BRPI0924191A2 - dispositivo de vídeo de eletroluminescência orgânica e método para a produção do mesmo - Google Patents
dispositivo de vídeo de eletroluminescência orgânica e método para a produção do mesmoInfo
- Publication number
- BRPI0924191A2 BRPI0924191A2 BRPI0924191A BRPI0924191A BRPI0924191A2 BR PI0924191 A2 BRPI0924191 A2 BR PI0924191A2 BR PI0924191 A BRPI0924191 A BR PI0924191A BR PI0924191 A BRPI0924191 A BR PI0924191A BR PI0924191 A2 BRPI0924191 A2 BR PI0924191A2
- Authority
- BR
- Brazil
- Prior art keywords
- producing
- same
- organic electroluminescent
- video device
- electroluminescent video
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/127—Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
- H10K59/1275—Electrical connections of the two substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009001935 | 2009-01-07 | ||
PCT/JP2009/065927 WO2010079640A1 (ja) | 2009-01-07 | 2009-09-11 | 有機エレクトロルミネセンス表示装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0924191A2 true BRPI0924191A2 (pt) | 2016-02-10 |
Family
ID=42316414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0924191A BRPI0924191A2 (pt) | 2009-01-07 | 2009-09-11 | dispositivo de vídeo de eletroluminescência orgânica e método para a produção do mesmo |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110254440A1 (pt) |
EP (1) | EP2375466A4 (pt) |
JP (1) | JPWO2010079640A1 (pt) |
CN (1) | CN102224613A (pt) |
BR (1) | BRPI0924191A2 (pt) |
RU (1) | RU2011133042A (pt) |
WO (1) | WO2010079640A1 (pt) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013132870A1 (ja) * | 2012-03-08 | 2015-07-30 | パナソニック株式会社 | 有機エレクトロルミネッセンス素子の製造方法、及び、有機エレクトロルミネッセンス素子 |
JP6303803B2 (ja) * | 2013-07-03 | 2018-04-04 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
WO2015047974A2 (en) * | 2013-09-24 | 2015-04-02 | Cooper Technologies Company | Systems and methods for improving service life of circuit boards |
CN117881215A (zh) | 2013-12-02 | 2024-04-12 | 株式会社半导体能源研究所 | 显示装置及其制造方法 |
JP6364998B2 (ja) * | 2014-06-23 | 2018-08-01 | 王子ホールディングス株式会社 | 有機発光ダイオード素子および有機薄膜太陽電池素子 |
JP6661996B2 (ja) * | 2015-11-25 | 2020-03-11 | 東レ株式会社 | 樹脂基板の製造方法、樹脂積層基板の製造方法および表示装置の製造方法 |
CN108630829B (zh) * | 2017-03-17 | 2019-11-08 | 京东方科技集团股份有限公司 | 显示面板的制作方法、显示面板及显示装置 |
WO2020136849A1 (ja) * | 2018-12-27 | 2020-07-02 | シャープ株式会社 | 表示装置及び表示装置の製造方法 |
CN109728197B (zh) * | 2019-01-02 | 2021-01-26 | 京东方科技集团股份有限公司 | 显示基板及其制备方法和显示装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6208404B1 (en) * | 1996-05-16 | 2001-03-27 | Tryonics Corporation | Black matrix |
JP4619644B2 (ja) | 1996-08-27 | 2011-01-26 | セイコーエプソン株式会社 | 薄膜素子の転写方法 |
US6114088A (en) * | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
JP3840010B2 (ja) * | 1999-10-19 | 2006-11-01 | 東北パイオニア株式会社 | 発光ディスプレイの製造方法 |
JP4053260B2 (ja) | 2000-10-18 | 2008-02-27 | シャープ株式会社 | 有機エレクトロルミネッセンス表示素子 |
CN1735970A (zh) * | 2000-11-02 | 2006-02-15 | 3M创新有限公司 | 直观式发射显示器亮度和对比度的提高 |
JP2002305076A (ja) * | 2001-02-01 | 2002-10-18 | Semiconductor Energy Lab Co Ltd | 表示装置及びその作製方法 |
JP4027740B2 (ja) | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP4255250B2 (ja) | 2002-06-12 | 2009-04-15 | 大日本印刷株式会社 | エレクトロルミネッセント素子 |
JP4912835B2 (ja) | 2002-11-01 | 2012-04-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP2004335968A (ja) | 2003-05-12 | 2004-11-25 | Sony Corp | 電気光学表示装置の製造方法 |
JP2004342432A (ja) * | 2003-05-15 | 2004-12-02 | Nec Corp | 有機el表示装置 |
JP2006080182A (ja) * | 2004-09-08 | 2006-03-23 | Seiko Epson Corp | 配線基板と半導体素子の接続方法、半導体基板の製造方法、半導体基板の補修方法及び電気光学装置の製造方法 |
TWI307612B (en) * | 2005-04-27 | 2009-03-11 | Sony Corp | Transfer method and transfer apparatus |
US7402951B2 (en) * | 2005-09-27 | 2008-07-22 | Eastman Kodak Company | OLED device having improved contrast |
US7952105B2 (en) * | 2007-01-29 | 2011-05-31 | Global Oled Technology, Llc. | Light-emitting display device having improved efficiency |
WO2008139370A1 (en) * | 2007-05-10 | 2008-11-20 | Koninklijke Philips Electronics N.V. | Method for the manufacturing of an optoelectronic device |
WO2008152840A1 (ja) * | 2007-06-13 | 2008-12-18 | Sharp Kabushiki Kaisha | 有機エレクトロルミネセンス表示装置及びその製造方法 |
-
2009
- 2009-09-11 US US13/140,135 patent/US20110254440A1/en not_active Abandoned
- 2009-09-11 RU RU2011133042/28A patent/RU2011133042A/ru not_active Application Discontinuation
- 2009-09-11 CN CN2009801471165A patent/CN102224613A/zh active Pending
- 2009-09-11 BR BRPI0924191A patent/BRPI0924191A2/pt not_active IP Right Cessation
- 2009-09-11 WO PCT/JP2009/065927 patent/WO2010079640A1/ja active Application Filing
- 2009-09-11 EP EP09837526A patent/EP2375466A4/en not_active Withdrawn
- 2009-09-11 JP JP2010545685A patent/JPWO2010079640A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2010079640A1 (ja) | 2010-07-15 |
US20110254440A1 (en) | 2011-10-20 |
EP2375466A4 (en) | 2012-10-17 |
RU2011133042A (ru) | 2013-02-20 |
EP2375466A1 (en) | 2011-10-12 |
CN102224613A (zh) | 2011-10-19 |
JPWO2010079640A1 (ja) | 2012-06-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 6A E 7A ANUIDADES. |
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B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2383 DE 06-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |
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B350 | Update of information on the portal [chapter 15.35 patent gazette] |