ATE313412T1 - System zur endpunktbestimmung beim chemisch- mechanischen polieren - Google Patents
System zur endpunktbestimmung beim chemisch- mechanischen polierenInfo
- Publication number
- ATE313412T1 ATE313412T1 AT01950481T AT01950481T ATE313412T1 AT E313412 T1 ATE313412 T1 AT E313412T1 AT 01950481 T AT01950481 T AT 01950481T AT 01950481 T AT01950481 T AT 01950481T AT E313412 T1 ATE313412 T1 AT E313412T1
- Authority
- AT
- Austria
- Prior art keywords
- point
- polishing pad
- chemical
- mechanical polishing
- point determination
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2001/020283 WO2003002301A1 (en) | 2001-06-26 | 2001-06-26 | End point detection system for chemical mechanical polishing applications |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE313412T1 true ATE313412T1 (de) | 2006-01-15 |
Family
ID=21742667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01950481T ATE313412T1 (de) | 2001-06-26 | 2001-06-26 | System zur endpunktbestimmung beim chemisch- mechanischen polieren |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1399294B1 (de) |
JP (1) | JP5027377B2 (de) |
CN (1) | CN1246125C (de) |
AT (1) | ATE313412T1 (de) |
DE (1) | DE60116148T2 (de) |
WO (1) | WO2003002301A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050066739A1 (en) * | 2003-09-26 | 2005-03-31 | Lam Research Corporation | Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring |
CN100369713C (zh) * | 2005-04-11 | 2008-02-20 | 广东工业大学 | 一种化学机械法金刚石膜抛光装置及其抛光方法 |
JP5481417B2 (ja) * | 2010-08-04 | 2014-04-23 | 株式会社東芝 | 半導体装置の製造方法 |
JP2012148376A (ja) * | 2011-01-20 | 2012-08-09 | Ebara Corp | 研磨方法及び研磨装置 |
WO2013015750A1 (en) * | 2011-07-25 | 2013-01-31 | Hoya Glass Disk (Thailand) Ltd | A method of manufacturing glass substrates for information recording medium |
CN102441839B (zh) * | 2011-11-11 | 2014-06-04 | 上海华力微电子有限公司 | 提高固定研磨料在研磨垫上进行cmp工艺稳定性的方法 |
CN102528664A (zh) * | 2012-01-11 | 2012-07-04 | 上海理工大学 | 磨削砂轮表面磨粒温度测量装置 |
JP6196858B2 (ja) * | 2012-09-24 | 2017-09-13 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
CN103978421B (zh) * | 2013-02-07 | 2017-04-19 | 中芯国际集成电路制造(上海)有限公司 | 终点侦测方法及化学机械抛光***的抛光方法 |
CN109719615A (zh) * | 2017-10-30 | 2019-05-07 | 凯斯科技股份有限公司 | 基板处理装置 |
CN109719613B (zh) * | 2017-10-30 | 2021-09-24 | 凯斯科技股份有限公司 | 基板处理装置及方法 |
CN109719617B (zh) * | 2017-10-30 | 2021-12-17 | 凯斯科技股份有限公司 | 基板处理装置 |
TWI825075B (zh) * | 2018-04-03 | 2023-12-11 | 美商應用材料股份有限公司 | 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體 |
EP3632254A1 (de) | 2018-10-03 | 2020-04-08 | The Swatch Group Research and Development Ltd | Plastikarmband mit verminderter rauigkeit |
US11355369B2 (en) | 2018-10-15 | 2022-06-07 | Jongpal AHN | Method of monitoring surface temperatures of wafers in real time in semiconductor wafer cleaning apparatus and temperature sensor for measuring surface temperatures of wafer |
KR101973712B1 (ko) * | 2018-10-15 | 2019-04-29 | 안종팔 | 반도체 웨이퍼 세정장치에서 웨이퍼 표면 온도 실시간 모니터링 방법 |
KR20200068785A (ko) * | 2018-12-05 | 2020-06-16 | 삼성디스플레이 주식회사 | 연마 모니터링 시스템 및 연마 모니터링 방법 |
CN110900337B (zh) * | 2019-12-06 | 2020-10-30 | 宿迁学院 | 一种用于金属件打磨的高精度打磨磨床 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940022734A (ko) * | 1993-03-15 | 1994-10-21 | 사또 후미오 | 연마 방법 및 연마 장치 |
JPH0794452A (ja) * | 1993-09-22 | 1995-04-07 | Toshiba Corp | 研磨方法及び研磨装置 |
JPH0724708A (ja) * | 1993-07-15 | 1995-01-27 | Toshiba Corp | 研磨方法及び研磨装置 |
US5597442A (en) * | 1995-10-16 | 1997-01-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Chemical/mechanical planarization (CMP) endpoint method using measurement of polishing pad temperature |
JPH09148281A (ja) * | 1995-11-24 | 1997-06-06 | Matsushita Electric Ind Co Ltd | 研磨装置及び研磨方法 |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6111634A (en) * | 1997-05-28 | 2000-08-29 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing |
US6007408A (en) * | 1997-08-21 | 1999-12-28 | Micron Technology, Inc. | Method and apparatus for endpointing mechanical and chemical-mechanical polishing of substrates |
TW398036B (en) * | 1998-08-18 | 2000-07-11 | Promos Technologies Inc | Method of monitoring of chemical mechanical polishing end point and uniformity |
US6325706B1 (en) * | 1998-10-29 | 2001-12-04 | Lam Research Corporation | Use of zeta potential during chemical mechanical polishing for end point detection |
JP2000340538A (ja) * | 1999-05-31 | 2000-12-08 | Hitachi Ltd | 基板の平坦化方法および平坦化加工装置とそれを用いた半導体装置の製造方法 |
-
2001
- 2001-06-26 DE DE60116148T patent/DE60116148T2/de not_active Expired - Fee Related
- 2001-06-26 JP JP2003508520A patent/JP5027377B2/ja not_active Expired - Fee Related
- 2001-06-26 EP EP01950481A patent/EP1399294B1/de not_active Expired - Lifetime
- 2001-06-26 CN CN01823405.4A patent/CN1246125C/zh not_active Expired - Fee Related
- 2001-06-26 AT AT01950481T patent/ATE313412T1/de not_active IP Right Cessation
- 2001-06-26 WO PCT/US2001/020283 patent/WO2003002301A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1399294A1 (de) | 2004-03-24 |
CN1520348A (zh) | 2004-08-11 |
CN1246125C (zh) | 2006-03-22 |
DE60116148T2 (de) | 2006-08-31 |
JP5027377B2 (ja) | 2012-09-19 |
DE60116148D1 (de) | 2006-01-26 |
JP2004522310A (ja) | 2004-07-22 |
EP1399294B1 (de) | 2005-12-21 |
WO2003002301A1 (en) | 2003-01-09 |
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Legal Events
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