes this plasma in stable condition.So-called etch processes operation is the operation of carrying out the etch processes of stipulated time in described plasmoid.So-called finish the operation that operation is the state in the process chamber 140 after the enforcement etch processes in the etching work procedure that is adjusted at just.Finish in the operation at this, for example comprise the terminal point operation that the etch processes in the etch processes operation that makes just now finishes at terminal point.The treatment process of so in addition wafer W is not to be defined as this concrete example.
Described common transfer chamber 150 have between described chambers 140A～140F or between chambers 140A～140F and each first, second load locking room 160M, the 160N, function that wafer W is sent into or taken out.Common transfer chamber 150 forms polygonal (for example hexagon), ((144A～144F) is connected around it chambers 140, and the front end of first, second load locking room 160M, 160N is connected around it by gate (vacuum one side gate) 154M, 154N respectively simultaneously by gate 144 respectively for 140A～140F).The bottom of first, second load locking room 160M, 160N is connected the cross section that constitutes on the conveying chamber 130 by gate (atmosphere one side gate) 162M, 162N respectively and is roughly on another side on polygonal long limit.
First, second load locking room 160M, 160N have interim preservation wafer W and after adjusting pressure, lead to the function of next stage.Handing-over platform 164M, the 164N that can place wafer W is set respectively in each first, second load locking room 160M, 160N inside.Whether this handing-over platform 164M, 164N are provided with can detect wafer W are placed on wafer transducer 165M, 165N on this handing-over platform 164M, the 164N.Wafer transducer 165M, 165N for example are made of well-known pick-up transducer respectively.
First, second load locking room 160M, 160N constitute the particulate and the vacuum exhaust that can purge residue etc.Specifically, first, second load locking room 160M, 160N are respectively arranged with gas extraction system, and the vacuum pump of dry pump etc. is connected the blast pipe that for example has vent valve (gas exhausting valve); And gas delivery system, gas importing source is connected on the have blow down valve gas introduction tube of (purge gas control valve).Such blow down valve is by control vent valve etc., carry out by import repeatedly purge gas vacuumize and to the cleaning processing and the pump-down process of atmosphere opening.
In addition, described common transfer chamber 150 and chambers 140A～140F also can constitute particulate and vacuum exhausts such as can purging residue.For example, in described common transfer chamber 150, dispose the gas delivery system of importing purge gas as described above and the gas extraction system that can vacuumize, manage throughout among the 140A～140F of chamber, dispose gas delivery system that also can import the processing gas except described purge gas and the gas extraction system that can vacuumize.
In such processing unit 110, as described above, between between common transfer chamber 150 and the chambers 140A～140F and common transfer chamber 150 and described each load locking room 160M, 160N, can constitute airtight conditions respectively with opening and closing, become compound table, can be communicated with in the common transfer chamber 150 as required.In addition, between described first, second load locking room 160M, 160N and described conveying chamber 130, also can constitute airtight conditions respectively with opening and closing.
Can bending in common transfer chamber 150, being provided with for example by structure, the processing unit side conveying mechanism (the indoor conveying mechanism of common transfer) 180 that constitutes of the multi-joint arm of lifting, rotation.This processing unit side conveying mechanism 180 is supported on the pedestal 182, can rotate freely.Pedestal 182 constitutes in bottom one side in common transfer chamber 150 on the guide rail 184 of front end one side configuration, for example can be free to slide by arm mechanism 186.If adopt the processing unit side conveying mechanism 180 that constitutes like this,, and can in each load locking room 160M, 160N and chambers 140A～140F, carry out access then by this processing unit side conveying mechanism 180 is slided along guide rail 184.
For example make processing unit side conveying mechanism 180 with each load locking room 160M, 160N and mutually in the face of process chamber 140A, the 140F of configuration when carrying out access, make processing unit side conveying mechanism 180 be positioned at bottom one side near common transfer chamber 150 along guide rail 184.In addition, when making processing unit side conveying mechanism 180 in process chamber 140B～140E, carry out access, make processing unit side conveying mechanism 180 be positioned at front end one side of close common transfer chamber 150 along guide rail 184.Therefore, utilize a processing unit side conveying mechanism 180, carry out access among whole load locking room 160M, 160N that can be on being connected common transfer chamber 150 and the chambers 140A～140F.Processing unit side conveying mechanism 180 has two pick-up 183A, 183B, can once get two wafers.Pick-up 183A, the 183B of processing unit side conveying mechanism 180 is respectively arranged with and can detects wafer transducer 183a, the 183b that whether clamps wafer W.Wafer transducer 183a, 183b can for example be made of well-known pick-up transducer respectively.
In addition, the structure of processing unit side conveying mechanism 180 is not defined as described structure, can be made of two conveying mechanisms yet.For example, can be flexible on common transfer chamber 150 is provided with by structure near bottoms one side, first conveying mechanism that constitutes of the multi-joint arm of lifting, rotation, second conveying mechanism that the multi-joint arm of flexible on common transfer chamber 150 is provided with by structure near front end one sides, lifting, rotation constitutes.In addition, the pick-up number of processing unit side conveying mechanism 180 is not defined as two situation, for example can be the conveying mechanism that a pick-up is only arranged yet.
In common transfer chamber 150, ((position, front of 144A～144F), configuration can detect wafer W and whether be admitted to or take out chambers 140 (the wafer transducer 188 of 140A～140F) (188A～188F) gate valve 144 of 140A～140F) respectively to manage chamber 140 throughout.In addition, 150 front ends, one side is provided with the position transducer 189 of the position correction that is used to carry out the wafer W of carrying by processing unit side conveying mechanism 180 in the common transfer chamber.In addition, the concrete example of the position correction of wafer W is narrated in the back.These wafer transducers 188A～188F, position transducer 189 for example are made of well-known pick-up transducer respectively.
In described substrate board treatment 100, be provided with control part 200, comprise the control of described supply unit side conveying mechanism 170, processing unit side conveying mechanism 180, each gate valve 133,144,154,162, locator 136, measuring fine particles chamber 134 etc., the action of substrate board treatment integral body is controlled.
(constituting the example of control part)
At this, describe with reference to the example of accompanying drawing to the concrete structure of described control part 200.Fig. 2 is the block diagram of example of the concrete structure of expression control part 200.As shown in Figure 2, control part 200 comprises: the CPU (central processing unit) 210 that constitutes the control part main body, deposit the ROM (read-only memory) 220 of the routine data that is used for CPU210 control each several part (for example the processing of wafer W and the recovery narrated later handle routine data) etc. in, be provided for the RAM (random asccess memory) 230 of the memory block etc. of the various data processing that CPU210 carries out, the time set 240 that constitutes with the counter of timing etc., with display-operation picture and the display unit 250 of selecting the LCD etc. of picture etc. to constitute, can import with the input of edit operation personnel's various data such as processing method with to the storage medium output processing method of regulation with handle the input/output unit 260 of various data outputs such as record, produce the aviso device 270 of the alarm (for example buzzer) etc. of circular when unusual such as electric leakage at substrate board treatment 100, the various controllers 280 that are used for the each several part of control basal plate processing unit 100, and the storage device 290 of hard disk (HDD) etc.
Bus by control bus, system busbar, data bus etc. is electrically connected with described CPU210, ROM220, RAM230, time set 240, display unit 250, input/output unit 260, aviso device 270, various controller 280, storage device 290.
In described storage device 290, for example (132A～132C) accommodates the processing of wafer storage information 292, each wafer W of each wafer W etc. to the processing of wafers record information (for example handling record) 294 in what stage etc. to box container 132 in storage.
At this, the concrete example of described wafer storage information 292 is described with reference to Fig. 3.As shown in Figure 3, wafer storage information 292 comprises the project of Container Name, serial number, wafer ID, wafer storage situation, recovery processing, processing of wafers situation etc.The project of Container Name is used to specify box container.Wafer storage information 292 is to be used for storing at each box container.If substrate board treatment 100 for example shown in Figure 1 is then represented the classification of box container 132A～132C.
The project of serial number is to be used to specify the project that a piece is accommodated the wafer storage layer in the box container 132 of wafer W.For example, can accommodate under the situation of 25 wafer W in a box container 132, serial number is 1～25.The project of wafer ID is the project of wafer ID that is used for representing the wafer W of each batch in the accepting box container 132.Wherein said wafer ID is the ID that is given by operating personnel before wafer W is handled, for example before processing to the wafer W in the accepting box container 132, operating personnel set by the operation of stipulating with input/output unit 260.The project of wafer storage situation is the whether project of the wafer storage layer of accepting box container 132 of expression wafer W.In example shown in Figure 3, the situation of " having " represents to accommodate wafer W, and the situation of " nothing " represents not accommodate wafer W.
The project of restore handling is whether each wafer W of being used to represent box container 132 is the project of the wafer W handled of the recovery of having carried out narrating later.Wherein, it is for example to produce at substrate board treatment 100 under the unusual and out-of-work situation such as electric leakages that said recovery is handled, and makes the processing of the state restoration of substrate board treatment 100 after the unusual releasing.In example shown in Figure 3, the situation of " having " is that expression has been carried out restoring the wafer W of handling, and the situation of " nothing " is to represent not restore the wafer W of processing.The project of processing of wafers situation be the present treatment situation that is used to represent each wafer W of box container 132 (processing stage) project.In example shown in Figure 3, " finishing dealing with " expression wafer W necessary processing is all finished, and " not handling " expression wafer W necessary processing is not carried out fully.In addition, " restore in the processing " expression and restoring processing now.
If adopt such wafer storage information 292, then except wafer W to the situation of accommodating of accepting box container 132, can also grasp have or not restore handle, the treatment situation of wafer W.In addition, if will such wafer storage information 292 by the operation of operating personnel by input/output unit 260, demonstration on display unit 250, then operating personnel also can see these wafer storage information.In this case as shown in Figure 3, carried out restoring the wafer W of handling and represented, wherein also can represent with dark oblique line for the wafer W of restoring in handling with oblique line.Can easily judge whether it is the wafer W of restore handling like this, for example in the inspection of after this wafer W etc., can effectively utilize.
In addition, wafer storage information 292 is not limited to project shown in Figure 3, also can increase item number, in addition, if at least separately with regard to the wafer storage situation, the then necessary project of restoring processing, processing of wafers situation that is provided with.
Below with reference to Fig. 4 the concrete example of described processing of wafers record information 294 is described.As shown in Figure 4, processing of wafers record information 294 comprise Container Name, serial number, wafer ID, handle numbering, wafer the processing stage, elapsed time etc. project.Projects of Container Name, serial label, wafer ID are respectively with shown in Figure 3 identical, so omitted detailed explanation.
The project of handling numbering be used to represent with wafer W implement the processing stage give the project of numbering.The project in processing of wafers stage be used to represent wafer W implements each the processing stage project.The project in elapsed time is the project of the temporal information be used to represent each processing stage.In example shown in Figure 4, the time (OUT) of for example representing the processing time started (STARTTIME) of wafer W, sending into the time (IN) of wafer W, wafer W is taken out to each chamber from each chamber.In addition, the processing stage the work of substrate board treatment midway 100 situation about stopping under, expression dwell time (STOPTIME).In example shown in Figure 4, as can be seen the etching work procedure of the first process chamber 140A midway, the situation that the work of substrate board treatment 100 stops.
In addition, such processing of wafers record information 294 according to for example be arranged on wafer transducer 135a, 138a, 165M, 165N, the 188A～188F in each chamber and be arranged on the processing of wafers information of the check result, processing method etc. of the wafer W of wafer transducer 173a in each conveying mechanism 170,180,173b, 183a, 183b, the timing time of time set 240 waits to determine.For example wafer W was determined according to the time that wafer transducer 138a detects wafer W to the time that locator 136 is sent into or taken out.In addition, wafer W was determined according to the time that detects wafer W with wafer transducer 165M, 165N to the time that load locking room 160M, 160N send into or take out.Wafer W was determined according to the time that detects wafer W with wafer transducer 188A～188F to the time that first～the 6th process chamber 140A～140F sends into or takes out.
If adopt such processing of wafers record information 294, then except wafer W the locating information of (delay) which chamber, temporal information relevant the processing stage, can also grasp the wafer W when the work of substrate board treatment 100 stops locating information and the processing stage information.In addition, about restore to handle the processing stage also by being added in processing of wafers record information 294, handle the processing stage which being implemented into and can grasp to restore.
In addition, the operation as if passing through by operating personnel's input/output unit 260 shows such processing of wafers record information 294 on display unit 250, and then operating personnel also can see these processing of wafers record informations 294.In addition, processing of wafers record information 294 is not limited to project shown in Figure 4.
Except described such wafer storage information 292, processing of wafers record information 292, make substrate board treatment 100 work handle needed information etc. and be stored in the storage device 290 wafer.For example be stored in the measurement result of measuring fine particles chamber 134 measuring particulate measurement results information, (the processing of wafers information that 140A～140F) handles the processing method of wafer W needs etc. also is stored in storage device 290 to be used for managing throughout chamber 140.The CPU210 of control part 200 is controlled at the processing of chambers 140A～140F to wafer W according to the processing of wafers information that is stored in the storage device 290.
(action of substrate board treatment)
Below, the action of the substrate board treatment that constitutes is as described above described.Substrate board treatment 100 is according to the program work of the CPU210 of control part 200 as described above, is made into processing of wafers record information (for example processing method) 294 processing stage of each of each wafer W, is stored in the storage device 290.
For example, utilize the some wafer W that transport of supply unit side conveying mechanism 170 from box container 132A～132C to be transported to locator 136, transfer to the rotation objective table 138 of locator 136, be positioned at this.The wafer W that is positioned is sent from locator 136, sends in load locking room 160M or the 160N.At this moment, if the completed end process wafer W of necessary whole processing then after the wafer W that taking-up is handled, is sent into untreated wafer W at load locking room 160M or 160N.
Send into the wafer W of load locking room 160M or 160N, take out from load locking room 160M or 160N, this wafer W is sent into the process chamber 140 of processing and implemented predetermined process by processing unit side conveying mechanism 180.Then, the wafer W of finishing after the processing of the processing of process chamber 140 is taken out from process chamber 140 by processing unit side conveying mechanism 180.In this case, need continuously under the situation that a plurality of process chambers 140 are handled, this wafer W be sent into other process chamber 140 that carries out next processing, be implemented in the processing of this process chamber 140 in this wafer W.
The wafer of having finished like this after the processing that all need handle turns back to load locking room 160M or 160N.The wafer W that turns back to after the processing of load locking room 160M or 160N turns back to original box container 132A～132C by supply unit side conveying mechanism 170.
And for the efficient of the processing that improves chambers 140, wish to make as close as possible process chamber 140 standbies of wafer W, so, during the handling of process chamber 140, also will be sequentially take out wafer W from box container 132, make these wafer W in common transfer chamber 150, load locking room 160M or standbies such as 160N, locator 136.Processing as if finish a wafer W at process chamber 140 then directly turns back to original box container 132, with the wafer W batch transportation in described each standby, directly sends into process chamber 140 in next piece wafer W of common transfer chamber 150 standbies.
In the work of such substrate board treatment 100, if produce the unusual of fault, power failure, electric leakage etc. in the substrate board treatment 100, then substrate board treatment 100 for example quits work with regard to outage.If the work of substrate board treatment 100 stops, then the processing of wafers of for example handling in chambers 140A～140F is interrupted halfway, intactly is trapped in process chamber 140A～140F.In addition, in supply unit 120 in (for example in the conveying chamber 130, in the locator 136, in the measuring fine particles chamber 134) and the processing unit 110 in (for example in the common transfer chamber 150, in load locking room 160M, the 160N) etc. the wafer W of standby be trapped in intactly that each is indoor.
In the substrate board treatment 100 of present embodiment, as described like that because of producing under the situation that the work that makes substrate board treatment 100 unusually stops, after this unusual releasing,, handle with regard to the recovery that the following describes automatically if make substrate board treatment 100 drop into power supply again.
(restore and handle)
At this, the recovery of substrate board treatment 100 handled describing.The CPU210 of the recovery processing and utilizing control part 200 of substrate board treatment 100 implements according to the program that is stored in ROM220 or the storage device 290 etc.
The recovery of present embodiment is handled and can mainly be divided into: substrate recycling (substrate recovery process), the wafer that wafer W is stipulated is saved processing (substrate is saved and handled), and reclaim as box container 132; The device internal state is restored and is handled (cuttling of device internal state), restores each indoor state of substrate board treatment 100.Below, respectively separately processing is described.
(restoring the substrate recycling in handling)
At first, recycling describes to substrate.In the substrate recycling, to the wafer W in each chamber that is trapped in substrate board treatment 100, the processing stage that when stopping (following also simply be called work) being implemented when stopping corresponding to the work up to substrate board treatment 100, save processing (substrate is saved and handled) accordingly, this wafer W is turned back to the box container 132 of carrying initial point.For example to the wafer W in the substrate board treatment 100, the chamber that wafer W is detained when stopping corresponding to work is saved processing accordingly.If from the viewpoint of overall situation, then according to the chamber difference of wafer W delay, it is different stopping to handle such processing of wafers stage in which stage for this wafer W up to work.The wafer W that for example are trapped in the supply unit 120 are to take out from box container 132, then will to processing unit carry do not have the processing stage, or finished the processing of whole needs, from finishing dealing with the stage that processing unit 110 returns.In contrast, be trapped in wafer W in the common transfer chamber 150 except being the wafer and the wafer in the stage of finishing dealing with do not have the processing stage, also having is the possibility of also being left not finish in the processing of the processing of other process chamber the wafer in stage.Therefore, save processing accordingly by the chamber of being detained corresponding to wafer W like this, can corresponding to wafer W the processing stage carry out appropriate redemption and handle.
Save processing as such wafer, the wafer W that for example is trapped in the supply unit 120 (for example in the conveying chamber 130, in the locator 136, in the measuring fine particles chamber 134 etc.) carries the box container 132 of initial point also no problem owing to can think to handle the wafer W of finishing dealing with of untreated wafer W of also not carrying out fully or the processing of having finished whole needs so these wafer W are directly returned.Therefore, be on the wafer W substrate in such supply unit 120 and intactly turn back in the box container 132 of carrying initial point.
In contrast, the wafer W that is trapped in the processing unit 110 (for example in chambers 140A～140F, the common transfer chamber 150, in load locking room 160M, the 160N) is except being the wafer and the wafer in the stage of finishing dealing with do not have the processing stage, and also having is the possibility of also remaining wafer do not have the processing stage.For example in process chamber 140, for example have in the interrupted midway processing of processing of etching work procedure etc. the wafer W in stage (the handling wafer midway) possibility of under this state, being detained midway.In addition, in common transfer chamber 150, be will be in the wafer W of the processing of a plurality of process chambers 140, also existing to be detained has the processing of being left at other process chamber, the processing of also all not handling not to finish the possibility of the wafer W in stage (handling the wafer of not finishing).For example hypothesis has needs the continuous wafer of handling at first～the 6th process chamber 140A～140F, have for this wafer W and finished processing at first～the 5th process chamber 140A～140E, take out from process chamber 140E, in common transfer chamber 150, wait under the state of the processing of remaining the 6th process chamber 140F the situation that substrate board treatment 100 work stop.
If suppose that the wafer W of not finishing for such processing wafer W midway and processing is also same as described above, directly be recovered in the box container 132, then just become sometimes and can not save these wafer W.For example as process processing of cluster etc., because of interrupted processing halfway, if be recycled in the original box container 132, then be exposed in the atmosphere owing to this wafer W, and can not carry out remaining processing (for example remaining etch processes etc.) to this wafer W, save wafer itself sometimes and become impossible.Therefore, for implementing remaining processing on such wafer W substrate in processing unit 110, be recovered to again after finishing dealing with in the box container 132 of carrying initial point.
Wafer W is carried out the situation of remaining processing and will implement stabilizing process earlier, adjust the state in the process chamber 140.For example the wafer W of process chamber 140 is being carried out under the situation of remaining etch processes, carried out the pump-down process in the process chamber 140 after, vacuumize, make the pressure of pressure in the process chamber 140 for stipulating, again import and handle gas, apply high-frequency electrical, recover plasma.As having that the pump-down process of process chamber 140 can exemplify: for example import N 2The purge gas of gas and inert gas etc. to atmosphere opening, makes this to atmosphere opening with vacuumize repeatedly the cycle purge etc. of the number of times of regulation.For example under the situation of handling gas use corrosive gas (for example chlorine, hydrogen chloride etc.), can import N 2The cycle purge of the diluent gas of gas etc. is implemented as sour pump-down process.
Like this, in the present embodiment, under the situation that causes the work of substrate board treatment to stop because of electric leakage etc. unusually, by carrying out having the redemption of each chamber of the substrate board treatment 100 of wafer W to handle corresponding to delay, can corresponding to wafer W the processing stage, save processing accordingly, so can correctly save wafer W.Carry out the situation that described redemption handles each chamber order preferably from, be near carrying and initial point begin with chamber wafer W container 132, implement substrate and save and handle.The order of supply unit 120, load locking room 160, common transfer chamber 150, process chamber 140 preferably for example.Owing to can carry out the recovery of wafer W smoothly, handle like this so can realize effective the recovery.
In addition, carrying out under the situation that substrate save to handle, needing to detect in each chamber the inside of (for example supply unit 120, load locking room 160, common transfer chamber 150, process chamber 140) and whether be detained wafer W is arranged.As such chip detection method, can be according to the processing of wafers stage of being stored in the processing of wafers record information 294 for example shown in Figure 4, which chamber in the detection processing unit 110, in the supply unit 120 are detained wafer W.
In addition, also can in the measuring fine particles chamber 134 of supply unit 120, locator 136, conveying chamber 130, detect wafer W according to wafer transducer 135a, the 138a of each chamber, transducer 173a, the 173b of supply unit side conveying mechanism 170.In addition, in each load locking room 160M, 160N of processing unit 110, common transfer chamber 150, detect wafer W according to wafer transducer 165M, the 165N of each chamber, wafer transducer 183a, the 183b of processing unit side conveying mechanism 180.
And in addition, also can utilize supply unit side conveying mechanism 170 and processing unit side conveying mechanism 180, whether the action of sending into or taking out by wafer W detects to be detained wafer W.For example in process chamber 140A～140F, utilize processing unit side conveying mechanism 180, the action of sending into or taking out by wafer W, whether according to corresponding to the wafer transducer 188A～188F of the common transfer chamber of each chamber and wafer transducer 183a, the 183b of processing unit side conveying mechanism 180, detecting to be detained in process chamber 140A～140F has wafer W.
(the device internal state of restoring in handling is restored processing)
Below, the device internal state in the described recovery processing is restored processing describe.The device internal state here restores that to handle be for example to handle by cleaning is implemented in each chamber in the supply unit 120, in the common transfer chamber 150, in load locking room 160M, the 160N, in chambers 140A～140F etc., and each indoor recovery that becomes the processing that can implement wafer W is handled.Handle as cleaning, for example import N each chamber 2The purge gas of gas etc. makes the cleaning processing (for example NPPC:Non-PlasmaParticle Cleaning) that vacuumizes and repeat stipulated number to atmosphere opening.When in this cleaning is handled, being not only, when vacuumizing, also continue to import purge gas to atmosphere opening.As the processing of the cleaning adopting, then can remove at each indoor floating particulate (for example attachment, dust, waste residue etc.).In addition, by vacuumizing repeatedly and, also peel off, force floatingly, also they can be removed attached to the particulate on the wall of each chamber and each indoor institute configured parts etc. to atmosphere opening.
In addition, handle, be not limited to described method, can carry out well-known cleaning and handle as the cleaning of each chamber of substrate board treatment 100.For example can use the cleaning that utilizes plasma to handle.
(restoring the concrete example of handling)
Below, exemplify concrete example recovery processing as described above is illustrated in greater detail.Fig. 5 is the flow chart of the main program of the concrete example handled of the recovery of the substrate board treatment of expression present embodiment.
In recovery shown in Figure 5 is handled, recycle as substrate, at first carry out saving processing (substrate is saved and handled), the wafer W that is trapped in each chamber is recovered in the box container 132 of carrying initial point corresponding to the wafer of each chamber of being detained wafer W in S110～S150 step and S200～S500 step.Just save as substrate in the supply unit and handle, judging in the S110 step has in supply unit 120 under the situation of wafer W, and the wafer that carries out in the S200 step in the supply unit 120 is saved processing.In addition, save processing as substrate in the processing unit, judging in the S120 step has under the situation of wafer W in load locking room 160, the wafer that carries out in the S300 step in the load locking room 160 is saved processing (the indoor substrate of load-lock is saved and handled), judging in the S130 step has under the situation of wafer W in common transfer chamber 150, the wafer that carries out in the S400 step in the common transfer chamber 150 is saved processing (the indoor substrate of common transfer is saved and handled), judging in the S140 step has in process chamber 140 under the situation of wafer W, and the wafer that carries out in the S500 step in the process chamber 140 is saved processing (substrate is saved and handled in the process chamber).Below, these wafers are saved the concrete example of handling describe.
(wafer in the supply unit is saved and is handled)
At first, with reference to Fig. 6 the wafer in the supply unit being saved the concrete example of handling (S200 step) describes.Fig. 6 is the flow chart that the wafer in the expression supply unit is saved the subprogram of handling.As the wafer W in the supply unit 120, for example except the wafer W of in conveying chamber 130, being detained with the state that is clamped on the supply unit side conveying mechanism 170, consider to be trapped in the locator 136 and the wafer W in the measuring fine particles chamber 134, so these wafer W become the object that the redemption in the supply unit 120 is handled.
During wafer in supply unit shown in Figure 6 was saved and handled, the wafer W that at first will be trapped in the S210 step in the supply unit 120 was for example sent into measuring fine particles chamber 134 with supply unit side conveying mechanism 170.At this moment, for the wafer W in conveying chamber 130, just, directly send into measuring fine particles chamber 134 for the wafer W on the pick-up of supply unit side conveying mechanism 170.For the wafer W in locator 136, take out from locator 136 with supply unit side conveying mechanism 170, send into measuring fine particles chamber 134.In this case, be detained in measuring fine particles chamber 134 under the situation of wafer W, to behind this wafer W enforcement measuring fine particles, this wafer W turned back in the box container 132 of carrying initial point earlier.
Then, in the S220 step, measure and sending into the particulate loading (measuring fine particles) that adheres on the wafer W of measuring fine particles chamber 134, in the S230 step, the result of this measurement is for example stored in the storage device 290 of control part 200 as the particulate measurement results recording of information.Then, in the S240 step, with wafer W 134 taking-ups, turn back in the box container 132 of carrying initial point from the measuring fine particles chamber with supply unit side conveying mechanism 170.In case the wafer of finishing in so a series of supply units 120 is saved processing, turns back to main program shown in Figure 5.
If adopt the wafer in such supply unit 120 to save processing, the whole wafer W that then are trapped in the supply unit 120 are being carried out behind the measuring fine particles, are recycled in the box container 132 of carrying initial point.Do like this is because be trapped in the supply unit 120 as the hypothesis wafer W, such wafer W the processing stage be being untreated the stage of also not handling, or it is all finished finishing dealing with the stage of processing, so also no problem even these wafer W directly reclaim.Therefore, wafer in supply unit 120 is present in the supply unit 120 as long as detect in saving and handling, just know wafer W the processing stage, so necessary for example from processing of wafers record information 294 detect wafer W the processing stage.
In addition, be trapped in wafer W in the supply unit 120 in being recovered to box container 132 before, carry out measuring fine particles, its result is stored in the record etc.Therefore according to the measurement result of particulate loading, can judge whether the wafer W that is recycled in the box container 132 can be handled again.
(the indoor wafer of load-lock is saved and is handled)
Below, with reference to Fig. 7 the wafer in the load locking room 160 is saved the concrete example of handling (S300 step) and describe.Fig. 7 is the flow chart that the wafer in the expression load locking room 160 is saved the subprogram of handling.In substrate board treatment shown in Figure 1 100, because two load locking room 160M, 160N are arranged, the processing shown in Figure 7 that is used on such substrate board treatment 100 represents that wafer W is trapped in the processing of the load locking room 160 of these load locking rooms 160M, 160N.
Save at the indoor wafer of load-lock shown in Figure 7 and to handle, at first, in the S310 step, it is motionless that wafer W is placed on load locking room 160, carries out the pump-down process in the load locking room 160.As pump-down process, for example gas extraction system of control load lock chamber 160 and gas delivery system make to vacuumize and repeat stipulated number to atmosphere opening simultaneously, carry out importing to atmosphere opening the time purge gas (N for example 2Gas) described cycle purge.
Then, in the S320 step, the wafer W that will be positioned at load locking room 160 is sent into measuring fine particles chamber 134 with supply unit side conveying mechanism 170.Specifically, carry out load locking room 160 after the pressure of atmosphere opening etc. is adjusted, by supply unit side conveying mechanism 170 this wafer W being taken out, and sending into measuring fine particles chamber 134.After this, in the S330 step, carry out measuring fine particles, in the S340 step, its measurement result is for example stored in the record etc.After this, in the S350 step, with wafer W 134 taking-ups, turn back in the box container 132 of carrying initial point from the measuring fine particles chamber by supply unit side conveying mechanism 170.If the wafer of finishing in so a series of load locking rooms 160 is saved processing, then turn back to main program shown in Figure 5.
Handle if adopt wafers in such load locking room 160 to save, the whole wafer W that then are trapped in the load locking room 160 are identical with wafer W in the supply unit 120, carry out measuring fine particles after, be recycled in the box container 132 of conveying initial point.Doing like this is because the hypothesis wafer W is trapped in the load locking room 160, then this wafer W the processing stage identical with the interior wafer W of supply unit 120, be do not have the processing stage or the stage of finishing dealing with, so also no problem even these wafer W directly reclaim.
But, before taking out wafer W, carry out the pump-down process (for example cycle purge) of load locking room 160 from load locking room 160.This is owing to worry in load locking room 160, from the processing gas residue of process chamber 140 on wafer W.In addition, also worry to vacuumize midway at load locking room 160, under the situation that the work of substrate board treatment 100 stops, waste residue and dust are from exhaust one side adverse current.By carrying out the pump-down process of load locking room 160, can remove these residual processing gases, waste residue, dust etc.In addition, use corrosive gas (for example chlorine, hydrogen chloride etc.) to carry out also described pump-down process to be carried out as the sour pump-down process in the load locking room 160 under the situation of processing of wafer W as handling gas.Therefore, owing to can prevent that corrosive gas from flowing to supply unit 120 1 sides, so can prevent the corrosion of the component parts of supply unit 120 and supply unit side conveying mechanism 170 etc.
(the indoor wafer of common transfer is saved and is handled)
Below, with reference to Fig. 8 the wafer in the common transfer chamber 150 is saved the concrete example of handling (in the S400 step) and describe.Fig. 8 represents the flow chart of the subprogram that the wafer redemption in the common transfer chamber 150 is handled.In common transfer chamber 150, except the untreated wafer W that what process chamber 140 in office is not also handled, might exist in the wafer W of being detained in the more than one process chamber 140 after the processing of having finished processing.In addition, in the wafer W after described processing, be not only the wafer of finishing dealing with of in whole process chambers 140 of needs, finishing processing, and also have to need continuously wafer W in the processing of a plurality of process chambers 140, also be included in the wafer W that processing that the processing of other process chamber 140 also do not finish is not finished.Therefore, during wafer in common transfer chamber 150 is saved and is handled, detects such wafer W the processing stage, carry out corresponding wafer processing stage of corresponding to it and save processing.
Save in the processing at the indoor wafer of common transfer shown in Figure 8, at first, in the S410 step, judge whether the wafer W that are in the common transfer chamber 150 are to handle the wafer W of not finishing.Specifically, for example by processing of wafers record information shown in Figure 4 294 detect the wafer W that is positioned at common transfer chamber 150 the processing stage, judge this wafer W the processing stage whether be to handle the stage of not finishing.For example be need be in the wafer W of the processing among the first process chamber 140A and the second process chamber 140B, the processing of wafers stage of this wafer W for example is under the situation about stopping in common transfer chamber 150 after the finishing dealing with of the first process chamber 140A, owing to also do not implement the processing among the second process chamber 140B, be to handle the stage of not finishing so can judge this wafer W.
In described S410 step, judge that the wafer W that is positioned at common transfer chamber 150 is to handle under the situation of the wafer W of not finishing, after the wafer W of in the S420 step processing not being finished is handled, enter the processing in the S430 step.Wherein, the processing of the wafer W that the processing in the S420 step is not finished is described in detail in the back.In addition, in the S410 step, judge that the wafer W that is positioned at common transfer chamber 150 is not to handle under the situation of the wafer W of not finishing, just judge it is under the situation of wafer W of not handling or the wafer W of finishing dealing with, enter the processing of S430 step.
In the S430 step, the described wafer W of not handling or the wafer W of finishing dealing with are for example sent into load locking room 160M or 160N with handling cell side conveying mechanism 180, in this load locking room 160M or 160N, implement described such pump-down process, for example implement described such cycle purge.In the said here wafer W of finishing dealing with, except because of substrate board treatment 100 cause work to stop unusually the time when beginning (or the restore handle) wafer of finishing dealing with, also comprise implement to restore handle to after the processing (S420 step) of handling the wafer W of not finishing, become the wafer of the wafer W of finishing dealing with.
Continue, in the S440 step, this wafer W is sent into measuring fine particles chamber 134 with supply unit side conveying mechanism 170.Specifically, carry out load locking room 160M or 160N after the pressure of atmosphere opening etc. is adjusted, this wafer W being taken out, send into measuring fine particles chamber 134 with supply unit side conveying mechanism 170.Then, in the S450 step, carry out measuring fine particles, in the S460 step, its measurement result is for example stored in record etc.After this, in the S470 step, use supply unit side conveying mechanism 170, turn back to the box container 132 of carrying initial point 134 taking-ups of this wafer W from the measuring fine particles chamber.Like this, if the wafer of finishing in a series of common transfer chamber 150 is saved processing, then turn back to main program shown in Figure 5.
(to handling the processing of uncompleted wafer)
At this, the concrete example of the processing of the wafer W of the processing in the S420 step shown in Figure 8 not being finished with reference to Fig. 9 describes.Fig. 9 is expression to the flow chart of the subprogram of the processing of handling the wafer W do not finish.
In the processing of the wafer W that processing shown in Figure 9 is not finished, at first, judge in the S421 step whether the process chamber 140 will handle the conveying destination that after this wafer W do not finished will be transported to is in the processing on the way of other wafer W.Judge to carry whether the process chamber 140 of destination is in the processing way of other wafer W, for example by with processing of wafers record information shown in Figure 4 294 detections described other wafer W the processing stage judge.The process chamber 140 of judging described conveying destination in the S421 step is under the situation about handling in the way, till standby carries the processing of other wafer W in the process chamber 140 of destination to finish to this in the S422 step, turns back to program shown in Figure 8.After the processing of other wafer W in the process chamber 140 of conveying destination finishes, handle the processing of the wafer W of not finishing.Specifically, in the case, owing to just handle the wafer W do not finish and be in common transfer chamber 150 state in standby, when returning Fig. 5 to main program after the EP (end of program) of Fig. 8, in the S150 step since the wafer W in carrying also be not recovered, so implement the processing of S400 again, just implement subprogram shown in Figure 9 again.At this moment, if the processing of other wafer W in carrying the process chamber of destination finishes,, just carry out in common transfer chamber 150 processing of the wafer W do not finished in the processing of standby then by in the later processing of S423 step.
On the other hand, the process chamber 140 of judging described conveying destination in the S421 step is not under the situation about handling in the way, and controlled processing unit side conveying mechanism 180 in the S423 step carries out position correction to handling the wafer W of not finishing.This is because in the conveying action of processing unit side conveying mechanism 180, under the situation that the work that makes substrate board treatment 100 stops, carry the processing unit side conveying mechanism 180 in the action also promptly to stop, having the situation that makes the position deviation of the wafer on the pick-up that is clamped in processing unit side conveying mechanism 180 because of inertia force etc. sometimes.If under the state of the position deviation of wafer W, send into process chamber 140 like this, owing to the objective table of worrying for example to be tangled by gate valve 144 or depart from process chamber 140 142 is placed, so, before sending into process chamber 140, carry out the position correction of wafer W in order to prevent the position deviation of such wafer W.
The correction of the position of this wafer W for example utilizes the position transducer 189 that is arranged on the common transfer chamber 150 to carry out as following.The state that just remains on holding chip W on the pick-up is delivered to processing unit side conveying mechanism 180 on the position transducer 189, detects the bias of this wafer W by position transducer 189.According to position transducer 189 detected biases, the pickup position of processing unit side conveying mechanism 180 is moved adjust, by carrying out the position correction of wafer W like this.
Then, in the S424 step, will send into the process chamber of handling next time 140 through the wafer W that the processing of position correction is not finished with handling cell side conveying mechanism 180.Subsequently, in the S425 step, in the process chamber 140 of carrying the destination, handle the processing of the wafer W of not finishing.
After this, in the S426 step, judge whether to finish whole processing.If the wafer W that need handle in a plurality of process chambers 140 judges whether that the processing of managing throughout in the chamber 140 is all over, whether whole processing of this wafer W are finished.Under the situation that the whole processing of judgement is not finished in the S426 step, turn back to the processing in the S424 step, carry out remaining processing.In addition, judge that in the S426 step processing of the wafer that a series of processing is not finished finishes, and turns back to program shown in Figure 8 under the situation of all finishing dealing with.
Save processing if adopt the wafer in such common transfer chamber 150, wafer W in being in common transfer chamber 150 the processing stage be under the situation in stage of finishing dealing with, after carrying out the pump-down process and measuring fine particles in load locking room 160, be recovered to the box container 132 of carrying initial point.In contrast, the wafer W in being in common transfer chamber 150 the processing stage be to handle under the situation in the stage of not finishing, carry out the processing in the process chamber of needs, up to whole finishing dealing with, be recovered to the box container 132 of carrying initial point then.Thereby, for example,, be not exposed in the atmosphere so handle the wafer W of not finishing owing to be not directly to be recovered to the box container 132 that is in atmospheric condition for handling the wafer W of not finishing, can prevent that situation about can not save from taking place.Like this, by corresponding to wafer W the processing stage carry out correct redemption and handle, can save processed substrate as much as possible.
(wafer in the process chamber is saved and is handled)
Below, save the concrete example of handling with reference to the wafer in 10 pairs of process chambers of accompanying drawing 140 and describe.Figure 10 is the flow chart that the wafer in the expression process chamber 140 is saved the subprogram of handling.In substrate board treatment shown in Figure 1 100, owing to have six process chamber 140A～140F, so be applicable to the processing shown in Figure 10 of such substrate board treatment 100, the expression wafer W is trapped in the processing of the process chamber 140 among these process chambers 140A～140F.
In addition, do not begin also in sending into this process chamber 140 in process chamber 140 that the untreated wafer W handled or the processing in this process chamber 140 are all over that the back not have to take out and the wafer W (comprising wafer W that processing is not finished and the wafer W of finishing dealing with) after the processing of being detained, also have processing at this process chamber 140 to begin and the situation of the processing of handling interrupt wafer W delay midway halfway.In addition, even handle wafer W midway, according in this process chamber 140 the processing stage in which the processing stage (in the stabilizing process for example described later, in the etching work procedure, finish operation medium) stop interrupted difference because of substrate board treatment 100 work, its save handle also different.Therefore, during wafer in process chamber 140 is saved and is handled, also comprise with wafer W in such process chamber the processing stage the corresponding redemption of processing handle.
During wafer in process chamber shown in Figure 10 140 is saved and handled, at first, judge in the S510 step whether the wafer W that is positioned at process chamber 140 is the wafer W of handling midway.Specifically, the wafer W of for example utilizing processing of wafers record information shown in Figure 4 294 to detect to be positioned at process chamber 140 the processing stage, judge this wafer W the processing stage whether be the stage of handling midway.For example, adopt processing of wafers record information 294 shown in Figure 4, the wafer W of wafer ID132A-22 is because in the processing way of the etching work procedure of the first process chamber 140A, substrate board treatment 100 quits work, and can judge the stage of handling midway.
Judge that in described S510 step the wafer W that is positioned at process chamber 140 is to handle under the situation of wafer W midway, in the S520 step, carry out entering the processing in the S530 step after the processing of handling wafer W midway.In addition, the detailed processing of wafer W to handling midway in the S520 step is narrated in the back.In addition, judge that in the S510 step wafer W be positioned at process chamber 140 is not to handle under the situation of wafer W midway, for example judgement is under the situation of untreated wafer W or the wafer W handled, directly enters the S530 step.
In the S530 step, judge whether the wafer W in process chamber 140 is to handle the wafer W of not finishing.The wafer W that said here processing is not finished, except because of substrate board treatment 100 cause work to stop unusually the time when beginning (or restore handle) handle the wafer W do not finished, even the processing to handling wafer W midway that also is included in the S520 step is implemented, the wafer W that need not finish in the processing of the processing in other process chamber 140 also.
Judge that in described S530 step the wafer W that is positioned at process chamber 140 is to handle under the situation of the wafer W of not finishing, in the S540 step, carry out entering the processing in the S550 step after the processing of handling the wafer W of not finishing.In addition, identical with the processing in the S420 step shown in Figure 8 in the S540 step to the processing of handling the wafer W do not finish, its concrete example is with shown in Figure 9 identical.In addition, judge that in the S530 step wafer W be positioned at process chamber 140 is not to handle under the situation of the wafer W of not finishing, judgement just is under the situation of untreated wafer W or the wafer W handled, enters the processing in the S550 step.
In the S550 step, for example untreated wafer W or the wafer W handled are sent into load locking room 160M or 160N by processing unit side conveying mechanism 180, in this load locking room 160M or 160N, implement described pump-down process, for example implement cycle purge.Said here wafer W of finishing dealing with, the wafer W that (when perhaps restoring the processing beginning) finishes dealing with when stopping except the work that causes unusually because of substrate board treatment 100, also comprise being implemented in the S540 step to becoming the wafer W of finishing dealing with after the processing of handling the wafer W of not finishing.
Then, in the S560 step, this wafer W is sent into measuring fine particles chamber 134 with supply unit side conveying mechanism 170.Specifically, carry out load locking room 160M or 160N after the pressure of atmosphere opening etc. is adjusted, this wafer W being taken out, send into measuring fine particles chamber 134 with supply unit side conveying mechanism 170.After this, in the S570 step, carry out measuring fine particles, for example in the S580 step, its measurement result stored in the record etc.After this, in the S590 step, use supply unit side conveying mechanism 170, turn back in the box container 132 of carrying initial point wafer W 134 taking-ups from the measuring fine particles chamber.If the wafer of finishing in so a series of process chambers 140 is saved processing, then turn back to main program shown in Figure 5.
(to handling the processing of wafer midway)
At this, the concrete example of the processing of the processing wafer W midway in the S520 step shown in Figure 10 is described with reference to Figure 11.Figure 11 is the flow chart of expression to the subprogram of the processing of processing wafer W midway.Shown in Figure 11 to the processing of handling wafer midway be carry out corresponding to because of substrate board treatment 100 cause work to stop unusually the time the interrupted processing of wafers stage redemption handle.The processing of general wafer W in process chamber 140 is just passed through a plurality of treatment process (processing method) stage by stage and is carried out, so by corresponding to interrupting carrying out remaining processing in the stage of which treatment process, can carry out corresponding to wafer W the processing stage suitable wafer save and handle.
Treatment process (handling procedure method) in the wafer W of described process chamber 140 is different with condition etc. because of the kind of the processing of wafer W, here, and the stabilizing process T shown in Figure 12～Figure 14 represents to pass through S, etching work procedure T P, finish operation T ECarry out the concrete example of the situation of etch processes.T among Figure 12～Figure 14 S, T P, T EThe time of representing stabilizing process, etching work procedure, end operation needs respectively.Figure 12～Figure 14 is the figure of concrete example of the treatment process of expression wafer, (a) of Figure 12～Figure 14 represents in the treatment process of wafer W the figure that substrate board treatment 100 work wherein stop respectively, and (b) of Figure 12～Figure 14 is illustrated respectively in the figure that the residue of the wafer W under the situation that substrate board treatment 100 work stop among (a) of Figure 12～Figure 14 is handled.
In the processing to processing wafer W midway shown in Figure 11, at first, whether the wafer W midway of the processing in the S521 step in the judgment processing chamber 140 is to stop to handle in the way of stabilizing process.Specifically, for example by processing of wafers record information shown in Figure 4 294 detect the wafer W that is positioned at process chamber 140 the processing stage, judge whether the processing of this wafer W stops in stabilizing process.Processing in the S521 step in the judgment processing chamber 140 wafer W midway is under the situation about stopping in the way of stabilizing process, in the S522 step from this stabilizing process of original adoption.
Shown in Figure 12 (a), under the situation that the processing of wafer W stops in the way of stabilizing process, owing on this wafer W, also do not carry out etch processes, so handle as residue to such processing wafer W midway, shown in Figure 12 (b), directly just enough from handling again at first of stabilizing process.
Then, if the processing in the S522 step finishes, just if stabilizing process finishes, then in the S527 step, continue processing after this, whether the residue processing of judging this process chamber 140 in the S528 step finishes, and judging under the situation that the residue processing does not have to finish, returns the processing in the S527 step.As processing after this, in the residue of the processing wafer W midway shown in Figure 12 (b) is handled, finish the back at stabilizing process and continue to implement etching work procedure TP, finish operation T ELike this, if all operation finishes, then, behind the state in the adjustment process chamber 140, the wafer W of handling is taken out by carrying out pump-down process and pressure control etc.Then, judge in the S528 step under the situation of the residue processing end in this process chamber 140 that a series of to handling the processing end of wafer midway, the wafer that is back in the process chamber shown in Figure 10 is saved processing.
Processing wafer W midway in described S521 step in the judgment processing chamber 140 is not that whether the wafer W midway of the processing in the S523 step in the judgment processing chamber 140 is to stop in the way of etching work procedure under the situation about stopping in the way at stabilizing process.In this case, also with processing of wafers record information shown in Figure 4 294 detect the wafer W that is positioned at process chamber 140 the processing stage, judge whether the processing of this wafer W is to stop in etching work procedure.According to processing of wafers record information 294 shown in Figure 4, because the wafer W of wafer ID132A-22 substrate board treatment 100 in the processing way of the etching work procedure of the first process chamber 140A quits work, and handles in the etching work procedure Halfway Stopping so can judge this wafer W.
Processing wafer W midway in described S523 step in the judgment processing chamber 140 is under the situation that the etching work procedure Halfway Stopping is handled, and implements the residue of this etching work procedure and handle in the S524 step behind stabilizing process.After just carrying out the pump-down process in the process chamber 140, vacuumize, make the pressure of pressure for stipulating in the process chamber 140, import again and handle gas, applying High frequency power recovers plasma, carries out the etching of remaining time again.
Shown in Figure 13 (a), under the situation that the etching work procedure Halfway Stopping is handled, in this wafer W,, only carry out T remaining time basically because etch processes is proceeding to midway PREtch processes get final product.But, in this case because etch processes once was interrupted, carry out pump-down process by stabilizing process again after, carry out plasmaization owing to import new processing gas, consider plasmoid before the interruption of etch processes and in have no progeny can not identical situation.Therefore, in the residue of wafer W is handled, can set additional etching period T such shown in Figure 13 (b) ATherefore, in the residue of wafer W such shown in Figure 13 (b) is handled, because of substrate board treatment 100 cause work to stop unusually the time (during handling interrupt) T remaining time of etch processes PRIn add and replenish etching period T A, only carry out the etch processes of this time.Should replenish etching period T AThe method of in the treatment process (processing method) of wafer W, handling as recovery, operating personnel can utilize the operation of input/output unit 260 freely to set in storage device 290 in advance, also can operating personnel import with input/output unit 260 when implementing to restore processing.
In addition, in the residue of the wafer W of present embodiment is handled, obtain T remaining time of etch processes according to processing of wafers record information 294 shown in Figure 4 PR, at the T remaining time of this etch processes PRIn, under the situation of needs, add and replenish etching period T A, with these times as the residue processing time, the situation of only carrying out the etch processes in this residue processing time is described, but this residue processing time may not be obtained according to processing of wafers record information 294 shown in Figure 4.For example, one among process chamber 140A～140F (for example process chamber 140F) constituted as the defect inspection chamber, to send into the defect inspection chamber in the wafer W that the etching work procedure Halfway Stopping is handled, detect the treatment state (for example the etch residue amount at the bottom of the hole that forms with etch processes on the wafer W etc.) of wafer W in the defect inspection chamber, can set the residue processing time (T for example of etch processes according to the result of this detection PR+ T A).The checkout gear that electron microscope etc. is arranged in the defect inspection chamber according to the indoor wafer W of this defect inspection is taken pictures with electron microscope etc., can detect the treatment state of wafer W according to the electron image that obtains.
In addition, the stabilizing process of implementing in advance in described etching work procedure also can be implemented the stabilizing process T in the treatment process (processing method) of wafer W in advance S, also can implement to be different from wafer that the treatment process (processing method) of wafer W sets in addition and save stabilizing process T when handling S'.In this case, the high frequency voltage that for example applies to lower electrode etc. can be set in the mode that segmentation applies.Particularly apply under the situation of higher high frequency voltage, apply, for example can prevent from process chamber 140, to produce particulate by segmentation.Such high frequency voltage applying method for example can be set by the magnitude of voltage of segmentation and the time of this voltage of effect etc.
Then, if the processing in the S524 step finishes, just if the residue processing of etching work procedure finishes, then in the S527 step, continue processing after this, whether the residue processing of judging this process chamber 140 in the S528 step finishes, judging under the situation that the residue processing does not have to finish, return the processing in the S527 step.As processing after this, in the residue of the processing wafer W midway shown in Figure 13 (b) is handled, finish the back at etching work procedure and continue to implement to finish operation.Like this, if all operation finishes, then, behind the state in the adjustment process chamber 140, the wafer W of handling is taken out by carrying out pump-down process and pressure control etc.Then, judge in the S528 step under the situation of the residue processing end in this process chamber 140 that a series of to handling the processing end of wafer midway, the wafer that is back in the process chamber shown in Figure 10 is saved processing.
Processing wafer W midway in described S523 step in the judgment processing chamber 140 is not under the situation that the etching work procedure Halfway Stopping is handled, and whether the wafer W midway of the processing in the S525 step in the judgment processing chamber 140 is finishing the processing of operation Halfway Stopping.In this case, for example also with processing of wafers record information shown in Figure 4 294 detect the wafer W that is positioned at process chamber 140 the processing stage, judge this wafer W the processing stage whether in end operation Halfway Stopping.
Processing in the S525 step in the judgment processing chamber 140 wafer W midway is under the situation that finishes the processing of operation Halfway Stopping, in the S526 step, implements this residue that finishes operation and handle behind stabilizing process.After just carrying out the pump-down process in process chamber 140, vacuumize, make the pressure in the process chamber 140 become authorized pressure, import again and handle gas, apply high-frequency electrical and recover plasma, implement the end operation of the endpoint procedure etc. of remaining time again.
For example, such under the situation that finishes the processing of operation Halfway Stopping shown in Figure 14 (a), shown in Figure 14 (b), only carry out T remaining time of the endpoint procedure in this end operation EREndpoint procedure.Just will finish T remaining time of operation ERThe moment of process finishes the etch processes in the etching work procedure before this as terminal point.
Then, if the processing in the S525 step finishes, just finish if finish operation, then in the S527 step, continue processing after this, whether the residue processing of judging this process chamber 140 in the S528 step finishes, judging under the situation that the residue processing does not have to finish, turn back to the processing in the S527 step.As processing after this, in the residue of the processing wafer W midway shown in Figure 14 (b) is handled, owing to finish by finishing operation, and whole operations finishes, so after carrying out the state in the adjustment process chambers 140 such as pump-down process and pressure control, take out the wafer W of handling.Then, judge in the S528 step under the situation of the residue processing end in this process chamber 140 that a series of to handling the processing end of wafer midway, the wafer that is back in the process chamber shown in Figure 10 is saved processing.
Yet, various methods are arranged as described such endpoint procedure.The process that the terminal time that will stipulate is for example arranged is constantly as terminal point, the method (the first endpoint procedure method) that etch processes is finished, the terminal point that detects according to plasmoid, with end-point detection method, the method (the second endpoint procedure method) that etch processes is finished, detecting with described end-point detection method under the situation of terminal point, at this etch processes is finished, under the situation of terminal time not detecting terminal point through regulation, make method (the 3rd endpoint procedure method) that etch processes finishes etc. with moment of this process.In addition, as such end-point detection method, except method, will shine the method that detects according to the variation of its catoptrical diffraction light in addition to wafer W from the light of light source according to the change-detection of the luminescence of plasma vector that in process chamber 140, excites.
The wafer shown in Figure 11 of present embodiment is saved and is handled and can use in comprising the end operation of any endpoint procedure.For example, the first endpoint procedure method and the 3rd endpoint procedure method are such as described, comprise utilizing through the terminal time of regulation determining under the situation of processing of terminal point, preestablish the terminal time (T among Figure 14 for example of described regulation E), so, if know work dwell time T S, then can obtain T remaining time that finishes operation ERTherefore, as mentioned above, will be through finishing T remaining time of operation ERAs terminal point, etch processes is finished.In this case, in the 3rd endpoint procedure method, do not carry out detection with the terminal point of plasmoid etc.
In contrast, under the situation of the second endpoint procedure method, the terminal point of etch processes is owing to detect according to plasmoid and wafer state specially, so be not the terminal time that preestablishes the regulation that is used for the determining described terminal point (T of Figure 14 for example E) reason.In this case, for example when carrying out the end operation of each wafer W, measure and to store in advance behind the terminal time in the memory etc., because of unusual the quitting work of substrate board treatment 100 time, the mean value of the terminal time of before this each wafer W as the terminal time of implementing to save the wafer W of handling, can be calculated T remaining time that finishes operation according to this terminal time ER
Wherein, identical for the stabilizing process of before described end operation, implementing with the stabilizing process of before described etching work procedure, implementing, in the treatment process (processing method) of wafer W, also can implement predefined stabilizing process T S, but also can implement to be different from the treatment process (processing method) of wafer W and the wafer set is in addition saved the stabilizing process T when handling S'.In this case, the high frequency voltage that for example applies to lower electrode can be set in the mode that segmentation applies.
Like this, finish, then turn back to the processing of main program shown in Figure 5 if the wafer in the described a series of process chamber 140 is saved processing.Judge in S150 step shown in Figure 5 just whether the wafer W in carrying all is recovered.Just judge to utilize at each wafer of S200 step～S500 step and save whether the wafer W of handling sends into the box container 132 of conveying initial point and whole wafers is recovered.In the S150 step, judge under the situation about also whole wafer W not being reclaimed, turn back to the processing of S110, judging under the situation that whole wafers are reclaimed, forward next device internal state to and restore the processing of handling (in the S160 step, in the S170 step).
(the device internal state is restored and is handled)
In recovery shown in Figure 5 is handled, restore processing as the device internal state, for example in the S160 step, implement the cleaning of each chamber of substrate board treatment 100 and handle.Just for example cleaning being implemented in each chamber such as in the supply unit 120, in the common transfer chamber 150, in load locking room 160M, the 160N, in chambers 140A～140F handles.As the cleaning of each chamber is handled, for example import purge gas (N for example 2Gas), make the cleaning processing (for example NPPC:Non-Plasma Particle Cleaning) that vacuumizes and repeat stipulated number to atmosphere opening.Removal is at these indoor particulates, with each indoor state that can carry out processing of wafers of adjusting to.In addition, handle, be not limited to described processing, also go for handling with the well-known cleaning that substrate board treatment carries out automatically as cleaning.
Then, carrying out described each indoor measuring fine particles in the S170 step handles.For example suppose in box container 132C, to accommodate the wafer that measuring fine particles is used, the wafer that this measuring fine particles is used takes out from box container 132C, and sends into each chamber once more, after this, turn back to measuring fine particles chamber 134, in measuring fine particles chamber 134, measure the particulate loading that on the wafer that measuring fine particles is used, adheres to.Then, the measurement result with the particulate loading of each chamber for example stores in record etc.This record for example can store in the storage means 290 of control part 200 and memory etc.
If the measuring fine particles processing of described each chamber finishes, then carry out the untreated wafer that is recovered in the box container 132 is handled again.Specifically, in the S180 step, judge in the untreated wafer W be recycled in the box container 132 the whether residual untreated wafer that has.Specifically, for example utilize wafer storage information 292 shown in Figure 3, judge in the wafer W be recycled in the box container 132 the whether residual untreated wafer that has.For example adopt wafer storage information 292 shown in Figure 3, the wafer of wafer ID132A-23 is because restore to handle be " having ", and the processing of wafers situation is " not handling ", is to restore the wafer W of handling so can judge this wafer W, is to be in the stage of being untreated.
In described S180 step, judge under the residual situation that untreated wafer arranged, in the S190 step, carry out the processing again (treatment process again of untreated wafer) of untreated wafer.Wherein, for untreated wafer, according to the process information (processing method) of this wafer W, from coming into effect processing of wafers at first.Like this, the processing again of untreated wafer W is recycled in the box container 132 once more, owing to being clears up in each chamber of substrate board treatment 100 to handle the back and carry out, so the same carrying out before the recovery of the processing that can make untreated wafer W and substrate board treatment 100.If the processing again of such untreated wafer finishes, then a series of recoveries are handled also and are finished.
Wherein, in said embodiment, restore for the device internal state of each chamber of substrate board treatment 100 and to handle after all the substrate recycling of chambers finishes, the situation that the cleaning of carrying out each chamber is once more handled is illustrated for example, but may not be defined in this, also can carry out substrate recycling and device internal state recovery processing in interior each chamber.For example, the cleaning of implementing at once in the processing unit 110 after the wafer recycling in processing unit 110 is handled, and in addition, also the cleaning that can implement at once in the common transfer chamber 150 after the recycling of the wafer in the common transfer chamber 150 is handled.Cleaning in the process chamber 140 is handled also and can directly be carried out under the state that wafer W is detained.Therefore, in process chamber 140, handle when being interrupted, can in the cleaning in the process chamber 140, remove the particulate of falling after floating on the wafer W.
In addition, the recovery of described execution mode is handled after unusual the releasing, can implement automatically by dropping into power supply, in addition, the selection picture of whether implementing to restore processing is shown on the display unit 250 of control part 200, can select the back to implement with the operation of input/output unit 260 by operating personnel.In addition, it is not only whole restoring processing, also can select a part to implement, the wafer redemption processing (S500) that for example also can select the indoor indoor wafer of wafer redemption processing (S300), common transfer of wafer redemption processing (in the S200 step), load-lock in the supply unit to save in processing (S400), the process chamber in the substrate recycling is respectively implemented.
If adopt the substrate board treatment 100 of present embodiment, then in the work of substrate board treatment 100 because of producing when unusually quitting work, handle as the recovery of the state restoration of substrate board treatment 100 in this unusual back of removing, to the wafer W of each indoor delay of substrate board treatment corresponding to when work stops, implementing the processing stage, save processing accordingly, wafer W is recovered to (substrate recovery process) in the box container 132 automatically, each indoor cleaning processing by carrying out substrate board treatment 100 automatically etc. simultaneously, make the state restoration (cuttling of device internal state) of each chamber, can make the processing of the state restoration of substrate board treatment 100 automatically.Can save the time and the time of the recovery processing of substrate board treatment 100 like this.In addition, when substrate board treatment 100 abends work because of generation, by corresponding to wafer W the processing stage carry out correct redemption and handle, can save wafer W as much as possible.
Wherein, the recovery of described execution mode is handled and is illustrated for the substrate board treatment 100 with measuring fine particles chamber 134, also goes for not having the substrate board treatment 100 of measuring fine particles chamber 134.In this case, also can omit the measuring fine particles of wafer W in the measuring fine particles chamber 134 and each chamber.For example also can omit respectively for S170 step shown in Figure 5, S210 shown in Figure 6～S230 step, S320～S340 step shown in Figure 7, S440～S460 step shown in Figure 8, S560～S580 step shown in Figure 10.
In addition,, promptly be applicable to the system that constitutes by a plurality of utensils, also be fit to the device that constitutes by a utensil for the present invention who is described in detail with described execution mode.Provide storage to realize the storage medium of the software program of described execution mode function to system or device, the computer of this system or device (perhaps CPU and MPU) is implemented after reading the program of accommodating media such as storage medium, can certainly realize the present invention.
In this case, the program itself that reads from the medium of storage medium realizes the function of described execution mode, as the medium of the storage medium etc. of this program of storage, for example can use soft (registered trade mark) dish, hard disk, CD, photomagneto disk, CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW, tape, nonvolatile memory card, ROM or the download by network etc.
In addition, the program of reading by object computer, not only can realize the function of described execution mode, the basis that is designated as with this program, the OS that works in computer etc. carries out part or all of actual treatment, realizes that with this processing the situation of the function of described execution mode is also included among the present invention.
In addition, the program of from the medium of storage medium, reading, after being written to the function expanding card that is inserted in computer or having the memory of connection function expanding parts on computers, indication according to this program, this function expanding card and the CPU etc. with function expanding parts carry out part or all of actual treatment, utilize the situation of the function of the described execution mode of this processings realization to be also included within the present invention.
Above, with reference to accompanying drawing preferred implementation of the present invention is illustrated, but the present invention is not limited in the described example certainly.Self-evident, those skilled in the art can expect various variation examples or revise example, be appreciated that into these and also belong in the technical scope of the present invention certainly in the scope of claims record.
For example, in said embodiment, making up the bench-type substrate board treatment with the what is called that connects a plurality of process chambers in the common transfer chamber on every side is that example is illustrated processing unit, but, for example except load locking room is connected on the process chamber, a plurality of processing units are connected beyond so-called tandem type substrate board treatment on the supply unit etc. side by side, and the present invention goes for board device because of producing the substrate board treatment of unusual and out-of-work various types.
Industrial applicibility
The substrate board treatment that the present invention goes for processed substrate is implemented predetermined processing because of Produce restoration processing method, the processing substrate dress of the substrate board treatment when unusually quitting work Put, program.

Claims (16)

1. the restoration processing method of a substrate board treatment is characterized in that:
Be in substrate board treatment, in owing to the work of this substrate board treatment, produce when unusually work being stopped, after this unusual releasing, make the restoration processing method of substrate board treatment of the state restoration of described substrate board treatment, and, described substrate board treatment comprises: processing unit is made of a plurality of chamber that comprises a plurality of process chambers of handling processed substrate at least; Supply unit is connected on the described processing unit, have and take in the conveying chamber that carries out the handing-over of described processed substrate between the substrate accommodation container of described processed substrate; Supply unit side conveying mechanism is set in the described supply unit, and described processed substrate is sent into and taken out to described processing unit; With processing unit side conveying mechanism, be set in the described processing unit, described processed substrate is sent into and taken out to described process chamber, wherein, described restoration processing method comprises:
The substrate recovery process, for the processed substrate that is trapped in the described processing unit, detect this processed substrate the processing stage whether be the necessary processing of this processed substrate of residue the processing stage, the necessary processing of residue the processing stage situation under, implement remaining processing, by described processing unit side conveying mechanism and described supply unit side conveying mechanism, reclaim to described substrate accommodation container, be not the necessary processing of residue the processing stage situation under, by described processing unit side conveying mechanism and described supply unit side conveying mechanism, the substrate of enforcement in the processing unit that described substrate accommodation container reclaims saved and handled
For the processed substrate that is trapped in the described supply unit, save processing by the substrate that described supply unit side conveying mechanism is implemented in the supply unit that described substrate accommodation container reclaims; With
Install the internal state cuttling, make the state restoration that described processing unit is interior and described supply unit is interior of described substrate board treatment.
2. the restoration processing method of substrate board treatment as claimed in claim 1 is characterized in that:
Described substrate board treatment is included in the storage device of the processing record information of the processed substrate of storage in the work of this substrate board treatment,
Substrate is saved the processing record information of handling according to being stored in the processed substrate in the described storage device in the described processing unit, detection be trapped in processed substrate in the described processing unit the processing stage whether be this processed substrate of residue must handle the processing stage, according to the result of this detection, implement remaining processing.
3. the restoration processing method of substrate board treatment as claimed in claim 1 is characterized in that:
Described substrate board treatment comprises the defect inspection chamber of carrying out defect inspection behind the treatment state that detects described processed substrate,
Substrate is saved the treatment state of handling according to detected processed substrate in described defect inspection chamber in the described processing unit, detection be trapped in processed substrate in the described processing unit the processing stage whether be residue this processed substrate the processing stage necessary to be processed, implement remaining processing according to this testing result.
4. as the restoration processing method of each described substrate board treatment in the claim 1～3, it is characterized in that:
The cuttling of described device internal state is implemented described processing unit each indoor cleaning interior and described supply unit of described substrate board treatment and is handled.
5. the restoration processing method of substrate board treatment as claimed in claim 4 is characterized in that:
The described processing unit of described substrate board treatment and each chamber of described supply unit comprise the gas delivery system that can import purge gas at least and can be by vacuumizing and adjust the gas extraction system of pressure to atmosphere opening,
It is that by described gas delivery system purge gas to be imported to each of described processing unit and described supply unit indoor that described cleaning is handled, and vacuumizes or repeat repeatedly predetermined process to atmosphere opening by described gas extraction system.
6. as the restoration processing method of each described substrate board treatment in the claim 1～3, it is characterized in that:
Also comprising treatment process again, detect whether the processed substrate that is recycled in the described substrate accommodation container is the stage of being untreated, is the stage of being untreated if detect, and then this processed substrate is implemented to handle again.
7. as the restoration processing method of each described substrate board treatment in the claim 1～3, it is characterized in that:
Described substrate board treatment comprises the measuring fine particles chamber,
Described substrate recovery process, before described processed substrate is recovered to described substrate accommodation container, be transported to described measuring fine particles chamber, carry out the measurement of the particulate loading on the described processed substrate in this measuring fine particles chamber, this measurement result is corresponding with described processed substrate and store in the storage device.
8. the restoration processing method of a substrate board treatment is characterized in that:
Be in substrate board treatment, in owing to the work of this substrate board treatment, produce when unusually work being stopped, after this unusual releasing, make the restoration processing method of substrate board treatment of the state restoration of described substrate board treatment, and, described substrate board treatment comprises: supply unit, and take in the conveying chamber that has the handing-over of carrying out described processed substrate between the placement processing substrate container of processed substrate; Processing unit has a plurality of process chambers that will handle described processed substrate and is connected common transfer chamber on every side and the load locking room that connects the conveying chamber of this common transfer chamber and described supply unit; Supply unit side conveying mechanism is set in the described supply unit, and described processed substrate is sent into and taken out to described load locking room; With processing unit side conveying mechanism, the common transfer that is set at described processing unit is indoor, and described processed substrate is sent into and taken out between described load locking room and described chambers, and wherein, the restoration processing method of described substrate board treatment comprises:
The substrate recovery process, if detect processed substrate in described supply unit, the substrate of then implementing in the supply unit that described substrate accommodation container reclaims is saved processing,
If detect processed substrate in that load-lock is indoor, then after the pump-down process of carrying out this load locking room, implement the indoor substrate of load-lock that this processed substrate carries out reclaiming to described substrate accommodation container saved and handle,
If detect processed substrate in described common transfer chamber, then judge this processed substrate the processing stage whether be the stage of not finishing processing, if do not finish the stage of processing, reclaim to described substrate accommodation container after just being implemented in the processing of remaining process chamber, if not the stage of not finishing processing, the indoor substrate of common transfer of just implementing to reclaim to described substrate accommodation container is saved and is handled
If in described process chamber, detect processed substrate, then judge this processed substrate the processing stage whether be the stage of handling midway, if the processing stage midway, after just being implemented in the remaining processing of this process chamber, reclaim to described substrate accommodation container, if not the stage of handling midway, the substrate redemption of just implementing in the process chamber that described substrate accommodation container reclaims is handled; With
Install the internal state cuttling, make each indoor state restoration of described substrate board treatment.
9. the restoration processing method of substrate board treatment as claimed in claim 8 is characterized in that:
Described substrate board treatment is included in the storage device of the processing record information of the processed substrate of storage in the work of this substrate board treatment,
In the described process chamber substrate save the processed substrate handled in judging described process chamber the processing stage be to handle under the situation in stage midway, according to the processing record information that is stored in the processed substrate in the described storage device, set the residue processing time of this processed substrate, this treatment substrate is only implemented the residue of this remaining time and handled.
10. the restoration processing method of substrate board treatment as claimed in claim 8 is characterized in that:
Described substrate board treatment comprises the defect inspection chamber of carrying out defect inspection behind the treatment state that detects described processed substrate,
Substrate in the described process chamber save the processed substrate handled in judging described process chamber the processing stage be to handle under the situation in stage midway, should carry to described defect inspection chamber by processed substrate, in this defect inspection chamber according to the treatment state of detected processed substrate, set the residue processing time of this processed substrate, this processed substrate is only carried out the residue of this remaining time and handle.
11. the restoration processing method as each described substrate board treatment in the claim 8～10 is characterized in that:
The cuttling of described device internal state is implemented described processing unit each indoor cleaning interior and described supply unit of described substrate board treatment and is handled.
12. the restoration processing method of substrate board treatment as claimed in claim 11 is characterized in that:
The described processing unit of described substrate board treatment and each chamber of described supply unit comprise the gas delivery system that can import purge gas at least and can be by vacuumizing and adjust the gas extraction system of pressure to atmosphere opening,
It is that by described gas delivery system purge gas to be imported to each of described processing unit and described supply unit indoor that described cleaning is handled, and vacuumizes or repeat repeatedly predetermined process to atmosphere opening by described gas extraction system.
13. the restoration processing method as each described substrate board treatment in the claim 8～10 is characterized in that:
Also comprising treatment process again, detect whether the processed substrate detection that is recycled in the described substrate accommodation container is the stage of being untreated, is the stage of being untreated if detect, and then this processed substrate is implemented to handle again.
14. the restoration processing method as each described substrate board treatment in the claim 8～10 is characterized in that,
Described substrate board treatment comprises the measuring fine particles chamber,
Described substrate recovery process, before described processed substrate is recovered to described substrate accommodation container, be transported to described measuring fine particles chamber, carry out the measurement of the particulate loading on the described processed substrate in this measuring fine particles chamber, this measurement result is corresponding with described processed substrate, store in the storage device.
15. a substrate board treatment of handling processed substrate is characterized in that, comprising:
Processing unit is made of a plurality of chamber that comprises a plurality of process chambers of handling described processed substrate at least;
Supply unit is connected on the described processing unit, have and take between the substrate accommodation container of described processed substrate, carry out the conveying chamber of the handing-over of described processed substrate;
Supply unit side conveying mechanism is set in the described supply unit, and described processed substrate is sent into and taken out to described processing unit;
Processing unit side conveying mechanism is set in the described processing unit, and described processed substrate is sent into and taken out to described process chamber; With
Control device because when producing abnormal work in the work of described substrate board treatment and stopping, being removed the state that described substrate board treatment is restored in the back unusually at this, wherein,
Described control device comprises:
The substrate retracting device, for the processed substrate that is trapped in the described processing unit, detect this processed substrate the processing stage whether be the necessary processing of this processed substrate of residue the processing stage, the necessary processing of residue the processing stage situation under, implement remaining processing, by described processing unit side conveying mechanism and described supply unit side conveying mechanism, reclaim to described substrate accommodation container, be not the necessary processing of residue the processing stage situation under, by described processing unit side conveying mechanism and described supply unit side conveying mechanism, the substrate of enforcement in the processing unit that described substrate accommodation container reclaims saved and handled
For the processed substrate that is trapped in the described supply unit, save processing by the substrate that described supply unit side conveying mechanism is implemented in the supply unit that described substrate accommodation container reclaims; With
Device internal state restoring means is with in the described processing unit of described substrate board treatment and the state restoration in the described supply unit.
16. a substrate board treatment of handling processed substrate is characterized in that, comprising:
Supply unit, and take in the conveying chamber that has the handing-over of carrying out described processed substrate between the substrate accommodation container of described processed substrate;
Processing unit has a plurality of process chambers that will handle described processed substrate and is connected common transfer chamber on every side and the load locking room that connects the conveying chamber of this common transfer chamber and described supply unit;
Supply unit side conveying mechanism is set in the conveying chamber of described supply unit, and described processed substrate is sent into and taken out to described load locking room;
Processing unit side conveying mechanism, the common transfer that is set at described processing unit is indoor, and described processed substrate is sent into and taken out between each chamber of described load locking room and described chambers; With
Control device when the generation abnormal work stops in the work of this substrate board treatment, makes the state restoration of described substrate board treatment after this unusual releasing, wherein,
Described control device comprises:
The substrate retracting device, if detect processed substrate in described supply unit, the substrate of then implementing in the supply unit that described substrate accommodation container reclaims is saved processing,
If detect processed substrate in that load-lock is indoor, then after the pump-down process of carrying out this load locking room, implement the indoor substrate of load-lock that this processed substrate carries out reclaiming to described substrate accommodation container saved and handle,
If detect processed substrate in described common transfer chamber, then judge this processed substrate the processing stage whether be the stage of not finishing processing, if do not finish the stage of processing, reclaim to described substrate accommodation container after just being implemented in the processing of remaining process chamber, if not the stage of not finishing processing, the indoor substrate of common transfer of just implementing to reclaim to described substrate accommodation container is saved and is handled
If in described process chamber, detect processed substrate, then judge this processed substrate the processing stage whether be the stage of handling midway, if the processing stage midway, after just being implemented in the remaining processing of this process chamber, reclaim to described substrate accommodation container, if not the stage of handling midway, the substrate redemption of just implementing in the process chamber that described substrate accommodation container reclaims is handled; With
Device internal state restoring means is with each indoor state restoration of described substrate board treatment.
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