BR9805985A - Redistribuicão de polifenileno éteres e polifenileno éteres com nova estrutura. - Google Patents
Redistribuicão de polifenileno éteres e polifenileno éteres com nova estrutura.Info
- Publication number
- BR9805985A BR9805985A BR9805985-8A BR9805985A BR9805985A BR 9805985 A BR9805985 A BR 9805985A BR 9805985 A BR9805985 A BR 9805985A BR 9805985 A BR9805985 A BR 9805985A
- Authority
- BR
- Brazil
- Prior art keywords
- phenolic compound
- redistribution
- phenolic
- toluene
- polyphenylene
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/48—Polymers modified by chemical after-treatment
- C08G65/485—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Polyethers (AREA)
- Laminated Bodies (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Patente de Invenção: <B>"REDISTRIBUIçãO DE POLIFENILENO éTERES E POLIFENILENO éTERES COM NOVA ESTRUTURA"<D>. A presente invenção refere-se à distribuição de polifenileno éteres por reação do polifenileno éter em solução com um composto fenólico, onde são usados compostos fenólicos especiais. A reação de redistribuição pode ser realizada em tolueno ou em misturas de tolueno/álcool. A reação pode ser realizada na presença ou ausência de um catalisador. Usando-se um processo para a redistribuição de polifenileno éteres por reação do polifenileno éter em solução com um composto fenólico, onde o polifenileno éter é reagido com um composto fenólico de fórmula 3, onde os anéis fenólicos são distribuídos com grupos metila ou grupos etila nas posições orto, e o grupo X é separado do anel fenólico através de pelo menos dois átomos de carbono, e o composto fenólico tem um peso molecular não-superior a 400 g/mo, de preferência não superior a 300 g/mol, e a redistribuição é realizada em uma mistura de tolueno e metanol com 1 - 30% em volume ou em tolueno na presença de um catalisador de transferência de fase, tal como cloreto de tri(alquil C8 - C10) metil amónio como promotor, e um difenoquinona, de preferência 3,3',5,5'-tetrametil-4,4'-difenoquinona, é usada como catalisador e a concentração molar do composto fenólico é escolhida entre 0,9 e 1,1 vezes a quantidade molar de unidades monoméricas no polifenileno éter na solução reacional, mais de 90% de composto fenólico podem ser incorporados no polifenileno.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/800,694 US5880221A (en) | 1997-02-14 | 1997-02-14 | Redistribution of polyphenylene ethers and polyphenylene ethers with novel structure |
PCT/US1998/000351 WO1998036015A1 (en) | 1997-02-14 | 1998-01-08 | Redistribution of polyphenylene ethers and polyphenylene ethers with novel structure |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9805985A true BR9805985A (pt) | 1999-08-31 |
Family
ID=25179123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9805985-8A BR9805985A (pt) | 1997-02-14 | 1998-01-08 | Redistribuicão de polifenileno éteres e polifenileno éteres com nova estrutura. |
Country Status (14)
Country | Link |
---|---|
US (1) | US5880221A (pt) |
EP (1) | EP0895519B1 (pt) |
JP (1) | JP4113261B2 (pt) |
KR (1) | KR20000064906A (pt) |
CN (1) | CN1188450C (pt) |
AT (1) | ATE226223T1 (pt) |
AU (1) | AU734335B2 (pt) |
BR (1) | BR9805985A (pt) |
CA (1) | CA2250841A1 (pt) |
CZ (1) | CZ325898A3 (pt) |
DE (1) | DE69808707T2 (pt) |
TR (1) | TR199802062T1 (pt) |
TW (1) | TW438837B (pt) |
WO (1) | WO1998036015A1 (pt) |
Families Citing this family (49)
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US6063875A (en) * | 1998-06-11 | 2000-05-16 | General Electric Company | Carboxy-functionalized polyphenylene ethers and blends containing them |
US6307010B1 (en) * | 1999-02-05 | 2001-10-23 | General Electric Company | Process for the manufacture of low molecular weight polyphenylene ether resins through redistribution |
US7235192B2 (en) | 1999-12-01 | 2007-06-26 | General Electric Company | Capped poly(arylene ether) composition and method |
US6576700B2 (en) * | 2000-04-12 | 2003-06-10 | General Electric Company | High flow polyphenylene ether formulations |
US6589656B2 (en) | 2000-07-26 | 2003-07-08 | Matsushita Electric Works, Ltd. | Epoxy resin composition, prepreg and metal-clad laminate |
JP2002265777A (ja) * | 2001-03-12 | 2002-09-18 | Matsushita Electric Works Ltd | ポリフェニレンオキサイド樹脂組成物、プリプレグ、積層板、プリント配線板、多層プリント配線板 |
TW574313B (en) * | 2001-12-12 | 2004-02-01 | Ind Tech Res Inst | Resin composition for circuit boards |
ES2307901T3 (es) * | 2002-02-21 | 2008-12-01 | Stichting Dutch Polymer Institute | Copolimero que contiene uno o mas segmentos amida. |
US7183350B2 (en) * | 2003-02-28 | 2007-02-27 | General Electric Company | Poly(arylene ether) blends having low melt viscosity in the absence of plasticizer |
US7148296B2 (en) * | 2003-10-03 | 2006-12-12 | General Electric Company | Capped poly(arylene ether) composition and process |
US7396895B2 (en) * | 2003-11-25 | 2008-07-08 | Xerox Corporation | Branched polyarylene ethers and processes for the preparation thereof |
US7067608B2 (en) * | 2003-11-25 | 2006-06-27 | Xerox Corporation | Process for preparing branched polyarylene ethers |
US7329708B2 (en) * | 2004-08-18 | 2008-02-12 | General Electric Company | Functionalized poly(arylene ether) composition and method |
US7378455B2 (en) * | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
CN101389691B (zh) * | 2006-02-21 | 2013-01-02 | 旭化成电子材料株式会社 | 低分子量聚苯醚的制造方法 |
US20080085989A1 (en) * | 2006-10-05 | 2008-04-10 | Gary William Yeager | Poly(arylene ether) copolymer |
US20080076884A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
US20080076885A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
US7638566B2 (en) * | 2006-10-30 | 2009-12-29 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) compositions |
US8252858B2 (en) * | 2007-01-10 | 2012-08-28 | Sabic Innovative Plastics Ip B.V. | Low smoke density poly(arylene ether) compositions, methods, and articles |
US7655278B2 (en) * | 2007-01-30 | 2010-02-02 | Sabic Innovative Plastics Ip B.V. | Composite-forming method, composites formed thereby, and printed circuit boards incorporating them |
US7595367B2 (en) * | 2007-08-28 | 2009-09-29 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) preparation method |
JP5469320B2 (ja) * | 2008-08-26 | 2014-04-16 | パナソニック株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
US8058359B2 (en) * | 2008-11-10 | 2011-11-15 | Sabic Innovative Plastics Ip B.V. | Varnish compositions for electrical insulation and method of using the same |
CN101735562B (zh) * | 2009-12-11 | 2012-09-26 | 广东生益科技股份有限公司 | 环氧树脂组合物及其制备方法及采用其制作的层压材料及覆铜箔层压板 |
WO2013097128A1 (zh) * | 2011-12-29 | 2013-07-04 | 广东生益科技股份有限公司 | 含磷低分子量聚苯醚树脂的制备方法 |
US8466253B1 (en) | 2012-06-29 | 2013-06-18 | Sabic Innovative Plastics Ip B.V. | Poly(phenylene ether) process |
EP3004208A4 (en) * | 2013-06-03 | 2017-01-04 | PolyOne Corporation | Low molecular weight polyphenylene ether prepared without solvents |
US9422394B2 (en) | 2013-06-28 | 2016-08-23 | Sabic Global Technologies B.V. | Thermoplastic polyurethane and associated method and article |
US9169368B2 (en) | 2013-07-30 | 2015-10-27 | Sabic Global Technologies B.V. | Rigid foam and associated article |
US9296916B2 (en) | 2013-08-09 | 2016-03-29 | Sabic Global Technologies B.V. | Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same |
US9266997B2 (en) | 2013-09-20 | 2016-02-23 | Sabic Global Technologies B.V. | Polyurethane foam and associated method and article |
JP5793641B2 (ja) * | 2014-01-30 | 2015-10-14 | パナソニックIpマネジメント株式会社 | ポリフェニレンエーテル樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
SG11201609185TA (en) | 2014-04-04 | 2016-12-29 | Hitachi Chemical Co Ltd | Polyphenylene ether derivative having n-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same |
SG11201705654PA (en) | 2015-01-13 | 2017-08-30 | Hitachi Chemical Co Ltd | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
CN107849239B (zh) | 2015-06-09 | 2019-03-08 | 沙特基础工业全球技术有限公司 | 用于聚(苯醚)制造的方法和相关聚(苯醚) |
CN108368255B (zh) | 2015-12-17 | 2021-01-05 | 沙特基础工业全球技术有限公司 | 形成高分子量聚(亚苯基醚)的方法、由其形成的聚(亚苯基醚)及包含聚(亚苯基醚)的纤维和制品 |
TWI759590B (zh) | 2018-03-29 | 2022-04-01 | 日商旭化成股份有限公司 | 聚伸苯醚、其組成物及製造方法 |
JP2020132716A (ja) * | 2019-02-15 | 2020-08-31 | 旭化成株式会社 | ポリフェニレンエーテル含有樹脂組成物 |
WO2021060210A1 (ja) * | 2019-09-24 | 2021-04-01 | 東洋紡株式会社 | ポリフェニレンエーテル溶融押出成形体、及び、ポリフェニレンエーテル溶融押出成形体の製造方法 |
US20220380538A1 (en) * | 2019-09-30 | 2022-12-01 | Taiyo Holdings Co., Ltd. | Curable composition including polyphenylene ether, dry film, prepreg, cured product, laminated board, and electronic component |
JP7202476B2 (ja) | 2019-10-02 | 2023-01-11 | 旭化成株式会社 | ポリフェニレンエーテル組成物 |
US20240141106A1 (en) | 2021-01-25 | 2024-05-02 | Asahi Kasei Kabushiki Kaisha | Polyphenylene ether, production method, thermosetting composition, prepreg, and laminate thereof |
KR20230113372A (ko) | 2021-03-10 | 2023-07-28 | 아사히 가세이 가부시키가이샤 | 폴리페닐렌에테르, 그 제조 방법, 열경화 조성물, 프리프레그및 적층체 |
CN115322365B (zh) * | 2021-05-10 | 2023-12-08 | 南通星辰合成材料有限公司 | 低分子量聚亚芳基醚及其制备方法 |
WO2022244817A1 (ja) | 2021-05-21 | 2022-11-24 | 旭化成株式会社 | ポリフェニレンエーテル、その製造方法、熱硬化組成物、プリプレグ、及び積層体 |
CN113683772B (zh) * | 2021-08-30 | 2022-10-04 | 浙江大学 | 一种低分子量官能化星型聚苯醚及其制备方法 |
CN116769298B (zh) * | 2023-05-26 | 2024-04-26 | 湖南恒屹新材料有限公司 | 一种车用高强度改性聚苯醚工程材料及其制备方法 |
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BE635349A (pt) * | 1962-07-24 | |||
NL295699A (pt) * | 1962-07-24 | |||
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DE3910832A1 (de) * | 1989-04-04 | 1990-10-11 | Huels Chemische Werke Ag | Blockcopolymere auf basis von polyphenylenethern und polykondensaten sowie verfahren zu ihrer herstellung |
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DE4023232A1 (de) * | 1990-07-21 | 1992-01-23 | Huels Chemische Werke Ag | Thermoplastische formmassen auf basis modifizierter polyphenylether |
DE69213374T2 (de) * | 1991-09-03 | 1997-02-06 | Mitsubishi Chem Corp | Verfahren zur Herstellung von Hydroxyl-substitutierten Polyphenylenetherharz |
CA2082695A1 (en) * | 1991-12-31 | 1993-07-01 | David F. Aycock | Polyphenylene ether capping process, polyphenylene resins obtained thereby and compositions thereof |
US5315042A (en) * | 1993-03-22 | 1994-05-24 | General Electric Company | Use of partial acetone conversion for capacity increase and quality/yield improvement in the bisphenol-A reaction |
JPH07278293A (ja) * | 1994-04-11 | 1995-10-24 | Asahi Chem Ind Co Ltd | ポリフェニレンエーテルの改質方法 |
WO1996001865A1 (en) * | 1994-07-11 | 1996-01-25 | Dsm N.V. | Multihydroxy-functional oligophenylene oxide |
-
1997
- 1997-02-14 US US08/800,694 patent/US5880221A/en not_active Expired - Lifetime
-
1998
- 1998-01-08 EP EP98901740A patent/EP0895519B1/en not_active Expired - Lifetime
- 1998-01-08 WO PCT/US1998/000351 patent/WO1998036015A1/en not_active Application Discontinuation
- 1998-01-08 KR KR1019980708169A patent/KR20000064906A/ko not_active Application Discontinuation
- 1998-01-08 CN CNB988004372A patent/CN1188450C/zh not_active Expired - Lifetime
- 1998-01-08 TR TR1998/02062T patent/TR199802062T1/xx unknown
- 1998-01-08 AU AU58191/98A patent/AU734335B2/en not_active Ceased
- 1998-01-08 AT AT98901740T patent/ATE226223T1/de not_active IP Right Cessation
- 1998-01-08 CZ CZ983258A patent/CZ325898A3/cs unknown
- 1998-01-08 BR BR9805985-8A patent/BR9805985A/pt unknown
- 1998-01-08 DE DE69808707T patent/DE69808707T2/de not_active Expired - Lifetime
- 1998-01-08 CA CA002250841A patent/CA2250841A1/en not_active Abandoned
- 1998-01-08 JP JP53572398A patent/JP4113261B2/ja not_active Expired - Lifetime
- 1998-02-02 TW TW087101183A patent/TW438837B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN1188450C (zh) | 2005-02-09 |
KR20000064906A (ko) | 2000-11-06 |
CZ325898A3 (cs) | 1999-08-11 |
JP2000509097A (ja) | 2000-07-18 |
ATE226223T1 (de) | 2002-11-15 |
DE69808707D1 (de) | 2002-11-21 |
US5880221A (en) | 1999-03-09 |
TR199802062T1 (xx) | 1999-05-21 |
AU734335B2 (en) | 2001-06-14 |
DE69808707T2 (de) | 2003-06-12 |
CN1222921A (zh) | 1999-07-14 |
WO1998036015A1 (en) | 1998-08-20 |
JP4113261B2 (ja) | 2008-07-09 |
EP0895519B1 (en) | 2002-10-16 |
EP0895519A1 (en) | 1999-02-10 |
TW438837B (en) | 2001-06-07 |
AU5819198A (en) | 1998-09-08 |
CA2250841A1 (en) | 1998-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |