CH616295B - - Google Patents
Info
- Publication number
- CH616295B CH616295B CH57577A CH57577A CH616295B CH 616295 B CH616295 B CH 616295B CH 57577 A CH57577 A CH 57577A CH 57577 A CH57577 A CH 57577A CH 616295 B CH616295 B CH 616295B
- Authority
- CH
- Switzerland
- Prior art keywords
- module structure
- resilient connector
- display
- circuit board
- display means
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G9/00—Visual time or date indication means
- G04G9/08—Visual time or date indication means by building-up characters using a combination of indicating elements, e.g. by using multiplexing techniques
- G04G9/12—Visual time or date indication means by building-up characters using a combination of indicating elements, e.g. by using multiplexing techniques using light valves, e.g. liquid crystals
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G9/00—Visual time or date indication means
- G04G9/02—Visual time or date indication means by selecting desired characters out of a number of characters or by selecting indicating elements the position of which represent the time, e.g. by using multiplexing techniques
- G04G9/06—Visual time or date indication means by selecting desired characters out of a number of characters or by selecting indicating elements the position of which represent the time, e.g. by using multiplexing techniques using light valves, e.g. liquid crystals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electric Clocks (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP464676A JPS5288370A (en) | 1976-01-20 | 1976-01-20 | Electronic watch |
Publications (2)
Publication Number | Publication Date |
---|---|
CH616295B true CH616295B (es) | |
CH616295GA3 CH616295GA3 (es) | 1980-03-31 |
Family
ID=11589718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH57577A CH616295GA3 (es) | 1976-01-20 | 1977-01-18 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4238848A (es) |
JP (1) | JPS5288370A (es) |
CH (1) | CH616295GA3 (es) |
DE (1) | DE2701448A1 (es) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2072891B (en) * | 1977-06-20 | 1982-08-25 | Hitachi Ltd | Electronic device and method of fabricating the same |
JPS603632B2 (ja) * | 1977-11-30 | 1985-01-29 | セイコーインスツルメンツ株式会社 | 電子時計 |
JPS54114967U (es) * | 1978-01-31 | 1979-08-13 | ||
GB2075726B (en) * | 1980-05-02 | 1983-11-23 | Suwa Seikosha Kk | Electronic timepiece |
US4342105A (en) * | 1980-06-23 | 1982-07-27 | Timex Corporation | Timepiece module frame and assembly |
FR2514536A1 (fr) * | 1981-10-14 | 1983-04-15 | Sfena | Element modulaire d'affichage a cristaux liquides |
US4824009A (en) * | 1981-12-31 | 1989-04-25 | International Business Machines Corporation | Process for braze attachment of electronic package members |
JPS6059677A (ja) * | 1983-09-09 | 1985-04-06 | 株式会社東芝 | 配線基板の接続装置 |
FR2583895A1 (fr) * | 1985-06-25 | 1986-12-26 | Graff Bruno | Systeme d'indication de l'heure qu'il est, par la combinaison de symboles graphiques |
JPS6312795U (es) * | 1987-06-18 | 1988-01-27 | ||
JPH05169885A (ja) * | 1991-12-26 | 1993-07-09 | Mitsubishi Electric Corp | 薄型icカード |
US5607882A (en) * | 1994-12-20 | 1997-03-04 | Lucent Technologies Inc. | Multi-component electronic devices and methods for making them |
US6976295B2 (en) * | 1997-07-29 | 2005-12-20 | Seiko Epson Corporation | Method of manufacturing a piezoelectric device |
JP2001255833A (ja) * | 2000-03-10 | 2001-09-21 | Seiko Instruments Inc | 電子機器用表示装置 |
JP3659175B2 (ja) * | 2001-02-16 | 2005-06-15 | 株式会社村田製作所 | 半導体チップの製造方法および半導体ウエハ |
US7652359B2 (en) * | 2002-12-27 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Article having display device |
EP1437683B1 (en) * | 2002-12-27 | 2017-03-08 | Semiconductor Energy Laboratory Co., Ltd. | IC card and booking account system using the IC card |
US7566001B2 (en) | 2003-08-29 | 2009-07-28 | Semiconductor Energy Laboratory Co., Ltd. | IC card |
US7130185B2 (en) * | 2004-06-02 | 2006-10-31 | Research In Motion Limited | Handheld computing device having drop-resistant LCD display |
DE102008018932A1 (de) * | 2007-04-17 | 2008-11-20 | C2Cure Inc., Wilmington | Bildgebende Systeme und Verfahren, insbesondere zur Verwendung mit einem bei offener Chirurgie verwendeten Instrument |
JP5127840B2 (ja) * | 2007-12-14 | 2013-01-23 | 富士通株式会社 | 表示パネル構造体、それを用いた電子装置、および携帯型情報機器 |
DE102008036837A1 (de) * | 2008-08-07 | 2010-02-18 | Epcos Ag | Sensorvorrichtung und Verfahren zur Herstellung |
JP4905815B2 (ja) * | 2009-10-28 | 2012-03-28 | カシオ計算機株式会社 | 緩衝部材、腕時計の衝撃緩衝構造および腕時計 |
CN107393948B (zh) * | 2017-08-11 | 2020-05-19 | 武汉华星光电半导体显示技术有限公司 | 用于固定柔性显示面板的中框及柔性显示装置 |
US10362684B1 (en) * | 2018-10-11 | 2019-07-23 | National Chung-Shan Institute Of Science And Technology | Method for improving adhesion between ceramic carrier and thick film circuit |
KR20210003410A (ko) * | 2019-07-02 | 2021-01-12 | 삼성전자주식회사 | 도전성 연결 부재를 포함하는 전자 장치 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3672155A (en) * | 1970-05-06 | 1972-06-27 | Hamilton Watch Co | Solid state watch |
US3861135A (en) * | 1973-02-08 | 1975-01-21 | Chomerics Inc | Electrical interconnector and method of making |
DE2410527C3 (de) * | 1973-03-08 | 1983-11-03 | Casio Computer Co., Ltd., Tokyo | Elektronisches Zeitanzeigegerät |
US3800525A (en) * | 1973-08-07 | 1974-04-02 | Time Computer | Solid state watch with magnetic setting |
US3863436A (en) * | 1974-04-18 | 1975-02-04 | Timex Corp | Solid state quartz watch |
US3945196A (en) * | 1974-05-30 | 1976-03-23 | American Microsystems, Inc. | Universal solid state time-keeping package |
US3977176A (en) * | 1974-08-22 | 1976-08-31 | Citizen Watch Co., Ltd. | Electronic watch structure |
US3983689A (en) * | 1975-03-31 | 1976-10-05 | Hughes Aircraft Company | Electronic watch construction |
-
1976
- 1976-01-20 JP JP464676A patent/JPS5288370A/ja active Pending
-
1977
- 1977-01-14 DE DE19772701448 patent/DE2701448A1/de active Pending
- 1977-01-17 US US05/760,123 patent/US4238848A/en not_active Expired - Lifetime
- 1977-01-18 CH CH57577A patent/CH616295GA3/xx unknown
Also Published As
Publication number | Publication date |
---|---|
US4238848A (en) | 1980-12-09 |
CH616295GA3 (es) | 1980-03-31 |
JPS5288370A (en) | 1977-07-23 |
DE2701448A1 (de) | 1977-07-28 |
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